ESMT M12L32321A 512k x 32bit x 2banks synchronous dram Datasheet

ESMT
M12L32321A
SDRAM
512K x 32Bit x 2Banks
Synchronous DRAM
FEATURES
z
z
z
z
z
z
z
z
z
GENERAL DESCRIPTION
The M12L32321A is 33,554,432 bits synchronous high data
rate Dynamic RAM organized as 2 x 524,288 words by 32
bits, fabricated with high performance CMOS technology.
Synchronous design allows precise cycle control with the use
of system clock I/O transactions are possible on every clock
cycle. Range of operating frequencies, programmable burst
length and programmable latencies allow the same device to
be useful for a variety of high bandwidth, high performance
memory system applications.
JEDEC standard 3.3V power supply
LVTTL compatible with multiplexed address
Dual banks operation
MRS cycle with address key programs
CAS Latency (2 & 3 )
Burst Length (1, 2, 4, 8 & full page)
Burst Type (Sequential & Interleave)
All inputs are sampled at the positive going edge of the
system clock
Burst Read Single-bit Write operation
DQM for masking
Auto & self refresh
64ms refresh period (4K cycle)
ORDERING INFORMATION
Product ID
Max Freq.
Package
Comments
M12L32321A-5.5BG
183MHz
90FBGA
Pb-free
M12L32321A-6BG
166MHz
90FBGA
Pb-free
143MHz
90FBGA
Pb-free
M12L32321A-7BG
PIN CONFIGURATION (TOP VIEW)
90 Ball FBGA
1
2
3
4
5
6
7
8
9
A
DQ26 DQ24 VSS
VDD DQ23 DQ21
B
DQ28 VDDQ VSSQ
VDDQ VSSQ DQ19
C
VSSQ DQ27 DQ25
DQ22 DQ20 VDDQ
D
VSSQ DQ29 DQ30
DQ17 DQ18 VDDQ
E
VDDQ DQ31
NC
NC
DQ16 VSSQ
F
VSS DQM3
A3
A2
DQM2 VDD
G
A4
A5
A6
A10
A0
A1
H
A7
A8
NC
NC
NC
NC
J
CLK
CKE
A9
BA
CS
RAS
K
DQM1
NC
NC
CAS
WE
DQM0
L
VDDQ DQ8
VSS
VDD
DQ7 VSSQ
M
VSSQ DQ10 DQ9
DQ6
DQ5 VDDQ
N
VSSQ DQ12 DQ14
DQ1
DQ3 VDDQ
P
DQ11 VDDQ VSSQ
R
DQ13 DQ15 VSS
Elite Semiconductor Memory Technology Inc.
VDDQ VSSQ DQ4
VDD
DQ0
DQ2
Publication Date : Oct. 2008
Revision : 1.1
1/28
ESMT
M12L32321A
FUNCTIONAL BLOCK DIAGRAM
CLK
Clock
CKE
Generator
Column
Address
Buffer
&
Refresh
Counter
Address
Mode
Row Decoder
Register
Control Logic
Bank B
Row
Address
Buffer
&
Refresh
Counter
Bank A
CAS
WE
Column Decoder
Data Control Circuit
Input & Output
Buffer
RAS
DQM0~3
Latch Circuit
CS
Command Decoder
Sense Amplifier
DQ
PIN FUNCTION DESCRIPTION
CLK
Pin
Name
System Clock
CS
Chip Select
CKE
Clock Enable
A0 ~ A10
Address
BA
Bank Select Address
RAS
Row Address Strobe
CAS
Column Address Strobe
WE
Write Enable
DQM0~3
Data Input / Output Mask
Elite Semiconductor Memory Technology Inc.
Input Function
Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM.
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
Row / column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA10, column address : CA0 ~ CA7
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with
CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS , WE active.
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when DQM active.
Publication Date : Oct. 2008
Revision : 1.1
2/28
ESMT
M12L32321A
DQ0 ~ 31
VDD/VSS
Data Input / Output
Power Supply/Ground
VDDQ/VSSQ
Data Output Power/Ground
N.C/RFU
No Connection/
Reserved for Future Use
Data inputs/outputs are multiplexed on the same pins.
Power and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide improved
noise immunity.
This pin is recommended to be left No Connection on the device.
