Sample & Buy Product Folder Tools & Software Technical Documents Support & Community AMC1301 SBAS667 – APRIL 2016 AMC1301 250-kHz, Fully-Differential Isolation Amplifier 1 Features 3 Description • The AMC1301 is a precision isolation amplifier with an output separated from the input circuitry by an isolation barrier that is highly resistant to magnetic interference. This barrier is certified to provide reinforced galvanic isolation of up to 7 kVPEAK according to VDE-V 0884-10 and UL1577. Used in conjunction with isolated power supplies, this device prevents noise currents on a high common-mode voltage line from entering the local ground and interfering with or damaging sensitive circuitry. • • • • • • • • ±250-mV Input Voltage Range Optimized for Current Measurement Using Shunt Resistors Low Offset Error and Drift: ±150 µV (Max) at 25°C, ±5 µV/°C (Max) Fixed Gain: 8.2 Very Low Gain Error and Drift: 0.5% (Max) at 25°C, ±50 ppm/°C (Max) Very Low Nonlinearity and Drift: 0.075% (Max), 2.4 ppm/°C 3.3-V Operation on High-Side and Low-Side Fully Specified Over the Extended Industrial Temperature Range Surge Immunity: Up to 10 kV Safety and Regulatory Approvals: – 7000-VPK Reinforced Isolation per DIN V VDE V 0884-10 – 5000-VRMS Isolation for 1 Minute per UL1577 – CSA Component Acceptance Notice 5A, IEC 60065 and IEC 60950-1 End Equipment Standards The input of the AMC1301 is optimized for direct connection to shunt resistors or other low voltagelevel signal sources. The excellent performance of the device supports accurate current control resulting in system-level power saving and, especially in motor control applications, lower torque ripple. The AMC1301 is fully specified over the extended industrial temperature range of –40°C to +125°C and is available in the SOIC-8 (DWV) package. Device Information DEVICE NAME AMC1301 • PACKAGE SOIC (8) BODY SIZE 5.85 mm × 7.50 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 2 Applications • (1) Shunt-Resistor-Based Current Sensing In: – Motor Controls – Green Energy – Frequency Inverters – Uninterruptible Power Supplies Isolated Voltage Sensing In: – Frequency Inverters – Power Supplies Simplified Schematic Floating Power Supply HV+ Gate Driver AMC1301 5.0 V VDD1 VDD2 GND1 GND2 3.3 V or 5.0 V RSHUNT To Load VINP VOUTP VINN VOUTN ADS7263 12-Bit ADC Gate Driver HV- Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW 1 AMC1301 SBAS667 – APRIL 2016 www.ti.com 4 Device And Documentation Support 4.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. PRODUCT PREVIEW ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, And Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: AMC1301 PACKAGE OPTION ADDENDUM www.ti.com 13-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AMC1301DWV PREVIEW SOIC DWV 8 64 TBD Call TI Call TI -40 to 125 AMC1301DWVR PREVIEW SOIC DWV 8 2000 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 13-May-2016 Addendum-Page 2 PACKAGE OUTLINE DWV0008A SOIC - 2.8 mm max height SCALE 2.000 SOIC C SEATING PLANE 11.5 0.25 TYP PIN 1 ID AREA 0.1 C 6X 1.27 8 1 2X 3.81 5.95 5.75 NOTE 3 4 5 0.51 0.31 0.25 C A 8X A 7.6 7.4 NOTE 4 B B 2.8 MAX 0.33 TYP 0.13 SEE DETAIL A (2.286) 0.25 GAGE PLANE 0 -8 0.46 0.36 1.0 0.5 (2) DETAIL A TYPICAL 4218796/A 09/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. www.ti.com EXAMPLE BOARD LAYOUT DWV0008A SOIC - 2.8 mm max height SOIC 8X (1.8) SEE DETAILS SYMM 8X (0.6) SYMM 6X (1.27) (10.9) LAND PATTERN EXAMPLE 9.1 mm NOMINAL CLEARANCE/CREEPAGE SCALE:6X METAL SOLDER MASK OPENING SOLDER MASK OPENING 0.07 MAX ALL AROUND METAL 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4218796/A 09/2013 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DWV0008A SOIC - 2.8 mm max height SOIC 8X (1.8) SYMM 8X (0.6) SYMM 6X (1.27) (10.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4218796/A 09/2013 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. 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