MCP3004/3008
2.7V 4-Channel/8-Channel 10-Bit A/D Converters
with SPI™ Serial Interface
Features
Description
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The Microchip Technology Inc. MCP3004/3008
devices are successive approximation 10-bit Analogto-Digital (A/D) converters with on-board sample and
hold circuitry. The MCP3004 is programmable to provide two pseudo-differential input pairs or four singleended inputs. The MCP3008 is programmable to provide four pseudo-differential input pairs or eight singleended inputs. Differential Nonlinearity (DNL) and Integral Nonlinearity (INL) are specified at ±1 LSB. Communication with the devices is accomplished using a
simple serial interface compatible with the SPI protocol.
The devices are capable of conversion rates of up to
200 ksps. The MCP3004/3008 devices operate over a
broad voltage range (2.7V - 5.5V). Low current design
permits operation with typical standby currents of only
5 nA and typical active currents of 320 µA. The
MCP3004 is offered in 14-pin PDIP, 150 mil SOIC and
TSSOP packages, while the MCP3008 is offered in 16pin PDIP and SOIC packages.
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10-bit resolution
± 1 LSB max DNL
± 1 LSB max INL
4 (MCP3004) or 8 (MCP3008) input channels
Analog inputs programmable as single-ended or
pseudo-differential pairs
On-chip sample and hold
SPI serial interface (modes 0,0 and 1,1)
Single supply operation: 2.7V - 5.5V
200 ksps max. sampling rate at VDD = 5V
75 ksps max. sampling rate at VDD = 2.7V
Low power CMOS technology
5 nA typical standby current, 2 µA max.
500 µA max. active current at 5V
Industrial temp range: -40°C to +85°C
Available in PDIP, SOIC and TSSOP packages
Applications
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Functional Block Diagram
Sensor Interface
Process Control
Data Acquisition
Battery Operated Systems
VDD VSS
VREF
CH0
CH1
Package Types
MCP3004
1
2
3
4
5
6
7
DAC
CH7*
PDIP, SOIC, TSSOP
CH0
CH1
CH2
CH3
NC
NC
DGND
Input
Channel
Max
14
13
12
11
10
9
8
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
Comparator
10-Bit SAR
Sample
and
Hold
Control Logic
CS/SHDN DIN
CLK
Shift
Register
DOUT
* Note: Channels 4-7 available on MCP3008 Only
PDIP, SOIC
1
2
3
4
5
6
7
8
MCP3008
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
16
15
14
13
12
11
10
9
© 2007 Microchip Technology Inc.
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
DGND
DS21295C-page 1
MCP3004/3008
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Name
Function
Absolute Maximum Ratings*
VDD
+2.7V to 5.5V Power Supply
VDD ........................................................................7.0V
DGND
Digital Ground
All inputs and outputs w.r.t. VSS .....-0.6V to VDD +0.6V
AGND
Analog Ground
Storage temperature ..........................-65°C to +150°C
CH0-CH7
Analog Inputs
Ambient temp. with power applied .....-65°C to +125°C
CLK
Serial Clock
Soldering temperature of leads (10 seconds) .. +300°C
DIN
Serial Data In
ESD protection on all pins .................................. > 4 kV
DOUT
Serial Data Out
*Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
CS/SHDN
Chip Select/Shutdown Input
VREF
Reference Voltage Input
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.
Parameter
Sym
Min
Typ
Max
Units
tCONV
—
—
10
clock
cycles
Conditions
Conversion Rate
Conversion Time
Analog Input Sample Time
tSAMPLE
Throughput Rate
fSAMPLE
—
—
Integral Nonlinearity
INL
—
Differential Nonlinearity
DNL
1.5
clock
cycles
200
75
ksps
ksps
VDD = VREF = 5V
VDD = VREF = 2.7V
±0.5
±1
LSB
—
±0.25
±1
LSB
Offset Error
—
—
±1.5
LSB
Gain Error
—
—
±1.0
LSB
Total Harmonic Distortion
—
-76
dB
VIN = 0.1V to 4.9V@1 kHz
Signal to Noise and Distortion
(SINAD)
—
61
dB
VIN = 0.1V to 4.9V@1 kHz
Spurious Free Dynamic Range
—
78
dB
VIN = 0.1V to 4.9V@1 kHz
Voltage Range
0.25
—
VDD
V
Note 2
Current Drain
—
100
0.001
150
3
µA
µA
CS = VDD = 5V
DC Accuracy
Resolution
10
bits
No missing codes over
temperature
Dynamic Performance
Reference Input
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,
for more information.
DS21295C-page 2
© 2007 Microchip Technology Inc.
