Catalyst CAT93C46VI-GT3 1-kb microwire serial eeprom Datasheet

CAT93C46
1-Kb Microwire Serial EEPROM
FEATURES
DESCRIPTION
■ High speed operation: 2MHz
The CAT93C46 is a 1K-bit Serial EEPROM memory
device which is configured as either 64 registers of 16
bits (ORG pin at VCC) or 128 registers of 8 bits (ORG pin
at GND). Each register can be written (or read) serially
by using the DI (or DO) pin. The CAT93C46 features a
self-timed internal write with auto-clear. On-chip PowerOn Reset circuit protects the internal logic against
powering up in the wrong state.
■ 1.8V to 5.5V supply voltage range
■ Selectable x8 or x16 memory organization
■ Self-timed write cycle with auto-clear
■ Software write protection
■ Power-up inadvertant write protection
■ Low power CMOS technology
■ 1,000,000 Program/erase cycles
■ 100 year data retention
■ Industrial temperature ranges
For Ordering Information details, see page 13.
■ RoHS-compliant 8-pin PDIP, SOIC, TSSOP and
8-pad TDFN packages
PIN CONFIGURATION
FUNCTIONAL SYMBOL
PDIP (L)
SOIC (V, X)
TSSOP (Y)
TDFN (VP2)
VCC
SOIC (W)
ORG
CS
1
8
VCC
NC
1
8
ORG
SK
2
7
NC
VCC
2
7
GND
DI
3
6
ORG
CS
3
6
DO
DO
4
5
GND
SK
4
5
DI
CS
CAT93C46
DO
SK
DI
GND
PIN FUNCTIONS
Pin Name
Function
CS
Chip Select
SK
Clock Input
DI
Serial Data Input
DO
Serial Data Output
VCC
Power Supply
GND
Ground
ORG
Memory Organization
NC
No Connection
Note: When the ORG pin is connected to VCC, the x16 organization
is selected. When it is connected to ground, the x8 organization is
selected. If the ORG pin is left unconnected, then an internal pullup
device will select the x16 organization.
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
1
Doc. No. 1106, Rev. F
CAT93C46
ABSOLUTE MAXIMUM RATINGS(1)
Storage Temperature
-65°C to +150°C
Voltage on Any Pin with Respect to Ground
(2)
-0.5 V to +6.5 V
RELIABILITY CHARACTERISTICS(3)
Symbol
NEND(4)
TDR
Parameter
Endurance
Data Retention
Min
1,000,000
Units
Program/ Erase Cycles
100
Years
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +5.5V, TA=-40°C to +85°C, unless otherwise specified.
Symbol
Parameter
Test Conditions
Max
Units
ICC1
Power Supply Current
(Write)
fSK = 1MHz
VCC = 5.0V
Min
1
mA
ICC2
Power Supply Current
(Read)
fSK = 1MHz
VCC = 5.0V
500
µA
ISB1
Power Supply Current
(Standby) (x8 Mode)
VIN=GND or VCC, CS =GND
ORG=GND
2
µA
ISB2
Power Supply Current
(Standby) (x16Mode)
VIN=GND or VCC, CS =GND
ORG=Float or VCC
1
µA
ILI
Input Leakage Current
VIN = GND to VCC
1
µA
ILO
Output Leakage Current
VOUT = GND to VCC,
CS = GND
1
µA
VIL1
Input Low Voltage
4.5V ≤ VCC < 5.5V
-0.1
0.8
V
VIH1
Input High Voltage
4.5V ≤ VCC < 5.5V
2
VCC + 1
V
VIL2
Input Low Voltage
1.8V ≤ VCC < 4.5V
0
VCC x 0.2
V
VIH2
Input High Voltage
1.8V ≤ VCC < 4.5V
VCC x 0.7
VCC+1
V
VOL1
Output Low Voltage
4.5V ≤ VCC < 5.5V
IOL = 2.1mA
0.4
V
VOH1
Output High Voltage
4.5V ≤ VCC < 5.5V
IOH = -400µA
VOL2
Output Low Voltage
1.8V ≤ VCC < 4.5V
IOL = 1mA
VOH2
Output High Voltage
1.8V ≤ VCC < 4.5V
IOH = -100µA
2.4
V
0.2
VCC - 0.2
V
V
Notes:
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
(2) The DC input voltage on any pin should not be lower than -0.5V or higher than VCC +0.5V. During transitions, the voltage on any pin may
undershoot to no less than -1.5V or overshoot to no more than VCC +1.5V, for periods of less than 20 ns.