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to VSS
Voltage on VDD supply relative to VSS
Storage temperature
Power dissipation
Short circuit current
Symbol
Value
Unit
VIN,VOUT
VDD,VDDQ
TSTG
PD
IOS
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ + 150
0.7
50
V
V
°C
W
MA
Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA=0 to 70 °C )
Parameter
Supply voltage
Input logic high voltage
Input logic low voltage
Output logic high voltage
Output logic low voltage
Input leakage current
Output leakage current
Symbol
Min
Typ
Max
Unit
Note
VDD,VDDQ
VIH
VIL
VOH
VOL
IIL
IOL
3.0
2.0
-0.3
2.4
-5
-5
3.3
3.0
0
-
3.6
VDD+0.3
0.8
0.4
5
5
V
V
V
V
V
uA
uA
1
2
IOH =-2mA
IOL = 2mA
3
4
Note : 1.VIH (max) = 4.6V AC for pulse width ≤ 10ns acceptable.
2.VIL (min) = -1.5V AC for pulse width ≤ 10ns acceptable.
3.Any input 0V ≤ VIN ≤ VDD+ 0.3V, all other pins are not under test = 0V.
4.Dout is disabled, 0V ≤ VOUT ≤ VDD.
CAPACITANCE (VDD = 3.3V, TA = 25 °C , f = 1MHz)
Pin
Symbol
Min
Max
Unit
CLOCK
CCLK
2.5
4.0
pF
CIN
CADD
COUT
2.5
2.5
4.0
5.0
5.0
6.5
pF
pF
pF
RAS , CAS , WE , CS , CKE, DQM
ADDRESS
DQ0 ~DQ31
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
3/28
ESMT
M12L32321A
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70 °C VIH(min)/VIL(max)=2.0V/0.8V)
Parameter
Operating Current
(One Bank Active)
Precharge Standby
Current in power-down
mode
Precharge Standby
Current in non
power-down mode
Active Standby Current
in power-down mode
Active Standby Current
in non power-down
mode
(One Bank Active)
Symbol
Test Condition
CAS
Latency
ICC1
Burst Length = 1
tRC ≥ tRC (min), tCC ≥ tCC (min), IOL= 0mA
ICC2P
CKE ≤ VIL(max), tCC =15ns
ICC2PS
CKE ≤ VIL(max), CLK ≤ VIL(max), tCC = ∞
ICC2N
Version
-5.5
-6
-7
160
140
120
CKE ≥ VIH(min), CS ≥ VIH(min), tCC =15ns
Input signals are changed one time during 30ns
Unit Note
mA
1
2
mA
-
2
mA
-
25
mA
-
mA
-
mA
-
ICC2NS
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
15
ICC3P
CKE ≤ VIL(max), tCC =15ns
10
ICC3PS
CKE ≤ VIL(max), CLK ≤ VIL(max), tCC = ∞
10
ICC3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCC=15ns
Input signals are changed one time during 2clks
25
mA
15
mA
-
All other pins ≥ VDD-0.2V or ≤ 0.2V
ICC3NS
CKE ≥ VIH (min), CLK ≤ VIL(max), tCC= ∞
Input signals are stable
Operating Current
(Burst Mode)
ICC4
IOL= 0Ma, Page Burst
All Band Activated, tCCD = tCCD (min)
Refresh Current
ICC5
tRC ≥ tRC(min)
Self Refresh Current
ICC6
CKE ≤ 0.2V
-
3
160
140
120
mA
1
2
160
140
120
mA
1
160
140
120
mA
2
mA
-
1
Note: 1.Measured with outputs open. Addresses are changed only one time during tCC(min).
2.Refresh period is 64ms. Addresses are changed only one time during tCC(min).
