ETC2 EM404M922VTA 16mb ( 2banks ) synchronous dram Datasheet

16Mb SDRAM
Ordering Information
EM 48 1M 16 2 2 V T A – 6 L
EOREX
Memory
EDO/FPM
D-RAMBUS
DDRSDRAM
DDRSGRAM
SGRAM
SDRAM
:
:
:
:
:
:
Power
Blank : Standard
L : Low power
I : Industrial
40
41
42
43
46
48
F: PB free package
Density
16M : 16 Mega Bits
8M : 8 Mega Bits
4M : 4 Mega Bits
2M : 2 Mega Bits
1M : 1 Mega Bit
Min Cycle Time ( Max Freq.)
-5 : 5ns ( 200MHz )
-6 : 6ns ( 167MHz )
-7 : 7ns ( 143MHz )
-75 : 7.5ns ( 133MHz )
-8 : 8ns ( 125MHz )
-10 : 10ns ( 100MHz )
Organization
8 : x8
9 : x9
16 : x16
18 : x18
32 : x32
Refresh
1 : 1K, 8 : 8K
2 : 2K, 6 :16K
4 : 4K
Bank
2 : 2Bank 6 : 16Bank
4 : 4Bank 3 : 32Bank
8 : 8Bank
Revision
A : 1st B : 2nd
C : 3rd D :4th
Package
C: CSP B: uBGA
T: TSOP Q: TQFP
P: PQFP ( QFP )
Interface
V: 3.3V
R: 2.5V
1/18
Rev.01
16Mb SDRAM
16Mb ( 2Banks ) Synchronous DRAM
EM481M1622VTA (1Mx16)
Description
The EM481M1622VTA is Synchronous Dynamic Random Access Memory (SDRAM) organized as
512K x 2 banks x 16 bits. All inputs and outputs are synchronized with the positive edge of the clock.
The 16Mb SDRAM uses synchronized pipelined architecture to achieve high speed data transfer rates
and is designed to operate at 3.3V low power memory system. It also provides auto refresh with power
saving / down mode. All inputs and outputs voltage levels are compatible with LVTTL .
Feature
• Fully
synchronous to positive clock edge
3.3V +/- 0.3V power supply
• LVTTL compatible with multiplexed address
• Programmable Burst Length (B/ L) - 1,2,4,8 or full page
• Programmable CAS Latency (C/ L) - 2 or 3
• Data Mask (DQM) for Read / Write masking
• Programmable wrap sequence - Sequential ( B/ L = 1/2/4/8/full page )
- Interleave ( B/ L = 1/2/4/8 )
• Burst read with single-bit write operation
• All inputs are sampled at the rising edge of the system clock.
• Auto refresh and self refresh
• 2,048 refresh cycles / 32ms
• Single
* EOREX reserves the right to change products or specification without notice.
2/18
Rev.01
16Mb SDRAM
Pin Assignment ( Top View )
VDD
1
50
VSS
DQ0
2
49
DQ15
DQ1
3
48
DQ14
VSSQ
4
47
VSSQ
DQ2
5
46
DQ13
DQ3
6
45
DQ12
VDDQ
7
44
VDDQ
DQ4
8
43
DQ11
DQ5
9
42
DQ10
VSSQ
10
41
VSSQ
DQ6
11
40
DQ9
DQ7
12
39
DQ8
VDDQ
13
38
VDDQ
LDQM
14
37
NC
/WE
15
36
UDQM
/CAS
16
35
CLK
/RAS
17
34
CKE
/CS
18
33
NC
BA
19
32
A9
A10
20
31
A8
A0
21
30
A7
A1
22
29
A6
A2
23
28
A5
A3
24
27
A4
VDD
25
26
VSS
50pin TSOP-II
3/18
Rev.01
16Mb SDRAM
Pin Descriptions ( Simplified )
Pin
Name
CLK
/CS
System Clock
Chip select
Pin Function
CKE
Clock Enable
A0 ~ A10
Address
BA
Bank Address
/RAS
Row address strobe
/CAS
Column address strobe
Latches Column Addresses on the positive rising edge of the
CLK with /CAS low. Enables column access.
/WE
Write Enable
Latches Column Addresses on the positive rising edge of the
CLK with /CAS low. Enables column access.
UDQM /LDQM
Data input/output Mask
DQ0 ~ 15
Data input/output
VDD/VSS
Power supply/Ground
VDD and VSS are power supply pins for internal circuits.
