82C82 CMOS Octal Latching Bus Driver March 1997 Features Description • Full Eight-Bit Parallel Latching Buffer The Intersil 82C82 is a high performance CMOS Octal Latching Buffer manufactured using a self-aligned silicon gate CMOS process (Scaled SAJI IV). The 82C82 provides an eight-bit parallel latch/buffer in a 20 pin package. The active high strobe (STB) input allows transparent transfer of data and latches data on the negative transition of this signal. The active low output enable (OE) permits simple interface to state-of-the-art microprocessor systems. • Bipolar 8282 Compatible • Three-State Noninverting Outputs • Propagation Delay . . . . . . . . . . . . . . . . . . . . . 35ns Max. • Gated Inputs: - Reduce Operating Power - Eliminate the Need for Pull-Up Resistors Ordering Information • Single 5V Power Supply PART NUMBER TEMP. RANGE • Low Power Operation . . . . . . . . . . . . . . . ICCSB = 10µA CP82C82 0oC to +70oC • Operating Temperature Ranges - C82C82 . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to +70oC IP82C82 -40oC to +85oC CS82C82 0oC to +70oC - I82C82 . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC IS82C82 - M82C82 . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC CD82C82 -40oC to +85oC 0oC to +70oC ID82C82 MD82C82/B PACKAGE E20.3 20 Ld PLCC N20.35 20 Ld CERDIP F20.3 -40oC to +85oC -55oC to +125oC 8406701RA MR82C82/B PKG. NO. 20 Ld PDIP SMD # -55oC to +125oC 20 Pad CLCC 84067012A J20.A SMD # Pinouts DI0 1 20 VCC DI1 2 19 DO0 DI2 3 18 DO1 DI1 DI0 VCC DO0 82C82 (PLCC, CLCC) TOP VIEW DI2 82C82 (PDIP, CERDIP) TOP VIEW 3 2 1 20 19 DI3 4 TRUTH TABLE 18 DO1 DI4 5 17 DO2 DI3 4 17 DO2 DI4 5 16 DO3 DI5 6 16 DO3 DI5 6 15 DO4 DI6 7 15 DO4 DI6 7 14 DO5 DI7 8 14 DO5 DI7 8 13 DO6 OE 9 12 DO7 GND 10 11 STB STB OE DI DO X H X Hi-Z H L L L H L H H ↓ L X † H L X † = Logic One = Logic Zero = Don’t Care = Latched to Value of Last Data Hi-Z = High Impedance ↓ = Neg. Transition PIN NAMES 13 DO6 12 DO7 11 STB 10 GND OE 9 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 4-274 PIN DI0-DI7 DESCRIPTION Data Input Pins DO0-DO7 Data Output Pins STB Active High Strobe OE Active Low Output Enable File Number 2975.1 82C82 Functional Diagram DIO D Q CLK DO0 DI1 DO1 DI2 DO2 DI3 DO3 DI4 DO4 DI5 DO5 DI6 DO6 DI7 DO7 STB OE Gated Inputs During normal system operation of a latch, signals on the bus at the device inputs will become high impedance or make transitions unrelated to the operation of the latch. These unrelated input transitions switch the input circuitry and typically cause an increase in power dissipation in CMOS devices by creating a low resistance path between VCC and GND when the signal is at or near the input switching threshold. Additionally, if the driving signal becomes high impedance (“float” condition), it could create an indeterminate logic state at the input and cause a disruption in device operation. The Intersil 82C8X Series of bus drivers eliminates these conditions by turning off data inputs when data is latched (STB = logic zero for the 82C82/83H) and when the device is disabled (OE = logic one for 82C86H/87H). These gated inputs disconnect the input circuitry from the VCC and ground power supply pins by turning off the upper P-channel and lower Nchannel (see Figures 1, 2). No new current flow from VCC to GND occurs during input transitions and invalid logic states from floating inputs are not transmitted. The next stage is held to a valid logic level internal to the device. DC input voltage levels can also