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Input Voltage Range for CH0 or
CH1 in Single-Ended Mode
VSS
—
VREF
V
Input Voltage Range for IN+ in
pseudo-differential mode
IN-
—
VREF+IN-
Input Voltage Range for IN- in
pseudo-differential mode
VSS-100
—
VSS+100
mV
—
0.001
±1
µA
Switch Resistance
—
1000
—
Ω
See Figure 4-1
Sample Capacitor
—
20
—
pF
See Figure 4-1
Analog Inputs
Leakage Current
Digital Input/Output
Data Coding Format
Straight Binary
0.7 VDD
—
—
V
—
0.3 VDD
V
High Level Input Voltage
VIH
Low Level Input Voltage
VIL
High Level Output Voltage
VOH
4.1
—
—
V
IOH = -1 mA, VDD = 4.5V
Low Level Output Voltage
VOL
—
—
0.4
V
IOL = 1 mA, VDD = 4.5V
Input Leakage Current
ILI
-10
—
10
µA
VIN = VSS or VDD
Output Leakage Current
ILO
-10
—
10
µA
VOUT = VSS or VDD
CIN,
COUT
—
—
10
pF
VDD = 5.0V (Note 1)
TAMB = 25°C, f = 1 MHz
fCLK
—
—
3.6
1.35
MHz
MHz
Clock High Time
tHI
125
—
—
ns
Clock Low Time
tLO
125
—
—
ns
CS Fall To First Rising CLK Edge
tSUCS
100
—
—
ns
CS Fall To Falling CLK Edge
tCSD
—
—
0
ns
Data Input Setup Time
tSU
—
—
50
ns
Data Input Hold Time
tHD
—
—
50
ns
CLK Fall To Output Data Valid
tDO
—
—
125
200
ns
ns
VDD = 5V, See Figure 1-2
VDD = 2.7V, See Figure 1-2
CLK Fall To Output Enable
tEN
—
—
125
200
ns
ns
VDD = 5V, See Figure 1-2
VDD = 2.7V, See Figure 1-2
CS Rise To Output Disable
tDIS
—
—
100
ns
See Test Circuits, Figure 1-2
CS Disable Time
Pin Capacitance
(All Inputs/Outputs)
Timing Parameters
Clock Frequency
VDD = 5V (Note 3)
VDD = 2.7V (Note 3)
tCSH
270
—
—
ns
DOUT Rise Time
tR
—
—
100
ns
See Test Circuits, Figure 1-2
(Note 1)
DOUT Fall Time
tF
—
—
100
ns
See Test Circuits, Figure 1-2
(Note 1)
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,
for more information.
© 2007 Microchip Technology Inc.
DS21295C-page 3
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TAMB = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TAMB = 25°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Operating Voltage
VDD
2.7
—
5.5
V
Operating Current
IDD
—
425
225
550
µA
VDD = VREF = 5V,
DOUT unloaded
VDD = VREF = 2.7V,
DOUT unloaded
Standby Current
IDDS
—
0.005
2
µA
CS = VDD = 5.0V
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TA
-40
—
+85
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 14L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
108
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Thermal Resistance, 16L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 16L-SOIC
θJA
—
90
—
°C/W
Power Requirements
Temperature Ranges
Thermal Package Resistance
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2, “Maintaining Minimum Clock Speed”,
for more information.
TCSH
CS
TSUCS
THI
TLO
CLK
TSU
DIN
THD
MSB IN
TEN
DOUT
FIGURE 1-1:
DS21295C-page 4
TR
TDO
NULL BIT
MSB OUT
TF
TDIS
LSB
Serial Interface Timing.
© 2007 Microchip Technology Inc.
MCP3004/3008
Test Point
1.4V
VDD
3 kΩ
Test Point
3 kΩ
tDIS Waveform 2
VDD /2
tEN Waveform
DOUT
DOUT
100 pF
CL = 100 pF
tDIS Waveform 1
VSS
Voltage Waveforms for tR, tF
Voltage Waveforms for tEN
VOH
VOL
DOUT
tF
tR
CS
1
CLK
2
3
4
Voltage Waveforms for tDO
B9
DOUT
CLK
tEN
tDO
Voltage Waveforms for tDIS
DOUT
CS
FIGURE 1-2:
Load Circuit for tR, tF, tDO.
VIH
DOUT
Waveform 1*
90%
TDIS
DOUT
10%
Waveform 2†
*
†
Waveform 1 is for an output with internal
conditions such that the output is high,
unless disabled by the output control.
Waveform 2 is for an output with internal
conditions such that the output is low,
unless disabled by the output control.
FIGURE 1-3:
© 2007 Microchip Technology Inc.
Load circuit for tDIS and tEN.
DS21295C-page 5
MCP3004/3008
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
1.0
1.0
0.8
0.8
0.6
0.6
0.4
Positive INL
0.2
INL (LSB)
INL (LSB)
0.4
0.0
-0.2
VDD = VREF = 2.7 V
Negative INL
-0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
175
200
225
250
0
25
Sample Rate (ksps)
FIGURE 2-1:
Sample Rate.
50
75
100
Sample Rate (ksps)
Integral Nonlinearity (INL) vs.
FIGURE 2-4: Integral Nonlinearity (INL) vs.
Sample Rate (VDD = 2.7V).
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.8
0.6
INL(LSB)
INL(LSB)
1.0
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Positive INL
0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
Negative INL
-0.6
-0.8
-1.0
0
1
2
3
4
5
0.0
6
0.5
1.0
VREF (V)
FIGURE 2-2:
VREF.
Integral Nonlinearity (INL) vs.
2.0
2.5
3.0
FIGURE 2-5: Integral Nonlinearity (INL) vs.
VREF (VDD = 2.7V).
