ON AR023ZMCSC00SUEAR-GEVK 1/2.7-inch 2.1 mp/full hd digital image sensor Datasheet

ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features
1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
AR023ZM Datasheet, Rev. 1
For the latest revision, please visit www.onsemi.com
Features
sharp digital pictures, and its ability to capture both
continuous video and single frames makes it the perfect choice for a wide range of applications.
Table 1:
Key Parameters
• Superior low-light performance
• Latest 3.0 m pixel with ON Semiconductor
DR-Pix™ technology with Dual Conversion Gain
• Full HD support at up to 1080P 60 fps for superior
video performance
• Linear or high dynamic range capture
• Optional adaptive local tone mapping (ALTM)
• Pixel or Line interleaved T1/T2 output
• Support for external mechanical shutter
• On-chip phase-locked loop (PLL) oscillator
• Integrated position-based color and lens shading
correction
• Slave mode for precise frame-rate control
• Stereo/3D camera support
• Statistics engine
• Data interfaces: four-lane serial high-speed pixel
interface (HiSPi) differential signaling (SLVS and
HiVCM), or parallel
• Auto black level calibration
• High-speed configurable context switching
• Temperature sensor
Parameter
Optical format
1/2.7-inch (6.6 mm)
Active pixels
1928(H) x 1088(V) (16:9 mode)
Pixel size
3.0 m x 3.0m
Color filter array
RGB Bayer
Shutter type
Electronic rolling shutter and GRR
Input clock range
6 – 48 MHz
Output clock
maximum
148.5 Mp/s (4-lane HiSPi)
74.25 Mp/s (Parallel)
Output
Frame
rate
Serial
HiSPi 10-, 12-, 14-, 16-, or 20-bit
Parallel
10-, 12-bit
1080p
60 fps
Responsivity
4.0 V/lux-sec
SNRMAX
41 dB
Max Dynamic range Up to 105 dB
I/O
Applications
•
•
•
•
Typical Value
Supply Digital
voltage Analog
Smart Home Automation
Smart Lighting
Smart Appliances
Smart Baby Monitoring
HiSPi
1.8 or 2.8 V
1.8 V
2.8 V
0.3 V - 0.6 V (SLVS), 1.7 V - 1.9 V (HiVcm)
Power consumption
<896 mW (HDR 1080p60, 8x gain, 25°C)
(typical)
General Description
Operating
temperature
–30°C to +85°C ambient
ON Semiconductor's AR023ZM is a 1/2.7-inch CMOS
digital image sensor with an active-pixel array of
1928Hx1088V. It captures images in either linear or
high dynamic range modes, with a rolling-shutter
readout. It includes sophisticated camera functions
such as in-pixel binning, windowing and both video
and single frame modes. It is designed for both low
light and high dynamic range scene performance. It is
programmable through a simple two-wire serial interface. The AR023ZM produces extraordinarily clear,
Package options
10x10 mm 80-pin iBGA
AR023ZM/D Rev. 1 Pub. 8/15 EN
1
©Semiconductor Components Industries, LLC 2015,
ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
AR023ZMCSC00SUEA0-DRBR
2 Mp 1/3" CIS RGB, 0deg CRA, iBGA Package
Drypack, Anti-Reflective Glass
AR023ZMCSC00SUEAD3-GEVK
RGB, 0deg CRA, Demo Kit
Demo Kit
AR023ZMCSC00SUEAH3-GEVB
RGB, 0deg CRA, Headboard
Headboard
AR023ZMCSC00SUEAR-GEVK
RGB, 0deg CRA
MatrixCam
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full
description of the naming convention used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
AR023ZM/D Rev. 4 Pub. 8/15 EN
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©Semiconductor Components Industries, LLC, 2015.
ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Features Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
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©Semiconductor Components Industries, LLC, 2015.
ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
List of Figures
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Block Diagram of AR023ZM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Typical Configuration: Serial Four-Lane HiSPi Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
80-Ball IBGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Quantum Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
80iBGA 10 x 10 Package Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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©Semiconductor Components Industries, LLC, 2015.
ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Table 21:
Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Descriptions, 80-ball iBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
List of Configurable Registers for Context A and Context B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
I/O Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
1080p30 HDR (ALTM) 74MHz Parallel 2.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
1080p30 Linear 74MHz Parallel 2.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
1080p30 HDR (ALTM) 74MHz Parallel 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
1080p30 Linear 74 MHz Parallel 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
1080p30 HDR (ALTM) 74 MHz HiSPi SLVS (Low Power Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
1080p30 Linear 74 MHz HiSPi SLVS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
1080p30 HDR (ALTM) 74 MHz HiSPi HiVcm (Low Power Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
1080p30 Linear 74 MHz HiSPi HiVcm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Line Interleaved HiSPi SLVS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Line Interleaved HiSPi HiVcm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Channel Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
General Description
General Description
The ON Semiconductor AR023ZM can be operated in its default mode or programmed
for frame size, exposure, gain, and other parameters. The default mode output is a
1080p-resolution image at 60 frames per second (fps) through the HiSPi port. In linear
mode, it outputs 12-bit or 10-bit A-Law compressed raw data, using either the parallel or
serial (HiSPi) output ports. In high dynamic range mode, it outputs 12-bit compressed
data using parallel output. In HiSPi mode, 12- or 14-bit compressed, or 16-bit linearized
data may be output. The device may be operated in video (master) mode or in single
frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a
synchronized pixel clock in parallel mode.
The AR023ZM includes additional features to allow application-specific tuning:
windowing and offset, auto black level correction, and on-board temperature sensor.