(3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100
and JEDEC test methods.
(4) Block Mode, VCC = 5V, 25°C
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
2
Doc No. 1106, Rev. F
CAT93C46
PIN CAPACITANCE
TA=25°C, f=1MHz, VCC=5V
Symbol
COUT
(1)
CIN(1)
Test
Conditions
Output Capacitance (DO)
Input Capacitance (CS, SK, DI, ORG)
Min
Typ
Max
Units
VOUT=0V
5
pF
VIN=0V
5
pF
A.C. CHARACTERISTICS(2)
VCC = +1.8V to +5.5V, TA=-40°C to +85°C, unless otherwise specified.
Limits
Symbol
Parameter
Min
tCSS
CS Setup Time
50
ns
tCSH
CS Hold Time
0
ns
tDIS
DI Setup Time
100
ns
tDIH
DI Hold Time
100
ns
tPD1
Output Delay to 1
0.25
µs
tPD0
Output Delay to 0
0.25
µs
tHZ(1)
Output Delay to High-Z
100
ns
tEW
Program/Erase Pulse Width
5
ms
tCSMIN
Minimum CS Low Time
0.25
µs
tSKHI
Minimum SK High Time
0.25
µs
tSKLOW
Minimum SK Low Time
0.25
µs
tSV
Output Delay to Status Valid
SKMAX
Maximum Clock Frequency
DC
Max
Units
0.25
µs
2000
kHz
POWER-UP TIMING (1)(3)
Symbol
tPUR
tPUW
Parameter
Power-up to Read Operation
Power-up to Write Operation
Max
1
1
Units
ms
ms
NOTES:
(1) These parameters are tested initially and after a design or process change that affects the parameter according to
appropriate AEC-Q100 and JEDEC test methods.
(2) Test conditions according to “AC Test Conditions” table.
(3) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
Doc No. 1106, Rev. F
CAT93C46
A.C. TEST CONDITIONS
Input Rise and Fall Times
Input Pulse Voltages
Timing Reference Voltages
Input Pulse Voltages
Timing Reference Voltages
Output Load
≤ 50ns
0.4V to 2.4V
4.5V ≤ VCC ≤ 5.5V
0.8V, 2.0V
4.5V ≤ VCC ≤ 5.5V
0.2VCC to 0.7VCC
1.8V ≤ VCC ≤ 4.5V
0.5VCC
1.8V ≤ VCC ≤ 4.5V
Current Source IOLmax/IOHmax; CL=100pF
DEVICE OPERATION
The CAT93C46 is a 1024-bit nonvolatile memory intended for use with industry standard microprocessors.
The CAT93C46 can be organized as either registers of
16 bits or 8 bits. When organized as X16, seven 9-bit
instructions control the reading, writing and erase operations of the device. When organized as X8, seven 10-bit
instructions control the reading, writing and erase
operations of the device. The CAT93C46 operates on
a single power supply and will generate on chip the high
voltage required during any write operation.
flag can be disabled only in Ready state; no change is
allowed in Busy state.
The format for all instructions sent to the device is a
logical "1" start bit, a 2-bit (or 4-bit) opcode, 6-bit address
(an additional bit when organized X8) and for write
operations a 16-bit data field (8-bit for X8 organization).
