LZ2315A/LZ2316AR Dual-power-supply (5 V/12 V) Operation 1/3-type CCD Area Sensors with 270 k Pixels LZ2315A/ LZ2316AR DESCRIPTION PIN CONNECTIONS The LZ2315A/LZ2316AR are 1/3-type (6.0 mm) solid-state image sensors that consist of PN photodiodes and CCDs (charge-coupled devices) driven by dual-power-supply. With approximately 270 000 pixels (542 horizontal x 492 vertical), the sensor provides a stable high-resolution color (LZ2315A)/ B/W (LZ2316AR) normal or mirror image. 16-PIN SHRINK-PITCH WDIP FEATURES • Number of effective pixels : 512 (H) x 492 (V) • Number of optical black pixels – Horizontal : 2 front and 28 rear • Pixel pitch : 9.6 µm (H) x 7.5 µm (V) • Mg, G, Cy, and Ye complementary color filters (For LZ2315A) • Low fixed-pattern noise and lag • No burn-in and no image distortion • Blooming suppression structure • Built-in output amplifier • Built-in pulse mix circuit • Built-in overflow drain voltage circuit and reset gate voltage circuit • Variable electronic shutter (1/60 to 1/10 000 s) • Normal or mirror image output available from common output pin • Compatible with NTSC standard (LZ2315A)/ EIA standard (LZ2316AR) • Package : 16-pin shrink-pitch WDIP [Ceramic] (WDIP016-N-0500C) Row space : 12.70 mm TOP VIEW ØRS 1 16 T1 RD 2 15 OFD GND 3 14 ØTG OS 4 13 ØV2 OD 5 12 ØV1 ØH2B 6 11 ØV4 ØH2 7 10 ØV3 ØH1B 8 9 ØH1 (WDIP016-N-0500C) PRECAUTIONS • The exit pupil position of lens should be more than 25 mm (LZ2315A)/20 mm (LZ2316AR) from the top surface of the CCD. • Refer to "PRECAUTIONS FOR CCD AREA SENSORS" for details. COMPARISON TABLE TV standard LZ2315A NTSC standard (Color) Characteristics LZ2316AR EIA standard (B/W) Refer to each following specification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 LZ2315A/LZ2316AR PIN DESCRIPTION RD SYMBOL PIN NAME Reset transistor drain OD OS Output transistor drain Output signals ØRS Reset transistor clock ØV1, ØV2, ØV3, ØV4 Vertical shift register clock 1 2 ØH1, ØH2, ØH1B, ØH2B ØTG Horizontal shift register clock Transfer gate clock 3 OFD Overflow drain 1 GND T1 Ground NOTE Test pin NOTES : 1. ØRS, OFD : Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly. When not using electronic shutter, connect OFD to GND through a 0.1 µF capacitor and a 1 M$ resistor. 2. ØV1-ØV4 : Input the clock through a 0.1 µF capacitor. 3. ØTG : Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE". ABSOLUTE MAXIMUM RATINGS PARAMETER Output transistor drain voltage (TA = +25 ˚C) NOTE SYMBOL VOD RATING 0 to +15 UNIT V Reset transistor drain voltage VRD Overflow drain voltage VOFD 0 to +15 Internal output V V 1 Test pin, T1 Reset gate clock voltage VT1 VØRS 0 to +15 Internal output V V 2 Vertical shift register clock voltage VØV 0 to +7.5 V –0.3 to +7.5 –0.3 to +15 V V –40 to +85 –20 to +70 ˚C ˚C Horizontal shift register clock voltage VØH Transfer gate clock voltage VØTG Storage temperature TSTG Ambient operating temperature TOPR NOTES : 1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is applied below 13 Vp-p. 2. Do not connect to DC voltage directly. When ØRS is connected to GND, connect VOD to GND. Reset gate clock is applied below 8 Vp-p. 2 LZ2315A/LZ2316AR RECOMMENDED OPERATING CONDITIONS PARAMETER Ambient operating temperature SYMBOL TOPR MIN. TYP. 25.0 MAX. UNIT ˚C Output transistor drain voltage VOD 12.0 12.5 13.0 V 12.0 12.5 13.0 V Reset transistor drain voltage Overflow drain clock Ground VRD VØOFD p-p level GND Test pin, T1 Transfer gate clock Vertical shift register clock Horizontal shift register clock LOW level HIGH level p-p level LOW level 0.0 VOD 0.0 0.05 V V VØTGH 12.0 12.5 13.0 V VØV1, VØV2 VØV3, VØV4 4.7 5.0 5.5 V VØH1L, VØH2L VØH1BL, VØH2BL –0.05 0.0 0.05 V 4.7 5.0 5.5 V 4.5 5.0 5.5 V VØRS fØV1, fØV2 Vertical shift register clock frequency fØV3, fØV4 Horizontal shift register clock frequency fØH1, fØH2 fØH1B, fØH2B Reset gate clock frequency tw1, tw2 15.73 kHz 9.53 MHz 9.53 fØRS Horizontal shift register clock phase 5.0 10.0 1 V –0.05 VØH1BH, VØH2BH p-p level V VT1 VØTGL VØH1H, VØH2H HIGH level Reset gate