0.5
0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
0.4
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.4
0.3
0.3
0.2
0.2
INL (LSB)
INL (LSB)
1.5
VREF (V)
0.1
0.0
-0.1
0.1
0.0
-0.1
-0.2
-0.2
-0.3
-0.3
-0.4
-0.4
-0.5
-0.5
0
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-3: Integral Nonlinearity (INL) vs.
Code (Representative Part).
DS21295C-page 6
0
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-6: Integral Nonlinearity (INL) vs.
Code (Representative Part, VDD = 2.7V).
© 2007 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
0.6
0.6
0.4
0.4
INL (LSB)
INL (LSB)
Positive INL
0.2
0.0
-0.2
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
Positive INL
0.2
0.0
Negative INL
-0.2
Negative INL
-0.4
-0.4
-0.6
-0.6
-50
-25
0
25
50
75
-50
100
-25
0
Temperature (°C)
FIGURE 2-7:
Temperature.
Integral Nonlinearity (INL) vs.
0.6
0.4
75
100
VDD = VREF = 2.7 V
0.4
0.2
DNL (LSB)
DNL (LSB)
50
FIGURE 2-10: Integral Nonlinearity (INL) vs.
Temperature (VDD = 2.7V).
0.6
Positive DNL
0.0
Negative DNL
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
-0.4
-0.4
-0.6
-0.6
0
25
50
75
100
125
150
175
200
225
0
250
25
FIGURE 2-8: Differential Nonlinearity (DNL)
vs. Sample Rate.
0.8
0.8
0.6
0.6
DNL (LSB)
0.2
0.0
Negative DNL
-0.4
0.0
-0.2
-0.6
-0.8
1
2
3
4
5
VREF (V)
FIGURE 2-9:
vs. VREF.
Differential Nonlinearity (DNL)
© 2007 Microchip Technology Inc.
Negative DNL
-0.4
-0.8
-1.0
Positive DNL
0.2
-0.6
0
100
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.4
Positive DNL
-0.2
75
FIGURE 2-11: Differential Nonlinearity (DNL)
vs. Sample Rate (VDD = 2.7V).
1.0
0.4
50
Sample Rate (ksps)
Sample Rate (ksps)
DNL (LSB)
25
Temperature (°C)
-1.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VREF(V)
FIGURE 2-12: Differential Nonlinearity (DNL)
vs. VREF (VDD = 2.7V).
DS21295C-page 7
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
1.0
1.0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
DNL (LSB)
0.8
0.2
0.0
-0.2
0.2
0.0
-0.2
-0.4
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
128
256
384
512
640
768
896
1024
0
128
256
384
Digital Code
512
640
768
896
1024
Digital Code
FIGURE 2-13: Differential Nonlinearity (DNL)
vs. Code (Representative Part).
FIGURE 2-16: Differential Nonlinearity (DNL)
vs. Code (Representative Part, VDD = 2.7V).
0.6
0.6
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.4
0.4
DNL (LSB)
DNL (LSB)
Positive DNL
0.2
0.0
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
Negative DNL
-0.4
-0.4
-0.6
-0.6
-50
-25
0
25
50
75
-50
100
-25
Temperature (°C)
25
50
75
100
Temperature (°C)
FIGURE 2-14: Differential Nonlinearity (DNL)
vs. Temperature.
FIGURE 2-17: Differential Nonlinearity (DNL)
vs. Temperature (VDD = 2.7V).
8
2.0
1.5
7
VDD = 2.7 V
fSAMPLE = 75 ksps
1.0
Offset Error (LSB)
Gain Error (LSB)
0
0.5
0.0
-0.5
VDD = 5 V
fSAMPLE = 200 ksps
-1.0
6
VDD = 5 V
fSAMPLE = 200 ksps
5
4
3
VDD = 2.7 V
fSAMPLE = 75 ksps
2
1
-1.5
0
-2.0
0
1
2
3
VREF(V)
FIGURE 2-15: Gain Error vs. VREF.
DS21295C-page 8
4
5
0
1
2
3
4
5
VREF (V)
FIGURE 2-18: Offset Error vs. VREF.
© 2007 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
1.2
0.0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-0.2
-0.3
-0.4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
1.0
Offset Error (LSB)
Gain Error (LSB)
-0.1
0.8
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.6
0.4
0.2
0.0
-0.6
-50
-25
0
25
50
75
-50
100
-25
0
FIGURE 2-19: Gain Error vs. Temperature.
50
75
100
FIGURE 2-22: Offset Error vs. Temperature.
80
80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
60
60
SINAD (dB)
SNR (dB)
25
Temperature (°C)
Temperature (°C)
50
40
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
30
50
30
20
20
10
10
0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
40
0
1
10
100
1
10
Input Frequency (kHz)
100
Input Frequency (kHz)
FIGURE 2-20: Signal to Noise (SNR) vs. Input
Frequency.
FIGURE 2-23: Signal to Noise and Distortion
(SINAD) vs. Input Frequency.
0
70
-10
60
-20
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-40
SINAD (dB)
THD (dB)
-30
-50
-60
-70
-80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-90
VDD = VREF = 5 V
fSAMPLE = 200 ksps
50
40
30
20
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
10
-100
0
1
10
100
Input Frequency (kHz)
FIGURE 2-21: Total Harmonic Distortion (THD)
vs. Input Frequency.
© 2007 Microchip Technology Inc.