Read
Upon receiving a READ command (Figure 2) and an
address (clocked into the DI pin), the DO pin of the
CAT93C46 will come out of the high impedance state
and, after sending an initial dummy zero bit, will begin
shifting out the data addressed (MSB first). The output
data bits will toggle on the rising edge of the SK clock and
are stable after the specified time delay (tPD0 or tPD1).
Instructions, addresses, and write data are clocked into
the DI pin on the rising edge of the clock (SK). The DO
pin is normally in a high impedance state except when
reading data from the device, or when checking the
ready/busy status during a write operation. The serial
communication protocol follows the timing shown in
Figure 1.
Erase/Write Enable and Disable
The CAT93C46 powers up in the write disable state. Any
writing after power-up or after an EWDS (write disable)
instruction must first be preceded by the EWEN (write
enable) instruction. Once the write instruction is enabled,
it will remain enabled until power to the device is removed,
or the EWDS instruction is sent. The EWDS instruction
can be used to disable all CAT93C46 write and erase
instructions, and will prevent any accidental writing or
clearing of the device. Data can be read normally from
the device regardless of the write enable/disable status.
The EWEN and EWDS instructions timing is shown in
Figure 3.
The ready/busy status can be determined after the start
of internal write cycle by selecting the device (CS high)
and polling the DO pin; DO low indicates that the write
operation is not completed, while DO high indicates that
the device is ready for the next instruction. If necessary,
the DO pin may be placed back into a high impedance
state during chip select by shifting a dummy “1” into the
DI pin. The DO pin will enter the high impedance state on
the rising edge of the clock (SK). Placing the DO pin
into the high impedance state is recommended in applications where the DI pin and the DO pin are to be tied
together to form a common DI/O pin. The Ready/Busy
INSTRUCTION SET
Address
Data
Instruction
Start Bit
Opcode
x8
x16
READ
1
10
A6-A0
A5-A0
Read Address AN– A0
ERASE
1
11
A6-A0
A5-A0
Clear Address AN– A0
WRITE
1
01
A6-A0
A5-A0
EWEN
1
00
11XXXXX
11XXXX
Write Enable
EWDS
1
00
00XXXXX
00XXXX
Write Disable
ERAL
1
00
10XXXXX
10XXXX
Clear All Addresses
WRAL
1
00
01XXXXX
01XXXX
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
4
x8
D7-D0
D7-D0
x16
D15-D0
D15-D0
Comments
Write Address AN– A0
Write All Addresses
Doc No. 1106, Rev. F
CAT93C46
Figure 1. Sychronous Data Timing
tSKLOW
tSKHI
tCSH
SK
tDIS
tDIH
VALID
DI
VALID
tCSS
CS
tDIS
tPD0,tPD1
DO
tCSMIN
DATA VALID
Figure 2. Read Instruction Timing
SK
tCSMIN
CS
STANDBY
AN
DI
1
1
AN—1
A0
0
DO
tHZ
tPD0
HIGH-Z
HIGH-Z
0
DN
DN—1
D1
D0
Figure 3. EWEN/EWDS Instruction Timing
SK
STANDBY
CS
DI
1
0
0
*
* ENABLE=11
DISABLE=00
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
5
Doc No. 1106, Rev. F
CAT93C46
Write
Erase All
After receiving a WRITE command (Figure 4), address
and the data, the CS (Chip Select) pin must be deselected
for a minimum of tCSMIN. The falling edge of CS will start
the self clocking for auto-clear and data store cycles on
the memory location specified in the instruction. The
clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy
status of the CAT93C46 can be determined by selecting
the device and polling the DO pin. Since this device
features Auto-Clear before write, it is NOT necessary to
erase a memory location before it is written into.
Upon receiving an ERAL command (Figure 6), the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN. The falling edge of CS will start the self clocking
clear cycle of all memory locations in the device. The
clocking of the SK pin is not necessary after the device
has entered the self clocking mode. The ready/busy
status of the CAT93C46 can be determined by selecting
the device and polling the DO pin. Once cleared, the
contents of all memory bits return to a logical “1” state.
