Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 LM34 Precision Fahrenheit Temperature Sensors 1 Features 3 Description • • • • • • • • • • • The LM34 series devices are precision integratedcircuit temperature sensors, whose output voltage is linearly proportional to the Fahrenheit temperature. The LM34 device has an advantage over linear temperature sensors calibrated in degrees Kelvin, because the user is not required to subtract a large constant voltage from its output to obtain convenient Fahrenheit scaling. The LM34 device does not require any external calibration or trimming to provide typical accuracies of ±1/2°F at room temperature and ±1-1⁄2°F over a full −50°F to 300°F temperature range. Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear output, and precise inherent calibration of the LM34 device makes interfacing to readout or control circuitry especially easy. It can be used with single power supplies or with plus and minus supplies. Because the LM34 device draws only 75 µA from its supply, the device has very low selfheating, less than 0.2°F in still air. 1 Calibrated Directly in Degrees Fahrenheit Linear 10.0 mV/°F Scale Factor 1.0°F Accuracy Assured (at 77°F) Rated for Full −50° to 300°F Range Suitable for Remote Applications Low Cost Due to Wafer-Level Trimming Operates From 5 to 30 Volts Less Than 90-μA Current Drain Low Self-Heating, 0.18°F in Still Air Nonlinearity Only ±0.5°F Typical Low-Impedance Output, 0.4 Ω for 1-mA Load 2 Applications • • • • Power Supplies Battery Management HVAC Appliances The LM34 device is rated to operate over a −50°F to 300°F temperature range, while the LM34C is rated for a −40°F to 230°F range (0°F with improved accuracy). The LM34 devices are series is available packaged in hermetic TO-46 transistor packages; while the LM34C, LM34CA, and LM34D are available in the plastic TO-92 transistor package. The LM34D device is available in an 8-lead, surface-mount, smalloutline package. The LM34 device is a complement to the LM35 device (Centigrade) temperature sensor. Device Information(1) PART NUMBER LM34 PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.91 mm TO-92 (3) 4.30 mm × 4.30 mm TO-46 (3) 4.699 mm × 4.699 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Basic Fahrenheit Temperature Sensor (5°F to 300°F) Full-Range Fahrenheit Temperature Sensor 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: LM34A and LM34CA ....... Electrical Characteristics: LM34, LM34C, and LM34D........................................................................ 6.7 Typical Characteristics .............................................. 7 7 9 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 8.3 System Examples ................................................... 14 9 Power Supply Recommendations...................... 16 10 Layout................................................................... 16 10.1 Layout Guidelines ................................................. 16 10.2 Layout Example .................................................... 17 11 Device and Documentation Support ................. 18 11.1 Trademarks ........................................................... 18 11.2 Electrostatic Discharge Caution ............................ 18 11.3 Glossary ................................................................ 18 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History Changes from Revision C (January 2015) to Revision D • Changed NDV Package (TO-46) pinout from Top View to Bottom View ............................................................................... 3 Changes from Revision B (November 2000) to Revision C • 2 Page Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 5 Pin Configuration and Functions NDV Package 3-PIn TO-46 (Bottom View) +VS VOUT GND t Case is connected to negative pin (GND) D Package 8-PIn SO8 (Top View) VOUT N.C. 1 2 8 7 +VS N.C. N.C. 3 6 N.C. GND 4 5 N.C. N.C. = No connection LP Package 3-Pin TO-92 (Bottom View) +VS VOUT GND Pin Functions PIN NAME TYPE TO46/NDV TO92/LP SO8/D +VS — — 8 POWER VOUT — — 1 O GND — — 4 GND DESCRIPTION Positive power supply pin Temperature Sensor Analog Output Device ground pin, connect to power supply negative terminal 2 3 N.C. — — 5 — No Connection 6 7 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 3 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage 35 –0.2 V Output