CAT6219 500 mA CMOS LDO Regulator Description The CAT6219 is a 500 mA CMOS low dropout regulator that provides fast response time during load current and line voltage changes. The quick-start feature allows the use of an external bypass capacitor to reduce the overall output noise without affecting the turn-on time of just 150 ms. With zero shutdown current and low ground current of 55 mA typical, the CAT6219 is ideal for battery-operated devices with supply voltages from 2.3 V to 5.5 V. An internal under voltage lockout circuit disables the output at supply voltages under 2.15 V typical. The CAT6219 offers 1% initial accuracy and low dropout voltage, 300 mV typical at 500 mA. Stable operation is provided with a small value ceramic capacitor, reducing required board space and component cost. Other features include current limit and thermal protection. The LDO is available in fixed and adjustable output in the low profile (1 mm max height) 5−lead TSOT23, 6−pad 1.5 mm x 1.5 mm WDFN and in the 6−pad 2 mm x 2 mm TDFN packages. http://onsemi.com 5 1 TSOT−23 TD SUFFIX CASE 419AE 1 OUT IN VOUT NC/ADJ NC EN GND BYP/ADJ WDFN−6 1 VIN GND EN TSOT−23 • Cellular Phones • Battery−powered Devices • Consumer Electronics 1 BYP/ADJ TAB NC VOUT VIN TDFN−6 MARKING DIAGRAMS RVYM USYM UMYM US = CAT6219−125, CAT6219−250, = CAT6219−300 Device Code RV = CAT6219−180, CAT6219−280, = CAT6219−285, CAT6219−330 Device Code UM = CAT6219−ADJ Device Code Y = Production Year (last digit) M = Production Month: 1 − 9, A, B, C ABYM (TDFN) AB = CAT6219180, CAT6219VP5 Device Code Y = Production Year (last digit) M = Production Month: 1 − 9, A, B, C TM Applications EN GND (Top Views) Guaranteed 500 mA Peak Output Current Low Dropout Voltage of 300 mV Typical at 500 mA Stable with Ceramic Output Capacitor External 10 nF Bypass Capacitor for Low Noise Quick−start Feature Under Voltage Lockout No−load Ground Current of 55 mA Typical Full−load Ground Current of 85 mA Typical ±1.0% Initial Accuracy (VOUT ≥ 2.0 V) ±2.0% Accuracy Over Temperature (VOUT ≥ 2.0 V) “Zero” Current Shutdown Mode Fold−back Current Limit Thermal Protection 5−lead TSOT−23, 6−pad WDFN and TDFN Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 TDFN−6 VP5 SUFFIX CASE 511AH PIN CONNECTIONS Features • • • • • • • • • • • • • • • 1 WDFN−6 MV2 SUFFIX CASE 511BJ T S U V M SM UM VM (WDFN) = CAT6219−285MV2 Device Code = CAT6219−280MV2 Device Code = CAT6219−330MV2 Device Code = CAT6219−ADJMV2 Device Code = Date Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2012 September, 2012 − Rev. 14 1 Publication Order Number: CAT6219/D CAT6219 VIN 2.3 V to 5.5 V OFF CIN VIN 1 mF ON VOUT COUT 2.2 mF VOUT CAT6219 EN BYP GND VIN CBYP (Optional) 10 nF Figure 1. Typical Application Circuit Supply voltage input. GND Ground reference. EN Enable input (active high); a 2.5 MW pull−down resistor is provided. BYP Optional bypass capacitor connection for noise reduction and PSRR enhancing. ADJ Adjustable input. Feedback pin connected to resistor divider. VOUT TAB R 1) 1 R2 GND R1 2.2 mF ADJ R2 EN is the enable control logic (active high) for the regulator output. It has a 2.5 MW pull−down resistor, which assures that if EN pin is left open, the circuit is disabled. Function VIN Ǔ EN VOUT COUT Figure 