Erase
Upon receiving a WRAL command and data, the CS
(Chip Select) pin must be deselected for a minimum of
tCSMIN (Figure 7). The falling edge of CS will start the self
clocking data write to all memory locations in the device.
The clocking of the SK pin is not necessary after the
device has entered the self clocking mode. The ready/
busy status of the CAT93C46 can be determined by
selecting the device and polling the DO pin. It is not
necessary for all memory locations to be cleared before
the WRAL command is executed.
Write All
Upon receiving an ERASE command and address, the
CS (Chip Select) pin must be deasserted for a minimum
of tCSMIN (Figure 5). The falling edge of CS will start the
self clocking clear cycle of the selected memory location.
The clocking of the SK pin is not necessary after the
device has entered the self clocking mode. The ready/
busy status of the CAT93C46 can be determined by
selecting the device and polling the DO pin. Once
cleared, the content of a cleared location returns to a
logical “1” state.
Figure 4. Write Instruction Timing
SK
tCSMIN
AN
DI
STANDBY
STATUS
VERIFY
CS
1
0
AN-1
A0
DN
D0
1
tSV
DO
tHZ
BUSY
HIGH-Z
READY
HIGH-Z
tEW
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
6
Doc No. 1106, Rev. F
CAT93C46
Figure 5. Erase Instruction Timing
SK
STATUS VERIFY
CS
AN
1
DI
1
tCS MIN
A0
AN-1
STANDBY
1
tSV
tHZ
HIGH-Z
DO
BUSY
READY
HIGH-Z
tEW
Figure 6. ERAL Instruction Timing
SK
CS
STATUS VERIFY
STANDBY
tCS MIN
DI
1
0
0
0
1
tSV
tHZ
HIGH-Z
DO
BUSY
READY
HIGH-Z
tEW
Figure 7. WRAL Instruction Timing
SK
CS
STATUS VERIFY
STANDBY
tCSMIN
DI
1
0
0
0
DN
1
D0
tSV
tHZ
DO
BUSY
READY
HIGH-Z
tEW
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
7
Doc No. 1106, Rev. F
CAT93C46
8-LEAD 300 MIL PLASTIC DIP (L)
E1
E
D
A2
A
A1
L
e
eB
b2
b
SYMBOL
A
A1
A2
b
b2
D
E
E1
e
eB
L
MIN
NOM
MAX
4.57
0.38
3.05
0.36
1.14
9.02
7.62
6.09
7.87
0.115
0.46
7.87
6.35
2.54 BSC
0.130
3.81
0.56
1.77
10.16
8.25
7.11
9.65
0.150
24C16_8-LEAD_DIP_(300P).eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MS001.
3. Dimensioning and tolerancing per ANSI Y14.5M-1982
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
8
Doc No. 1106, Rev. F
CAT93C46
8-LEAD 150 MIL SOIC (V, W)
E1
E
h x 45
D
C
A
θ1
e
A1
L
b
SYMBOL
MIN
A1
A
b
C
D
E
E1
e
h
L
θ1
0.10
1.35
0.33
0.19
4.80
5.80
3.80
NOM
MAX
0.25
1.75
0.51
0.25
5.00
6.20
4.00
1.27 BSC
0.25
0.40
0°
0.50
1.27
8°
24C16_8-LEAD_SOIC.eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC specification MS-012.
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
9
Doc No. 1106, Rev. F
CAT93C46
8-LEAD 208 MIL SOIC (X)
E
b
D
c
A
θ1
e
A1
L
SYMBOL
MIN
A1
A
b
c
D
E
E1
e
L
θ1
0.05
NOM
MAX
0.25
2.03
0.48
0.25
5.33
8.26
5.38
0.36
0.19
5.13
7.75
5.13
1.27 BSC
0.51
0°
0.76
8°
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with EIAJ specification EDR-7320.