voltage 6 –1 V 10 mA Output current Storage temperature, Tstg (1) (2) TO-46 Package −76 356 TO-92 Package −76 300 SO-8 Package −65 150 °F Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Specified operating temperature range (TMIN ≤ TA ≤ TMAX) MIN MAX LM34, LM34A –50 300 LM34C, LM34CA –40 230 32 212 4 30 NDV (TO-46) LP (TO-92) D (SO8) 3 PINS 3 PINS 8 PINS LM34D Supply Voltage Range (+VS) UNIT °F V 6.4 Thermal Information LM34 THERMAL METRIC (1) RθJA Junction-to-ambient thermal resistance 720 324 400 RθJC Junction-to-case thermal resistance 43 — — (1) 4 UNIT °F/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 6.5 Electrical Characteristics: LM34A and LM34CA Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the LM34C and LM34CA; and 32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from 5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). PARAMETER TEST CONDITIONS Tested Limit (2) TA = 77°F LM34A MIN TYP –1 LM34CA MAX MIN 1 –1 TYP MAX UNIT 1 Design Limit (3) °F ±0.4 ±0.4 Tested Limit T A = 0°F Accuracy Design Limit –2 ±0.6 (1) Tested Limit TA = TMAX –2 2 –2 Tested Limit °F 2 Design Limit °F ±0.8 TA = TMIN 2 ±0.6 –2 ±0.8 2 Design Limit –3 ±0.8 3 °F 0.6 °F 10.1 mV/°F ±0.8 Tested Limit Nonlinearity (4) Design Limit –0.7 TA = 77°F Tested Limit Sensor gain (Average Slope) 0.7 9.9 ±0.3 10.1 Design Limit +9.9 TA = 77°F +10 Tested Limit TA = 77°F 0 ≤ IL ≤ 1 mA –0.6 ±0.35 –1 10 1 –1 mV/mA ±0.4 Load regulation (5) ±0.4 Tested Limit 0 ≤ IL ≤ 1 mA Design Limit –3 3 –3 ±0.5 Tested Limit TA = 77°F 5 V ≤ VS ≤ 30 V Line regulation –0.05 0.05 (4) (5) –0.05 mV/mA 0.05 mV/V ±0.01 ±0.01 Tested Limit Design Limit –0.1 0.1 ±0.02 (2) (3) 3 ±0.5 Design Limit (5) 5 V ≤ VS ≤ 30 V (1) 1 Design Limit –0.1 0.1 mV/V ±0.02 Accuracy is defined as the error between the output voltage and 10 mV/°F times the device’s case temperature at specified conditions of voltage, current, and temperature (expressed in °F). Tested limits are specified and 100% tested in production. Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated temperature range of the device. Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 5 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com Electrical Characteristics: LM34A and LM34CA (continued) Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the LM34C and LM34CA; and 32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from 5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). PARAMETER TEST CONDITIONS LM34A MIN TYP Tested Limit VS = 5 V, TA = 77°F LM34CA MAX MIN TYP 90 MAX UNIT 90 Design Limit µA 75 75 Tested Limit VS = 5 V Quiescent current Design Limit 160 131 (6) Tested Limit VS = 30 V, TA = 77°F 139 µA 116 92 92 Design Limit µA 76 76 Tested Limit VS = 30 V Design Limit 163 132 Tested Limit 4 V ≤ VS ≤ 30 V, TA = 77°F 2 µA 2 Design Limit µA 0.5 Change of quiescent current (5) 142 117 0.5 Tested Limit 5 V ≤ VS ≤ 30 V Design Limit 3 1 3 µA 1 Tested Limit Temperature coefficient of quiescent current Design Limit 0.5 0.3 In circuit of Basic Fahrenheit Minimum temperature for Temperature Sensor (5°F to rated accuracy 300°F), IL = 0 TA = 77°F Long-term stability (6) 6 0.5 µA/°F 0.3 Tested Limit Design Limit TJ = TMAX for 1000 hours 5 5 3 3 ±0.16 ±0.16 °F °F Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 6.6 Electrical Characteristics: LM34, LM34C, and LM34D Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the LM34C and LM34CA; and +32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from 5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). PARAMETER CONDITIONS Tested Limit (2) TA = 77°F LM34 MIN TYP –2 LM34C, LM34D MAX MIN 2 –2 TYP MAX UNIT 2 Design Limit (3) °F ±0.8 ±0.8 Tested Limit TA = 0°F Design Limit –3 ±1 Accuracy, LM34, LM34C (1) Tested Limit TA = TMAX –3 3 °F 3 °F 4 °F ±1 3 Design Limit –3 ±1.6 ±1.6 Tested Limit TA = TMIN Design Limit –3 3 –4 ±1.6 ±1.6 Tested Limit TA = 77°F –3 3 Design Limit °F ±1.2 Tested Limit Accuracy, LM34D (1) TA = TMAX Design Limit –4 4 °F 4 °F 1 °F ±1.8 Tested Limit TA = TMIN Design Limit –4 ±1.8 Tested Limit Nonlinearity (4) Design Limit –1.0 1 –1 ±0.6 Tested Limit Sensor gain (Average Slope) 9.8 ±0.4 10.2 Design Limit 9.8 10 TA = 77°F 0 ≤ IL ≤ 1 mA Tested Limit –2.5 2.5 –2.5 mV/mA ±0.4 Tested Limit TMIN ≤ TA ≤ 150°F 0 ≤ IL ≤ 1 mA Design Limit –6.0 6 –6 ±0.5 Tested Limit TA = 77°F, 5 V ≤ VS ≤ 30 V –0.1 0.1 (5) –0.1 0.1 Design Limit mV/V Design