Optional register information and histogram statistic information can be embedded in
the first and last 2 lines of the image frame.
The AR023ZM is designed to operate over a wide temperature range of -30°C to +85°C
ambient.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Functional Overview
The AR023ZM is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally
enabled to generate all internal clocks from a single master input clock running between
6 and 48 MHz. The maximum output pixel rate is 148.5 Mp/s, corresponding to a clock
rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor configured in linear
mode, and in HDR mode.
Figure 1:
Block Diagram of AR023ZM
In Linear Mode
In HDR Mode
ADC Data
ADC Data
12
12
Row Noise Correction
Row Noise Correction
Black Level Correction
Black Level Correction
Test Pattern Generator
Test Pattern Generator
Pixel Defect Correction
Pixel Defect Correction
Adaptive CD Filter
Adaptive CD Filter
12
12
Digital Gain and Pedestal
Digital Gain and Pedestal
Motion Correction
HDR
HDRLinearization
Linearization
A-Law Compression
Smoothing Filter
10 bits
16
12 bits
16 bits
HiSPi
Parallel
Companding or ALTM
14 or 12 bits
HiSPi
12 bits
Parallel
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 2.1 Mp Active- Pixel Sensor array. The timing and control circuitry sequences
through the rows of the array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the pixels in the row integrate
incident light. The exposure is controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the columns is sequenced through an
analog signal chain (providing offset correction and gain), and then through an analogto-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in
the array. The ADC output passes through a digital processing signal chain (which
provides further data path corrections and applies digital gain). The sensor also offers a
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
high dynamic range mode of operation where multiple images are combined on-chip to
produce a single image at 16-bit per pixel value. A compression mode is further offered
to allow the 16 bits per pixel to be transmitted to the host system as a 12-bit value with
close to zero loss in image quality.
Typical Configuration: Serial Four-Lane HiSPi Interface
VDD_IO
1.5kΩ2
1.5kΩ2
Digital Digital
I/O
Core
power1 power1
VDD
Master clock
(6–48 MHz)
EXTCLK
From
controller
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
RESET_BAR
HiSPi
power1
VDD_SLVS
Figure 2:
VDD
Notes:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
VDD_SLVS
VDD_PLL
VAA
VDD_PLL
VAA
VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
FLASH
SHUTTER
TEST
VDD_IO
PLL
Analog Analog
power1 power1 power1
DGND
AGND
Digital
ground
Analog
ground
To
controller
VAA_PIX
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The parallel interface output pads can be left unconnected if the serial output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR023ZM demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
8
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Figure 3:
Typical Configuration: Parallel Pixel Data Interface
1.5kΩ2,
1.5kΩ2
Digital Digital
core
I/O
power1 power1
Master clock
(6-48 MHz)
VDD_IO
PLL Analog Analog
power1 power1 power1
VDD
DOUT [11:0]
EXTCLK
PIXCLK
LINE_VALID
FRAME_VALID
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
From
Controller
VAA_PIX
VDD_PLL VAA
To
controller
FLASH
SHUTTER
RESET_BAR
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
AGND
Analog
ground
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The serial interface output pads and VDDSLVS can be left unconnected if the parallel output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR023ZM demo headboard schematics for circuit recommendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7. The EXTCLK input is limited to 6-48 MHz.
9
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Figure 4:
80-Ball IBGA Package
1
A
2
3
4
5
6
7
8
9
SLVS0_P
SLVS1_P
SLVSC_P
SLVS2_P
SLVS3_P
VDD
VDD_IO
SLVSC_N
SLVS2_N
SLVS3_N
DGND
DGND
SHUTTER
DGND
DGND
DGND
Reserved
TRIGGER
DGND
AGND
AGND
B
VDD_PLL
SLVS0_N
SLVS1_N
C
VAA
AGND
DGND
VDD_
SLVS
VDD
D
VDD
DGND
EXTCLK
PIXCLK
SADDR
E
VDD_IO
DGND
SDATA
FLASH
FRAME_
VALID
SCLK
DGND
F
VDD
DGND
DOUT11
DOUT10
DOUT9
LINE_
VALID
Reserved
G
VAA
AGND
DGND
DOUT8
DOUT7
DOUT6
H
VDD_IO
DGND
DGND
DOUT5
DOUT4
DOUT3
J
DOUT2
VDD_IO
DOUT1
DOUT0
VDD
DGND
VDD
VAA
VAA_PIX
AGND
VAA
DGND
DGND
VDD_IO
RESET_
BAR
TEST
VDD_IO
VDD
OE_BAR
VDD_IO
Top View
(Ball Down)
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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©Semiconductor Components Industries, LLC, 2015.
ON Semiconductor Confidential and Proprietary
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Table 3:
Pin Descriptions, 80-ball iBGA
Name
iBGA Pin
Type
Description
SLVS0_P
A2
Output HiSPi serial data, lane 0, differential P.
SLVS1_P
A3
Output HiSPi serial data, lane 1, differential P.
SLVSC_P
A4
Output HiSPi serial DDR clock differential P.
SLVS2_P
A5
Output HiSPi serial data, lane 2, differential P.
SLVS3_P
A6
Output HiSPi serial data, lane 3, differential P.
VDD_PLL
B1
Power
SLVS0_N
B2
Output HiSPi serial data, lane 0, differential N.
PLL power.
SLVS1_N
B3
Output HiSPi serial data, lane 1, differential N.
SLVSC_N
B4
Output HiSPi serial DDR clock differential N.
SLVS2_N
B5
Output HiSPi serial data, lane 2, differential N.
SLVS3_N
B6
Output HiSPi serial data, lane 3, differential N.