VDDQ/VSSQ
Power supply/Ground
VDDQ and VSSQ are power supply pins for the output buffers.
NC
No connection
Master Clock Input(Active on the Positive rising edge)
Selects chip when active
Activates the CLK when “H” and deactivates when “L”.
CKE should be enabled at least one cycle prior to new
command. Disable input buffers for power down in standby.
Row address (A0 to A10) is determined by A0 to A10 level
at the bank active command cycle CLK rising edge.
CA(CA0 to CA7) is determined by A0 to A7 level at the
read or write command cycle CLK rising edge.
And this column address becomes burst access start
address. A10 defines the pre-charge mode. When A10 = High
at the pre-charge command cycle, all banks are pre-charged.
But when A10 = Low at the pre-charge command cycle,
only the bank that is selected by BA is pre-charged.
Selects which bank is to be active.
Latches Row Addresses on the positive rising edge of the
CLK with /RAS “L”. Enables row access & pre-charge.
DQM controls I/O buffers.
DQ pins have the same function as I/O pins on a conventional
DRAM.
This pin is recommended to be left No Connection on the
device.
4/18
Rev.01
16Mb SDRAM
Block Diagram
Auto/Self
Refresh Counter
A0
A1
DQM
A6
A7
Memory
Array
Write DQM
Control
Data In
A8
S/A & I/O gating
A9
Col. Decoder
A10
DQi
Data Out
Col. Add. Buffer
BA
Read DQM
Control
Col. Add. Counter
Mode Register Set
DQM
A5
Row Decoder
A4
Address Register
A3
Row Add. Buffer
A2
Burst Counter
Timing Register
CLK
CKE
/CS
/RAS
/CAS
/WE
DQM
5/18
Rev.01
16Mb SDRAM
Simplified State Diagram
Self
Refresh
LF
SE
LF
SE
Mode
Register
Set
MRS
it
Ex
CBR
Refresh
REF
IDLE
CK
E↓
ACT
CK
E
wi
th
Wr
ite
CKE
BS
T
Re
ad
Read
READ
Write
CKE
WRITEA
CKE
POWER
ON
Precharge
Active
Power
Down
CKE↓
READ
Suspend
CKE
READA
PR
E
CKE↓
th
wi
Read
ad
Re
WRITE
E
PR
WRITEA
Suspend
CKE↓
CKE↓
Row
Active
Write
WRITE
Suspend
Power
Down
CKE↓
CKE
READA
Suspend
Precharge
Manual Input
Automatic Sequence
6/18
Rev.01
16Mb SDRAM
Address Input for Mode Register Set
BA
A10
A9
A8
A7
Operation Mode
A6
A5
A4
A3
CAS Latency
BT
Sequential
1
2
4
8
Reserved
Reserved
Reserved
Full Page
BA
0
0
A10
0
0
A9
0
1
A8
0
0
A7
0
0
A6
0
0
0
0
1
1
1
1
A5
0
0
1
1
0
0
1
1
A1
A0
Burst Length
Burst Length
Interleave A2
1
0
2
0
4
0
8
0
Reserved
1
Reserved
1
Reserved
1
Reserved
1
Burst Type
Interleave
Sequential
CAS Latency
Reserved
2
3
Reserved
Reserved
Reserved
Reserved
Reserved
A2
A1
0
0
1
1
0
0
1
1
A0
0
1
0
1
0
1
0
1
A3
0
1
A4
0
1
0
1
0
1
0
1
Operation Mode
Normal
Burst read with Single-bit Write
7/18
Rev.01
16Mb SDRAM
Burst Type ( A3 )
Burst Length
2
4
8
Full Page *
A2 A1 A0
XX0
XX1
X0 0
X0 1
X1 0
X1 1
000
001
010
011
100
101
110
111
nnn
Sequential Addressing
01
10
0123
1230
2301
3012
01234567
12345670
23456701
34567012
45670123
56701234
67012345
70123456
Cn Cn+1 Cn+2 …...