2. Adjustable Output LDO Table 1. PIN DESCRIPTIONS Name ǒ VOUT CAT6219 1 mF OFF ON V OUT + 1.24 V VIN CIN 2.3 V to 5.5 V VOUT is the LDO regulator output. A small 2.2 mF ceramic bypass capacitor is required between the VOUT pin and ground. For better transient response, its value can be increased to 4.7 mF. The capacitor should be located near the device. For the SOT23-5 package, a continuous 500 mA output current may turn-on the thermal protection. A 250 W internal shutdown switch discharges the output capacitor in the no-load condition. GND is the ground reference for the LDO. The pin must be connected to the ground plane on the PCB. LDO Output Voltage. To be connected to the ground plane on PCB Pin Function VIN is the supply pin for the LDO. A small 1 mF ceramic bypass capacitor is required between the VIN pin and ground near the device. When using longer connections to the power supply, CIN value can be increased without limit. The operating input voltage range is from 2.3 V to 5.5 V. BYP is the reference bypass pin. An optional 0.01 mF capacitor can be connected between BYP pin and GND to reduce the output noise and enhance the PSRR at high frequency. ADJ is the adjustable input pin for the adjustable LDO. The pin is connected to the resistor voltage divider. Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit 0 to 6.5 V −0.3 to VIN + 0.3 V +150 _C Internally Limited (Note 1) mW −65 to +150 _C 260 _C 3 kV VIN VEN, VOUT Junction Temperature, TJ Power Dissipation, PD Storage Temperature Range, TS Lead Temperature (soldering, 5 sec.) ESD Rating (Human Body Model) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. RECOMMENDED OPERATING CONDITIONS (Note 2) Parameter Range Unit VIN 2.3 to 5.5 V VEN 0 to VIN V −40 to +125 _C 235 206 _C/W Junction Temperature Range, TJ Package Thermal Resistance, θJA SOT23−5 Package Thermal Resistance, θJA TDFN−6 NOTE: Typical application circuit with external components is shown above. 1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax − TA)/qJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2. The device is not guaranteed to work outside its operating rating. http://onsemi.com 2 CAT6219 Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 3) (VIN = VOUT + 1.0 V, VEN = High, IOUT = 100 mA, CIN = 1 mF, COUT = 2.2 mF, ambient temperature of 25°C (over recommended operating conditions unless specified otherwise). Bold numbers apply for the entire junction temperature range.) Symbol VOUT−ACC Parameter Output Voltage Accuracy TCOUT Output Voltage Temp. Coefficient VR−LINE Line Regulation Conditions Initial accuracy for VOUT ≥ 2.0 V (Note 6) Min Typ Max Unit −1.0 +1.0 % −2.0 +2.0 40 VIN = VOUT + 1.0 V to 5.5 V −0.2 ±0.1 −0.4 VR−LOAD Load Regulation IOUT = 100 mA to 500 mA ppm/°C +0.2 %/V +0.4 1 1.5 % 2 VDROP Dropout Voltage (Note 4) IOUT = 500 mA 300 400 mV 500 IGND Ground Current IOUT = 0 mA 55 75 mA 90 IOUT = 500 mA IGND−SD Shutdown Ground Current 85 VEN < 0.4 V 1 mA 2 PSRR Power Supply Rejection Ratio f = 1 kHz, CBYP = 10 nF 64 f = 20 kHz, CBYP = 10 nF 54 dB ISC Output short circuit current limit VOUT = 0 V 200 mA TON Turn−On Time CBYP = 10 nF 150 ms eN Output Noise Voltage (Note 5) BW = 10 Hz to 100 kHz 45 mVrms ROUT−SH Shutdown Switch Resistance 250 W Enable