cause an increase in ICC if these input levels approach the minimum VIH or maximum VIL conditions. This is due to the operation of the input circuitry in its linear operating region (partially conducting state). The 82C8X series gated inputs mean that this condition will occur only during the time the device is in the trans parent mode (STB = logic one). ICC remains below the maximum ICC standby specification of l0mA during the time inputs are disabled, thereby, greatly reducing the average power dissipation of the 82C8X series devices Typical 82C82 System Example In a typical 80C86/88 system, the 82C82 is used to latch multiplexed addresses and the STB input is driven by ALE (Address Latch Enable) (see Figure 3). The high pulse width of ALE is approximately 100ns with a bus cycle time of 800ns (80C86/88 at 5MHz). The 82C82 inputs are active only 12.5% of the bus cycle time. Average power dissipation related to input transitioning is reduced by this factor also. VCC VCC VCC P P P OE STB N P INTERNAL DATA DATA IN VCC INTERNAL DATA DATA IN P N P N N N N FIGURE 16. 82C82/83H FIGURE 17. 82C86H/87H GATED INPUTS 4-275 82C82 Application Information Decoupling Capacitors The transient current required to charge and discharge the 300pF load capacitance specified in the 82C82 data sheet is determined by: I = C L (dv/dt) (EQ. 1) Assuming that all outputs change state at the same time and that dv/dt is constant; I = CL (EQ. 2) ( V CC x 80% ) ----------------------------------tR/tF (EQ. 3) where tR = 20ns, VCC = 5.0V, CL = 300pF on each of eight outputs. I = ( 8 x 300 x 10 -12 )x (5.0V x 0.8)/ ( 20 x 10 –9 ) = 480mA (EQ. 4) This current spike may cause a large negative voltage spike on VCC, which could cause improper operation of the device. To filter out this noise, it is recommended that a 0.1µF ceramic disc decoupling capacitor be placed between VCC and GND at each device, with placement being as near to the device as possible. VCC VCC P P ALE MULTIPLEXED BUS N STB ADDRESS P ADDRESS INTERNAL DATA DATA IN N ICC N FIGURE 18. SYSTEM EFFECTS OF GATED INPUTS 4-276 82C82 Absolute Maximum Ratings Thermal Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.5V to VCC +0.5V ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance (Typical) θJA θJC CERDIP . . . . . . . . . . . . . . . . . . . . . . . . 75oC/W 18oC/W CLCC. . . . . . . . . . . . . . . . . . . . . . . . . . 85oC/W 22oC/W PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . 75 N/A PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . 75 N/A Storage Temperature Range . . . . . . . . . . . . . . . . . .-65oC to +150oC Maximum Junction Temperature Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150oC Minimum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300oC (PLCC Lead Tips Only) Operating Conditions Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V Operating Temperature Range C82C82. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to +70oC I82C82 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC M82C82 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC Die Characteristics Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Gates CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. DC Electrical Specifications SYMBOL VIH VCC = 5.0V ±10%; PARAMETER Logical One Input Voltage VIL Logical Zero Input Voltage VOH Logical One Output Voltage VOL Logical Zero Output Voltage TA = 0oC to +70oC (C82C82); TA = -40oC to +85oC (I82C82); TA = -55oC to +125oC (M82C82) MIN MAX