MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Features
Specified from 50 MHz to 20 GHz
Usable up to 26 GHz
Low Insertion Loss
High Isolation
Low Parasitic Capacitance and Inductance
RoHS Compliant Surmount™ Package
Rugged, Fully Monolithic
Glass Encapsulated Construction
Up to +38 dBm C.W. Power Handling1 @ +25°C
Silicon Nitride Passivation
Polymer Scratch Protection
Functional Schematic
J3
Description
The MASW-003103-1364 is a Surmount™
broadband monolithic SP3T switch using series and
shunt connected silicon PIN diodes. This part is
designed for use as a moderate signal, high
performance switch in applications up to 20 GHz.
This Surface Mount
chipscale configuration is
optimized for broadband performance with minimal
associated parasitics usually associated with hybrid
MIC designs incorporating beam lead and PIN
diodes that require chip and wire assembly.
The MASW-003103-1364 is fabricated using M/ACOM Tech’s patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of
silicon pedestals that form series and shunt diodes
or vias by imbedding them in low loss, low
dispersion glass. By using small spacing between
elements, this combination of silicon and glass gives
HMIC devices low loss and high isolation
performance through low millimeter frequencies.
Selective backside metalization is applied producing
a Surface Mount device. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection.
These protective coatings prevent
damage to the junction and the anode airbridge
during handling and assembly.
1.
Power Handling Testing performed @ 2GHz
1
J2
J4
J1
Pin Configuration 2
Pin
Function
J1
RFC
J2
RF1
J3
RF2
J4
RF3
2. The exposed pad centered on the chip bottom must be con-
Ordering Information
Part Number
Package
MASW-003103-13640G
50 piece gel pack
MASW-003103-13645P
500 piece reel
MASW-003103-13640P
3000 piece reel
MASW-003103-001SMB
Sample Test Board
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Electrical Specifications: TA = 25°C, PIN = 0 dBm, Z0 = 50 Ω, 20mA/-10V
Parameter
Frequency
Units
Min.
Typ.
Max.
Insertion Loss
6 GHz
13 GHz
20 GHz
dB
—
—
—
0.50
0.8
1.2
0.6
1.1
1.4
Isolation
6 GHz
13 GHz
20 GHz
dB
50
37
25
54
40
31
—
—
—
Input Return Loss
6 GHz
13 GHz
20 GHz
dB
19
14
14
25
22
21
—
—
—
Output to Output Isolation
6 GHz
13 GHz
20 GHz
dB
—
—
—
57
42
30
—
—
—
Switching Speed3
—
ns
—
20
—
Voltage Rating4
—
V
—
—
80
Input 0.1dB Compression Point
2 GHz
dBm
—
36
—
3.
4.
Typical Switching Speed measured fro 10% to 90 % of detected RF signal driven by TTL compatible drivers.
Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 uA maximum @ -80 volts.
Absolute Maximum Ratings 5,6
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Absolute Maximum
-65 °C to +125 °C
-65 °C to +150 °C
+175 °C
Applied Reverse Voltage
|-80 V|
38dBm CW @ 2GHz, +25°C
33dBm CW @ 20GHz,+25°C
RF CW Incident Power
Bias Current +25°C
± 50 mA
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These devices are rated at Class 1A Human Body.
Proper ESD control techniques should be used
when handling these devices.
Max Operating Conditions for combination RF
Pwr, DC Bias, & Temp: 33dBm CW @ 20mA per
Diode @ +85ºC @ 2GHz
5.
6.
Exceeding any one or combination of these limits may cause
permanent damage to this device.
