MC74HCT04A Hex Inverter With LSTTL−Compatible Inputs High−Performance Silicon−Gate CMOS The MC74HCT04A may be used as a level converter for interfacing TTL or NMOS outputs to High−Speed CMOS inputs. The HCT04A is identical in pinout to the LS04. www.onsemi.com Features • • • • • • • • • Output Drive Capability: 10 LSTTL Loads TTL/NMOS−Compatible Input Levels Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1 mA In Compliance With the JEDEC Standard No. 7 A Requirements Chip Complexity: 48 FETs or 12 Equivalent Gates NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant SOIC−14 NB D SUFFIX CASE 751A TSSOP−14 DT SUFFIX CASE 948G PIN ASSIGNMENT VCC A6 Y6 A5 Y5 A4 Y4 14 13 12 11 10 9 8 1 2 3 4 5 6 7 A1 Y1 A2 Y2 A3 Y3 GND 14−Lead (Top View) LOGIC DIAGRAM MARKING DIAGRAMS A1 1 2 3 4 5 6 9 8 11 10 13 12 Y1 14 14 A2 A3 Y2 HCT 04A ALYWG G HCT04AG AWLYWW 1 Y3 1 TSSOP−14 SOIC−14 NB A4 A5 A6 Y4 A L, WL Y, YY W, WW G or G Y5 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Y6 FUNCTION TABLE Y=A Pin 14 = VCC Pin 7 = GND Inputs Outputs A Y L H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. © Semiconductor Components Industries, LLC, 2015 August, 2015 − Rev. 12 1 Publication Order Number: MC74HCT04A/D MC74HCT04A MAXIMUM RATINGS Symbol Parameter Value Unit –0.5 to +7.0 V DC Input Voltage (Referenced to GND) –0.5 to VCC + 0.5 V DC Output Voltage (Referenced to GND) –0.5 to VCC + 0.5 V VCC DC Supply Voltage (Referenced to GND) Vin Vout Iin DC Input Current, per Pin ±20 mA Iout DC Output Current, per Pin ±25 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air 500 450 mW Tstg Storage Temperature Range –65 to +150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds SOIC or TSSOP Package SOIC Package† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. _C 260 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. †Derating: SOIC Package: –7 mW/_C from 65_ to 125_C TSSOP Package: −6.1 mW/_C from 65_ to 125_C RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter Min Max Unit 4.5 5.5 V 0 VCC V –55 +125 _C 0 500 ns DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature Range, All Package Types tr, tf Input Rise/Fall Time (Figure 1) Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC CHARACTERISTICS (Voltages Referenced to GND) −55 to 25°C ≤85°C ≤125°C Unit Vout = 0.1V |Iout| ≤ 20mA 4.5 5.5 2.0 2.0 2.0 2.0 2.0 2.0 V Maximum Low−Level Input Voltage Vout = VCC − 0.1V |Iout| ≤ 20mA 4.5 5.5 0.8 0.8 0.8 0.8 0.8 0.8 V Minimum High−Level Output Voltage Vin = VIL |Iout| ≤ 20mA 4.5 5.5 4.4 5.4 4.4 5.4 4.4 5.4 V 4.5 3.98 3.84 3.70 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 4.5 0.26 0.33 0.40 Parameter VIH Minimum High−Level Input Voltage VIL VOH Condition |Iout| ≤ 4.0mA Vin = VIL VOL Guaranteed Limit VCC V Symbol Maximum Low−Level Output Voltage Vin = VIH |Iout| ≤ 20mA |Iout| ≤ 4.0mA Vin = VIH V Iin Maximum Input Leakage Current Vin = VCC or GND 5.5 ±0.1 ±1.0 ±1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0mA 5.5 1 10 40 mA DICC Additional Quiescent Supply Current Vin = 2.4V, Any One Input Vin = VCC or GND, Other Inputs Iout = 0mA 5.5 ≥ −55°C 25 to 125°C 2.9 2.4 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Total Supply Current = ICC + ΣDICC. www.onsemi.com 2 MC74HCT04A AC CHARACTERISTICS (VCC = 5.0V ±10%, CL = 50pF, Input tr = tf = 6ns) Guaranteed Limit Symbol Parameter −55 to 25°C ≤85°C ≤125°C Unit tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figures 1 and 2) 15 17 19 21 22 26 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 2) 15 19 22 ns Maximum Input Capacitance 10 10 10 pF Cin Typical @ 25°C, VCC = 5.0 V CPD 22 Power Dissipation Capacitance (Per Inverter)* pF * Used to determine the no−load dynamic power consumption: P D = CPD VCC2 f + ICC VCC . tf tr 3.0V 2.7V INPUT A TEST POINT 1.3V 0.3V GND tPLH OUTPUT DEVICE UNDER TEST tPHL 90% OUTPUT Y CL* 1.3V 10% tTLH tTHL *Includes all probe and jig capacitance Figure 1. Switching Waveforms Figure 2. Test Circuit A Y Figure 3. Expanded Logic Diagram (1/6 of the Device Shown) ORDERING INFORMATION Package Shipping† MC74HCT04ADG SOIC−14 NB (Pb−Free) 55 Units / Rail MC74HCT04ADR2G SOIC−14 NB (Pb−Free) 2500 / Tape & Reel TSSOP−14 (Pb−Free) 2500 / Tape & Reel NLV74HCT04ADG* SOIC−14 NB (Pb−Free) 55 Units / Rail NLV74HCT04ADR2G* SOIC−14 NB (Pb−Free) 2500 / Tape & Reel TSSOP−14 (Pb−Free) 2500 / Tape & Reel Device MC74HCT04ADTR2G NLV74HCT04ADTR2G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 3 MC74HCT04A PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 4 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HCT04A PACKAGE DIMENSIONS D SOIC−14 NB CASE 751A−03 ISSUE K A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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