clock VOD NOTE 1 1 MHz 18.0 ns 2 NOTES : 1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly. 2. ØH1, ØH2 ØH1B, ØH2B : Normal image output mode ØH1B, ØH2B : Mirror image output mode tw1 tw2 * To apply power, first connect GND and then turn on VOD and then turn on other powers and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied. 3 LZ2315A/LZ2316AR CHARACTERISTICS FOR LZ2315A (Drive method : Field accumulation) (TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.) PARAMETER Standard output voltage SYMBOL VO Photo response non-uniformity Saturation output voltage PRNU VSAT Dark output voltage VDARK Dark signal non-uniformity Sensitivity DSNU R Smear ratio Image lag SMR AI Blooming suppression ratio ABL Output transistor drain current IOD Output impedance RO MIN. TYP. 150 MAX. 15 650 420 UNIT mV NOTE 2 % 3 mV 4 0.5 mV 1, 5 0.5 600 mV mV 1, 6 7 8 9 –110 –90 1.0 dB % 4.0 400 8.0 mA $ Vector breakup Line crawling 10.0 3.0 ˚, % % 11 12 Luminance flicker 2.0 % 13 1 000 10 NOTES : • Within the recommended operating conditions of VOD, VOFD of the internal output satisfies with ABL larger than 1 000 times exposure of the standard exposure conditions, and VSAT larger than 650 mV. 1. TA = +60 ˚C 2. The average output voltage under uniform illumination. The standard exposure conditions are defined as when Vo is 150 mV. 3. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax – Vmin)/Vo, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 4. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 5. The average output voltage under non-exposure conditions. 6. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax – Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 7. The average output voltage when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, f50 mm. 8. The sensor is exposed only in the central area of V/10 square with a lens at F4, where V is the vertical image size. SMR is defined by the ratio of the output voltage detected during the vertical blanking period to the maximum output voltage in the V/10 square. 9. The sensor is exposed at the exposure level corresponding to the standard conditions. AI is defined by the ratio of the output voltage measured at the 1st field during the non-exposure period to the standard output voltage. 10. The sensor is exposed only in the central area of V/10 square, where V is the vertical image size. ABL is defined by the ratio of the exposure at the standard conditions to the exposure at a point where blooming is observed. 11. Observed with a vector scope when the color bar chart is imaged under the standard exposure conditions. 12. The difference between the average output voltage of the (Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G + Ye) line under the standard exposure conditions. 13. The difference between the average output voltage of the odd field and that of the even field under the standard exposure conditions. 4 LZ2315A/LZ2316AR CHARACTERISTICS FOR LZ2316AR (Drive method : Field accumulation) (TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.) PARAMETER Standard output voltage SYMBOL VO Photo response non-uniformity Saturation output voltage PRNU VSAT Dark output voltage VDARK Dark signal non-uniformity Sensitivity DSNU R Smear ratio Image lag SMR AI Blooming suppression ratio ABL Output transistor drain current IOD Output impedance RO MIN. TYP. 150 MAX. 15 650 700 UNIT mV NOTE 2 % 3 mV 4 0.5 mV 1, 5 0.5 1 000 mV mV 1, 6 7 8 9 –110 –90 1.0 dB % 4.0 400 8.0 mA $ 1 000 10 NOTES : • Within the recommended operating conditions of VOD, VOFD of the internal output satisfies with ABL larger than 1 000 times exposure of the standard exposure conditions, and VSAT larger than 650 mV. 1. TA = +60 ˚C 2. The average output voltage under uniform illumination. The standard exposure conditions are defined as when Vo is 150 mV. 3. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax – Vmin)/Vo, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 4. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 5. The average output voltage under non-exposure conditions. 6. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax – Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 7. The average output voltage when a 1000 lux light source with a 90% reflector is imaged by a lens of F4, f50 mm. 8. The sensor is exposed only in the central area of V/10 square with a lens at F4, where V is the vertical image size. SMR is defined by the ratio of the output voltage detected during the vertical blanking period to the maximum output voltage in the V/10 square. 9. The sensor is exposed at the exposure level corresponding to the standard conditions. AI is defined by the ratio of the output voltage measured at the 1st field during the non-exposure period to the standard output voltage. 10. The sensor is exposed only in the central area of V/10 square, where V is the vertical image size. ABL is defined by the ratio of the exposure at the standard conditions to the exposure at a point where blooming is observed. 5 LZ2315A/LZ2316AR PIXEL STRUCTURE yy ,, ,, yy ,, yy ,, yy ,, yy ,, yy yyy ,,, ,,, yyy ,,, yyy ,,, yyy ,,, yyy ,,, yyy OPTICAL BLACK (2 PIXELS) 512 (H) x 492 (V) COLOR FILTER ARRAY (FOR LZ2315A) (1, 492) ODD field OPTICAL BLACK (28 PIXELS) (512, 492) Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy G Mg G Mg G Mg G Mg G Mg Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy Mg G Mg G Mg G Mg G Mg G Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy G Mg G Mg G Mg G Mg G Mg Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy Mg G Mg G Mg G Mg G Mg G Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy G Mg G Mg G Mg G Mg G Mg Ye Cy Ye Cy Ye Cy Ye Cy Ye Cy Mg G Mg G Mg G Mg G Mg G (1, 1) EVEN field (512, 1) 6 LZ2315A/LZ2316AR TIMING CHART VERTICAL TRANSFER TIMING <NORMAL OUTPUT> (ODD FIELD) 525 1 10 17 19 HD VD ØV1 ØV2 ØV3 ØV4 ØTG 484 486 488 490 492 + + + + 485 487 489 491 1 + 2 3 + 4 5 + 6 7 + 8 9 + 10 11 + 12 4 + 5 6 + 7 8 + 9 10 + 11 OS (EVEN FIELD) 263 272 279 282 HD VD ØV1 ØV2 ØV3 ØV4 ØTG 483 485 487 489 491 + + + + + 484 486 488 490 492 1 2 + 3 OS HORIZONTAL TRANSFER TIMING <NORMAL OUTPUT> HD 606, 1 60 24 ØH1 84.5 ØH2 ØRS OS π512 PRESCAN (4) OB (2) OUTPUT (512) 1ππππππππππ OB (28) 29 49 ØV1 39 59 ØV2 24 54 ØV3 34 64 ØV4 62 ØOFD 7 72 LZ2315A/LZ2316AR READOUT TIMING <NORMAL OUTPUT> (ODD FIELD) HD 1 606, 1 60 60 29 49 ØV1 39 59 ØV2 24 ØV3 54 34 ØV4 242 ØTG 25.36 µs (242 bits) 64 338 10.06 µs (96 bits) 63.5 µs (606 bits) (EVEN FIELD) HD 60 1 606, 1 60 29 49 ØV1 39 59 ØV2 24 54 ØV3 34 64 ØV4 242 338 ØTG 25.36 µs (242 bits) 10.06 µs (96 bits) 63.5 µs (606 bits) 8 LZ2315A/LZ2316AR VERTICAL TRANSFER TIMING <MIRROR OUTPUT> (ODD FIELD) 525 1 17 10 19 HD VD ØV1 ØV2 ØV3 ØV4 ØTG 482 484 486 488 490 492 + + + + + 483 485 487 489 491 1 + 2 3 + 4 5 + 6 7 + 8 9 + 10 2 + 3 4 + 5 6 + 7 8 + 9 OS (EVEN FIELD) 272 263 279 282 HD VD ØV1 ØV2 ØV3 ØV4 ØTG 481 483 485 487 489 491 + + + + + + 482 484 486 488 490 492 1 OS HORIZONTAL TRANSFER TIMING <MIRROR OUTPUT> 606, 1 60 HD 4 58.5 ØH1 ØH2 ØRS OS ππππ1 PRESCAN (4) OB (2) 9 29 ØV1 19 39 ØV2 4 34 ØV3 14 44 ØV4 42 ØOFD 9 52 OB (28) OUTPUT (512) 512πππππππππ LZ2315A/LZ2316AR READOUT TIMING <MIRROR OUTPUT> (ODD FIELD) 1 606, 1 60 HD 60 9 29 ØV1 19 39 ØV2 ØV3 4 34 14 ØV4 222 ØTG 23.27 µs (222 bits) 44 318 10.06 µs (96 bits) 63.5 µs (606 bits) (EVEN FIELD) HD 1 606, 1 60 60 9 29 ØV1 19 39 ØV2 4 34 ØV3 14 44 ØV4 222 318 ØTG 23.27 µs (222 bits) 10.06 µs (96 bits) 63.5 µs (606 bits) 10 OFD T1 • Example of drive circuit with LR38580 driver IC. 11 8 7 6 5 OD 4 OS 3 GND 2 RD 1 (*1) LZ2315A or LZ2316AR 9 ØH2B ØRS 1 k$ 2SC4627 ØV2 ØH2 CCD OUT ØTG ØH1B VOD ØV1 16 15 14 13 12 11 10 (*1) (*3) (*2) ØV4 1 M$ 1 M$ ØV3 0.01 µF 1 000 pF 0.47 µF 10 $ 0.1 µF 0.1 µF 0.1 µF 0.1 µF ØH1 ØRS TGX OFDX 10 $ ØH1 ØH1B ØH2 ØH2B (*1) ØRS, OFD : Use the circuit parameter indicated in this circuit example, and do not connect to DC voltage directly. When not using electronic shutter, connect OFD to GND through a 0.1 µF capacitor and a 1 M$ resistor. (*2) ØV1-ØV4 : Input the clock