-40
-35
-30
-25
-20
-15
-10
-5
0
Input Signal Level (dB)
FIGURE 2-24: Signal to Noise and Distortion
(SINAD) vs. Input Signal Level.
DS21295C-page 9
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
10.0
10.00
9.8
ENOB (rms)
9.75
ENOB (rms)
VDD = VREF = 5 V
fSAMPLE = 200 ksps
9.6
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
9.50
9.25
9.4
9.2
9.0
8.8
8.6
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
8.4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
8.2
9.00
8.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
10
VREF (V)
FIGURE 2-25: Effective Number of Bits (ENOB)
vs. VREF.
VDD = VREF = 5 V
fSAMPLE = 200 ksps
SFDR (dB)
80
70
60
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
50
40
FIGURE 2-28: Effective Number of Bits (ENOB)
vs. Input Frequency.
Power Supply Rejection (dB)
100
90
30
20
10
0
1
10
0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-10
-20
-30
-40
-50
-60
-70
1
100
10
VDD = VREF = 5 V
FSAMPLE = 200 ksps
FINPUT = 10.0097 kHz
4096 points
20000
40000
60000
80000
100000
Frequency (Hz)
FIGURE 2-27: Frequency Spectrum of 10 kHz
Input (Representative Part).
DS21295C-page 10
1000
10000
FIGURE 2-29: Power Supply Rejection (PSR)
vs. Ripple Frequency.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
fINPUT = 1.00708 kHz
4096 points
Amplitude (dB)
Amplitude (dB)
FIGURE 2-26: Spurious Free Dynamic Range
(SFDR) vs. Input Frequency.
0
100
Ripple Frequency (kHz)
Input Frequency (kHz)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
100
Input Frequency (kHz)
0
5000
10000 15000 20000 25000 30000 35000
Frequency (Hz)
FIGURE 2-30: Frequency Spectrum of 1 kHz
Input (Representative Part, VDD = 2.7V).
© 2007 Microchip Technology Inc.
MCP3004/3008
550
550
500
500
450
450
400
400
350
350
IDD (µA)
IDD (µA)
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
300
250
200
100
50
250
200
150
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
150
300
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
100
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
3.5
FIGURE 2-31: IDD vs. VDD.
450
400
IREF (µA)
IDD (µA)
350
VDD = VREF = 5 V
250
200
VDD = VREF = 2.7 V
150
100
50
0
10
100
4.5
5.0
5.5
6.0
FIGURE 2-34: IREF vs. VDD.
500
300
4.0
VDD (V)
VDD (V)
1000
120
110
100
90
80
70
60
50
40
30
20
10
0
VDD = VREF = 5 V
VDD = VREF = 2.7 V
10
10000
100
1000
10000
Clock Frequency (kHz)
Clock Frequency (kHz)
FIGURE 2-32: IDD vs. Clock Frequency.
FIGURE 2-35: IREF vs. Clock Frequency.
550
500
VDD = VREF = 5 V
fCLK = 3.6 MHz
450
140
IREF (µA)
IDD (µA)
350
300
250
200
150
50
100
80
60
40
VDD = VREF = 2.7 V
fCLK = 1.35 MHz
100
VDD = VREF = 5 V
fCLK = 3.6 MHz
120
400
VDD = VREF = 2.7 V
fCLK = 1.35 MHz
20
0
0
-50
-25
0
25
50
Temperature (°C)
FIGURE 2-33: IDD vs. Temperature.
© 2007 Microchip Technology Inc.
75
100
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-36: IREF vs. Temperature.
DS21295C-page 11
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = 25°C.
2.0
70
Analog Input Leakage (nA)
VREF = CS = VDD
60
IDDS (pA)
50
40
30
20
10
0
1.8
VDD = VREF = 5 V
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-39: Analog Input Leakage Current
vs. Temperature.
FIGURE 2-37: IDDS vs. VDD.
100.00
VDD = VREF = CS = 5 V
IDDS (nA)
10.00
1.00
0.10
0.01
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-38: IDDS vs. Temperature.
DS21295C-page 12
© 2007 Microchip Technology Inc.
MCP3004/3008
3.0
PIN DESCRIPTIONS
4.0
DEVICE OPERATION
CLK
Serial Clock
DIN
Serial Data In
DOUT
Serial Data Out
CS/SHDN
Chip Select/Shutdown Input
The MCP3004/3008 A/D converters employ a conventional SAR architecture. With this architecture, a sample is acquired on an internal sample/hold capacitor for
1.5 clock cycles starting on the first rising edge of the
serial clock once CS has been pulled low. Following
this sample time, the device uses the collected charge
on the internal sample and hold capacitor to produce a
serial 10-bit digital output code. Conversion rates of
100 ksps are possible on the MCP3004/3008. See
Section 6.2, “Maintaining Minimum Clock Speed”, for
information on minimum clock rates. Communication
with the device is accomplished using a 4-wire SPIcompatible interface.
VREF
Reference Voltage Input
4.1
TABLE 3-1:
PIN FUNCTION TABLE
Name
Function
VDD
+2.7V to 5.5V Power Supply
DGND
Digital Ground
AGND
Analog Ground
CH0-CH7
Analog Inputs
3.1
DGND
Digital ground connection to internal digital circuitry.
3.2
AGND
Analog ground connection to internal analog circuitry.
