IRF840S RoHS-compliant Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Ease of Paralleling D ▼ Fast Switching Characteristic ▼ Simple Drive Requirement BVDSS 500V RDS(ON) 0.85Ω ID G 8A S Description APEC MOSFET provide the power designer with the best combination of fast switching , lower on-resistance and reasonable cost. GD S The TO-263 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. TO-263(S) Absolute Maximum Ratings Parameter Symbol Rating Units VDS Drain-Source Voltage 500 V VGS Gate-Source Voltage +20 V ID@TC=25℃ Continuous Drain Current, V GS @ 10V 8 A ID@TC=100℃ Continuous Drain Current, V GS @ 10V 5.1 A 32 A 125 W 320 mJ 8 A 1 IDM Pulsed Drain Current PD@TC=25℃ Total Power Dissipation 2 EAS Single Pulse Avalanche Energy IAR Avalanche Current TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Rthj-c Maximum Thermal Resistance, Junction-case Rthj-a Maixmum Thermal Resistance, Junction-ambient Data & specifications subject to change without notice Value Unit 1.0 ℃/W 40 ℃/W 1 200904141 IRF840S o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 500 - - V RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=4.8A - - 0.85 Ω VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=4.8A - 4.2 - S IDSS Drain-Source Leakage Current VDS=500V, VGS=0V - - 25 uA Drain-Source Leakage Current (T j=125 C) VDS=400V, VGS=0V - - 250 uA Gate-Source Leakage VGS=+20V, VDS=0V - - +100 nA ID=8A - 45 72 nC o IGSS 3 Qg Total Gate Charge Qgs Gate-Source Charge VDS=400V - 7 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 25 - nC 3 td(on) Turn-on Delay Time VDD=250V - 12 - ns tr Rise Time ID=8A - 31 - ns td(off) Turn-off Delay Time RG=9.1Ω,VGS=10V - 48 - ns tf Fall Time RD=31Ω - 33 - ns Ciss Input Capacitance VGS=0V - 1250 2000 pF Coss Output Capacitance VDS=25V - 270 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 85 - pF Rg Gate Resistance f=1.0MHz - 1.6 2.4 Ω Min. Typ. Max. Units Tj=25℃, IS=8A, VGS=0V - - 1.5 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 3 3 Test Conditions trr Reverse Recovery Time IS=8A, VGS=0V, - 515 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 8.6 - uC Notes: 1.Pulse width limited by Max. junction temperature. o 2.Starting Tj=25 C , VDD=50V , L=10mH , RG=25Ω 3.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 IRF840S 16 8 10V 7.0V ID , Drain Current (A) 10V 7 .0V 6 .0V T C =150 o C ID , Drain Current (A) o T C =25 C 12 6.0V 8 4 6 5 .0 V 4 V G = 4. 5 V 2 5.0V V G =4.5V 0 0 0 4 8 12 16 20 0 24 V DS , Drain-to-Source Voltage (V) 4 8 12 16 20 24 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 3 1.2 Normalized RDS(ON) Normalized BVDSS (V) I D =4.8A V G =10V 1.1 1 2 1 0.9 0 0.8 -50 0 50 100 -50 150 o Fig 3. Normalized BVDSS v.s. Junction 50 100 150 Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 1.4 8 1.2 Normalized VGS(th) (V) 10 T j = 150 o C IS (A) 0 T j , Junction Temperature ( o C ) T j , Junction Temperature ( C) T j = 25 o C 6 4 2 1 0.8 0.6 0 0.4 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 IRF840S f=1.0MHz 2400 12 I D =8A 2000 V DS =100V V DS =250V V DS =400V 8 1600 C (pF) VGS , Gate to Source Voltage (V) 10 6 C iss 1200 4 800 2 400 0 C oss C rss 0 0 10 20 30 40 50 60 1 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 10 ID (A) 100us 1ms 1 10ms 100ms DC o T c =25 C Single Pulse Normalized Thermal Response (Rthjc) 100 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + T C Single Pulse 0.01 0.1 1 10 100 1000 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4