SHUTTER
B9
Output Control for external mechanical shutter. Can be left floating if not used.
VAA
C1, G1, D9, F9
Power
Analog power.
AGND
C2, G2, D8, E8, F8
Power
Analog ground.
VDD_SLVS
C4
Power
0.3V-0.6V or 1.7V - 1.9V port to HiSPi Output Driver. Set the High_VCM
(R0x306E[9]) bit to 1 when configuring VDD_SLVS to 1.7 – 1.9V.
VDD
C5, J5, A9, H9, A7, D1, F1
Power
Digital power.
Power
Digital ground.
Input
External input clock.
Reserved
C9, F7
DGND
EXTCLK
B7, C7, D7, E7, G7, B8, C8, G8,
D2, E2, F2, H2, C3, G3, H3, C6,
J6
D3
PIXCLK
D4
Output Pixel clock out. Dout is valid on rising edge of this clock.
SADDR
D5
Input
TRIGGER
D6
Input
Exposure synchronization input.
VAA_PIX
E9
Power
Pixel power.
VDD_IO
E1, H1, J2, J7, A8, G9, J9
Power
I/O supply power.
SDATA
E3
I/O
Two-Wire Serial data I/O.
Two-Wire Serial address select. 0: 0x20. 1: 0x30
FLASH
E4
Output Flash control output.
FRAME_VALID
E5
Output Asserted when Dout frame data is valid.
SCLK
E6
Input
DOUT11
F3
Output Parallel pixel data output (MSB)
DOUT10
F4
Output Parallel pixel data output.
DOUT9
F5
Output Parallel pixel data output.
LINE_VALID
F6
Output Asserted when Dout line data is valid.
DOUT8
G4
Output Parallel pixel data output.
DOUT7
G5
Output Parallel pixel data output.
DOUT6
G6
Output Parallel pixel data output.
DOUT5
H4
Output Parallel pixel data output.
DOUT4
H5
Output Parallel pixel data output.
DOUT3
H6
Output Parallel pixel data output.
RESET_BAR
H7
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Input
Two-Wire Serial clock input.
Asynchronous reset (active LOW). All settings are restored to factory
default.
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Functional Overview
Table 3:
Pin Descriptions, 80-ball iBGA
Name
iBGA Pin
Type
Description
TEST
H8
Input.
Manufacturing test enable pin (connect to Dgnd).
DOUT2
J1
Output Parallel pixel data output.
DOUT1
J3
Output Parallel pixel data output.
DOUT0
J4
Output Parallel pixel data output (LSB)
OE_BAR
J8
Input
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Output enable (active LOW).
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Pixel Data Format
Pixel Data Format
Pixel Array Structure
While the sensor's format is 1928 x1088, additional active columns and active rows are
included for use when horizontal or vertical mirrored readout is enabled, to allow
readout to start on the same pixel. The pixel adjustment is always performed for monochrome or color versions. The active area is surrounded with optically transparent
dummy pixels to improve image uniformity within the active area. Not all dummy pixels
or barrier pixels can be read out.
Figure 5:
Pixel Array Description
1944
10 barrier + 4 border pixels
19281 x 1088
5.78 mm x 3.26 mm
1116
2 barrier + 6 border pixels
2 barrier + 6 border pixels
10 barrier + 4 border pixels
Light dummy
pixel
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Active pixel
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Pixel Data Format
Figure 6:
Pixel Color Pattern Detail (Top Right Corner)
Column Readout Direction
Row Readout Direction
Active Pixel (0,0)
Array Pixel (0, 0)
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
Default Readout Order
By convention, the sensor core pixel array is shown with pixel (0,0) in the top right
corner (see Figure 6). This reflects the actual layout of the array on the die. Also, the first
pixel data read out of the sensor in default condition is that of pixel (10, 14).
When the sensor is imaging, the active surface of the sensor faces the scene as shown in
Figure 7. When the image is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 7.
Figure 7:
Imaging a Scene
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Pixel (0,0)
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Features Overview
Features Overview
For a complete description, recommendations, and usage guidelines for product
features, refer to the AR023ZM Developer Guide.
3.0m Dual Conversion Gain Pixel
To improve the low light performance and keep the high dynamic range, a large (3.0um)
dual conversion gain pixel is implemented for better image optimization. With a dual
conversion gain pixel, the conversion gain of the pixel may be dynamically changed to
better adapt the pixel response based on dynamic range of the scene. This gain can be
switched manually or automatically by an auto exposure control module.
HDR
By default, the sensor powers up in HDR Mode. The HDR scheme used is multi-exposure
HDR. This allows the sensor to handle up to 105 dB of dynamic range. In HDR mode, the
sensor sequentially captures two exposures by maintaining two separate read and reset
pointers that are interleaved within the rolling shutter readout. The intermediate pixel
values are stored in line buffers while waiting for the two exposure values to be present.
As soon as a pixel's two exposure values are available, they are combined to create a
linearized 16-bit value for each pixel's response. The exposure ratio may be set to 4x, 8x,
16x, or 32x. Depending on whether HiSPi or Parallel mode is selected, the full 16 bit value
may be output, it can be compressed to 12 bits using Adaptive Local Tone Mapping
(ALTM), or companded to 12 or 14 bits.
Options to output T1 only, T2 only, or pixel interleaved data are also available. Individual
exposures may be read out in a line interleaved mode as described in the T1/T2 Line
Interleaved Mode section.
Resolution
The active array supports a maximum of 1928x1088 pixels to support 1080p resolution.
Utilizing a 3.0um pixel will result in an optical format of 1/2.7-inch (approximately
6.6mm diagonal).