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
4/28
ESMT
M12L32321A
AC OPERATING TEST CONDITIONS (VDD=3.3V ± 0.3V,TA= 0 to 70 °C )
Parameter
Input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Value
2.4 / 0.4
1.4
tr / tf = 1 / 1
1.4
See Fig.2
Unit
V
V
ns
V
3.3V
Vtt =1.4V
1200 Ω
50
Output
VOH(DC) = 2.4V, IOH = -2mA
VOL(DC) = 0.4V, IOL = 2mA
870 Ω
Output
Z0=50
Ω
Ω
30 pF
30 pF
(Fig.2) AC Output Load Circuit
(Fig.1) DC Output Load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Version
Symbol
-5.5
-6
-7
Unit
Note
Row active to row active delay
tRRD(min)
11
12
14
ns
1
RAS to CAS delay
tRCD(min)
16.5
18
20
ns
1
Row precharge time
tRP(min)
16.5
18
20
ns
1
tRAS(min)
33
36
42
ns
1
us
-
ns
1
Row active time
tRAS(max)
100
Row cycle time
tRC(min)
Last data in to new col. Address delay
tCDL(min)
1
CLK
2
Last data in to row precharge
tRDL(min)
2
CLK
2
Last data in to burst stop
tBDL(min)
1
CLK
2
Col. Address to col. Address delay
tCCD(min)
1
CLK
3
Refresh period (4,096 rows)
tREF(max)
64
ms
5
ea
4
Number of valid output data
60
CAS latency=3
CAS latency=2
60
63
2
1
1
1
Note: 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and
then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
The earliest a precharge command can be issued after a Read command without the loss of data is CL+BL-2 clocks.
5. A maximum of eight consecutive AUTO REFRESH commands (with tRFCmin) can be posted to any given SDRAM, and
the maximum absolute interval between any AUTO REFRESH command and the next AUTO REFRESH command is
8x15.6 μ s.)
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
5/28
ESMT
M12L32321A
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
CLK cycle time
CAS Latency =3
CAS Latency =2
CAS Latency =3
CLK to valid
output delay
CAS Latency =2
Symbol
tCC
tSAC
-5.5
Min
Max
5.5
10
-6
Min
6
1000
-7
Max
Min
7
1000
10
10
Max
Unit
Note
1000
ns
1
ns
1
-
6
-
6
-
6
-
6
-
6
-
6
Output data hold time
tOH
2.5
-
2.5
-
2.5
-
ns
2
CLK high pulse width
tCH
2
-
2
-
2.5
-
ns
3
CLK low pulse width
tCL
2
-
2
-
2.5
-
ns
3
Input setup time
tSS
1.8
-
2
-
2
-
ns
3
Input hold time
tSH
1.2
-
2
-
2
-
ns
3
CLK to output in Low-Z
tSLZ
0
-
0
-
0
-
ns
2
-
6
-
6
-
6
-
6
-
6
-
6
ns
-
CLK to output in
Hi-Z
CAS Latency =3
CAS Latency =2
tSHZ
*All AC parameters are measured from half to half.
Note: 1.Parameters depend on programmed CAS latency.
2.If clock rising time is longer than 1ns,(tr/2-0.5)ns should be added to the parameter.
3.Assumed input rise and fall time (tr & tf)=1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr+ tf)/2-1]ns should be added to the
parameter.
Parameter
CLK to valid
output delay
CAS Latency =3
CAS Latency =2
Output data hold time
CLK to output in
Hi-Z
CAS Latency =3
CAS Latency =2
Symbol
tSAC
tOH
tSHZ
-5.5
-6
Min
Max
Min
Max
-
5.5
-
5.5
-
5.5
-
5.5
2
-
2
-
-
5.5
-
5.5
-
5.5
-
5.5
Unit
Note
ns
4
ns
4
ns
4
Note: 4. Special condition (Output Load ≤ 10 ohm+10 pF)
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
6/28
ESMT
M12L32321A
MODE REGISTER FIELD TABLE TO PROGRAM MODES
Register Programmed with MRS
Address
BA
A11~A10/AP
A9
Function
RFU
RFU
W.B.L
Test Mode
A8
A7
A6
TM
CAS Latency
A5
A4
A3
CAS Latency
A2
BT
A1
A0
Burst Length
Burst Type
Burst Length
A8
A7
Type
A6
A5
A4
Latency
A3
Type
A2
A1
A0
BT = 0
BT = 1
0
0
Mode Register Set
0
0
0
Reserved
0
Sequential
0
0
0
1
1
0
1
Reserved
0
0
1
Reserved
1
Interleave
0
0
1
2
2
1
0
Reserved
0
1
0
2
0
1
0
4
4
1
1
Reserved
0
1
1
3
0
1
1
8
8
1
0
0
Reserved
1
0
0
Reserved Reserved
Write Burst Length
A9
Length
1
0
1
Reserved
1
0
1
Reserved Reserved
0
Burst
1
1
0
Reserved
1
1
0
Reserved Reserved
1
Single Bit
1
1
1
Reserved
1
1
1
Full Page Reserved
Full Page Length : 256
Note :
