ON MC74AC245DTR2G Octal bidirectional transceiver with 3−state inputs/output Datasheet

MC74AC245, MC74ACT245
Octal Bidirectional
Transceiver with 3−State
Inputs/Outputs
The MC74AC245/74ACT245 contains eight non−inverting
bidirectional buffers with 3−state outputs and is intended for
bus−oriented applications. Current sinking capability is 24 mA at both
the A and B ports. The Transmit/Receive (T/R) input determines the
direction of data flow through the bidirectional transceiver. Transmit
(active−HIGH) enables data from A ports to B ports; Receive
(active−LOW) enables data from B ports to A ports. The Output
Enable input, when HIGH, disables both A and B ports by placing
them in a High Z condition.
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PDIP−20
N SUFFIX
CASE 738
1
Features
•
•
•
•
•
Noninverting Buffers
Bidirectional Data Path
A and B Outputs Source/Sink 24 mA
′ACT245 has TTL Compatible Inputs
Pb−Free Packages are Available
SOIC−20W
DW SUFFIX
CASE 751D
1
PIN ASSIGNMENT
TSSOP−20
DT SUFFIX
CASE 948E
PIN
FUNCTION
OE
Output Enable Input
T/R
Transmit/Receive Input
A0−A7
Side A 3−State Inputs or 3−State Outputs
B0−B7
Side B 3−State Inputs or 3−State Outputs
1
SOEIAJ−20
M SUFFIX
CASE 967
TRUTH TABLES
1
Inputs
OE
T/R
L
L
H
L
H
X
Outputs
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Bus B Data to Bus A
Bus A Data to Bus B
High Z State
DEVICE MARKING INFORMATION
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
See general marking information in the device marking
section on page 7 of this data sheet.
VCC
OE
B0
B1
B2
B3
B4
B5
B6
B7
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
T/R
A0
A1
A2
A3
A4
A5
A6
A7
GND
Figure 1.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 7
1
Publication Order Number:
MC74AC245/D
MC74AC245, MC74ACT245
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
IIN
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
tr, tf
Parameter
Supply Voltage
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
−
−
140
°C
−40
25
85
°C
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − High
−
−
−24
mA
IOL
Output Current − Low
−
−
24
mA
ns/V
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC245, MC74ACT245
DC CHARACTERISTICS
Symbol
Parameter
74AC
74AC
TA = +25°C
−40°C to
+85°C
TA =
VCC
(V)
Typ
VIH
VIL
VOH
VOL
IIN
IOZT
IOLD
IOHD
ICC
Unit
Conditions
Guaranteed Limits
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
Maximum Input
Leakage Current
5.5
−
±0.1
Maximum
3-State
Current
5.5
−
5.5
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
IOUT = −50 mA
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 mA
V
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
mA
VI = VCC, GND
±0.6
±6.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80.0
mA
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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3
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
Symbol
Parameter
VCC*
TA = +25°C
(V)
CL = 50 pF
74AC
TA = −40°C
to +85°C
Unit
Fig.
No.
CL = 50 pF
Min
Typ
Max
Min
Max
tPLH
Propagation Delay
An to Bn or Bn to An
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.5
1.0
1.0
9.0
7.0
ns
3−5
tPHL
Propagation Delay
An to Bn or Bn to An
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.0
1.0
1.0
9.0
7.0
ns
3−5
tPZH
Output Enable Time
3.3
5.0
2.5
1.5
7.0
5.0
11.5
8.5
2.0
1.0
12.5
9.0
ns
3−7
tPZL
Output Enable Time
3.3
5.0
2.5
1.5
7.5
5.5
12.0
9.0
2.0
1.0
13.5
9.5
ns
3−8
tPHZ
Output Disable Time
3.3
5.0
2.0
1.5
6.5
5.5
12.0
9.0
1.0
1.0
12.5
10.0
ns
3−7
tPLZ
Output Disable Time
3.3
5.0
2.0
1.5
7.0
5.5
11.5
9.0
1.5
1.0
13.0
10.0
ns
3−8
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
74ACT
74ACT
TA = +25°C
−40°C to
+85°C
TA =
VCC
(V)
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
Maximum
3−State
Current
5.5
−
±0.6
±6.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80.0
mA
VIN = VCC or GND
VOL
IIN
DICCT
IOZT
IOLD
IOHD
ICC
Maximum Low Level
Output Voltage
†Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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4
V
V
IOUT = −50 mA
*VIN = VIL or VIH
IOH −24 mA
−24 mA
IOUT = 50 mA
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74ACT
Symbol
Parameter
74ACT
VCC*
TA = +25°C
(V)
CL = 50 pF
TA = −40°C
to +85°C
Unit
CL = 50 pF
Fig.