3.3
CH0 - CH7
Analog inputs for channels 0 - 7, respectively, for the
multiplexed inputs. Each pair of channels can be programmed to be used as two independent channels in
single-ended mode or as a single pseudo-differential
input where one channel is IN+ and one channel is IN.
See Section 4.1, “Analog Inputs”, and Section 5.0,
“Serial
Communication”,
for
information
on
programming the channel configuration.
3.4
Serial Clock (CLK)
The SPI clock pin is used to initiate a conversion and
clock out each bit of the conversion as it takes place.
See Section 6.2, “Maintaining Minimum Clock Speed”,
for constraints on clock speed.
3.5
Serial Data Input (DIN)
The SPI port serial data input pin is used to load
channel configuration data into the device.
3.6
Serial Data Output (DOUT)
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
3.7
Chip Select/Shutdown (CS/SHDN)
The CS/SHDN pin is used to initiate communication
with the device when pulled low. When pulled high, it
will end a conversion and put the device in low power
standby. The CS/SHDN pin must be pulled high
between conversions.
© 2007 Microchip Technology Inc.
Analog Inputs
The MCP3004/3008 devices offer the choice of using
the analog input channels configured as single-ended
inputs or pseudo-differential pairs. The MCP3004 can
be configured to provide two pseudo-differential input
pairs or four single-ended inputs. The MCP3008 can be
configured to provide four pseudo-differential input
pairs or eight single-ended inputs. Configuration is
done as part of the serial command before each conversion begins. When used in the pseudo-differential
mode, each channel pair (i.e., CH0 and CH1, CH2 and
CH3 etc.) are programmed as the IN+ and IN- inputs as
part of the command string transmitted to the device.
The IN+ input can range from IN- to (VREF + IN-). The
IN- input is limited to ±100 mV from the VSS rail. The INinput can be used to cancel small signal commonmode noise, which is present on both the IN+ and INinputs.
When operating in the pseudo-differential mode, if the
voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is
equal to or greater than {[VREF + (IN-)] - 1 LSB}, then
the output code will be 3FFh. If the voltage level at INis more than 1 LSB below VSS, the voltage level at the
IN+ input will have to go below VSS to see the 000h
output code. Conversely, if IN- is more than 1 LSB
above VSS, the 3FFh code will not be seen unless the
IN+ input level goes above VREF level.
For the A/D converter to meet specification, the charge
holding capacitor (CSAMPLE) must be given enough
time to acquire a 10-bit accurate voltage level during
the 1.5 clock cycle sampling period. The analog input
model is shown in Figure 4-1.
This diagram illustrates that the source impedance (RS)
adds to the internal sampling switch (RSS) impedance,
directly affecting the time that is required to charge the
capacitor (CSAMPLE). Consequently, larger source
impedances increase the offset, gain and integral linearity errors of the conversion (see Figure 4-2).
DS21295C-page 13
MCP3004/3008
4.2
EQUATION
Reference Input
1024 × VIN
Digital Output Code = --------------------------V REF
For each device in the family, the reference input
(VREF) determines the analog input voltage range. As
the reference input is reduced, the LSB size is reduced
accordingly.
VIN = analog input voltage
VREF = reference voltage
EQUATION
V REF
LSB Size = ------------1024
The theoretical digital output code produced by the A/D
converter is a function of the analog input signal and the
reference input, as shown below.
When using an external voltage reference device, the
system designer should always refer to the manufacturer’s recommendations for circuit layout. Any instability in the operation of the reference device will have a
direct effect on the operation of the A/D converter.
VDD
RSS
Sampling
Switch
VT = 0.6V
CHx
CPIN
7 pF
VA
VT = 0.6V
SS
ILEAKAGE
±1 nA
RS = 1 kΩ
CSAMPLE
= DAC capacitance
= 20 pF
VSS
Legend
VA = Signal Source
ILEAKAGE = Leakage Current At The Pin
Due To Various Junctions
RSS = Source Impedance
SS = sampling switch
CHx = Input Channel Pad
RS = sampling switch resistor
CPIN = Input Pin Capacitance
VT = Threshold Voltage
FIGURE 4-1:
CSAMPLE = sample/hold capacitance
Analog Input Model.
Clock Frequency (Mhz)
4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
3
2
1
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0
100
1000
10000
Input Resistance (Ohms)
FIGURE 4-2: Maximum Clock Frequency vs.
Input resistance (RS) to maintain less than a
0.1 LSB deviation in INL from nominal
conditions.
DS21295C-page 14
© 2007 Microchip Technology Inc.
MCP3004/3008
5.0
SERIAL COMMUNICATION
Communication with the MCP3004/3008 devices is
accomplished using a standard SPI-compatible serial
interface. Initiating communication with either device is
done by bringing the CS line low (see Figure 5-1). If the
device was powered up with the CS pin low, it must be
brought high and back low to initiate communication.
The first clock received with CS low and DIN high will
constitute a start bit. The SGL/DIFF bit follows the start
bit and will determine if the conversion will be done
using single-ended or differential input mode. The next
three bits (D0, D1 and D2) are used to select the input
channel configuration. Table 5-1 and Table 5-2 show
the configuration bits for the MCP3004 and MCP3008,
respectively. The device will begin to sample the analog input on the fourth rising edge of the clock after the
start bit has been received. The sample period will end
on the falling edge of the fifth clock following the start
bit.