1. RFU(Reserved for future use) should stay “0” during MRS cycle.
2. If A9 is high during MRS cycle, “Burst Read Single Bit Write” function will be enabled.
3. The full column burst (256 bit) is available only at sequential mode of burst type.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
7/28
ESMT
M12L32321A
Burst Length and Sequence
(Burst of Two)
Starting Address
(column address A0 binary)
0
1
Sequential Addressing
Sequence (decimal)
0,1
1,0
Interleave Addressing
Sequence (decimal)
0,1
1,0
Sequential Addressing
Sequence (decimal)
0,1,2,3
1,2,3,0
2,3,0,1
3,0,1,2
Interleave Addressing
Sequence (decimal)
0,1,2,3
1,0,3,2
2,3,0,1
3,2,1,0
(Burst of Four)
Starting Address
(column address A1-A0, binary)
00
01
10
11
(Burst of Eight)
Starting Address
(column address A2-A0, binary)
000
001
010
0 11
100
101
11 0
111
Sequential Addressing
Sequence (decimal)
0,1,2,3,4,5,6,7
1,2,3,4,5,6,7,0
2,3,4,5,6,7,0,1
3,4,5,6,7,0,1,2
4,5,6,7,0,1,2,3
5,6,7,0,1,2,3,4
6,7,0,1,2,3,4,5
7,0,1,2,3,4,5,6
Interleave Addressing
Sequence (decimal)
0,1,2,3,4,5,6,7
1,0,3,2,5,4,7,6
2,3,0,1,6,7,4,5
3,2,1,0,7,6,5,4
4,5,6,7,0,1,2,3
5,4,7,6,1,0,3,2
6,7,4,5,2,3,0,1
7,6,5,4,3,2,1,0
Full page burst is an extension of the above tables of Sequential Addressing, with the length being 256 for device.
POWER UP SEQUENCE
1.Apply power and start clock, attempt to maintain CKE= “H”, DQM = “H” and the other pin are NOP condition at the inputs.
2.Maintain stable power, stable clock and NOP input condition for a minimum of 200us.
3.Issue precharge commands for all banks of the devices.
4.Issue 2 or more auto-refresh commands.
5.Issue mode register set command to initialize the mode register.
Cf.)Sequence of 4 & 5 is regardless of the order.
The device is now ready for normal operation.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
8/28
ESMT
M12L32321A
SIMPLIFIED TRUTH TABLE
COMMAND
Register
CKEn-1 CKEn CS
Mode Register Set
Auto Refresh
Entry
Self Refresh
Exit
Refresh
Bank Active & Row Addr.
Auto Precharge Disable
Read &
Column Address
Write & Column
Address
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
Burst Stop
Bank Selection
Both Banks
Precharge
Clock Suspend or
Active Power Down
Precharge Power Down Mode
H
H
X
H
L
WE
L
L
L
L
X
L
L
L
H
X
H
X
L
H
X
H
H
X
H
X
V
H
L
H
X
V
H
H
X
L
H
L
H
X
L
X
H
X
L
H
L
L
X
H
X
L
H
H
L
X
Entry
H
L
Exit
L
H
Entry
H
L
Exit
L
H
H
H
H
X
L
L
H
L
H
L
X
H
L
H
L
X
V
X
X
H
X
V
X
X
H
X
V
X
X
H
X
V
X
V
X
X
H
X
V
X
H
X
H
H
L
X
X
X
3
3
X
Row Address
Column
L
V
L
H
V
X
L
H
4
Address
(A0~A7) 4,5
Column
4
Address
4,5
(A0~A7)
H
X
No Operation Command
CAS
L
H
DQM
A11
Note
A9~A0
OP CODE
1,2
3
X
3
DQM BA A10/AP
RAS
X
X
6
4
4
X
X
X
X
V
X
X
X
7
(V= Valid, X= Don’t Care, H= Logic High , L = Logic Low)
Note:
1. OP Code: Operation Code
A0~ A10, BA: Program keys.(@MRS)
2. MRS can be issued only at both banks precharge state.
A new command can be issued after 2 clock cycle of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by “Auto”.
Auto / self refresh can be issued only at both banks idle state.
4.
BA: Bank select address.