Frame Rate
At full (1080p) resolution, the AR023ZM is capable of running up to 3060 fps.
Image Acquisition Mode
The AR023ZM supports two image acquisition modes:
• Electronic rolling shutter (ERS) mode
This is the normal mode of operation. When the AR023ZM is streaming, it generates
frames at a fixed rate, and each frame is integrated (exposed) using the ERS. When ERS
mode is in use, timing and control logic within the sensor sequences through the rows of
the array, resetting and then reading each row in turn. In the time interval between resetting a row and subsequently reading that row, the pixels in the row integrate incident
light. The integration (exposure) time is controlled by varying the time between row
reset and row readout. For each row in a frame, the time between row reset and row
readout is the same, leading to a uniform integration time across the frame. When the
integration time is changed (by using the two-wire serial interface to change register
settings), the timing and control logic controls the transition from old to new integration
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Features Overview
time in such a way that the stream of output frames from the AR023ZM switches cleanly
from the old integration time to the new while only generating frames with uniform integration. See “Changes to Integration Time” in the AR023ZM Register Reference.
• Global reset mode.
This mode can be used to acquire a single image at the current resolution. In this mode,
the end point of the pixel integration time is controlled by an external electromechanical
shutter, and the AR023ZM provides control signals to interface to that shutter. The
benefit of using an external electromechanical shutter is that it eliminates the visual artifacts associated with ERS operation. Visual artifacts arise in ERS operation, particularly
at low frame rates, because an ERS image effectively integrates each row of the pixel
array at a different point in time.
Embedded Data and Statistics
The AR023ZM has the capability to output image data and statistics embedded within
the frame timing. There are two types of information embedded within the frame
readout.
• Embedded Data:
If enabled, these are displayed on the two rows immediately before the first active
pixel row is displayed.
• Embedded Statistics:
If enabled, these are displayed on the two rows immediately after the last active pixel
row is displayed.
Multi-Camera Synchronization
The AR023ZM supports advanced line synchronization controls for multi-camera
(stereo) support.
Slave Mode
The slave mode feature of the AR023ZM supports triggering the start of a frame readout
from an input signal that is supplied from an external ASIC. The slave mode signal allows
for precise control of frame rate and register change updates.
Context Switching and Register Updates
The user has the option of using the highly configurable context memory, or a simplified
implementation in which only a subset of registers is available for switching. The
AR023ZM supports a highly configurable context switching RAM of size 256 x 16. Within
this Context Memory, changes to any register may be stored. The register set for each
context must be the same, but the number of contexts and registers per context are
limited only by the size of the context memory.
Alternatively, the user may switch between two predefined register sets A and B by
writing to a context switch change bit. When the context switch is configured to context
A the sensor will reference the context A registers. If the context switch is changed from A
to B during the readout of frame n, the sensor will then reference the context B
coarse_integration_time registers in frame n+1 and all other context B registers at the
beginning of reading frame n+2. The sensor will show the same behavior when changing
from context B to context A. The registers listed in Table 4 are context-switchable:
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Features Overview
Table 4:
List of Configurable Registers for Context A and Context B
Context A
Context B
Register Description
Register Description
coarse_integration_time
coarse_integration_time_cb
line_length_pck
line_length_pck_cb
frame_length_lines
frame_length_lines_cb
row_bin
row_bin_cb
col_bin
col_bin_cb
fine_gain
fine_gain_cb
coarse_gain
coarse_gain_cb
x_addr_start
x_addr_start_cb
y_addr_start
y_addr_start_cb
x_addr_end
x_addr_end_cb
y_addr_end
y_addr_end_cb
y_odd_inc
y_odd_inc_cb
x_odd_inc
x_odd_inc_cb
green1_gain
green1_gain_cb
blue_gain
blue_gain_cb
red_gain
red_gain_cb
green2_gain
green2_gain_cb
global_gain
global_gain_cb
operation_mode_ctrl
operation_mode_ctrl_cb
bypass_pix_comb
bypass_pix_comb_cb
Motion Compensation/DLO
In typical multi-exposure HDR systems, motion artifacts can be created when objects
move during the T1 or T2 integration time. When this happens, edge artifacts can potentially be visible and might look like a ghosting effect. To correct this, the AR023ZM has
special 2D motion compensation circuitry that detects motion artifacts and corrects the
image. The motion compensation feature can be optionally enabled by register write.
Additional parameters are available to control the extent of motion detection and
correction as per the requirements of the specific application.
Tone Mapping
Real-world scenes often have a very high dynamic range (HDR) that far exceeds the electrical dynamic range of the imager. Dynamic range is defined as the luminance ratio
between the brightest and the darkest objects in a scene. Even though the AR023ZM can
capture full dynamic range images, the images are still limited by the low dynamic range
of display devices. Today's typical LCD monitor has a contrast ratio around 1,000:1 while
it is not atypical for an HDR image having a contrast ratio of around 250,000:1. Therefore, in order to reproduce HDR images on a low dynamic range display device, the
captured high dynamic range must be compressed to the available range of the display
device. This is commonly called tone mapping. The AR023ZM has implemented an
adaptive local tone mapping (ALTM) feature to reproduce visually appealing images that
increase the local contrast and the visibility of the images.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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Features Overview
Adaptive Color Difference (ADACD) Noise Filtering
A good noise reduction filter will remove noise from an image while retaining as much
image detail as possible. To retain image detail, the noise reduction filter must adapt to
the image signal. To remove noise, the noise reduction filter must adapt to the noise level
of the image signal. The key is to remove the appropriate amount of noise. Over-filtering
will cause image blurring while under-filtering will leave noise in the image. The AdaCD
algorithm relies on a noise model derived from characterization data to aid in separating
noise from signal.