Once the D0 bit is input, one more clock is required to
complete the sample and hold period (DIN is a “don’t
care” for this clock). On the falling edge of the next
clock, the device will output a low null bit. The next 10
clocks will output the result of the conversion with MSB
first, as shown in Figure 5-1. Data is always output from
the device on the falling edge of the clock. If all 10 data
bits have been transmitted and the device continues to
receive clocks while the CS is held low, the device will
output the conversion result LSB first, as is shown in
Figure 5-2. If more clocks are provided to the device
while CS is still low (after the LSB first data has been
transmitted), the device will clock out zeros indefinitely.
If necessary, it is possible to bring CS low and clock in
leading zeros on the DIN line before the start bit. This is
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to
Section 6.1, “Using the MCP3004/3008 with Microcontroller (MCU) SPI Ports”, for more details on using the
MCP3004/3008 devices with hardware SPI ports.
© 2007 Microchip Technology Inc.
TABLE 5-1:
CONFIGURE BITS FOR THE
MCP3004
Control Bit
Selections
Input
Configuration
Single/
D2* D1 D0
Diff
Channel
Selection
1
X
0
0
single-ended
CH0
1
X
0
1
single-ended
CH1
1
X
1
0
single-ended
CH2
1
X
1
1
single-ended
CH3
0
X
0
0
differential
CH0 = IN+
CH1 = IN-
0
X
0
1
differential
CH0 = INCH1 = IN+
0
X
1
0
differential
CH2 = IN+
CH3 = IN-
0
X
1
1
differential
CH2 = INCH3 = IN+
* D2 is “don’t care” for MCP3004
TABLE 5-2:
CONFIGURE BITS FOR THE
MCP3008
Control Bit
Selections
Input
Configuration
Channel
Selection
0
single-ended
CH0
0
1
single-ended
CH1
1
0
single-ended
CH2
0
1
1
single-ended
CH3
1
0
0
single-ended
CH4
1
1
0
1
single-ended
CH5
1
1
1
0
single-ended
CH6
1
1
1
1
single-ended
CH7
0
0
0
0
differential
CH0 = IN+
CH1 = IN-
0
0
0
1
differential
CH0 = INCH1 = IN+
0
0
1
0
differential
CH2 = IN+
CH3 = IN-
0
0
1
1
differential
CH2 = INCH3 = IN+
0
1
0
0
differential
CH4 = IN+
CH5 = IN-
0
1
0
1
differential
CH4 = INCH5 = IN+
0
1
1
0
differential
CH6 = IN+
CH7 = IN-
0
1
1
1
differential
CH6 = INCH7 = IN+
Single
/Diff
D2
1
0
0
1
0
1
0
1
1
D1 D0
DS21295C-page 15
MCP3004/3008
tCYC
tCYC
tCSH
CS
tSUCS
CLK
DIN
D2 D1 D0
Start
Start
Don’t Care
SGL/
DIFF
HI-Z
DOUT
D2
SGL/
DIFF
Null
Bit B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *
tCONV
tSAMPLE
HI-Z
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output LSB
first data, then followed with zeros indefinitely. See Figure 5-2 below.
** tDATA: during this time, the bias current and the comparator powers down while the reference input becomes
a high impedance node.
FIGURE 5-1:
Communication with the MCP3004 or MCP3008.
tCYC
tCSH
CS
tSUCS
Power Down
CLK
Start
DIN
DOUT
D2 D1 D0
SGL/
DIFF
HI-Z
Don’t Care
HI-Z
Null
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9*
Bit
(MSB)
tSAMPLE
tCONV
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output zeros
indefinitely.
** tDATA: During this time, the bias circuit and the comparator powers down while the reference input becomes
a high impedance node, leaving the CLK running to clock out LSB first data or zeroes.
FIGURE 5-2:
DS21295C-page 16
Communication with MCP3004 or MCP3008 in LSB First Format.
© 2007 Microchip Technology Inc.
MCP3004/3008
6.0
APPLICATIONS INFORMATION
6.1
Using the MCP3004/3008 with
Microcontroller (MCU) SPI Ports
With most microcontroller SPI ports, it is required to
send groups of eight bits. It is also required that the
microcontroller SPI port be configured to clock out data
on the falling edge of clock and latch data in on the rising edge. Because communication with the MCP3004/
3008 devices may not need multiples of eight clocks, it
will be necessary to provide more clocks than are
required. This is usually done by sending ‘leading
zeros’ before the start bit. As an example, Figure 6-1
and Figure 6-2 shows how the MCP3004/3008 can be
interfaced to a MCU with a hardware SPI port.
Figure 6-1 depicts the operation shown in SPI Mode
0,0, which requires that the SCLK from the MCU idles
in the ‘low’ state, while Figure 6-2 shows the similar
case of SPI Mode 1,1, where the clock idles in the ‘high’
state.