pull−down resistor 2.5 MW Under voltage lockout threshold 2.15 V REN VUVLO ESR COUT equivalent series resistance VADJ Adjustable input voltage 5 IOUT = 100 mA 1.2 VIN = 2.3 to 5.5 V 1.8 VIN = 2.3 to 5.5 V, 0°C to +125°C junction temperature 1.6 1.24 500 mW 1.27 V ENABLE INPUT VHI Logic High Level VLO Logic Low Level VIN = 2.3 to 5.5 V IEN Enable Input Current VEN = 0.4 V VEN = VIN V 0.4 V 0.15 1 mA 1.5 4 THERMAL PROTECTION TSD Thermal Shutdown 160 °C THYS Thermal Hysteresis 10 °C 3. Specification for 2.80 V output version unless specified otherwise. 4. Dropout voltage is defined as the input−to−output differential at which the output voltage drops 2% below its nominal value. During test, the input voltage stays always above the minimum 2.3 V. 5. Specification for 1.8 V output version. 6. For VOUT < 2.0 V, the initial accuracy is ±2% and across temperature ±3%. http://onsemi.com 3 CAT6219 TYPICAL CHARACTERISTICS (shown for 2.80 V output option) (VIN = 3.85 V, IOUT = 100 mA, CIN 1 mF, = COUT = 2.2 mF, CBYP = 10 nF, TA = 25°C unless otherwise specified.) 3.0 2.87 0.1 mA 500 mA OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.5 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 3. Dropout Characteristics Figure 4. Line Regulation 5.5 2.87 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.83 INPUT VOLTAGE (V) 2.85 2.80 0 50 2.86 2.85 2.84 2.83 2.82 −40 −20 100 150 200 250 300 350 400 450 500 0 20 40 60 80 100 120 140 OUTPUT LOAD CURRENT (mA) TEMPERATURE (°C) Figure 5. Load Regulation Figure 6. Output Voltage vs. Temperature 70 65 60 GROUND CURRENT (mA) GROUND CURRENT (mA) 2.84 INPUT VOLTAGE (V) 2.90 50 40 30 20 10 0 2.85 2.82 5.5 2.95 2.75 2.86 0 61 57 53 49 45 −40 −20 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 20 40 60 80 100 120 140 INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 7. Ground Current vs. Input Voltage Figure 8. Ground Current vs. Temperature http://onsemi.com 4 CAT6219 TYPICAL CHARACTERISTICS (shown for 2.80 V output option) (VIN = 3.85 V, IOUT = 100 mA, CIN 1 mF, = COUT = 2.2 mF, CBYP = 10 nF, TA = 25°C unless otherwise specified.) GROUND CURRENT (mA) 100 90 80 70 60 50 0 50 100 150 200 250 300 350 400 450 500 OUTPUT LOAD CURRENT (mA) Figure 9. Ground Current vs. Load Current 400 450 DROPOUT VOLTAGE (mV) 500 mA DROPOUT VOLTAGE (mV) 500 400 350 300 250 350 300 250 200 150 100 50 200 −40 −20 0 20 40 60 80 100 120 0 140 0 50 100 150 200 250 300 350 400 450 500 TEMPERATURE (°C) OUTPUT LOAD CURRENT (mA) Figure 10. Dropout vs. Temperature (500 mA Load) Figure 11. Dropout vs. Load Current 1.6 80 1.2 CBYP = 10 nF 60 PSRR (dB) ENABLE THRESHOLD (V) 70 0.8 CBYP = 0 50 40 30 20 0.4 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5.5 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 INPUT VOLTAGE (V) FREQUENCY (Hz) Figure 12. Enable Threshold vs. Input Voltage Figure 13. PSRR vs. Frequency (10 mA Load) http://onsemi.com 5 CAT6219 TRANSIENT CHARACTERISTICS (shown for 2.80 V output option) (VIN = 3.85 V, IOUT = 100 mA, CIN 1 mF, = COUT = 2.2 mF, CBYP = 10 nF, TA = 25°C unless otherwise specified.) Figure 14. Enable Turn−on (100 mA Load) Figure 15. Enable Turn−off (100 mA Load) Figure 16. Enable Turn−on (500 mA Load) Figure 17. Enable Turn−off (500 mA Load) Figure 