The AR023ZM AdaCD algorithm performs pixel-by-pixel color noise correction for each
of the red, blue, and green color planes. Each pixel is corrected based on surrounding
pixel values on the same color plane and a noise model. The noise model is based on
characterization data, and takes into account applied analog gain.
Fast Mode Switch (Combi Mode)
To facilitate faster switching between linear and HDR modes, the AR023ZM includes a
Combi Mode feature. When enabled, Combi Mode loads a single (HDR) sequencer.
When switching from HDR to linear modes, the sequencer remains the same, but only
the T1 image is output. While not optimized for linear mode operation, it allows faster
mode switching as a new sequencer load is not needed. Switching between modes may
result in the output of one bad frame.
Analog/Digital Gains
A programmable analog gain of 1.5x to 12x (HDR) and 1.5x to 16x (linear) applied simultaneously to all color channels will be featured along with a digital gain of 1x to 16x that
may be configured on a per color channel basis.
Skipping/Binning Modes
The AR023ZM supports subsampling. Subsampling allows the sensor to read out a
smaller set of active pixels by either skipping, binning, or summing pixels within the
readout window. Horizontal binning is achieved in the digital readout. The sensor will
sample the combined 2x adjacent pixels within the same color plane. Vertical row
binning is applied in the pixel readout. Row binning can be configured as 2x rows within
the same color plane. Pixel skipping can be configured up to 2x in both the x-direction
and y-direction. Skipping pixels in the x-direction will not reduce the row time. Skipping
pixels in the y direction will reduce the number of rows from the sensor effectively
reducing the frame time. Skipping will introduce image artifacts from aliasing.
The AR023ZM supports row wise vertical binning. Row wise vertical summing is not
supported.
Clocking Options
The sensor contains a phase-locked loop (PLL) that is used for timing generation and
control. The required VCO clock frequency is attained through the use of a pre-PLL clock
divider followed by a multiplier. The PLL multiplier should be an even integer. If an odd
integer (M) is programmed, the PLL will default to the lower (M-1) value to maintain an
even multiplier value. The multiplier is followed by a set of dividers used to generate the
output clocks required for the sensor array, the pixel analog and digital readout paths,
and the output parallel and serial interfaces. Use of the PLL is required when using the
HiSPi interface.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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Temperature Sensor
The AR023ZM sensor has a built-in PTAT-based temperature sensor, accessible through
registers, that is capable of measuring die junction temperature. The value read out from
the temperature sensor register is an ADC output value that needs to be converted
downstream to a final temperature value in degrees Celsius. Since the PTAT device characteristic response is quite linear in the temperature range of operation required, a
simple linear function can be used to convert the ADC output value to the final temperature in degrees Celsius.
A single reference point will be made available via register read as well as a slope for
back-calculating the junction temperature value. An error of +/-5% or better over the full
specified operating range of the sensor is to be expected.
Silicon / Firmware / Sequencer Revision Information
A revision register will be provided to read out (via I2C) silicon and sequencer/OTPM
revision information. This will be helpful to distinguish among different lots of material
if there are future OTPM or sequencer revisions.
Lens Shading Correction
The latest lens shading correction algorithm will be included for potential low Z height
applications.
Companding
The 16-bit linearized HDR image may be compressed to 12- or 14- bits using on-chip
companding. This is useful if on-chip ALTM will not be used and the ISP cannot handle
16 bit data.
Compression
When the AR023ZM is configured for linear mode operation, the sensor can optionally
compress 12-bit data to 10-bit using A-law compression. The A-law compression is
disabled by default.
Packaging
The AR023ZM will be offered in a 10x10 80-iBGA package (parallel and HiSPi). The
package will have anti-reflective coating on both sides of the cover glass.
Parallel Interface
The parallel pixel data interface uses these output-only signals:
• FRAME_VALID
• LINE_VALID
• PIXCLK
• DOUT[11:0]
The parallel pixel data interface is disabled by default at power up and after reset. It can
be enabled by programming R0x301A. When the parallel pixel data interface is in use,
the serial data output signals can be left unconnected.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
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Features Overview
High Speed Serial Pixel (HiSPi) Interface
The HiSPi interface supports three protocols, Streaming-S, Streaming-SP, and Packetized
SP. The streaming protocols conform to a standard video application where each line of
active or intra-frame blanking provided by the sensor is transmitted at the same length.
The Packetized SP protocol will transmit only the active data ignoring line-to-line and
frame-to-frame blanking data.
The HiSPi interface building block is a unidirectional differential serial interface with
four data and one double data rate (DDR) clock lanes. One clock for every four serial
data lanes is provided for phase alignment across multiple lanes. The AR023ZM
supports serial data widths of 10, 12, 14, 16, or 20 bits on one, two, or four lanes. The
specification includes a DLL to compensate for differences in group delay for each data
lane. The DLL is connected to the clock lane and each data lane, which acts as a control
master for the output delay buffers. Once the DLL has gained phase lock, each lane can
be delayed in 1/8 unit interval (UI) steps. This additional delay allows the user to
increase the setup or hold time at the receiver circuits and can be used to compensate
for skew introduced in PCB design. Delay compensation may be set for clock and/or
data lines in the hispi_timing register R0x31C0. If the DLL timing adjustment is not
required, the data and clock lane delay settings should be set to a default code of 0x0000
to reduce jitter, skew, and power dissipation.
