TaNFilm® Chip Carrier Resistor Network CCN Series • Qualified to DESC 87016 and 87017 military specifications • Gold, Sn/Pb and RoHS compliant terminations available • Ideal for all reflow soldering techniques • Meet JEDEC standard for type 'C' package • Custom schematics readily available • Absolute TCR to ±15 ppm/°C The IRC TaNFilm® Chip Carrier Network offers higher lead density, increased component count, lower installed resistor cost, better reliability, and is ideal for use with all surface mount solder techniques. In addition, the TaNFilm® leadless CCN provides all the unique qualities of our other TaNFilm® package configurations. Testing has demonstrated performance exceeding MIL-PRF-914 Characteristic H. Precise state-of-the-art laser trimming provides close tolerances and tight ratios. The TaNFilm® process enables IRC to manufacture custom circuit configurations and multiple resistance values without sacrificing the tightest tolerance and tracking characteristics of precision networks. The Tantalum Nitride resistor material is passivated for environmental protection surpassing military requirements and guaranteeing exceptional ratio stability. For applications requiring a high degree of reliability, stability, accuracy and low noise, plus the advantages of new resistor configurations, specify the IRC Leadless Chip Carrier Configuration Resistor Network. Electrical Data Resistance Range 10Ω to 300KΩ Absolute Resistance Tolerance To ±0.1% Ratio Tolerance to R1 to ±0.01% Power Rating @ 70°C 0.1 watt/resistor, 1.0 watt/network Operating Temperature Range -55°C to +150°C Absolute TCR To ±15ppm/°C TCR Tracking To ±5 ppm/°C Noise Termination Options (nickel leach barrier) Substrate Material Construction Less than -25 dB Gold 60/40 Sn/Pb 100% matte-tin 99.5% pure alumina substrate Epoxy overcoat (78xx) Ceramic lid (79xx) Custom circuits and special testing available. General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TT electronics plc CCN Series Issue April 2009 Sheet 1 of 4 TaNFilm® Chip Carrier Resistor Network Manufacturing Capability Data Circuit Isolated Schematics 7907/7807 7908/7808 Isolated Schematic 7909/7809 Bussed Schematic 7900/7800 Resistance Range Available Absolute Tolerances Available Ratio Tolerances (Ratio to R1) Best Absolute TCR Tracking TCR (Track to R1) 10Ω - 24.9Ω FGJ DFG ±300 ppm/°C ±50 ppm/°C 25.0Ω - 49.9Ω FGJ DFG ±100 ppm/°C ±25 ppm/°C 50Ω - 199Ω DFGJ BDFG ±50 ppm/°C ±10 ppm/°C 200Ω - 999Ω BDFGJ BDFG ±25 ppm/°C ±5 ppm/°C 1.0K -50.0K BDFGJ ABDFG ±25 ppm/°C ±5 ppm/°C 10Ω - 24.9Ω FGJ DFG ±300 ppm/°C ±50ppm/°C 25Ω - 74.9Ω FGJ DFG ±100 ppm/°C ±25 ppm/°C 75Ω - 379Ω DFGJ BDFG ±50 ppm/°C ±10 ppm/°C 380Ω - 999Ω BDFGJ ABDFG ±25 ppm/°C ±5 ppm/°C 1.0KΩ - 100KΩ BDFGJ TQABDFG ±25 ppm/°C ±5 ppm/°C 101KΩ - 250KΩ BDFGJ ABDFG ±25 ppm/°C ±5 ppm/°C 10Ω - 24.9Ω FGJ DFG ±300 ppm/°C ±50ppm/°C 25Ω - 74.9Ω FGJ DFG ±100 ppm/°C ±25ppm/°C 75Ω - 149Ω FGJ BDFG ±50 ppm/°C ±10ppm/°C 150Ω - 100KΩ BDFGJ ABDFG ±25 ppm/°C ±5ppm/°C Physical Data TOP VIEW 0.015″x45° 0.035″ x 45° 3 places SIDE VIEW 79xx SERIES SIDE VIEW 78xx SERIES 0.025″± .003 0.026″± .003 BOTTOM VIEW 0.050″Typ 0.085″ 0.050″Typ 0.0200″Typ 0.350″± .008 0.025″± .003 0.290″± .010 0.018″Typ 0.075″± .010 © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com CCN Series Issue April 2009 Sheet 2 of 4 TaNFilm® Chip Carrier Resistor Network Schematic Data 3 2 R3 1 R2 20 3 19 R1 2 R19 1 20 R2 R18 4 18 4 17 5 19 R10 18 R4 5 R17 17 R9 R3 6 R5 6 16 R16 7 R6 R15 8 