Interleave Addressing
01
10
0123
1032
2301
3210
01234567
10325476
23016745
32107654
45670123
54761032
67452301
76543210
-
* Page length is a function of I/O organization and column addressing
x16 (CA0 ~ CA7) : Full page = 256 bits
8/18
Rev.01
16Mb SDRAM
Truth Table
1. Command Truth Table
Command
Symbol
Ignore Command
No operation
Burst stop
Read
Read with auto pre-charge
Write
Write with auto pre-charge
Bank activate
Pre-charge select bank
Pre-charge all banks
Mode register set
CKE
n-1
n
H
H
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
DESL
NOP
BSTH
READ
READA
WRIT
WRITA
ACT
PRE
PALL
MRS
/CS /RAS /CAS /WE
H
L
L
L
L
L
L
L
L
L
L
X
H
H
H
H
H
L
L
L
L
L
X
H
H
L
L
L
H
H
H
H
L
BA
X
H
L
H
H
L
H
H
L
L
L
A10 A9~A0
X
X
X
V
V
V
V
V
V
X
L
X
X
X
L
H
L
H
V
L
H
L
X
X
X
V
V
V
V
V
X
X
V
Note : H = High level, L = Low level, X = High or Low level (Don't care), V = Valid data input
2. DQM Truth Table
Command
Symbol
CKE
/CS
n-1
n
ENB
MASK
H
H
X
X
H
L
BSTH
READ
READA
WRIT
WRITA
ACT
PRE
PALL
MRS
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
X
L
L
L
L
L
L
L
L
L
( EM481M1622VT )
Data w rite / output enable
Data mask / output disable
( EM481M1622VT )
Upper byte w rite enable / output enable
Read
Read w ith auto pre-charge
Write
Write w ith auto pre-charge
Bank activate
Pre-charge select bank
Pre-charge all banks
Mode register set
Note : H = High level, L = Low level, X = High or Low level (Don't care), V = Valid data input
3. CKE Truth Table
Command
Command
Activating
Any
Clock suspend
Idle
Idle
Clock suspend mode entry
Clock suspend mode
Clock suspend mode exit
CBR refresh command
Self refresh entry
Self refresh
Self refresh exit
Idle
Power down
Pow er dow n entry
Pow er dow n exit
Symbol
REF
SELF
CKE
n-1
n
H
L
L
H
H
L
L
H
L
L
L
H
H
L
H
H
L
H
/CS /RAS /CAS /WE Addr.
X
X
X
L
L
L
H
X
X
X
X
X
L
L
H
X
X
X
X
X
X
L
L
H
X
X
X
X
X
X
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
Re m ark H = High level, L = Low level, X = High or Low level (Don't care)
9/18
Rev.01
16Mb SDRAM
4. Operative Command Table
Current
state
Idle
Row active
Re ad
Write
/CS /R /C /W
H
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
X
H
H
H
L
L
L
L
X
H
H
H
L
L
L
L
X
H
H
H
L
L
L
L
L
X
H
H
H
L
L
L
L
L
X
H
L
L
H
H
L
L
X
H
L
L
H
H
L
L
X
H
H
L
L
H
H
L
L
X
H
H
L
L
H
H
L
L
X
X
H
L
H
L
H
L
X
X
H
L
H
L
H
L
X
H
L
H
L
H
L
H
L
X
H
L
H
L
H
L
H
L
Addr.
Command
Action
Notes
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA/A10
X
Op-Code
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA/A10
X
Op-Code
DESL
NOP or BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP or BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
Nop or pow er dow n
Nop or pow er dow n
ILLEGAL
ILLEGAL
Row activating
Nop
Refresh or self refresh
Mode register accessing
Nop
Nop
Begin read : Determine AP
Begin w rite : Determine AP
ILLEGAL
Precharge
ILLEGAL
ILLEGAL
Continue burst to end → Row active
Continue burst to end → Row active
Burst stop → Row active
Terminate burst, new read : Determine AP
Terminate burst, start w rite : Determine AP
ILLEGAL
Terminate burst, pre-charging
ILLEGAL
ILLEGAL
Continue burst to end → Write recovering
Continue burst to end → Write recovering
Burst stop → Row active
Terminate burst, start read : Determine AP 7, 8
Terminate burst, new w rite : Determine AP 7
ILLEGAL
Terminate burst, pre-charging
ILLEGAL
ILLEGAL
2
2
3
3
Re m ark H = High level, L = Low level, X = High or Low level (Don't care)
10/18
Rev.01
4
5
5
3
6
4
7
7, 8
3
4
7,8
7
3
9
16Mb SDRAM
Current
state
Re ad w ith AP
Write w ith AP
Pre charging
Row activating
/CS /R /C /W
Addr.
