Freescale MC13192FCR2 2.4 ghz low power transceiver for the ieee 802.15.4 standard Datasheet

Freescale Semiconductor
Technical Data
Document Number: MC13192
Rev. 3.3, 04/2008
MC13192
MC13192
Package Information
Plastic Package
Case 1311-03
(QFN-32)
2.4 GHz Low Power Transceiver
for the IEEE® 802.15.4 Standard
Ordering Information
1
Introduction
The MC13192 is a short range, low power, 2.4 GHz
Industrial, Scientific, and Medical (ISM) band
transceivers. The MC13192 contains a complete
802.15.4 physical layer (PHY) modem designed for the
IEEE® 802.15.4 Standard which supports peer-to-peer,
star, and mesh networking.
The MC13192 includes the 802.15.4 PHY/MAC for use
with the HCS08 Family of MCUs. The MC13192 can be
used with Freescale’s IEEE 802.15.4 MAC and
BeeStack, which is Freescale’s ZigBee 2006 compliant
protocol stack.
Device
Device Marking
Package
MC13192FC
13192
QFN-32
MC13192FCR2
(Tape and reel)
13192
QFN-32
Contents
1
2
3
4
5
6
7
8
9
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 4
Data Transfer Modes . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics . . . . . . . . . . . . . . . 7
Functional Description . . . . . . . . . . . . . . . . 11
Pin Connections . . . . . . . . . . . . . . . . . . . . . . 14
Applications Information . . . . . . . . . . . . . . . 17
Packaging Information . . . . . . . . . . . . . . . . . 23
When combined with an appropriate microcontroller
(MCU), the MC13192 provide a cost-effective solution
for short-range data links and networks. Interface with
the MCU is accomplished using a four wire serial
peripheral interface (SPI) connection and an interrupt
request output which allows for the use of a variety of
processors. The software and processor can be scaled to
fit applications ranging from simple point-to-point
systems, through complete ZigBee™ networking.
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2004, 2005, 2006, 2007, 2008. All rights reserved.
Features
For more detailed information about MC13192 operation, refer to the MC13192 Reference Manual,
(MC13192RM).
Applications include, but are not limited to, the following:
• Remote control and wire replacement in industrial systems such as wireless sensor networks
• Factory automation and motor control
• Energy Management (lighting, HVAC, etc.)
• Asset tracking and monitoring
Potential consumer applications include:
• Home automation and control (lighting, thermostats, etc.)
• Human interface devices (keyboard, mice, etc.)
• Remote control
• Wireless toys
The transceiver includes a low noise amplifier, 1.0 mW power amplifier (PA), PLL with internal voltage
controlled oscillator (VCO), on-board power supply regulation, and full spread-spectrum encoding and
decoding. The device supports 250 kbps Offset-Quadrature Phase Shift Keying (O-QPSK) data in 2.0
MHz channels with 5.0 MHz channel spacing per the 802.15.4 Standard. The SPI port and interrupt request
output are used for receive (RX) and transmit (TX) data transfer and control.
2
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Supports 250 kbps O-QPSK data in 5.0 MHz channels and full spread-spectrum encode and decode
(compatible with the 802.15.4 Standard)
Operates on one of 16 selectable channels in the 2.4 GHz band
RX sensitivity of <-92 dBm (typical) at 1.0% packet error rate
0 dBm nominal, programmable from -27 dBm to 4 dBm typical maximum output power
Recommended power supply range: 2.0 to 3.4 V
Buffered transmit and receive data packets for simplified use with low cost MCUs
Three power down modes for power conservation:
— < 1 µA Off current
— 1 µA Typical Hibernate current
— 35 µA Typical Doze current (no CLKO)
Four internal timer comparators available to supplement MCU resource
Programmable frequency clock output (CLKO) for use by MCU
Onboard trim capability for 16 MHz crystal reference oscillator eliminates need for external
variable capacitors and allows for automated production frequency calibration.
Seven general purpose input/output (GPIO) signals
Operating temperature range: -40 °C to 85 °C
Small form factor QFN-32 Package
MC13192 Technical Data, Rev. 3.3
2
Freescale Semiconductor
Features
—
—
—
—
2.1
RoHS compliant
Meets moisture sensitivity level (MSL) 3
260 °C peak reflow temperature
Meets lead-free requirements
Software Features
Freescale provides a wide range of software functionality to complement the MC13192 hardware. There
are three levels of application solutions:
1. Simple proprietary wireless connectivity.
2. User networks built on the 802.15.4 MAC standard.
3. ZigBee-compliant network stack.
2.1.1
•
•
•
•
2.1.2
•
•
•
•
2.1.3
•
•
•
Simple MAC (SMAC)
Small memory footprint (about 3 Kbytes typical)
Supports point-to-point and star network configurations
Proprietary networks
Source code and application examples provided
802.15.4 Standard-Compliant MAC
Supports star, mesh and cluster tree topologies
Supports beaconed networks
Supports GTS for low latency
Multiple power saving modes (idle doze, hibernate)
ZigBee-Compliant Network Stack
Supports ZigBee 1.0 specification
Supports star, mesh and tree networks
Advanced Encryption Standard (AES) 128-bit security
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
3
Block Diagrams
3
Block Diagrams
Figure 1 shows a simplified block diagram of the MC13192 which is an 802.15.4 Standard compatible
transceiver that provides the functions required in the physical layer (PHY) specification.