Limit –0.2 ±0.01 0.2 ±0.02 (4) mV/mA Tested Limit 5 V ≤ VS ≤ 30 V (2) (3) 6 ±0.5 ±0.01 Line regulation (5) (1) mV/°F 2.5 Design Limit ±0.4 Load regulation (5) 10.2 10 –0.2 0.2 mV/V ±0.02 Accuracy is defined as the error between the output voltage and 10 mV/˚F times the device’s case temperature at specified conditions of voltage, current, and temperature (expressed in ˚F). Tested limits are specified and 100% tested in production. Design limits are specified (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line over the rated temperature range of the device. Regulation is measured at constant junction temperature using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 7 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com Electrical Characteristics: LM34, LM34C, and LM34D (continued) Unless otherwise noted, these specifications apply: −50°F ≤ TJ ≤ 300°F for the LM34 and LM34A; −40°F ≤ TJ ≤ 230°F for the LM34C and LM34CA; and +32°F ≤ TJ ≤ 212°F for the LM34D. VS = 5 Vdc and ILOAD = 50 µA in the circuit of Full-Range Fahrenheit Temperature Sensor; 6 Vdc for LM34 and LM34A for 230°F ≤ TJ ≤ 300°F. These specifications also apply from 5°F to TMAX in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). PARAMETER CONDITIONS LM34 MIN TYP Tested Limit VS = 5 V, TA = 77°F LM34C, LM34D MAX MIN TYP 100 MAX UNIT 100 Design Limit µA 75 75 Tested Limit VS = 5 V Quiescent current Design Limit 176 131 (6) Tested Limit VS = 30 V, TA = 77°F 154 µA 116 103 103 Design Limit µA 76 76 Tested Limit VS = 30 V Design Limit 181 132 Tested Limit 4 V ≤ VS ≤ 30 V, TA = +77°F 3 µA 3 Design Limit µA 0.5 Change of quiescent current (5) 159 117 0.5 Tested Limit 5 V ≤ VS ≤ 30 V Design Limit 5 1 5 µA 1 Tested Limit Temperature coefficient of quiescent current Design Limit 0.7 0.3 Minimum temperature for rated accuracy Long-term stability (6) 8 In circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F), IL = 0 0.7 µA/°F 0.3 Tested Limit Design Limit TJ = TMAX for 1000 hours 5.0 5 3 3 ±0.16 ±0.16 °F °F Quiescent current is defined in the circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F). Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 6.7 Typical Characteristics Figure 1. Thermal Resistance Junction to Air Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air Figure 4. Thermal Response in Stirred Oil Bath Figure 5. Minimum Supply Voltage vs Temperature Figure 6. Quiescent Current vs Temperature (in Circuit of Basic Fahrenheit Temperature Sensor (5°F to 300°F)) Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 9 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com Typical Characteristics (continued) Figure 7. Quiescent Current vs Temperature (in Circuit of Full-Range Fahrenheit Temperature Sensor; −VS = −5V, R1 = 100k) Figure 8. Accuracy vs Temperature (Specified) Figure 10. Noise Voltage Figure 9. Accuracy vs Temperature (Specified) Figure 11. Start-Up Response 10 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 7 Detailed Description 7.1 Overview The LM34 series devices are precision integrated-circuit temperature sensors, whose output voltage is linearly proportional to the Fahrenheit temperature. The LM34 device has an advantage over linear temperature sensors calibrated in degrees Kelvin, because the user is not required to subtract a large constant voltage from its output to obtain convenient Fahrenheit scaling. The LM34 device does not require any external calibration or trimming to provide typical accuracies of ±1/2°F at room temperature and ±1-1⁄2°F over a full −50°F to 300°F temperature range. Lower cost is assured by trimming and calibration at the wafer level. The low output impedance, linear output, and precise inherent calibration of the LM34 device makes interfacing to readout or control circuitry especially easy. It can be used with single power supplies or with plus and minus supplies. Because the LM34 device draws only 75 µA from its supply, the device has very low self-heating, less than 0.2°F in still air. The temperature sensing element is comprised of a simple base emitter junction that is forward biased by a current source. The temperature sensing element is buffered by an amplifier and provided to the OUT pin. The amplifier has a simple class-A output stage thus providing a low impedance output that can source 16 μA and sink 1 μA. The temperature sensing element is comprised of a delta-VBE architecture. The temperature sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage with typical 0.5-Ω output impedance as shown in the Functional Block Diagram. Therefore, the LM34 device can only source current and the sinking capability of the device is limited to 1 µA. 