UNITS TEST CONDITIONS 2.0 - V C82C82, I82C82 (Note 1) 2.2 - V M82C82 (Note 1) - 0.8 V 2.9 - V IOH = -8mA, OE = GND VCC -0.4V - V IOH = -100µA, OE = GND - 0.4 V IOL = 8mA, OE = GND II Input Leakage Current -1.0 1.0 µA VIN = GND or VCC, DIP Pins 1-9, 11 IO Output Leakage Current -10.0 10.0 µA VO = GND or VCC, OE ≥ VCC -0.5V DIP Pins 12-19 VIN = VCC or GND, VCC = 5.5V, Outputs Open ICCSB Standby Power Supply Current - 10 µA ICCOP Operating Power Supply Current - 1 mA/MHz TA = +25oC, VCC = 5V, Typical (See Note 2) NOTES: 1. VIH is measured by applying a pulse of magnitude = VIH min to one data input at a time and checking the corresponding device output for a valid logical “1” during valid input high time. Control pins (STB, OE) are tested separately with all device data input pins at VCC -0.4. 2. Typical ICCOP = 1mA/MHz of STB cycle time. (Example: 5MHz µP, ALE = 1.25MHz, ICCOP = 1.25mA). Capacitance SYMBOL TA = +25oC PARAMETER TYPICAL UNITS TEST CONDITIONS Freq = 1MHz, all measurements are referenced to device GND CIN Input Capacitance 13 pF COUT Output Capacitance 20 pF 4-277 82C82 AC Electrical Specifications SYMBOL VCC = 5.0V ±10%; TA = 0oC to +70oC (C82C82); CL = 300pF (Note 1), Freq = 1MHz TA = -40oC to +85oC (I82C82); TA = -55oC to +125oC (M82C82) PARAMETER MIN MAX UNITS TEST CONDITIONS (1) TIVOV Propagation Delay Input to Output - 35 ns Notes 2, 3 (2) TSHOV Propagation Delay STB to Output - 55 ns Notes 2, 3 (3) TEHOZ Output Disable Time - 35 ns Notes 2, 3 (4) TELOV Output Enable Time - 50 ns Notes 2, 3 (5) TIVSL Input to STB Setup Time 0 - ns Notes 2, 3 (6) TSLIX Input to STB Hold Time 25 - ns Notes 2, 3 (7) TSHSL STB High Time 25 - ns Notes 2, 3 (8) TR, TF Input Rise/Fall Times - 20 ns Notes 2, 3 NOTES: 1. Output load capacitance is rated at 300pF for ceramic and plastic packages. 2. All AC parameters tested as per test circuits and definitions below. Input rise and fall times are driven at 1ns/V. 3. Input test signals must switch between VIL - 0.4V and VIH +0.4V. Timing Waveforms TR, TF (8) 2.0V 0.8V INPUTS TIVSL (5) TSLIX (6) STB TSHSL (7) OE TIVOV (1) TELOV (4) TEHOZ (3) VOH -0.1V OUTPUTS VOL +0.1V 2.4V 0.8V TSHOV (2) Test Load Circuits 1.7V 150Ω OUTPUT 0.6V TEST POINT 300pF (NOTE) TIVOV, TSHOV, TELOV 3.3V 300Ω OUTPUT TEST POINT 50pF (NOTE) TEHOZ OUTPUT HIGH DISABLE NOTE: Includes stray and jig capacitance. 4-278 300Ω OUTPUT TEST POINT 50pF (NOTE) TEHOZ OUTPUT LOW DISABLE 82C82 Burn-In Circuits MD82C82 CERDIP VCC F2 F2 F2 F2 F2 F2 F2 F2 F0 R1 1 R1 C1 20 2 19 A 3 18 A 4 17 A 5 16 A 6 15 A 7 14 A 8 13 A 9 12 10 11 R1 R1 R1 R1 R1 R1 R1 VCC R2 A A R1 R2 F1 MR82C82 CLCC C1 VCC F2 F2 R3 3 F2 F2 F2 F2 F2 R3 R3 R3 R3 R3 VCC/2 F2 R3 2 R3 R3 1 20 19 18 4 5 17 16 6 15 7 14 8 9 10 R3 F0 11 12 R3 13 R3 R3 F1 VCC/2 VCC/2 NOTES: 1. VCC = 5.5 ± 0.5V, GND = 0V. 2. VIH = 4.5V ±10%. 3. VIL = -0.2V to 0.4V. 4. R1 = 47kΩ ±5%. 5. R2 = 2.0kΩ ±5%. 6. R3 = 4.2kΩ ±5%. 7. R4 = 470kΩ ±5%. 8. C1 = 0.01µF minimum. 9. F0 = 100kHz ±10%. 10. F1 = F0/2, F2 = F1/2. 4-279 R3 R3 R3 R3 R3 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 82C82 Die Characteristics DIE DIMENSIONS: 118.1 x 92.1 x 19 ±1mils GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ METALLIZATION: Type: Si - Al Thickness: 11kÅ ±1kÅ WORST CASE CURRENT DENSITY: 2.00 x 105 A/cm2 Metallization Mask Layout 82C82 D12 D11 D10 VCC DO0 D01 2 1 20 19 18 3 D13 4 D14 5 D15 6 D16 7 8 9 10 11 12 D17 OE GND STB DO7 17 DO2 16 DO3 15 DO4 14 DO5 13 DO6 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 4-280