Command
H
L
L
L
L
L
L
L
L
X
H
H
H
H
L
L
L
L
X
H
H
L
L
H
H
L
L
X
X
H
X
L
X
H BA/CA/A10
L BA/CA/A10
H
BA/RA
L
BA, A10
H
X
L
Op-Code
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
H
X
X
X
X
DESL
L
H
H
H
X
NOP
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
H
H
L
L
L
L
X
H
H
H
H
L
L
L
L
X
H
H
H
H
L
L
L
L
H
L
L
H
H
L
L
X
H
H
L
L
H
H
L
L
X
H
H
L
L
H
H
L
L
L
H
L
H
L
H
L
X
H
L
H
L
H
L
H
L
X
H
L
H
L
H
L
H
L
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
Action
Continue burst to end → Precharging
Continue burst to end → Precharging
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
burst to end → Write
recovering w ith auto precharge
Continue burst to end → Write
recovering w ith auto precharge
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Nop → Enter idle after tRP
Nop → Enter idle after tRP
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Nop → Enter idle after tRP
ILLEGAL
ILLEGAL
Nop → Enter idle after tRCD
Nop → Enter idle after tRCD
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Notes
3
3
3
3
3
3
3
3
3
3
3
3
3
3,10
3
Re m ark H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Precharge
11/18
Rev.01
16Mb SDRAM
Current
state
Write re cove ring
Write re cove ring
w ith AP
Re freshing
M ode Re giste r
Acces sing
/CS /R /C /W
Addr.
Command
Action
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP
BST
READ/READA
WRIT/WRITA
ACT
PRE/PALL
REF/SELF
MRS
DESL
NOP/ BST
READ/WRIT
ACT/PRE/PALL
REF/SELF/MRS
DESL
NOP
BST
READ/WRIT
ACT/PRE/PALL/
REF/SELF/MRS
Nop → Enter row active after tDPL
Nop → Enter row active after tDPL
Nop → Enter row active after tDPL
Start read, Determine AP
New w rite, Determine AP
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Nop → Enter precharge after tDPL
Nop → Enter precharge after tDPL
Nop → Enter precharge after tDPL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
Nop → Enter idle after tRC
Nop → Enter idle after tRC
ILLEGAL
ILLEGAL
ILLEGAL
Nop
Nop
ILLEGAL
ILLEGAL
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
H
L
L
L
L
H
L
L
L
X
H
H
H
H
L
L
L
L
X
H
H
H
H
L
L
L
L
X
H
H
L
L
X
H
H
H
X
H
H
L
L
H
H
L
L
X
H
H
L
L
H
H
L
L
X
H
L
H
L
X
H
H
L
X
H
L
H
L
H
L
H
L
X
H
L
H
L
H
L
H
L
X
X
X
X
X
X
H
L
X
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
X
BA/CA/A10
BA/CA/A10
BA/RA
BA, A10
X
Op-Code
X
X
X
X
X
X
X
X
X
L
L
X
X
X
Notes
8
3
3
3,8
3
3
ILLEGAL
Re m ark H = High level, L = Low level, X = High or Low level (Don't care), AP = Auto Precharge
Notes 1. All entries assume that CKE w as active (High level) during the preceding clock cycle.
2. If all banks are idle, and CKE is inactive (Low level), SDRAM w ill enter Pow er dow n mode.
All input buffers except CKE w ill be disabled.
3. Illegal to bank in specified states;
→ Function may be legal in the bank indicated by Bank Address (BA), depending on the state of that bank.
4. If all banks are idle, and CKE is inactive (Low level), SDRAM w ill enter Self refresh mode.
All input buffers except CKE w ill be disabled.
5. Illegal if tRCD is not satisfied.
6. Illegal if tRAS is not satisfied.
7. Must satisfy burst interrupt condition.
8. Must satisfy bus contention, bus turn around, and/or w rite recovery requirements.
9. Must mask preceding data w hich don't satisfy tDPL.
10. Illegal if tRRD is not satisfied.
12/18
Rev.01
16Mb SDRAM
5. Command Truth Table for CKE
Current
state
CKE
n-1
H
L
L
Se lf re fre sh
L
L
L
H
H
H
Se lf re fre sh H
re covery
H
H
H
H
H
Pow er dow n L
L
H
H
H
H
H
Both banks
H
idle
H
H
H
H
L
H
Row active
L
H
Any state
H
other than
L
liste d above
L
n
X
H
H
H
H
L
H
H
H
H
L
L
L
L
X
H
L
H
H
H
H
H
L
L
L
L
L
X
X
X
H
L
H
L
/CS /R /C /W
X
H
L
L
L
X
H
L
L
L
H
L
L
L
X
X
X
H
L
L
L
L
H
L
L
L
L
X
X
X
X
X
X
X
X
X
H
H
L
X
X
H
H
L
X
H
H
L
X
X
X
X
H
L
L
L
X
H
L
L
L
X
X
X
X
X
X
X
X
X
H
L
X
X
X
H
L
X
X
H
L
X
X
X
X
X
X
H
L
L
X
X
H
L
L
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
H
L
X
X
X
H
L
X
X
X
X
X
X
X
Addr.