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Capacitive Drive Capability Like most micropower circuits, the LM34 device has a limited ability to drive heavy capacitive loads. The LM34 device, by itself, is able to drive 50 pF without special precautions. If heavier loads are anticipated, it is easy to isolate or decouple the load with a resistor; see Figure 12. You can improve the tolerance of capacitance with a series R-C damper from output to ground; see Figure 13. When the LM34 is applied with a 499-Ω load resistor (as shown Figure 18 and Figure 19), the device is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input, not on the output. However, as with any linear circuit connected to wires in a hostile environment, its performance can be affected adversely by intense electromagnetic sources such as relays, radio transmitters, motors with arcing brushes, transients of the SCR, and so on, as the wiring of the device can act as a receiving antenna and the internal junctions can act as rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such as 75 Ω in series with 0.2 μF or 1 μF from output to ground, are often useful. See Figure 23, Figure 24 and Figure 26 for more details. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 11 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com Feature Description (continued) Figure 12. LM34 With Decoupling from Capacitive Load Figure 13. LM34 With R-C Damper 7.3.2 LM34 Transfer Function The accuracy specifications of the LM34 devices are given with respect to a simple linear transfer function shown in Equation 1: VOUT = 10 mV/°F × T °F where • • VOUT is the LM34 output voltage T is the temperature in °F (1) 7.4 Device Functional Modes The only functional mode of the LM34 device is that it has an analog output directly proportional to temperature. 12 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The features of the LM34 device make it suitable for many general temperature sensing applications. Multiple package options expand on flexibility of the device. 8.2 Typical Application 8.2.1 Basic Fahrenheit Temperature Sensor Application Figure 14. Basic Fahrenheit Temperature Sensor (5°F to 300°F) 8.2.1.1 Design Requirements Table 1. Key Requirements PARAMETER VALUE Accuracy at 77°F ±2°F Accuracy from –50°F to 300°F Temperature Slope ±3°F 10 mV/°F 8.2.1.2 Detailed Design Procedure Because the LM34 is a simple temperature sensor that provides an analog output, design requirements related to layout are more important than electrical requirements (see Layout). 8.2.1.3 Application Curve Figure 15. Temperature Error Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 13 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com 8.3 System Examples Figure 16. Full-Range Fahrenheit Temperature Sensor Figure 17. Full Range Farenheit Sensor (–50 °F to 300 °F) VOUT = 10 mV/°F (TA+3°F) from 3°F to 100°F Figure 18. Two-Wire Remote Temperature Sensor (Grounded Sensor) Figure 19. Two-Wire Remote Temperature Sensor (Output Referred to Ground) Figure 20. 4- to -20 mA Current Source (0°F to 100°F) Figure 21. Fahrenheit Thermometer (Analog Meter) 14 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 System Examples (continued) Figure 22. Expanded Scale Thermometer (50°F to 80°F, for Example Shown) Figure 23. Temperature-to-Digital Converter (Serial Output, 128°F Full Scale) ∗ = 1% or 2% film resistor — Trim RB for VB = 3.525V — Trim RC for VC = 2.725V — Trim RA for VA = 0.085V + 40 mV/°F x TAMBIENT — Example, VA = 3.285V at 80°F Figure 24. LM34 With Voltage-to-Frequency Converter and Isolated Output (3°F to 300°F; 30 Hz to 3000 Hz) Figure 25. Bar-Graph Temperature Display (Dot Mode) Figure 26. Temperature-to-Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to µP Interface, 128°F Full Scale) Figure 27. Temperature Controller Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 15 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com 9 Power Supply Recommendations It may be necessary to add a bypass filter capacitor in noisy environments, as shown in as shown in Figure 13. 