3. D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed 0.06in per side.
4. E1 does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.010in per side.
5. Lead span/stand off height/coplanarity are considered as special characteristic (A1).
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
10
Doc No. 1106, Rev. F
CAT93C46
8-LEAD TSSOP (Y)
D
5
8
SEE DETAIL A
c
E
E1
E/2
GAGE PLANE
4
1
PIN #1 IDENT.
0.25
θ1
L
A2
SEATING PLANE
SEE DETAIL A
A
e
A1
b
SYMBOL
A
A1
A2
b
c
D
E
E1
e
L
θ1
MIN
0.05
0.80
0.19
0.09
2.90
6.30
4.30
0.50
0.00
NOM
0.90
3.00
6.4
4.40
0.65 BSC
0.60
MAX
1.20
0.15
1.05
0.30
0.20
3.10
6.50
4.50
0.75
8.00
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MO-153
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc No. 1106, Rev. F
CAT93C46
8-PAD TDFN 2X3 PACKAGE (VP2)
A
E
PIN 1 INDEX AREA
A1
D
D2
A2
A3
SYMBOL
MIN
NOM
MAX
A
A1
A2
A3
b
D
D2
E
E2
e
L
0.70
0.00
0.45
0.75
0.02
0.55
0.20 REF
0.25
2.00
1.40
3.00
1.30
0.50 TYP
0.30
0.80
0.05
0.65
0.20
1.90
1.30
2.90
1.20
0.20
E2
0.30
2.10
1.50
3.10
1.40
0.40
PIN 1 ID
L
b
e
3xe
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
TDFN2X3 (03).eps
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC specification MO-229.
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
12
Doc No. 1106, Rev. F
CAT93C46
EXAMPLE OF ORDERING INFORMATION
Prefix
Device #
CAT
93C46
Optional
Company ID
Suffix
V
Product Number
93C46
L
V
W
X
Y
VP2
–G
I
Temperature Range
I = Industrial (-40°C - 85°C)
Package
= PDIP
= SOIC, JEDEC
= SOIC, JEDEC
= SOIC, EIAJ
= TSSOP
= TDFN (2X3mm)
T3
Tape & Reel(4)
T: Tape & Reel
2: 2000/Reel
3: 3000/Reel
Lead Finish(2)
Blank: Matte-Tin
G: NiPdAu
Notes:
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).
(2) The standard lead finish for the SOIC, EIAJ (X) package is Matte-Tin; the standard lead finish for all other packages is NiPdAu.
(3) The device used in the above example is a CAT93C46VI-GT3 (SOIC, JEDEC, Industrial Temperature, NiPdAu, Tape & Reel).
(4) The SOIC, EIAJ (X) package is available in reels of 2000 pcs/reel (i.e. CAT93C46XI-T2). All other packages are offered in reels
of 3000 pcs/reel.
(5) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
13
Doc No. 1106, Rev. F
CAT93C46
REVISION HISTORY
Date
12/01/05
Revision Comments
A
Initial Issue
12/08/05
B
Update D.C Operating Characteristics
02/22/06
C
Update Pin Configuration
Update A.C. Charateristics, Die Rev N
Update Package Dimensions
Update Ordering Information
Update Package Marking
05/24/06
D
Update Pin Configuration
Update Pin Functions
Update D.C. Operating Charateristics
Update A.C. Charateristics
Update Device Operation
Update Package Marking
Remove Tape and Reel
Update Example of Package Information
08/01/06
E
Update D.C. Operating Charateristics
UpdateTest Condition for Pin Capacitance
Update A.C. Charateristics
Update Device Operation
Add 8 Lead 208 mil SOIC (X) Package
Update Package Marking
Update Example of Package Information
02/08/07
F
Update D.C. Operating Characteristics
Update A.C. Characteristics
Update Figures 5 and 6
Remove Package Marking
© 2007 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
14
Doc No. 1106, Rev. F
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Publication #:
Revison:
Issue date:
1106
E
02/08/07
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