Sony CXG1234XR Sp4t antenna switch Datasheet

SP4T Antenna Switch
CXG1234XR
Description
The CXG1234XR is an SP4T antenna switch.
On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch
to digital baseband control lines with the CMOS logic levels. It requires 2 CMOS control lines.
The Sony GaAs JPHEMT MMIC Process is used for low insertion loss.
Features
‹ Insertion loss: 0.40dB (Typ.) @960MHz
0.50dB (Typ.) @2170MHz
‹ Lead-Free and RoHS compliant
Package
Small package size: 16-pin XQFN (2.3mm × 2.3mm × 0.35mm) (Typ.)
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings
Š Bias voltage
VDD
7
V
(Ta = 25°C)
Š Control voltage
Vctl
5
V
(Ta = 25°C)
Š Input power max.
27
dBm
(824 to 915MHz, Ta = 25°C)
Š Input power max.
24
dBm
(1710 to 1980MHz, Ta = 25°C)
Š Operating temperature
–35 to +85
°C
Š Storage temperature
–65 to +150
°C
Š Allowable power dissipation
*1
PD
100
mW
*1
25mm × 25mm × t: 0.8mm, Mounted on standard board (FR-4)
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E07Y31
CXG1234XR
Block Diagram
Ant
RF1
F1
F5
RF2
F2
F6
F7
RF3
F3
F8
RF4
F4
GND
5 VDD
6 CTLA
7 GND
8 CTLB
Pin Configuration
9
4 ANT
RF4 10
3 GND
GND 11
2
RF3 12
RF1
N.C. 16
GND 15
RF2 14
GND 13
1 GND
16-pin XQFN
2.3mm × 2.3mm × 0.35mm (Typ.)
-2-
CXG1234XR
Truth Table
Port
A
B
F1
F2
F3
F4
F5
F6
F7
F8
ANT – RF1
H
H
ON
OFF
OFF
OFF
OFF
ON
ON
ON
ANT – RF2
H
L
OFF
ON
OFF
OFF
ON
OFF
ON
ON
ANT – RF3
L
L
OFF
OFF
ON
OFF
ON
ON
OFF
ON
ANT – RF4
L
H
OFF
OFF
OFF
ON
ON
ON
ON
OFF
DC Bias Condition
(Ta = 25°C)
Item
Min.
Typ.
Max.
Vctl (H)
1.5
1.8
3.6
Vctl (L)
0
—
0.3
2.6
2.8
3.6
VDD
Unit
V
-3-
CXG1234XR
Electrical Characteristics
(Ta = 25°C, VDD = 2.8V, Vctl = 0V/1.8V)
Item
Symbol
Insertion loss
IL
VSWR
VSWR
Port
Ant – RF1, 2, 3, 4
2fo
Harmonics
3fo
2fo
Min.
Typ.
Max.
*1
Condition
—
0.40
0.55
*2
—
0.50
0.65
869 to 2170MHz
—
1.2
1.5
—
–50
–35
—
–45
–35
—
–50
–35
—
–50
–35
—
–94
–84
dBm
89
99
—
dBm
—
–91
–81
dBm
53
58
—
dBm
*3
Ant – RF1, 2, 3, 4
*4
3fo
Unit
dB
—
dBm
IMD2
IMD2
Input IP2
IIP2
IMD3
IMD3
Input IP3
IIP3
Control current
Ictl
Vctl = 1.8V
—
10
25
μA
Supply current
Idd
VDD = 2.8V (state: HH)
—
160
260
μA
Switching speed
Swt
50% Ctl to 90% RF
—
3
6
μs
Ant – RF1, 2, 3, 4
*5
Ant – RF1, 2, 3, 4
*6
Electrical characteristics are measured with all RF ports terminated in 50Ω.
*1
*2
*3
*4
*5
*6
Power incident on Ant, Pin = 0dBm, 869 to 960MHz.
Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz.
Power incident on RFx, Pin = 24dBm, 824 to 915MHz.
Power incident on RFx, Pin = 21dBm, 1710 to 1980MHz.
Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 190MHz, Fim = 2140MHz,
IIP2 = Pin + (PBlocker – IMD2)
Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 1760MHz, Fim = 2140MHz,
IIP3 = Pin + (PBlocker – IMD3)/2
-4-
CXG1234XR
(Ta = 25°C, VDD = 2.8V, Vctl = 0V/1.8V)
Item
Symbol
Port
Active
Condition
Min.
Typ.
Max.
20
33
—
20
32
—
Ant – RF4
20
32
—
Ant – RF2
20
38
—
20
35
—
20
31
—
20
31
—
20
33
—
20
30
—
20
26
—
20
28
—
Ant – RF4
20
24
—
Ant – RF1
20
31
—
20
30
—
Ant – RF4
20
32
—
Ant – RF1
20
27
—
20
26
—
20
28
—
20
32
—
20
31
—
20
34
—
20
27
—
20
31
—
20
37
—
Port
Ant – RF2
Ant – RF3
RF1
Ant – RF3
*1
*2
Ant – RF4
Ant – RF1
Ant – RF3
RF2
Ant – RF4
Ant – RF1
Ant – RF3
Isolation
ISO.
Ant – RF2
RF3
*1
Ant – RF2
*2
*1
*2
Ant – RF4
Ant – RF1
Ant – RF2
RF4
*1
Ant – RF3
Ant – RF1
Ant – RF2
*2
Ant – RF3
Electrical characteristics are measured with all RF ports terminated in 50Ω.
*1
*2
Power incident on Ant, Pin = 0dBm, 869 to 960MHz.
Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz.
-5-
Unit
dB
CXG1234XR
Recommended Circuit
CtlB
CtlA
Cbypass
(100pF)
VDD 5
CTLA 6
Cbypass
(100pF)
GND 7
CTLB 8
Cbypass
(100pF)
VDD
CRF
(56pF)
9 GND
ANT 4
10 RF4
GND 3
ANT
∗1
(56nH)
CRF
(56pF)
RF4
CRF
(56pF)
11 GND
RF1 2
RF1
CRF
(56pF)
12 RF3
1
16 N.C.
14 RF2
15 GND
GND
13 GND
RF3
N.C.
CRF
(56pF)
RF2
When using this IC, the following external components should be used:
CRF: This capacitor is used for RF decoupling and must be used for all applications.
Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
∗1 Inductor (56nH) is recommended on Ant port for ESD protection.
Capacitors are required on all RF ports for DC blocking.
-6-
CXG1234XR
Package Outline
(Unit: mm)
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
-7-
SPEC.
COPPER ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18µm
Sony Corporation
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