Action
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Op-Code
X
Op-Code
X
X
X
X
X
X
INVALID, CLK (n – 1) w ould exit self refresh
Self refresh recovery
Self refresh recovery
ILLEGAL
ILLEGAL
Maintain self refresh
Idle after tRC
Idle after tRC
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
ILLEGAL
INVALID, CLK(n-1) w ould exit pow er dow n
Exit pow er dow n → Idle
Maintain pow er dow n mode
Refer to operations in Operative Command Table
Refer to operations in Operative Command Table
Refer to operations in Operative Command Table
Refresh
Refer to operations in Operative Command Table
Refer to operations in Operative Command Table
Refer to operations in Operative Command Table
Refer to operations in Operative Command Table
Self refresh
Refer t o operations in Operative Command Table
Pow er dow n
Refer to operations in Operative Command Table
Pow er dow n
Refer to operations in Operative Command Table
Begin clock suspend next cycle
Exit clock suspend next cycle
Maintain clock suspend
Notes
1
1
1
2
Re m ark : H = High level, L = Low level, X = High or Low level (Don't care)
Notes 1. Self refresh can be entered only from the both banks idle state.
Pow er dow n can be entered only from both banks idle or row active state.
2. Must be legal command as defined in Operative Command Table.
13/18
Rev.01
16Mb SDRAM
Absolute Maximum Ratings
Symbol
Item
Rating
Units
VIN, VOUT
Input, Output Voltage
-0.3 ~ 4.6
V
VDD, VDDQ
Power Supply Voltage
-0.3 ~ 4.6
V
TOP
Operating Temperature
0 ~ 70
°C
TSTG
Storage Temperature
-55 ~ 150
°C
PD
Power Dissipation
1
W
IOS
Short Circuit Current
50
mA
Note : Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specif ication. Exposure to Absolute Maximum
Rating conditions for extended periods may affect device reliability.
Recommended DC Operation Conditions ( Ta = 0 ~ 70°C )
Symbol
Parameter
Min.
Typical
Max.
Units
VDD
Power Supply Voltage
3.0
3.3
3.6
V
VDDQ
Power Supply Voltage (for I/O Buffer)
3.0
3.3
3.6
V
VIH
Input logic high voltage
2.0
VDD+0.3
V
VIL
Input logic low voltage
-0.3
0.8
V
Note : 1. All voltage referred to V SS.
2. V IH (max) = 5.6V for pulse w idth ≤ 3ns
3. V IL (min) = -2.0V for pulse w idth ≤ 3ns
Capacitance ( Vcc =3.3V, f = 1MHz, Ta = 25°C )
Symbol
Parameter
Min.
Max.
Units
CCLK
Clock capacitance
2.5
4.0
pF
CI
Input capacitance for CLK, CKE, Address, /CS,
/RAS, /CAS, /WE, DQML,DQMU
2.5
5.0
pF
CO
Input/Output capacitance
4.0
6.5
pF
14/18
Rev.01
16Mb SDRAM
Recommended DC Operating Conditions
( VDD = 3.3V +/- 0.3 V, Ta = 0 ~ 70 °C , Ta = -40 to 85°C for 6I)
MAX
Parameter
Symbol
Operating current
ICC1
Burst length = 1,
tRC ≥ tRC (min), IOL = 0 mA,
One bank active
Precharge standby
current in power down
mode
ICC2P
CKE ≤ V IL (max.), tCk = 15 ns
ICC2PS
CKE ≤ V IL (max.), tCk = ∞
ICC2N
CKE ≥ V IL (min.), tCK = 15 ns, /CS ≥ V IH (min.)
Input signals are changed one time during 30ns
ICC2NS
Precharge standby
current in non-power
down mode
Active standby current
in power down mode
Active standby current
in non-power down
mode
Test condition
100
6/6I/6L 7/7L
90
80
Units Notes
mA
1
2 / 0.7*
mA
5
2 / 0.7*
mA
5
20
mA
CKE ≥ V IL (min.), tCK = ∞
Input signals are stable
8
mA
ICC3P
CKE ≤ VIL(max), tCK = 15ns
5
mA
ICC3PS
CKE ≤ VIL(max), tCK = ∞
5
mA
ICC3N
CKE ≥ VIL(min), tCK = 15ns,/ CS ≥ VIH(min)
Input signals are changed one time during
30ns
30
mA
ICC3NS
CKE ≥ VIL(min), tCK = ∞
Input signals are stable
20
mA
operating current
(Burst mode)
ICC4
tCCD = 2CLKs , IOL = 0 mA
Refresh current
ICC5
tRC ≥ tRC(min.)
