MTD6502B 5V 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver Features: Description: • Position Sensorless BLDC Drivers (No Hall Sensor Required) • 180° Sinusoidal Drive, for High Efficiency and Low Acoustic Noise • Support 2V to 5.5V Power Supplies • Direction Control: - Forward direction: connect DIR pin to GND or leave floating - Reverse direction: connect DIR pin to VDD • Speed Control through Power Supply Modulation (PSM) and/or Pulse-Width Modulation (PWM) • Built-in Frequency Generator (FG Output Signal) • Built-in Lock-up Protection and Automatic Recovery Circuit (External Capacitor not Necessary) • Built-in Over Current Limitation • Built-in Thermal Shutdown Protection • No External Tuning Required • Available Packages: - 3 mm x 3 mm TDFN-10 The MTD6502B device is a 3-phase full-wave driver for brushless sensorless DC motors. It features 180° sinusoidal drive, high torque output and silent drive. With adaptive features, parameters and a wide range of power-supplies (2V to 5.5V), the MTD6502B device is intended to cover a wide range of motor characteristics, while requiring minimum external components. Speed control can be achieved through either power supply modulation or pulse-width modulation (using the PWM digital input pin). Applications: • Notebook CPU Cooling Fans • 5V 3-Phase Brushless DC Motors With the compact packaging and minimum bill-ofmaterial (integrated power transistors, no Hall sensor, no external tuning), the MTD6502B is best suited for low-cost fan applications requiring high efficiency and low acoustic noise, such as notebook CPU cooling fans. Frequency generator (FG) output enables the precision speed control in closed-loop applications. The MTD6502B driver includes a lock-up protection mode, which turns off the output current when the motor is under lock condition, and an automatic recovery that enables the fan to run when the lock condition is removed. The motor overcurrent limitation and thermal-shutdown protection are included for safetyenhanced operations. The MTD6502B is available in a compact thermallyenhanced 3 mm x 3 mm TDFN package. Package Types MTD6502B 3x3 TDFN* 10 PWM FG 1 9 DIR GND 2 VDD 3 OUT1 4 OUT2 5 EP 11 8 VCC 7 OUT3 6 GND * Includes Exposed Thermal Pad (EP); see Table 2-1. 2011 Microchip Technology Inc. DS25003A-page 1 MTD6502B Functional Block Diagram VCC VREF VDD Motor Phase Detection Circuit Regulator Over-current protection VCC PWM Controller DIR Output Drive Circuit VCC Soft Switching Drive FG OUT3 OUT2 OUT1 GND Thermal protection DS25003A-page 2 Short-circuit protection 2011 Microchip Technology Inc. MTD6502B Typical Application MCU Side (Vlogic) PWM Input (1-100 kHz) C1 1 FG 2 GND 3 VDD 4 OUT1 5 OUT2 MTD6502B R1 PWM 10 DIR 9 VCC 8 OUT3 7 GND 6 VCC C2 Recommended External Components for Typical Application Element Type/Value C1 1 µF Connect as close as possible to IC input pins C2 1 µF Connect as close as possible to IC input pins R1 10 kΩ 2011 Microchip Technology Inc. Comment Connect to Vlogic on microcontroller side DS25003A-page 3 MTD6502B NOTES: DS25003A-page 4 2011 Microchip Technology Inc. MTD6502B 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Power Supply Voltage (VCC_MAX) ...................... -0.7 to +7.0V Maximum Output Voltage (VOUT_MAX) ............... -0.7 to +7.0V Maximum Output Current(2) (IOUT_MAX) ....................1000 mA FG Maximum Output Voltage (VFG_MAX) ........... -0.7 to +7.0V FG Maximum Output Current (IFG_MAX) .....................5.0 mA VDD Maximum Voltage (VDD_MAX) ..................... -0.7 to +4.0V PWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +7.0V Allowable Power Dissipation(2)(PD_MAX).........................1.5W Maximum Junction Temperature (TJ) .......................... +150°C † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: Reference PCB, according to JEDEC standard EIA/JESD 51-9. 2: IOUT is also internally limited, according to limits defined in the Electrical Characteristics. ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for TA = +25°C Parameters Sym Min Typ Max Units VCC 2 — 5.5 V Power Supply Current IVCC — 50 — µA PWM = 0, VCC = 5V OUTx High Resistance RON(H) — 0.75 1 Ω IOUT = 0.5A, VCC = 5V OUTx Low Resistance RON(L) — 0.75 1 Ω IOUT = 0.5A, VCC = 5V OUTx Total Resistance RON(H+L) — 1.5 2 Ω IOUT = 0.5A, VCC = 5V VDD — 3 — V VCC = 3.3V to 5.5V — VCC – 0.2 — V VCC < 3.3V Power Supply Voltage VDD Output Voltage PWM Input Frequency fPWM 1 — 100 kHz PWM Input H Level VPWM_H 0.8*VCC — VCC V PWM Input L Level VPWM_L 0 — 0.2*VCC V PWM Internal Pull-Up Current IPWM_L — — 55 µA Conditions PWM = 0 IDIR — 20 — µA FG Output Pin Low Level Voltage VOL_FG — — 0.25 V IFG = -1 mA FG Output Pin Leakage Current ILH_FG — — 10 µA VFG = 5.5V Lock Protection Operating Time TRUN — 0.5 — s DIR Internal Pull-Down Current Lock Protection Waiting Time Overcurrent Protection Thermal Shutdown Thermal Shutdown Hysteresis 2011 Microchip Technology Inc. TWAIT 4.5 5 5.5 s IOC_MOT — 750 — mA TSD — 170 — °C TSD_HYS — 25 — °C DS25003A-page 5 MTD6502B TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C Parameters Sym Min Typ Max Units Operating Temperature TOPR -40 — +125 °C Storage Temperature Range TSTG -55 — +150 °C JA — 68 — °C/W Conditions Temperature Ranges Thermal Package Resistances Thermal Resistance, 10L-TDFN DS25003A-page 6 2011 Microchip Technology Inc. MTD6502B 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: MTD6502B 3x3 TDFN MTD6502B PIN FUNCTION TABLE Type Name Function 1 O FG 2, 6 — GND Motor speed indication output 3 — VDD 4 O OUT1 Single phase coil output pin 5 O OUT2 Single phase coil output pin 7 O OUT3 Single phase coil output pin 8 — VCC Positive voltage supply for motor driver 9 I DIR Motor Rotation Direction: - Forward direction: connect pin to GND or leave floating - Reverse direction: connect pin to VDD 10 I PWM 11 — EP Negative voltage supply (ground) Internal regulator output (for decoupling only) PWM input signal for speed control Exposed Thermal Pad (EP) Legend: I = Input; O = Output 2011 Microchip Technology Inc. DS25003A-page 7 MTD6502B NOTES: DS25003A-page 8 2011 Microchip Technology Inc. MTD6502B 3.0 FUNCTIONAL DESCRIPTION The MTD6502B generates a full-wave signal to drive a 3-phase sensorless BLDC motor. High efficiency and low-power consumption are achieved due to the CMOS transistors and synchronous rectification drive type. 3.1 Speed Control The rotational speed of the motor can be controlled either through the PWM digital input signal, or by acting directly on the power supply (VCC). When the PWM signal is High (or left open), the motor rotates at full speed. When the PWM signal is Low, the motor is stopped (and the IC outputs are set to high-impedance). By changing the PWM duty cycle, the speed can be adjusted. Notice that the PWM frequency has no special meaning for the motor speed and is asynchronous with the activation of the output transistors. Thus, the user has the maximum freedom to choose the PWM system frequency within a wide range (from 1 kHz to 100 kHz), while the output transistor activation always occurs at a fixed rate (20 kHz, or 30 kHz), which is outside of the range of audible frequencies. Note: 3.2 The standard output frequency is 30 kHz. The 20 kHz output frequency option is available upon request. Motor Rotation Direction The current carrying order of the outputs depends on the DIR pin state (Rotation Direction) according to Table 3-1. TABLE 3-1: Outputs Activation Sequence Connected to GND or Floating Forward OUT1 OUT2 OUT3 Connected to VDD Reverse OUT3 OUT2 OUT1 3.3 Frequency Generator Function The Frequency Generator output (FG) is a “Hall-sensor equivalent” digital output, that gives information to an external controller about the speed and phase of the motor. The FG pin is an open collector output, connecting to a logical voltage level through an external pull-up resistor. When a lock (or out-of-sync) situation is detected by the driver, this output is set to high-impedance until the motor is restarted. Leave the pin open when not used. Note: Lock-up Protection and Automatic Restart If the motor is blocked and cannot rotate freely, a lock-up protection circuit detects this situation and disables the driver (by setting its outputs to high-impedance), in order to prevent the motor coil from burnout. After a “waiting time” (TWAIT), the lock-up protection is released and normal operation resumes for a given time (TRUN). If the motor is still blocked, a new period of waiting time is started. TWAIT and TRUN timings are fixed internally, so that no external capacitor is needed. 