Sensor Control Interface
The two-wire serial interface bus enables read/write access to control and status registers within the AR023ZM. The interface protocol uses a master/slave model in which a
master controls one or more slave devices. The sensor acts as a slave device. The master
generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers.
Data is transferred between the master and the slave on a bidirectional signal (SDATA).
SDATA is pulled up to VDD_IO off-chip by a 1.5k resistor. Either the slave or master
device can drive SDATA LOW-the interface protocol determines which device is allowed
to drive SDATA at any given time. The two-wire serial interface can run at 100 kHz or 400
kHz.
T1/T2 Line Interleaved Mode
The AR023ZM has the capability to output the T1 and T2 exposures separately, in a line
interleaved format. The purpose of this is to enable off chip HDR linear combination
and processing. See the AR023ZM Developer Guide for more information.
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Features Overview
Figure 8:
Quantum Efficiency
80
B lue
70
Q uantum E fficiency (% )
G reen (B )
G reen (R )
60
R ed
50
40
30
20
10
0
350
450
550
650
750
850
950
1050
1150
W avelength (nm )
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Electrical Specifications
Electrical Specifications
Unless otherwise stated, the following specifications apply under the following conditions: VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;
VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +85°C-40°C to +105°C; output load = 10pF;
frequency = 74.25 MHz; HiSPi off.
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 9 and Table 5.
Figure 9:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tf
tSU;DAT
tr
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
tHD;DAT
Note:
Table 5:
tSU;STA
tHIGH
tSU;STO
Sr
P
S
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register
address are issued.
Two-Wire Serial Bus Characteristics
fEXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; T = 25°C
A
Standard Mode
Parameter
Symbol
Min
Max
fSCL
0
tHD;STA
4.0
LOW period of the SCLK clock
tLOW
4.7
HIGH period of the SCLK clock
t
HIGH
4.0
SU;STA
4.7
HD;DAT
04
3.455
SCLK Clock Frequency
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
Set-up time for a repeated START
condition
t
Data hold time
t
Data set-up time
t
Fast Mode
Min
Max
Unit
100
0
400
KHz
-
0.6
-
s
-
1.3
-
s
-
0.6
-
s
-
0.6
-
s
06
0.95
s
6
SU;DAT
250
-
100
-
ns
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
ns
Fall time of both SDATA and SCLK signals
t
7
Set-up time for STOP condition
Bus free time between a STOP and START
condition
Capacitive load for each bus line
AR0230CS_DS Rev. 4 Pub. 8/15 EN
f
-
300
20 + 0.1Cb
300
ns
tSU;STO
4.0
-
0.6
-
s
tBUF
4.7
-
1.3
-
s
Cb
-
400
-
400
pF
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Electrical Specifications
Table 5:
Two-Wire Serial Bus Characteristics (continued)
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V; VDD_PLL = 2.8V; TA = 25°C
Standard Mode
Fast Mode
Parameter
Symbol
Min
Max
Min
Max
Unit
Serial interface input pin capacitance
CIN_SI
-
3.3
-
3.3
pF
SDATA max load capacitance
SDATA pull-up resistor
Notes:
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
Two-wire control is I2C-compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according
to the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
1.
2.
3.
4.
I/O Timing
By default, the AR023ZM launches pixel data, FV, and LV with the falling edge of PIXCLK.
The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of
PIXCLK.
See Figure 10 below and Table 6 on page 24 for I/O timing (AC) characteristics.
Figure 10:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
PIXCLK
t PD
Data[11:0]
LINE_VALID/
FRAME_VALID
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Pxl _0
Pxl _1
Pxl _2
Pxl _n
t PLH
t PFL
t PFH
t PLL
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
23
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
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Table 6:
I/O Timing Characteristics
Symbol
Definition
fEXTCLK1s
Input clock frequency
Condition
tEXTCLK1
Input clock period
Min
Typ
Max
Unit
6
–
48
MHz
20.8
–
166
ns
tR
Input clock rise time
–
3
–
ns
–
3
–
ns
tF
Input clock fall time
tRP
Pixclk rise time
2
3.5
5
ns
tFP
Pixclk fall time
2
3.5
5
ns
Clock duty cycle
45
50
55
%
EXTCLK to PIXCLK propagation delay
Nominal voltages,
PLL Disabled
10
14
18
ns
PIXCLK frequency
Default,
Nominal Voltages
6
74.25
MHz
tPD
PIXCLK to data valid
Default,
Nominal Voltages
3.6
5.5
9.5
ns
tPFH
PIXCLK to FV HIGH
Default,
Nominal Voltages
2.9
5.3
9
ns
tPLH
PIXCLK to LV HIGH
Default,
Nominal Voltages
2.9
5
9
ns
tPFL
PIXCLK to FV LOW
Default,
Nominal Voltages
2.9
5
9
ns
tPLL
PIXCLK to LV LOW
Default,
Nominal Voltages
2.9
4.8
9
ns
Output load capacitance
–
<10
–
pF
Input pin capacitance
–
2.5
–
pF
tCP
fPIXCLK
CLOAD
CIN
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
I/O timing characteristics are measured under the following conditions:
- Temperature is 25°C ambient
- 10 pF load
- 1.8V I/O supply voltage
24
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
DC Electrical Characteristics
The DC electrical characteristics are shown in the tables below.