If “Low”: at read, write, row active and precharge, bank A is selected.
If “High”: at read, write, row active and precharge, bank B is selected.
If A10/AP is “High” at row precharge, BA ignored and both banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read /write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but
makes
Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
9/28
ESMT
M12L32321A
Single Bit Read-Write-Read Cycle (Same Page) @CAS Latency=3, Burst Length=1
tCH
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
tCL
tCC
HIGH
CKE
tRAS
tRC
*Note1
tSH
CS
tRP
tRCD
tSS
tSH
RAS
tSS
tCCD
tSH
CAS
tSS
tSS
tSH
ADDR
Ra
Ca
Cb
*Note2
Rb
Cc
tSH
tSS
*Note2,3
BA
BS
BS
A10 /AP
Ra
*Note 3
*Note2,3
*Note2,3
BS
BS
*Note 3
*Note 3
*Note4
*Note2
BS
BS
*Note4
Rb
tRAC
tSAC
tSH
DQ
tSLZ
Qc
Db
Qa
tSS
tOH
tSH
WE
tSS
tSS
tSH
DQM
Row Active
Read
W rite
Read
Row Active
Precharge
:D on' t Care
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
10/28
ESMT
M12L32321A
*Note: 1. All inputs expect CKE & DQM can be don’t care when CS is high at the CLK high going edge.
2. Bank active & read/write are controlled by BA.
BA
Active & Read/Write
0
Bank A
1
Bank B
3.Enable and disable auto precharge function are controlled by A10/AP in read/write command.
A10/AP
0
1
BA
Operation
0
Disable auto precharge, leave bank A active at end of burst.
1
Disable auto precharge, leave bank B active at end of burst.
0
Enable auto precharge, precharge bank A at end of burst.
1
Enable auto precharge, precharge bank B at end of burst.
4.A10/AP and BA control bank precharge when precharge command is asserted.
A10/AP
BA
precharge
0
0
Bank A
0
1
Bank B
1
X
Both Banks
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
11/28
ESMT
M12L32321A
Power Up Sequence
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
High l evel is n ec es sar y
CS
tRC
tRC
tRP
RAS
CAS
ADDR
RAa
Key
BA
Key
A10 /AP
Key
RAa
High-Z
DQ
WE
DQM
High level is necessary
Precharge
All Banks
Auto Ref resh
Auto Ref resh
Mode R egis ter Set
( A- Ban k )
Row Active
: Don't care
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
12/28
ESMT
M12L32321A
Read & Write Cycle at Same Bank @Burst Length = 4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
t RC
*Note1
CS
tRCD
RAS
*Note2
CAS
ADDR
Ra
Rb
Ca0
Cb0
BA
A10/AP
Ra
Rb
tO H
CL=2
Qa0
t R AC
QC
Qa2
Qa1
t S AC
*Note3
CL=3
Qa1
Db0
tS H Z
tOH
Qa0
t
R AC
*Note3
Qa3
Qa2
Db2
Db3
tRDL
Qa3
t S AC
Db1
*Note4
Db0
tS H Z
*Note4
Db1
Db2
Db3
tRDL
WE
DQ M
Row Active
(A- Bank)
Read
(A- Bank)
Precharge
Row Active
(A- Bank)
(A- Bank)
W r ite
(A-Bank)
Precharge
(A- Bank)
: Don't care
*Note: 1.Minimum row cycle times is required to complete internal DRAM operation.
2.Row precharge can interrupt burst on any cycle. [CAS Latency-1] number of valid output data is available after Row
precharge. Last valid output will be Hi-Z(tSHZ) after the clock.
3.Access time from Row active command. tcc*(tRCD +CAS latency-1)+tSAC
4.Ouput will be Hi-Z after the end of burst.(1,2,4,8 bit burst)
Burst can’t end in Full Page Mode.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
13/28
ESMT
M12L32321A
Page Read & Write Cycle at Same Bank @ Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
CS
tRCD
RAS
*Note2
CAS
ADDR
Ra
Ca0
Cb0
Cc0
Cd0
BA
A10/AP
Ra
tRDL
CL=2
Qa0
Qa1
Qb0
Qb1
Qb2
Dc0
Qa0
Qa1
Qb0
Qb1
Dc0
Dc1
Dd0
Dd1
DQ
CL=3
Dc1
Dd0
Dd2
tCDL
WE
*Note3
*Note1
DQM
Row Active
(A-Bank)
Read
(A-Bank)
Read
(A-Bank)
Write
(A-Bank)
Write
(A-Bank)
Precharge
(A-Bank)
: Don't care
*Note :1.To write data before burst read ends, DQM should be asserted three cycle prior to write command to avoid bus
contention.