3.5 Overcurrent Protection The motor peak current is limited by the driver to a fixed value (defined internally), thus limiting the maximum power dissipation in the coils. 3.6 Thermal Shutdown The MTD6502B has a thermal protection function which detects when the die temperature exceeds TJ = +170°C. When this temperature is reached, the circuit enters the Thermal Shutdown mode, and the outputs OUT1, OUT2 and OUT3 are disabled (highimpedance), avoiding the IC destruction and allowing the circuit to cool down. Once the junction temperature (TJ) has dropped below +145°C, the normal operation resumes (thermal detection circuit has +25°C hysteresis function). Thermal shutdown MOTOR ROTATION DIRECTION OPTIONS (DIR PIN) Rotation Direction DIR Pin State 3.4 Normal operation +145° FIGURE 3-1: Hysteresis. 3.7 +170° TJ Thermal Protection Internal Voltage Regulator VDD voltage is generated internally and is used to supply the internal logical blocks. The VDD pin is used to connect an external decoupling capacitor (1 µF, or higher). Notice that this pin is for IC internal use, and is not designed to supply DC current to external blocks. FG/2 option is available upon request for 8-pole applications. 2011 Microchip Technology Inc. DS25003A-page 9 MTD6502B 3.8 BEMF Coefficient Setting Km is the electro-mechanical coupling coefficient of the motor (also referred to as “motor constant” or “BEMF constant”). Depending on the conventions in use, there may be some inconsistency in the exact definition of Km and its measurement criteria among different motor manufacturers. In order to work with various motor applications, the MTD6502B offers various options to adopt a wide range of BEMF coefficient. The BEMF coefficient (Km) is defined as the peak value of the phase-to-phase BEMF voltage, normalized to the electrical speed of the motor. TABLE 3-2: KM OPTIONS Km (mV/Hz) Range Phase-to-Phase Option Min Max 3.25 6.5 0 6.5 13 1 13 26 2 DS25003A-page 10 2011 Microchip Technology Inc. MTD6502B 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 10-Lead TDFN (3x3x0.9 mm) Example XXXX YYWW NNN AAAA 1104 256 PIN 1 PIN 1 Device Legend: XX...X Y YY WW NNN e3 * Note: Code MTD6502B-LC1-00 AAAA MTD6502B-LC1-01 AAAB MTD6502B-LC1-02 AAAC Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2011 Microchip Technology Inc. DS25003A-page 11 MTD6502B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS25003A-page 12 2011 Microchip Technology Inc. MTD6502B Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2011 Microchip Technology Inc. DS25003A-page 13 MTD6502B NOTES: DS25003A-page 14 2011 Microchip Technology Inc. MTD6502B APPENDIX A: REVISION HISTORY Revision A (March 2011) • Original Release of this Document. 2011 Microchip Technology Inc. DS25003A-page 15 MTD6502B NOTES: DS25003A-page 16 2011 Microchip Technology Inc. MTD6502B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -X XX Device Tape&Reel Device: -XX Package MTD6502B-L: = Km Range Value 3-Phase BLDC Sinusoidal Sensorless Fan Motor Driver (Tape and Reel) Package: C1 Plastic Dual Flat, No Lead Package, 3x3x0.9 mm Body (TDFN) Km Range Value: See Table 3-2 for details. 2011 Microchip Technology Inc. Examples: a) MTD6502B-LC1-00 b) MTD6502B-LC1-01 c) MTD6502B-LC1-02 Tape and Reel, 10LD TDFN Pkg, Km Range Value = 0 Tape and Reel, 10LD TDFN Pkg, Km Range Value = 1 Tape and Reel, 10LD TDFN Pkg, Km Range Value = 2 DS25003A-page 17 MTD6502B NOTES: DS25003A-page 18 2011 Microchip Technology Inc. MTD6502B Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-991-4 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2011 Microchip Technology Inc. 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