R10 R11 R12 16 15 7 14 8 R8 15 14 R7 R9 R1 R4 R5 R6 R13 R7 R14 R8 9 10 11 12 9 13 10 7800/7900 3 2 1 20 3 19 R2 4 R1 12 13 5 2 1 20 19 R3 R10 R2 R9 4 18 R10 18 R9 17 17 5 R3 R1 6 16 7 R4 15 R6 14 10 11 12 R5 R7 R6 R8 14 8 R7 9 15 7 R4 R5 16 6 R8 8 11 7807/7907 9 13 7808/7908 10 11 12 13 7809/7909 Environmental Data Test Per MIL-PRF-914 TaNFilm® Test Data (ΔR%) MIL-PRF-914 Limits (ΔR%) M K H V Max Typical Thermal Shock and Power Conditioning 0.7 0.7 0.5 0.25 0.1 0.02 Low Temperature Operation 0.5 0.25 0.1 0.1 0.05 0.02 Short Term Overload 0.5 0.25 0.1 0.1 0.05 0.02 Resistance to Bonding Exposure 0.25 0.25 0.25 0.25 0.1 0.02 Steady State Humidity 0.5 0.5 0.5 0.2 0.1 0.03 Moisture Resistance 0.5 0.5 0.4 0.25 0.1 0.03 Shock 0.25 0.25 0.25 0.25 0.1 0.03 Vibration 0.25 0.25 0.25 0.25 0.1 0.03 Life 2.0 0.5 0.5 0.5 0.1 0.03 High Temperature Exposure 1.0 0.5 0.2 0.1 0.1 0.03 Low Temperature Storage 0.5 0.25 0.1 0.1 0.05 0.01 © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com CCN Series Issue April 2009 Sheet 3 of 4 TaNFilm® Chip Carrier Resistor Network Power Derating Data % Of Rated Power 100 50 10 25 70 125 Ambient Temperature (°C) Ordering Data Prefix CCN - 7900 - 01 - 1001 - B - B Model 7800: 20-pin, 19 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations 7800LF: 20-pin, 19 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations 7807: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations 7807LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations 7808: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations 7808LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations 7809: 20-pin, 10 resistor schematic, epoxy overcoat construction, 60/40 Sn/Pb solder plate terminations 7809LF: 20-pin, 10 resistor schematic, epoxy overcoat construction, 100% matte-tin (Pb-free) terminations 7900: 20-pin, 19 resistor schematic, ceramic lid construction, gold over nickel plate terminations 7900SD: 20-pin, 19 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations 7900LF: 20-pin, 19 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations 7907: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations 7907SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations 7907LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations 7908: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations 7908SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations 7908LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations 7909: 20-pin, 10 resistor schematic, ceramic lid construction, gold over nickel plate terminations 7909SD: 20-pin, 10 resistor schematic, ceramic lid construction, Sn/Pb hot solder dipped terminations 7909LF: 20-pin, 10 resistor schematic, ceramic lid construction, 100% matte-tin (Pb-free) terminations TCR/Screening Code Code Classification 00 01 02 03 04 05 06 07 11 Commercial Grade Commercial Grade Commercial Grade Commercial Grade MIL-PRF-914M Screened MIL-PRF-914K Screened MIL-PRF-914H Screened MIL-PRF-914H Screened Commercial Grade Absolute TCR ±300ppm/°C ±100ppm/°C ±50ppm/°C ±25ppm/°C ±300ppm/°C ±100ppm/°C ±50ppm/°C ±25ppm/°C ±15ppm/°C Resistance Code Standard 4-Digit MIL Resistance Code. Example: 1001 = 1000Ω, 50R0 - 50Ω Absolute Tolerance Code B = ±0.1%; D = ±0.5%; F = ±1%; G = ±2%; J = ±5% Ratio Tolerance to R1 T = ±0.01%; Q = ±0.02%; A = ±0.05%; B = ±0.1%; D = ±0.5%; F = ±1%; G = ±2% © IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com CCN Series Issue April 2009 Sheet 4 of 4