2.Row precharge will interrupt writing. Last data input, tRDL before Row precharge, will be written.
3.DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst.
Input data after Row precharge cycle will be masked internally.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
14/28
ESMT
M12L32321A
Page Read Cycle at Different Bank @ Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
HIGH
*Note1
CS
RAS
*Note2
CAS
ADDR
RAa
CAa
CAc
CBb
RBb
CBd
CAe
BA
A10/AP
RAa
RBb
CL=2
QAa0
QAa1
QAa2
QAa3
QBb0
QBb1
QBb2
QBb3
QAc0
QAc1
QBd0
QBd1
QAe0
QAe1
QAa0
QAa1
QAa2
QAa3
QBb0
QBb1
QBb2 QBb3
QAc0
QAc1
QBd0
QBd1
QAe0
DQ
CL=3
QAe1
WE
DQM
Row Active
(A-Bank)
Read
(A-Bank)
Read
(B-Bank)
Read
(A-Bank)
Read
(B-Bank)
Read
(A-Bank)
Precharge
(A-Bank)
Row Active
(B-Bank)
: Don't care
*Note: 1. CS can be don’t cared when RAS , CAS and WE are high at the clock high going dege.
2.To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
15/28
ESMT
M12L32321A
Page Write Cycle at Different Bank @Burst Length = 4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
CS
RAS
CAS
*Note2
ADDR
RAa
CAa
CBb
RBb
CAc
CBd
BA
A10/AP
RAa
DQ
RBb
DAa0
DAa1
DAa2
DAa3
DBb0
DBb1
DBb2 DBb3
DAc0
DAc1
DBd0
tCDL
DBd1
tRDL
WE
*Note1
DQM
Row Active
(A-Bank)
Row Active
(B-Bank)
Write
(A-Bank)
Write
(B-Bank)
Precharge
(Both Banks)
Write
(A-Bank)
Write
(B-Bank)
: Don't care
*Note: 1.To interrupt burst write by Row precharge, DQM should be asserted to mask invalid input data.
2.To interrupt burst write by row precharge, both the write and the precharge banks must be the same.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
16/28
ESMT
M12L32321A
Read & Write Cycle at Different Bank @ Burst Length = 4
*Note: 1.tCDL should be met to complete write.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
17/28
ESMT
M12L32321A
Read & Write Cycle with auto Precharge @ Burst Length =4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
CS
RAS
CAS
ADDR
Ra
Rb
Ra
Rb
Cb
Ca
BA
A10 /A P
CL= 2
Qa0
Q a1
Qa2
Q a3
Q a1
Qa2
Db0
Db1
Db2
Db3
Db0
Db1
Db2
Db3
DQ
CL=3
Q a0
Qa3
WE
DQM
Row Active
( A - Bank )
Read with
Auto Precharge
( A - Bank )
Auto Precharge
Start Point
( A - Bank)
W rite with
Auto Pr echarge
( B- Bank )
Auto Pr echarge
Star t Poin t
( B- Bank )
Row Active
( B - Bank )
:D on' t Ca re
*Note: 1.tCDL Should be controlled to meet minimum tRAS before internal precharge start
(In the case of Burst Length=1 & 2 and BRSW mode)
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
18/28
ESMT
M12L32321A
Clock Suspension & DQM Operation Cycle @CAS Latency=2, Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
CS
RAS
CAS
ADDR
Ra
Ca
Cb
Cc
BA
A10 /AP
Ra
Q a0
DQ
Qa1
Q a2
Qb0
Q a3
tSHZ
Q b1
Dc2
Dc 0
tSHZ
WE
*Note1
DQM
Row Active
Read
Clock
Suspension
Read
W rite
DQM
Read DQM
W rite
W rite
DQM
Cloc k
Sus pension
:Don't Car e
*Note:1.DQM is needed to prevent bus contention.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
19/28
ESMT
M12L32321A
Read Interrupted by Precharge Command & Read Burst Stop Cycle @Burst Length =Full page
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
CS
RAS
CAS
ADDR
RAa
CAa
CAb
BA
A10 /AP
RAa
*Note2
1
1
QAa0 QAa1 QAa2 QAa 3 QAa4
CL=2
DQ
QAb0 QAb1 QAb 2 QAb3 QAb4 QAb5
2
2
CL=3
QAa0 QAa1 QAa 2 QAa3 QAa4
WE
QAb0 QAb1 QAb2 QAb3 QAb4 QAb5
*Note1
DQM
Row Active
( A- B an k )
Read
(A- Ban k)
Burst Stop
Read
(A- Ban k)
Precharge
( A- B an k )
:Don't Care
*Note: 1.Burst can’t end in full page mode, so auto precharge can’t issue.