through a 0.1 µF capacitor. (*3) ØTG : Use the circuit parameter indicated in this circuit example. ØV3 ØV2 ØV1 ØV4 LZ2315A/LZ2316AR SYSTEM CONFIGURATION EXAMPLE PACKAGES FOR CCD AND CMOS DEVICES PACKAGE (Unit : mm) 16 WDIP (WDIP016-N-0500C) θ CCD Glass Lid 1.66±0.10 6.20±0.15 16 12.40±0.15 0.60±0.60 1.40±0.60 11.20±0.10 (◊) Center of effective imaging area and center of package (◊ : Lid's size) 9 7.00±0.15 CCD Package (Cerdip) 0.04 Cross Section A-A' 8 Rotation error of die : ¬ = 1.5˚MAX. A P-1.78TYP. A' 0.46TYP. 0.90TYP. 0.25 M 2.63TYP. 1.05MIN. 3.90±0.30 1.27±0.25 2.60±0.20 14.00±0.15 5.24MAX. 3.42±0.25 11.20±0.10 (◊) 0.80±0.05 (◊) 1 0.25±0.10 12.70±0.25 12 PRECAUTIONS FOR CCD AREA SENSORS PRECAUTIONS FOR CCD AREA SENSORS (In the case of plastic packages) – The leads of the package are fixed with package body (plastic), so stress added to a lead could cause a crack in the package body (plastic) in the jointed part of the lead. 1. Package Breakage In order to prevent the package from being broken, observe the following instructions : 1) The CCD is a precise optical component and the package material is ceramic or plastic. Therefore, ø Take care not to drop the device when mounting, handling, or transporting. ø Avoid giving a shock to the package. Especially when leads are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isn’t fixed. 2) When applying force for mounting the device or any other purposes, fix the leads between a joint and a stand-off, so that no stress will be given to the jointed part of the lead. In addition, when applying force, do it at a point below the stand-off part. Glass cap Package Lead Fixed Stand-off 3) When mounting the package on the housing, be sure that the package is not bent. – If a bent package is forced into place between a hard plate or the like, the package may be broken. 4) If any damage or breakage occurs on the surface of the glass cap, its characteristics could deteriorate. Therefore, ø Do not hit the glass cap. ø Do not give a shock large enough to cause distortion. ø Do not scrub or scratch the glass surface. – Even a soft cloth or applicator, if dry, could cause dust to scratch the glass. (In the case of ceramic packages) – The leads of the package are fixed with low melting point glass, so stress added to a lead could cause a crack in the low melting point glass in the jointed part of the lead. Low melting point glass Lead 2. Electrostatic Damage As compared with general MOS-LSI, CCD has lower ESD. Therefore, take the following anti-static measures when handling the CCD : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hold the part without leads and do not touch any lead. Fixed Stand-off 13 PRECAUTIONS FOR CCD AREA SENSORS ø The contamination on the glass surface should be wiped off with a clean applicator soaked in Isopropyl alcohol. Wipe slowly and gently in one direction only. – Frequently replace the applicator and do not use the same applicator to clean more than one device. ◊ Note : In most cases, dust and contamination are unavoidable, even before the device is first used. It is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device. 3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dustcleaning tape. 4) When storing or transporting the device, put it in a container of conductive material. 3. Dust and Contamination Dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the glass surface, take the following precautions : 1) Handle the CCD in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 2) Do not touch the glass surface with the fingers. If dust or contamination gets on the glass surface, the following cleaning method is recommended : ø Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the leads on the device before blowing off the dust. 4. Other 1) Soldering should be manually performed within 5 seconds at 350 °C maximum at soldering iron. 2) Avoid using or storing the CCD at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CCD. 3) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters. 14