Self Refresh current
5
ICC6
CKE ≤ 0.2V
CL=3
CL=2
180
160
140
130
120
110
2
0.3
mA
2
mA
3
mA
4
5
Note : 1. ICC1 depends on output loading and cycle rates.
Specified values are obtained w ith the output open.
Input signals are changed only one time during tCK(min)
2. ICC4 depends on output loading and cycle rates.
Specified values are obtained w ith the output open.
Input signals are changed only one time during tCK(min)
3. Input signals are changed only one time during tCK(min)
4. Standard pow er version.
5. * Low pow er version.
15/18
Rev.01
16Mb SDRAM
Recommended DC Operating Conditions ( Continued )
Parameter
Symbol
Input leakage current
IIL
Output leakage current
Test condition
Min.
Max.
Unit
0 ≤ VI ≤ VDDQ, VDDQ=VDD
All other pins not under test=0 V
-0.5
+0.5
uA
IOL
0 ≤ VO ≤ VDDQ, DOUT is disabled
-0.5
+0.5
uA
High level output voltage
VOH
Io = -4mA
2.4
Low level output voltage
VOL
Io = +4mA
V
0.4
V
AC Operating Test Conditions
( VDD = 3.3V +/- 0.3 V, Ta = 0 ~ 70 °C , Ta = -40 to 85°C for 6I )
Output Reference Level
1.4V / 1.4V
Output Load
See diagram as below
Input Signal Level
2.4V / 0.4V
Transition Time of Input Signals
2ns
Input Reference Level
1.4V
Vtt = 1.4V
50Ω
Output
Z = 50Ω
50pF
16/18
Rev.01
16Mb SDRAM
Operating AC Characteristics
( VDD = 3.3V +/- 0.3 V, Ta = 0 ~ 70 °C , Ta = -40 to 85°C for 6I)
Parameter
Clock cycle time
Access time from CLK
Symbol
CL = 3
CL = 2
CL = 3
CL = 2
tCK
-5
Min.
-6/6I/6L
Max.
Min.
Max.
-7/7L
Min.
Max.
Units Notes
5
6
7
ns
7
7.5
8
ns
4.5
tAC
5
5.5
5.5
5.5
ns
5
ns
CLK high level width
tCH
1.5
2
2.75
2
ns
CLK low level width
tCL
1.5
2
2.75
2
ns
1.5
2
22
ns
2
ns
Data-out hold time
Data-out high impedance time
CL = 3
CL = 2
CL = 3
CL = 2
tOH
1.5
tHZ
5
2
6
2
7
ns
ns
Data-out low impedance time
tLZ
0
0
1
ns
Input hold time
1
1
1
ns
Input setup time
tIH
tIS
1.5
1.5
1.5
ns
ACTIVE to ACTIVE command period
tRC
54
60
65
ns
2
ACTIVE to PRECHARGE command period
tRAS
40
ns
2
PRECHARGE to ACTIVE command period
tRP
18
18
18
ns
2
ACTIVE to READ/WRITE delay time
tRCD
14
18
20
ns
2
ACTIVE(one) to ACTIVE(another) command
tRRD
10
12
14
ns
2
READ/WRITE command to READ/WRITE
command
tCCD
1
1
1
CLK
Data-in to PRECHARGE command
tDPL
2
2
2
CLK
Data-in to BURST stop command
tBDL
1
1
1
CLK
3
3
3
CLK
2
CLK
Data-out to high impedance from
PRECHARGE command
CL = 3
CL = 2
Refresh time(2,048 cycle)
tROH
tREF
100k
42
32
100k
32
45
100k
32
ms
＊ All voltages referenced to Vss.
Note :
1. tHZ defines the time at which the output achieve the open circuit
condition and is not referenced to output voltage levels.
2. These parameters account for the number of clock cycles and
depend on the operating frequency of the clock, as follows :
The number of clock cycles = Specified value of timing/clock
period
(Count fractions as a whole number)
17/18
Rev.01
16Mb SDRAM
Package Dimension
18/18
Rev.01