M/A-COM Tech does not recommend sustained operation
near these survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Typical Performance Curves
Insertion Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
Isolation @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
0.0
0
-20
Isolation (dB)
-0.5
Insertion Loss (dB)
J1 TO J2
J1 TO J3
J1 TO J4
J1 TO J2
J1 TO J3
J1 TO J4
-1.0
-40
-1.5
-60
-2.0
-80
0
5
10
15
20
25
30
0
5
10
15
20
30
Frequency (GHz)
Input Return Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
Output Return Loss @ 20mA, -10V
RF Input to RF Outputs (J1 to J2, J3, J4)
0
0
J1 TO J2
J1 TO J3
J1 TO J4
Output Return Loss (dB)
J1 TO J2
J1 TO J3
J1 TO J4
Input Return Loss (dB)
25
Frequency (GHz)
-10
-20
-30
-10
-20
-30
-40
-40
0
5
10
15
20
25
30
0
5
10
Frequency (GHz)
15
20
25
30
Frequency (GHz)
Output to Output Isolation @ 20mA, -10V
J2 to J3 and J3 to J4
MASW-003103-1364 Maximum Input Power Curve
Baseplate Temperature fixed @ 25degC
0
12
10
J3 TO J4
-20
Input Power (Watts)
Output to Output Isolation (dB)
J2 TO J3
-40
-60
8
2GHz, 5.8W
6
4
10GHz, 2.75W
2
20GHz, 2W
0
-80
0
3
5
10
15
20
25
30
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Insertion Loss (dB)
Frequency (GHz)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1.6
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Bias Control
Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage
and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining
switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path.
In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased
with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse
biased with voltage.
Driver Connections
Control Level (DC Currents and Voltages)
Condition of
RF Output
Condition of
RF Output
Condition of
RF Output
B2
B3
B4
J1-J2
J1-J3
J1-J4
-15V at -20mA
+20mA
6V at +20mA
Low Loss
Isolation
Isolation
6V at +20mA
Isolation
Low Loss
Isolation
Isolation
Isolation
Low Loss
7
6V at +20mA
6V at +20mA
7
-15V at -20mA
6V at +20mA
7
-15V at -20mA
7. The voltage applied to the off arm can vary as long as 20mA is applied through the shunt diode on the off arm.
Application Circuit 8,9,10,11,12
Example:
J1 to J2→ Low Loss
R1 = 250Ω
R2 = 450Ω
B2 = -15V
B3, B4 = 6V
4
Notes:
8. Assume Vf ~ 1V at 20mA
9. R1 = 5V / 0.02A = 250Ω; R2 = 9V / 0.02A = 450Ω
10. PR1 = 0.02A x 0.02A x 250 = 0.1 W
11. PR2 = 0.02A x 0.02A x 450 = 0.18 W
12. Inductors are bias RF chokes. The operating band width of a broad-band PIN diode switch is often dependent on the bias components, particularly the RF bias chokes. It is suggested that the frequency response be checked with all the bias components attached
before installing the PIN diode.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Outline Drawing Footprint
Top View
Side View
Backside View
125
2065
1960
680
200
J3
684
200
290 200
J3
200
J1
J1
680
200 290
285
200 285
200 200 200
Units in µm
Ground radius is 200um centered
on the I/O Pad.
MASW-003103-1364
DIM
Width
Length
Thickness
Inches
MIN
0.06417
0.08031
0.00394
MAX
0.06614
0.08228
0.00591
mm
MIN
1.630
2.040
0.100
MAX
1.680
2.090
0.150
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1540
J2
J4
J4
J2
200 200 200
1655
200
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting
pads are conveniently located on the bottom surface of these devices and are removed from the active junction
locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ≤ 1W,
conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up
tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit
board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die
so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 ,
“Surface Mounting Instructions“ and can viewed on the MA-COM Technology Solutions website @
www.macomtech.com
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Pocket Tape Information
Carrier Tape Dimensions
.157 ± .004
4.00 ± 0.10
.157 ± .004
4.00 ± 0.10
.079 ± .002
2.00 ± 0.05
Ф .059 ± .004 THRU
1.5 ±
.069 ± .004
1.75 ± 0.10
+.012
.138
3.5 ± 0.05
+0.30
8.00 - 0.10
.093 ± .002
2.36 ± 0.05
Ф 0.035
THRU TYP.
Ф 0.89
.012 ± .001
0.30 ± 0.03
5° MAX.
.012 ± .002
0.30 ± 0.05
POCKET DEPTH
.071 ± .002
1.80 ± 0.05
Chip Orientation in Tape
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
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MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
Reel Information
A
DIM
INCHES
MM
MIN.
MAX.
MIN.
MAX.
A
6.980
7.019
177.3
178.3
B
.059
.098
1.5
2.5
C
.504
.520
12.8
13.2
D
.795
.815
20.2
20.7
N
2.146
2.185
54.5
55.5
W1
.331
.337
8.4
8.55
W2
—-
.567
—-
14.4
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch
50 MHz - 20 GHz
Rev. V2
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
9
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support