2.About the valid DQs after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated above timing diagram. See the label 1,2 on them.
But at burst write, burst stop and RAS interrupt should be compared carefully.
Refer the timing diagram of “Full page write burst stop cycle”.
3.Burst stop is valid at every burst length.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
20/28
ESMT
M12L32321A
Write Interrupted by Precharge Command & Write Burst stop Cycle @ Burst Length =Full page
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
HIGH
CKE
CS
RAS
CAS
ADDR
RAa
CAa
CAb
BA
A10 /AP
RAa
tBDL
tRDL
*Note2
DQ
DAa0 DAa1 DAa2 DAa3 DAa4
DAb0 DAb1 DAb2 DAb3 DAb4 DAb5
WE
DQM
Row Active
( A- B an k )
W rite
(A- Ban k )
Burst Stop
W rite
(A- Ban k )
Precharge
( A- B an k )
:Don't Care
*Note: 1. Burst can’t end in full page mode, so auto precharge can’t issue.
2.Data-in at the cycle of interrupted by precharge can not be written into the corresponding memory cell. It is defined by
AC parameter of tRDL.
DQM at write interrupted by precharge command is needed to prevent invalid write.
Input data after Row precharge cycle will be masked internally.
3.Burst stop is valid at every burst length.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
21/28
ESMT
M12L32321A
Burst Read Single bit Write Cycle @Burst Length=2
CLOCK
*Note1
HIGH
CKE
CS
RAS
*Note2
CAS
RAa
ADDR
CAa
RBb
CAb
CBc
RAc
CAd
BA
A10 /AP
RAa
RAc
RBb
CL=2
DAa0
CL= 3
DAa0
QAb0 QAb1
QAd0 QAd1
DBc0
DQ
QAb0 QAb1
QAd0 QAd1
DBc0
WE
DQM
Row Active
( A- B an k )
Row Active
(B-Bank)
W rite
(A- Ban k)
Read with
Auto Precharge
(A-Bank)
Read
( A- B an k )
Row Act ive
( A- B an k )
Precharge
( A- B an k )
W rite with
Auto Pr echarge
( B- Bank )
:Don't Care
*Note:1.BRSW modes is enabled by setting A9 “High” at MRS(Mode Register Set).
At the BRSW Mode, the burst length at write is fixed to “1” regardless of programmed burst length.
2.When BRSW write command with auto precharge is executed, keep it in mind that tRAS should not be violated.
Auto precharge is executed at the next cycle of burst-end, so in the case of BRSW write command, the precharge
command will be issued after two clock cycles.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
22/28
ESMT
M12L32321A
Active/Precharge Power Down Mode @CAS Latency=2, Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Q a0
Qa1
16
17
18
19
CLOCK
*Note2
tSS
CKE
tS S
*Note1
tS S
*Not e3
CS
RAS
CAS
Ra
ADDR
Ca
BA
A10 /A P
Ra
tSHZ
DQ
Qa2
WE
DQM
Pr ech ar ge
Pow er - Dow n
Entry
Row Active
Precharge
Power-Down
Exit
Active
Power-down
Entry
Read
Precharge
Active
Power-down
Exit
: Don't care
*Note :1.Both banks should be in idle state prior to entering precharge power down mode.
2.CKE should be set high at least 1CLK+tss prior to Row active command.