Table 7:
DC Electrical Characteristics
Symbol
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.95
V
VDD_IO
I/O digital voltage
1.7/2.5
1.8/2.8
1.9/3.1
V
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
VAA
Pixel supply voltage
2.5
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.5
2.8
3.1
V
VDD_SLVS
HiSPi supply voltage
0.3
0.4
0.6
V
VIH
Input HIGH voltage
VDD_IO*0.7
–
–
V
VIL
Input LOW voltage
–
–
VDD_IO*0.3
V
20
–
–
A
IIN
Input leakage current
No pull-up resistor; VIN = VDD_IO or
DGND
VOH
Output HIGH voltage
VDD_IO-0.3
–
–
V
VOL
Output LOW voltage
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
-22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
Caution
Table 8:
Stresses greater than those listed in Table 8 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Definition
Condition
Min
Max
Unit
VDD_MAX
Core digital voltage
–0.3
2.4
V
VDD_IO_MAX
I/O digital voltage
–0.3
4
V
VAA_MAX
VAA_PIX
VDD_PLL
VDD_SLVS_MAX
tST
Analog voltage
–0.3
4
V
Pixel supply voltage
–0.3
4
V
PLL supply voltage
–0.3
4
V
HiSPi I/O digital voltage
–0.3
2.4
V
Storage temperature
–40
85
°C
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
25
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 9:
1080p30 HDR (ALTM) 74MHz Parallel 2.8V
Definition
Voltage
Min
Typ
Max
Digital operating current
Streaming 1080p30
Condition
IDD
1.8
90
175
220
I/O digital operating current
Streaming 1080p30
IDD_IO
2.8
10
30
50
Analog operating current
Streaming 1080p30
IAA
2.8
35
45
85
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
2
4
7
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.2
7
Power (mW)
309
557.76
813.2
Note:
Table 10:
Symbol
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL = VDD_IO =2.8 V
- VDD= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C
1080p30 Linear 74MHz Parallel 2.8V
Definition
Condition
Symbol
Voltage
Min
Typ
Max
75
107
145
Digital operating current
Streaming 1080p30
IDD
1.8
I/O digital operating current
Streaming 1080p30
IDD_IO
2.8
10
30
50
Analog operating current
Streaming 1080p30
IAA
2.8
20
30
50
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.2
7
Power (mW)
237.2
386.36
580.2
Note:
Table 11:
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL = VDD_IO =2.8 V
- VDD= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C
1080p30 HDR (ALTM) 74MHz Parallel 1.8V
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Digital operating current
Streaming 1080p30
IDD
1.8
90
175
220
I/O digital operating current
Streaming 1080p30
IDD_IO
1.8
10
20
30
Analog operating current
Streaming 1080p30
IAA
2.8
35
45
85
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
2
4
7
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
Power (mW)
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
5.5
6.2
7
299
509.76
727.2
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C
26
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 12:
1080p30 Linear 74 MHz Parallel 1.8V
Voltage
Min
Typ
Max
Digital operating current
Definition
Streaming 1080p30
Condition
IDD
1.8
75
107
145
I/O digital operating current
Streaming 1080p30
IDD_IO
1.8
10
20
30
Analog operating current
Streaming 1080p30
IAA
2.8
20
30
50
Pixel supply current
Streaming 1080p30
IAA_PIX
2.8
1
3
7
PLL supply current
Streaming 1080p30
IDD_PLL
2.8
5.5
6.2
7
Power (mW)
227.2
338.36
494.2
Note:
Table 13:
Symbol
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- Low power mode enabled
- TA = 25°C
1080p30 HDR (ALTM) 74 MHz HiSPi SLVS (Low Power Mode)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Digital Operating Current
Streaming 1080p30
IDD
1.8
145
175
235
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
25
46
65
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
4
7
8.5
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
6
7.4
SLVS Supply Current
Streaming 1080p30
IDD_PLL
0.4
3
9
14
Power (mW)
351.8
479.32
654
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- VDD_SLVS= 0.4V
- PLL Enabled and PIXCLK = 37.125 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C
27
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 14:
1080p30 Linear 74 MHz HiSPi SLVS
Voltage
Min
Typ
Max
Digital Operating Current
Definition
Streaming 1080p30
Condition
IDD
1.8
75
115
155
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
20
30
50
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
3
7
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
6
7.4
8.5
SLVS Supply Current
Streaming 1080p30
IDD_PLL
Note:
Table 15:
Symbol
0.4
3
9
14
Power (mW)
211.8
323.72
468
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- VDD_SLVS= 0.4V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C
1080p30 HDR (ALTM) 74 MHz HiSPi HiVcm (Low Power Mode)
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Digital Operating Current
Streaming 1080p30
IDD
1.8
145
175
235
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
25
46
65
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
4
7
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
6
7.4
8.5
SLVS Supply Current
Streaming 1080p30
IDD_PLL
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
1.8
10
20
30
Power (mW)
368.6
511.72
702.4
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO = VDD_SLVS = 1.8 V
- PLL Enabled and PIXCLK = 37.125 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C
28
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 16:
1080p30 Linear 74 MHz HiSPi HiVcm
Definition
Voltage
Min
Typ
Max
Digital Operating Current
Streaming 1080p30
Condition
IDD
1.8
75
115
155
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
20
30
50
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
3
7
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
6
7.4
8.5
SLVS Supply Current
Streaming 1080p30
IDD_PLL
Note:
Table 17:
Symbol
1.8
10
20
30
Power (mW)
228.6
356.12
516.4
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO = VDD_SLVS= 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- Low power mode enabled
- TA = 25°C
Line Interleaved HiSPi SLVS
Definition
Condition
Symbol
Voltage
Min
Typ
Max
Digital Operating Current
Streaming 1080p30
IDD
1.8
185
230
265
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
20
36
55
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
3.3
7
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
7
8.2
9.5
SLVS Supply Current
Streaming 1080p30
IDD_PLL
0.4
3
9
14
Power (mW)
412.6
550.6
668.8
Note:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL =2.8 V
- VDD = VDD_IO= 1.8 V
- VDD_SLVS= 0.4V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- TA= 25°C
29
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Electrical Specifications
Table 18:
Line Interleaved HiSPi HiVcm
Definition
Condition
Symbol
IDD
Voltage
Min
Typ
Max
1.8
185
230
265
Digital Operating Current
Streaming 1080p30
Analog Operating Current
Streaming 1080p30
IDD_IO
2.8
20
36
55
Pixel Supply Current
Streaming 1080p30
IAA
2.8
1
3.3
7
PLL Supply Current
Streaming 1080p30
IAA_PIX
2.8
7
8.2
9.5
SLVS Supply Current
Streaming 1080p30
IDD_PLL
1.8
10
20
30
Power (mW)
429.4
583
717.2
Note:
Operating currents are measured in mA at the following conditions:
- VAA = VAA_PIX = VDD_PLL = 2.8 V
- VDD= VDD_IO = 1.8 V
- VDD_SLVS = 1.8 V
- PLL Enabled and PIXCLK = 74.25 MHz
- 4-lane HiSPi mode
- TA = 25°C
HiSPi Electrical Specifications
The ON Semiconductor AR023ZM sensor supports both SLVS and HiVCM HiSPi modes.