As is shown in Figure 6-1, the first byte transmitted to
the A/D converter contains seven leading zeros before
the start bit. Arranging the leading zeros this way
induces the 10 data bits to fall in positions easily manipulated by the MCU. The MSB is clocked out of the A/D
converter on the falling edge of clock number 14. Once
the second eight clocks have been sent to the device,
the MCU receive buffer will contain five unknown bits
(the output is at high impedance for the first two
clocks), the null bit and the highest order 2 bits of the
conversion. Once the third byte has been sent to the
device, the receive register will contain the lowest order
eight bits of the conversion results. Employing this
method ensures simpler manipulation of the converted
data.
Figure 6-2 shows the same thing in SPI Mode 1,1,
which requires that the clock idles in the high state. As
with mode 0,0, the A/D converter outputs data on the
falling edge of the clock and the MCU latches data from
the A/D converter in on the rising edge of the clock.
© 2007 Microchip Technology Inc.
DS21295C-page 17
MCP3004/3008
CS
MCU latches data from A/D
converter on rising edges of SCLK
1
SCLK
2
3
4
5
6
7
8
9
11 12 13 14 15 16
17 18 19
Data is clocked out of
A/D converter on falling edges
SGL/ D2 D1 DO
Start DIFF
DIN
Start
MCU Transmitted Data
Bit
(Aligned with falling 0
0
0
0
0 0
0 1
edge of clock)
MCU Received Data
(Aligned with rising
?
?
?
?
?
?
?
?
edge of clock)
SGL/
DIFF D2 D1 DO X
?
Data stored into MCU receive
register after transmission of first
8 bits
X = “Don’t Care” Bits
FIGURE 6-1:
?
?
?
20 21 22 23 24
Don’t Care
NULL
BIT B9 B8
HI-Z
DOUT
CS
10
X
X
B7
B6 B5 B4 B3 B2 B1 B0
X
X
0 B9 B8
? (Null)
X
X
X
X
X
X
X
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of
second 8 bits
Data stored into MCU receive
register after transmission of last
8 bits
SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 0,0: SCLK idles low).
MCU latches data from A/D converter
on rising edges of SCLK
SCLK
1
2
3
4
5
6
7
8
9
10
11 12 13 14 15
16
17 18 19
20
21 22 23
24
Data is clocked out of A/D
converter on falling edges
Start
DIN
FIGURE 6-2:
DS21295C-page 18
B8
B7
B6 B5 B4 B3 B2 B1 B0
X
X
Start
Bit
MCU Transmitted Data
(Aligned with falling
0
edge of clock)
X = “Don’t Care” Bits
Don’t Care
NULL
BIT B9
HI-Z
DOUT
MCU Received Data
(Aligned with rising
edge of clock)
SGL/ D2 D1 DO
DIFF
0
?
0
?
0
?
0
?
0
?
?
SGL/
DIFF D2
1
0
?
?
Data stored into MCU receive
register after transmission of first
8 bits
?
?
D1 DO X
?
?
X
?
X
0
(Null) B9
Data stored into MCU receive
register after transmission of
second 8 bits
X
B8
X
X
X
X
X
X
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of last
8 bits
SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 1,1: SCLK idles high).
© 2007 Microchip Technology Inc.
MCP3004/3008
6.2
Maintaining Minimum Clock
Speed
When the MCP3004/3008 initiates the sample period,
charge is stored on the sample capacitor. When the
sample period is complete, the device converts one bit
for each clock that is received. It is important for the
user to note that a slow clock rate will allow charge to
bleed off the sample capacitor while the conversion is
taking place. At 85°C (worst case condition), the part
will maintain proper charge on the sample capacitor for
at least 1.2 ms after the sample period has ended. This
means that the time between the end of the sample
period and the time that all 10 data bits have been
clocked out must not exceed 1.2 ms (effective clock
frequency of 10 kHz). Failure to meet this criterion may
introduce linearity errors into the conversion outside
the rated specifications. It should be noted that during
the entire conversion cycle, the A/D converter does not
require a constant clock speed or duty cycle, as long as
all timing specifications are met.
6.3
Buffering/Filtering the Analog
Inputs
If the signal source for the A/D converter is not a low
impedance source, it will have to be buffered or inaccurate conversion results may occur (see Figure 4-2). It is
also recommended that a filter be used to eliminate any
signals that may be aliased back in to the conversion
results, as is illustrated in Figure 6-3, where an op amp
is used to drive, filter and gain the analog input of the
MCP3004/3008. This amplifier provides a low impedance source for the converter input, plus a low pass
filter, which eliminates unwanted high frequency noise.
Low pass (anti-aliasing) filters can be designed using
Microchip’s free interactive FilterLab™ software. FilterLab will calculate capacitor and resistors values, as
well as determine the number of poles that are required
for the application. For more information on filtering signals, see AN699, “Anti-Aliasing Analog Filters for Data
Acquisition Systems”.
VDD
10 µF
4.096V
Reference
0.1 µF
MCP1541
1 µF
1 µF
VIN
R1
C1
MCP601
IN+
R2
-
VREF
MCP3004
+
IN-
C2
R
R3 4
FIGURE 6-3: The MCP601 Operational
Amplifier is used to implement a second order
anti-aliasing filter for the signal being converted
by the MCP3004.
6.4
Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass capacitor value of 1 µF is recommended.
Digital and analog traces should be separated as much
as possible on the board, with no traces running underneath the device or bypass capacitor. Extra precautions should be taken to keep traces with high
frequency signals (such as clock lines) as far as possible from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating return current paths and associated
errors (see Figure 6-4). For more information on layout
tips when using A/D converters, refer to AN688, “Layout Tips for 12-Bit A/D Converter Applications”.