3.Can not violate minimum refresh specification. (64ms)
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
23/28
ESMT
M12L32321A
Self Refresh Entry & Exit Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
*Note2
*Note4
tRCmin
*Note6
*Note1
*Note3
CKE
tSS
CS
*Note5
RAS
*Note7
CAS
ADDR
BA
A10 /AP
Hi-Z
DQ
Hi-Z
WE
DQM
Sel f R ef r esh En tr y
S e l f R ef r e s h E xi t
Auto Refresh
: Don't care
*Note: TO ENTER SELF REFRESH MODE
1. CS , RAS & CAS with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don’t care except for CKE.
3. The device remains in self refresh mode as long as CKE stays “Low”.
cf.) Once the device enters self refresh mode, minimum tRAS is required before exit from self refresh.
TO EXIT SELF REFRESH MODE
4. System clock restart and be stable before returning CKE high.
5. CS Starts from high.
6. Minimum tRC is required after CKE going high to complete self refresh exit.
7. 4K cycles of burst auto refresh is required immediately before self refresh entry and immediately after self refresh
exit.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
24/28
ESMT
M12L32321A
Mode Register Set Cycle
0
1
2
3
4
5
Auto Refresh Cycle
6
0
1
2
3
4
5
6
7
8
9
10
CLOCK
HIGH
CKE
HIGH
CS
*Note2
tRC
RAS
*Note1
CAS
*Note3
ADDR
Key
DQ
Ra
Hi-Z
Hi-Z
WE
DQM
MRS
New C om m an d
Auto Ref res h
New C om m an d
:Don't Care
*Both banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.
MODE REGISTER SET CYCLE
*Note: 1. CS , RAS , CAS & WE activation at the same clock cycle with address key will set internal mode register.
2.Minimum 2 clock cycles should be met before new RAS activation.
3.Please refer to Mode Register Set table.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
25/28
ESMT
PACKING
90-BALL
M12L32321A
DIMENSIONS
SDRAM ( 8x13 mm )
Symbol
A
A1
A2
øb
D
E
D1
E1
e
Dimension in mm
Min
Norm
Max
1.40
0.30
0.40
0.84
0.89
0.94
0.40
0.50
7.90
8.00
8.10
12.90
13.00
13.10
6.40
11.20
0.80
Dimension in inch
Min
Norm
Max
0.055
0.012
0.016
0.033
0.035
0.037
0.016
0.020
0.311
0.315
0.319
0.508
0.512
0.516
0.252
0.441
0.031
Controlling dimension : Millimeter.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
26/28
ESMT
M12L32321A
Revision History
Revision
Date
0.1
2006.09.15
Original
0.2
2006.12.05
Add -5.5 & -6BG spec
0.3
2007.03.02
Delete BGA ball name of packing dimensions
0.4
2007.05.03
Modify DC Characteristics
0.5
2007.06.08
Add -5 spec
0.6
2007.07.10
Modify type error
0.7
2007.07.25
Add -5BG part No. into ordering information
0.8
2008.06.27
Modify the value of tSS and tSH
1.0
2008.08.19
1. Revision 1.0
2. Modify the value of tRC
2008.10.24
1. Modify ICC3N test condition description
2. Add tREF(max)
3. Update tSAC(max), tOH(min) and tSHZ(max) of -5.5 and -6
speed grade
4. Modify the description about self refresh operation
5. Delete -5 spec.
1.1
Elite Semiconductor Memory Technology Inc.
Description
Publication Date : Oct. 2008
Revision : 1.1
27/28
ESMT
M12L32321A
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or by
any means without the prior permission of ESMT.
The contents contained in this document are believed to be accurate at the
time of publication. ESMT assumes no responsibility for any error in this
document, and reserves the right to change the products or specification in
this document without notice.
The information contained herein is presented only as a guide or examples
for the application of our products. No responsibility is assumed by ESMT for
any infringement of patents, copyrights, or other intellectual property rights of
third parties which may result from its use. No license, either express ,
implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of ESMT or others.
Any semiconductor devices may have inherently a certain rate of failure. To
minimize risks associated with customer's application, adequate design and
operating safeguards against injury, damage, or loss from such failure,
should be provided by the customer when making application designs.
ESMT's products are not authorized for use in critical applications such as,
but not limited to, life support devices or system, where failure or abnormal
operation may directly affect human lives or cause physical injury or property
damage. If products described here are to be used for such kinds of
application, purchaser must do its own quality assurance testing appropriate
to such applications.
Elite Semiconductor Memory Technology Inc.
Publication Date : Oct. 2008
Revision : 1.1
28/28