Refer to the High-Speed Serial Pixel (HiSPi) Interface Physical Layer Specification
v2.00.00 for electrical definitions, specifications, and timing information. The VDD_SLVS
supply in this datasheet corresponds to VDD_TX in the HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as referenced in the specification. The
DLL as implemented on AR023ZM is limited in the number of available delay steps and
differs from the HiSPi specification as described in this section.
Table 19:
Channel Skew
Measurement Conditions: VDD_HiSPi = 1.8V;VDD_HiSPi_TX = 0.4V; Data Rate =480 Mbps; DLL set to 0
Data Lane Skew in Reference to Clock
AR0230CS_DS Rev. 4 Pub. 8/15 EN
tCHSKEW1PHY
30
-150
ps
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Power-On Reset and Standby Timing
Power-Up Sequence
The recommended power-up sequence for the AR023ZM is shown in Figure 11. The
available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have
the separation specified below.
1. Turn on VDD_PLL power supply.
2. After 100s, turn on VAA and VAA_PIX power supply.
3. After 100s, turn on VDD_IO power supply.
4. After 100s, turn on VDD power supply.
5. After 100s, turn on VDD_SLVS power supply.
6. After the last power supply is stable, enable EXTCLK.
7. Assert RESET_BAR for at least 1ms. The parallel interface will be tri-stated during this
time.
8. Wait 150000 EXTCLKs (for internal initialization into software standby.
9. Configure PLL, output, and image settings to desired values.
10. Wait 1ms for the PLL to lock.
11. Set streaming mode (R0x301a[2] = 1).
Figure 11:
Power Up
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD_IO (1.8/2.8)
VDD (1.8)
t0
t1
t2
t3
VDD_SLVS (0.4)
EXTCLK
t4
RESET_BAR
tx
t5
Hard Reset
AR0230CS_DS Rev. 4 Pub. 8/15 EN
31
Internal
Initialization
t6
Software
Standby
PLL Lock
Streaming
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Table 20:
Power-Up Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_PLL to VAA/VAA_PIX3
VAA/VAA_PIX to VDD_IO
VDD_IO to VDD
VDD to VDD_SLVS
Xtal settle time
Hard Reset
Internal Initialization
PLL Lock Time
t0
t1
t2
t3
tx
t4
t5
t6
0
0
0
0
–
12
150000
1
100
100
100
100
301
–
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
ms
EXTCLKs
ms
Notes:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
1. Xtal settling time is component-dependent, usually taking about 10 – 100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard
reset is held down by RC circuit, then the RC time must include the all power rail settle time and
Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered
before or at least at the same time as the others. If the case happens that VDD_PLL is powered after
other supplies then sensor may have functionality issues and will experience high current draw on
this supply.
32
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
Power-Down Sequence
The recommended power-down sequence for the AR023ZM is shown in Figure 12. The
available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have
the separation specified below.
1. Disable streaming if output is active by setting standby R0x301a[2] = 0
2. The soft standby state is reached after the current row or frame, depending on configuration, has ended.
3. Turn off VDD_SLVS.
4. Turn off VDD.
5. Turn off VDD_IO.
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
Figure 12:
Power Down
VDD_SLVS (0.4)
t0
VDD (1.8)
t1
V DD_IO (1.8/2.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Table 21:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_SLVS to VDD
VDD to VDD_IO
VDD_IO to VAA/VAA_PIX
VAA/VAA_PIX to VDD_PLL
Power Down until Next Power Up Time
t0
t1
t2
t3
t4
0
0
0
0
100
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
t4 is required between power down and next power up time; all decoupling caps from
regulators must be completely discharged.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
33
©Semiconductor Components Industries, LLC, 2015.
80iBGA 10 x 10 Package Diagram
Figure 13:
AR0230CS_DS Rev. 4 Pub. 8/15 EN
Package Diagrams
ON Semiconductor Confidential and Proprietary
©Semiconductor Components Industries, LLC, 2015
AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Power-On Reset and Standby Timing
34
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AR023ZM: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Revision History
Revision History
Rev. 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/3/15
• Initial release
DR-Pix is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the
rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/
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products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including
without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey
any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
This literature is subject to all applicable copyright laws and is not for resale in any manner.
AR0230CS_DS Rev. 4 Pub. 8/15 EN
35
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