10 Layout 10.1 Layout Guidelines The LM34 device can be easily applied in the same way as other integrated-circuit temperature sensors. The device can be glued or cemented to a surface and its temperature will be within about 0.02°F of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM34 die would be at an intermediate temperature between the surface temperature and the air temperature. This is especially true for the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the surface temperature. To minimize this problem, be sure that the wiring to the LM34, as it leaves the device, is held at the same temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of epoxy, which will insure that the leads and wires are all at the same temperature as the surface, and that the die temperature of the LM34 device will not be affected by the air temperature. The TO-46 metal package can be soldered to a metal surface or pipe without damage. In the case where soldering is used, the V− terminal of the circuit will be grounded to that metal. Alternatively, the LM34 device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM34 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that moisture cannot corrode the LM34 or its connections. These devices are sometimes soldered to a small, light-weight heat fin to decrease the thermal time constant and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the sensor to give the steadiest reading despite small deviations in the air temperature. Table 2. Temperature Rise of LM34 Due to Self-Heating (Thermal Resistance) TO-46 NO HEAT SINK TO-46, SMALL HEAT Fin (1) TO-92, NO HEAT SINK TO-92, SMALL HEAT Fin (2) SO-8 NO HEAT SINK SO-8 SMALL HEAT Fin Still air 720°F/W 180°F/W 324°F/W 252°F/W 400°F/W 200°F/W Moving air 180°F/W 72°F/W 162°F/W 126°F/W 190°F/W 160°F/W Still oil 180°F/W 72°F/W 162°F/W 126°F/W — — Stirred oil 90°F/W 54°F/W 81°F/W 72°F/W — — — — CONDITIONS (Clamped to metal, infinite heart sink) (1) (2) 16 (43°F/W ) (95°F/W ) Wakefield type 201 or 1-inch disc of 0.020-inch sheet brass, soldered to case, or similar. TO-92 and SO-8 packages glued and leads soldered to 1-inch square of 1/16 inches printed circuit board with 2 oz copper foil, or similar. Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 LM34 www.ti.com SNIS161D – MARCH 2000 – REVISED JANUARY 2016 10.2 Layout Example VIA to ground plane VIA to power plane VOUT +VS N.C. N.C. N.C. N.C. GND N.C. 0.01µ F Figure 28. Layout Example Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 17 LM34 SNIS161D – MARCH 2000 – REVISED JANUARY 2016 www.ti.com 11 Device and Documentation Support 11.1 Trademarks All trademarks are the property of their respective owners. 11.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated Product Folder Links: LM34 PACKAGE OPTION ADDENDUM www.ti.com 21-Apr-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM34AH ACTIVE TO NDV 3 500 TBD Call TI Call TI -45.6 to 148.9 ( LM34AH ~ LM34AH) LM34AH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -45.6 to 148.9 ( LM34AH ~ LM34AH) LM34CAH ACTIVE TO NDV 3 500 TBD Call TI Call TI -40 to 110 ( LM34CAH ~ LM34CAH) LM34CAH/NOPB ACTIVE TO NDV 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 110 ( LM34CAH ~ LM34CAH) LM34CAZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 110 LM34 CAZ LM34CZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 110 LM34 CZ LM34DH ACTIVE TO NDV 3 1000 TBD Call TI Call TI 0 to 100 ( LM34DH ~ LM34DH) LM34DH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI | POST-PLATE Level-1-NA-UNLIM 0 to 100 ( LM34DH ~ LM34DH) LM34DM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 100 LM34D M LM34DM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 100 LM34D M LM34DMX NRND SOIC D 8 TBD Call TI Call TI 0 to 100 LM34D M LM34DMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 100 LM34D M LM34DZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type LM34DZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 LM34 DZ 0 to 100 LM34 DZ Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Apr-2016 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM34DMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Apr-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM34DMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDV0003H H03H (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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