18. Line Transient Response (3.85 V to 4.85 V) Figure 19. Load Transient Response (0.1 mA to 500 mA) http://onsemi.com 6 CAT6219 VOUT VIN ENABLE Enable Logic VOUT VIN + + − − VREF + − BYPASS ENABLE GND Enable Logic VREF + − GND Figure 20. Block Diagram − Fixed Voltage Figure 21. Block Diagram − Adjustable Voltage http://onsemi.com 7 ADJ CAT6219 PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE−01 ISSUE O SYMBOL D MIN NOM A1 0.01 0.05 0.10 A2 0.80 0.87 0.90 b 0.30 c 0.12 A e E1 1.00 0.45 0.15 D 2.90 BSC E 2.80 BSC E1 1.60 BSC E MAX e 0.20 0.95 TYP L 0.30 0.40 L1 0.60 REF L2 0.25 BSC 0º θ 0.50 8º TOP VIEW A2 A b q L A1 c L1 SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. http://onsemi.com 8 L2 CAT6219 PACKAGE DIMENSIONS TDFN6, 2x2 CASE 511AH−01 ISSUE A D A DETAIL A DAP SIZE 1.8 x 1.2 E2 PIN#1 IDENTIFICATION PIN# 1 INDEX AREA A1 TOP VIEW SIDE VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 0.00 0.02 0.05 A3 BOTTOM VIEW e 0.25 0.30 0.35 D 1.90 2.00 2.10 D2 1.50 1.60 1.70 E 1.90 2.00 2.10 E2 0.90 1.00 1.10 e L b 0.20 REF b L D2 DETAIL A A 0.65 TYP 0.15 0.25 0.35 A1 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC standard MO-229. http://onsemi.com 9 FRONT VIEW A3 CAT6219 PACKAGE DIMENSIONS WDFN6 1.5x1.5, 0.5P CASE 511BJ−01 ISSUE B D L A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 DETAIL A ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ ALTERNATE TERMINAL CONSTRUCTIONS E PIN ONE REFERENCE ÉÉÉ ÉÉ ÉÉÉ ÉÉ ÇÇ EXPOSED Cu 0.10 C 2X 2X 0.10 C 0.05 C TOP VIEW DETAIL B MOLD CMPD A3 A1 A3 DETAIL B ALTERNATE CONSTRUCTIONS 0.05 C 1 A1 C SIDE VIEW DETAIL A e 1 SEATING PLANE X MG G X = Specific Device Code M = Date Code G = Pb−Free Package (*Note: Microdot may be in either location) 5X L 3 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 1.50 BSC 1.50 BSC 0.50 BSC 0.40 0.60 --0.15 0.50 0.70 GENERIC MARKING DIAGRAM* A NOTE 4 DIM A A1 A3 b D E e L L1 L2 L2 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 6 4 BOTTOM VIEW 6X b 0.10 C A 0.05 C RECOMMENDED MOUNTING FOOTPRINT* B 6X NOTE 3 0.35 5X 0.73 1.80 0.83 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 CAT6219 ORDERING INFORMATION (Notes 7 − 9) Device Order Number Specific Device Marking Package Type VOUT Voltage (V) CAT6219−125TDGT3 US 1.25 CAT6219−180TDGT3 RV 1.80 CAT6219−250TDGT3 US 2.50 CAT6219−280TDGT3 RV CAT6219−285TDGT3 RV CAT6219−300TDGT3 US 3.00 CAT6219−330TDGT3 RV 3.30 CAT6219ADJTD−GT3 UM Adjustable CAT6219ADJVP5GT4 AF Lead Finish 2.80 TSOT−23−5 Shipping (Note 10) Tape & Reel, 3,000 Units / Reel 2.85 NiPdAu Adjustable TDFN−6 (2.0 x 2.0) CAT6219180VP5GT4 AB CAT6219VP5330GT4 AB 1.80 3.30 CAT6219−280MV2T3 S 2.80 CAT6219−285MV2T3 T CAT6219−330MV2T3 U CAT6219ADJMV2−T3 V 2.85 WDFN−6 (1.5 x 1.5) 3.30 Tape & Reel, 4,000 Units / Reel Tape & Reel, 3,000 Units / Reel Adjustable 7. All packages are RoHS−compliant (Lead−free, Halogen−free). 8. The standard lead finish is NiPdAu pre−plated (PPF) lead frames. 9. For other voltage options, please contact your nearest ON Semiconductor Sales office. 10. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 11. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device Nomenclature document, TND310/D, available at www.onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CAT6219/D