VDD
Connection
Device 4
Device 1
Device 3
Device 2
FIGURE 6-4: VDD traces arranged in a ‘Star’
configuration in order to reduce errors caused by
current return paths.
© 2007 Microchip Technology Inc.
DS21295C-page 19
MCP3004/3008
6.5
Utilizing the Digital and Analog
Ground Pins
The MCP3004/3008 devices provide both digital and
analog ground connections to provide additional
means of noise reduction. As is shown in Figure 6-5,
the analog and digital circuitry is separated internal to
the device. This reduces noise from the digital portion
of the device being coupled into the analog portion of
the device. The two grounds are connected internally
through the substrate which has a resistance of 5 -10Ω.
If no ground plane is utilized, both grounds must be
connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be connected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D converter.
VDD
MCP3004/08
Digital Side
Analog Side
-SPI Interface
-Shift Register
-Control Logic
-Sample Cap
-Capacitor Array
-Comparator
Substrate
5 - 10Ω
DGND
AGND
0.1 µF
Analog Ground Plane
FIGURE 6-5:
Ground Pins.
DS21295C-page 20
Separation of Analog and Digital
© 2007 Microchip Technology Inc.
MCP3004/3008
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
14-Lead PDIP (300 mil)
Example:
MCP3004-I/P e3
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil)
Example:
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (4.4mm) *
XXXXXXXX
MCP3004ISL e3
XXXXXXXXXXX
0712027
Example:
3004 e3
YYWW
0712
NNN
027
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
0712027
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.
© 2007 Microchip Technology Inc.
DS21295C-page 21
MCP3004/3008
Package Marking Information (Continued)
16-Lead PDIP (300 mil) (MCP3308)
Example:
MCP3008-I/P e3
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
16-Lead SOIC (150 mil) (MCP3308)
XXXXXXXXXXXXX
XXXXXXXXXXXXX
YYWWNNN
DS21295C-page 22
0712030
Example:
MCP3008-I/SL e3
XXXXXXXXXX
0712030
© 2007 Microchip Technology Inc.
MCP3004/3008
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
b1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
14
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.750
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.045
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc.
DS21295C-page 23
MCP3004/3008
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
3
e
h
b
A
A2
c
φ
L
A1
β
L1
Units
Dimension Limits
Number of Pins
α
h
MILLMETERS
MIN
N
NOM
MAX
14
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-065B
DS21295C-page 24
© 2007 Microchip Technology Inc.
MCP3004/3008
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
A
c
A1
φ
Units
Dimension Limits
Number of Pins
L
L1
MILLIMETERS
MIN
N
NOM
MAX
14
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
1.20
Overall Width
E
Molded Package Width
E1
4.30
6.40 BSC
4.40
Molded Package Length
D
4.90
5.00
5.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc.
DS21295C-page 25
MCP3004/3008
16-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
D
E
A
A2
L
A1
c
b1
b
e
eB
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
16
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.735
.755
.775
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.045
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-017B
DS21295C-page 26
© 2007 Microchip Technology Inc.
MCP3004/3008
16-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
3
2
e
b
h
α
h
A1
L
β
L1
Units
Dimension Limits
Number of Pins
c
φ
A2
A
MILLMETERS
MIN
N
NOM
MAX
16
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
9.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-108B
© 2007 Microchip Technology Inc.
DS21295C-page 27
MCP3004/3008
NOTES:
DS21295C-page 28
© 2007 Microchip Technology Inc.
MCP3004/3008
APPENDIX A:
REVISION HISTORY
Revision C (January 2007)
This revision includes updates to the packaging
diagrams.
© 2007 Microchip Technology Inc.
DS21295C-page 29
MCP3004/3008
NOTES:
DS21295C-page 30
© 2007 Microchip Technology Inc.
MCP3004/3008
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
Temperature Range:
Package:
MCP3004: 4-Channel 10-Bit Serial A/D Converter
MCP3004T: 4-Channel 10-Bit Serial A/D Converter
(Tape and Reel)
MCP3008: 8-Channel 10-Bit Serial A/D Converter
MCP3008T: 8-Channel 10-Bit Serial A/D Converter
(Tape and Reel)
I
P
SL
ST
Examples:
a)
MCP3004-I/P: Industrial Temperature, PDIP
package.
b)
MCP3004-I/SL: Industrial Temperature,
SOIC package.
c)
MCP3004-I/ST: Industrial Temperature,
TSSOP package.
d)
MCP3004T-I/ST: Industrial Temperature,
TSSOP package, Tape and Reel.
a)
MCP3008-I/P: Industrial Temperature, PDIP
package.
b)
MCP3008-I/SL: Industrial Temperature,
SOIC package.
= -40°C to +85°C
= Plastic DIP (300 mil Body), 14-lead, 16-lead
= Plastic SOIC (150 mil Body), 14-lead, 16-lead
= Plastic TSSOP (4.4mm), 14-lead
© 2007 Microchip Technology Inc.
DS21295C-page31
MCP3004/3008
NOTES:
DS21295C-page 32
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21295C-page 33
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21295C-page 34
© 2007 Microchip Technology Inc.