No.
Min
Typ
Max
Min
Max
8.0
ns
3−5
tPLH
Propagation Delay, An to Bn or Bn to An
5.0
1.5
4.0
7.5
1.5
tPHL
Propagation Delay, An to Bn or Bn to An
5.0
1.5
4.0
8.0
1.0
9.0
ns
3−5
tPZH
Output Enable Time
5.0
1.5
5.0
10
1.5
11.0
ns
3−7
tPZL
Output Enable Time
5.0
1.5
5.5
10
1.5
12.0
ns
3−8
tPHZ
Output Disable Time
5.0
1.5
5.5
10
1.0
11.0
ns
3−7
tPLZ
Output Disable Time
5.0
2.0
5.0
10
1.5
11.0
ns
3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol
Value
Parameter
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CI/O
Input/Output Capacitance
15
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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5
MC74AC245, MC74ACT245
ORDERING INFORMATION
Device
Package
MC74AC245N
PDIP−20
MC74AC245NG
PDIP−20
(Pb−Free)
MC74ACT245N
PDIP−20
MC74ACT245NG
PDIP−20
(Pb−Free)
MC74AC245DW
SOIC−20
MC74AC245DWG
SOIC−20
(Pb−Free)
MC74AC245DWR2
SOIC−20
MC74AC245DWR2G
SOIC−20
(Pb−Free)
MC74ACT245DW
SOIC−20
MC74ACT245DWG
SOIC−20
(Pb−Free)
MC74ACT245DWR2
SOIC−20
MC74ACT245DWR2G
SOIC−20
(Pb−Free)
MC74AC245DT
TSSOP−20*
MC74AC245DTG
TSSOP−20*
MC74AC245DTR2
TSSOP−20*
MC74AC245DTR2G
TSSOP−20*
MC74ACT245DT
TSSOP−20*
MC74ACT245DTG
TSSOP−20*
MC74ACT245DTR2
TSSOP−20*
MC74ACT245DTR2G
TSSOP−20*
MC74AC245M
SOEIAJ−20
MC74AC245MG
SOEIAJ−20
(Pb−Free)
MC74AC245MEL
SOEIAJ−20
MC74AC245MELG
SOEIAJ−20
(Pb−Free)
MC74ACT245M
SOEIAJ−20
MC74ACT245MG
SOEIAJ−20
(Pb−Free)
MC74ACT245MEL
SOEIAJ−20
MC74ACT245MELG
SOEIAJ−20
(Pb−Free)
Shipping †
18 Units / Rail
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
1000 / Tape & Reel
75 Units / Rail
2500 / Tape & Reel
75 Units / Rail
2500 / Tape & Reel
40 Units / Rail
2000 / Tape & Reel
40 Units / Rail
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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6
MC74AC245, MC74ACT245
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
20
20
20
20
AC
245
ALYWG
G
AC245
AWLYYWWG
MC74AC245N
AWLYYWWG
SOEIAJ−20
1
74AC245
AWLYWWG
1
1
1
20
20
20
20
ACT
245
ALYWG
G
ACT245
AWLYYWWG
MC74ACT245N
AWLYYWWG
1
1
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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7
74ACT245
AWLYWWG
1
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
−A−
20
11
1
10
B
L
C
−T−
K
SEATING
PLANE
M
N
E
G
F
J
D
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
M
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
18X
e
A1
SEATING
PLANE
C
T
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8
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60
0.252
0.260
B
4.30
4.50
0.169
0.177
−−−
−−− 0.047
C
1.20
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
20
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.15
0.25
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.006
0.010
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.032
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