R F IN +
R F IN -
V DDA
A nalog
R egulator
M atc hed
F ilter
DC D
CCA
Symbol
B as e band
M ix e r
Synch & Det
1 s t IF M ix er
IF = 6 5 M Hz
Dec im ation
F ilter
Correlator
LN A
2nd IF M ix er
IF = 1 M Hz P M A
P ow er-U p
C ontrol
Lo gic
P ac k et
P roc e s s or
VBAT T
Digital
R egulator L
V DDIN T
Digital
R e gulato r H
V DDD
C ry s tal
R egulator
R ec eiv e
P ac k e t R A M
VC O
R egulator
R ec e iv e R A M
A rbiter
V DDV C O
AGC
256 M Hz
R XT XEN
S equ enc e
M ana ger
(C o ntrol L ogic )
24 B it E v ent T im er
X T A L1
C ry s t a l
O s c illa t or
X T A L2
16 M Hz
SERIAL
PERIPHERAL
4 P ro gram m able
T im er C o m parators
INTERFACE
(SPI)
V DDLO 2
P ro gram m able
P res c aler
÷4
T rans m it
P ac k et R A M 1
2. 45 G Hz
V CO
PAO+
PAO-
PA
T rans m it R A M
A rbite r
IR Q
A rbiter
S y m bol
G ene ra tion
P has e S h ift M o dulato r
IR Q
C LK O
MUX
V DDLO 1
R ST
G P IO 1
G P IO 2
G P IO 3
G P IO 4
G P IO 5
G P IO 6
G P IO 7
T rans m it
P ac k et R A M 2
S y n th e size r
CE
M OSI
M IS O
S P IC L K
ATT N
FCS
G e neratio n
Heade r
G ene ra tion
Figure 1. MC13192 Simplified Block Diagram
Figure 2 shows the basic system block diagram for the MC13192 in an application. Interface with the
transceiver is accomplished through a 4-wire SPI port and interrupt request line. The media access control
(MAC), drivers, and network and application software (as required) reside on the host processor. The host
can vary from a simple 8-bit device up to a sophisticated 32-bit processor depending on application
requirements.
MC13192
Control
Logic
SPI
and GPIO
ROM
(Flash)
SPI
Timer
RAM Arbiter
RAM
IRQ Arbiter
Frequency
Generation
Digital Transceiver
Analog Receiver
Timer
Microcontroller
CPU
A/D
Application
Analog
Transmitter
Network
Voltage
Regulators
Power Up
Management
Buffer RAM
MAC
PHY Driver
Figure 2. System Level Block Diagram
MC13192 Technical Data, Rev. 3.3
4
Freescale Semiconductor
Data Transfer Modes
4
Data Transfer Modes
The MC13192 has two data transfer modes:
1. Packet Mode — Data is buffered in on-chip RAM
2. Streaming Mode — Data is processed word-by-word
The Freescale 802.15.4 MAC software only supports the streaming mode of data transfer. For proprietary
applications, packet mode can be used to conserve MCU resources.
4.1
Packet Structure
Figure 3 shows the packet structure of the MC13192. Payloads of up to 125 bytes are supported. The
MC13192 adds a four-byte preamble, a one-byte Start of Frame Delimiter (SFD), and a one-byte Frame
Length Indicator (FLI) before the data. A two-byte Frame Check Sequence (FCS) is calculated and
appended to the end of the data.
4 bytes
1 byte
1 byte
125 bytes maximum
2 bytes
Preamble
SFD
FLI
Payload Data
FCS
Figure 3. MC13192 Packet Structure
4.2
Receive Path Description
In the receive signal path, the RF input is converted to low IF In-phase and Quadrature (I & Q) signals
through two down-conversion stages. A Clear Channel Assessment (CCA) can be performed based upon
the baseband energy integrated over a specific time interval. The digital back end performs Differential
Chip Detection (DCD), the correlator “de-spreads” the Direct Sequence Spread Spectrum (DSSS) Offset
QPSK (O-QPSK) signal, determines the symbols and packets, and detects the data.
The preamble, SFD, and FLI are parsed and used to detect the payload data and FCS which are stored in
RAM. A two-byte FCS is calculated on the received data and compared to the FCS value appended to the
transmitted data, which generates a Cyclical Redundancy Check (CRC) result. Link Quality is measured
over a 64 µs period after the packet preamble and stored in RAM.
If the MC13192 is in packet mode, the data is processed as an entire packet. The MCU is notified that an
entire packet has been received via an interrupt.
If the MC13192 is in streaming mode, the MCU is notified by an interrupt on a word-by-word basis.
Figure 4 shows CCA reported power level versus input power. Note that CCA reported power saturates at
about -57 dBm input power which is well above 802.15.4 Standard requirements.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
5
Data Transfer Modes
Reported Power Level (dBm)
-50
-60
-70
802.15.4 Accuracy
and range Requirements
-80
-90
-100
-90
-80
-70
-60
-50
Input Pow er (dBm)
Figure 4. Reported Power Level versus Input Power in Clear Channel Assessment Mode
Figure 5 shows energy detection/LQI reported level versus input power.
NOTE
For both graphs the required 802.15.4 Standard accuracy and range limits
are shown.
-15
Reported Power Level (dBm)
-25
-35
-45
-55
-65
802.15.4 Accuracy
and Range Requirements
-75
-85
-85
-75
-65
-55
-45
-35
-25
-15
Input Power Level (dBm)
Figure 5. Reported Power Level Versus Input Power for Energy Detect or Link Quality Indicator
MC13192 Technical Data, Rev. 3.3
6
Freescale Semiconductor
Electrical Characteristics
4.3
Transmit Path Description
For the transmit path, the TX data that was previously stored in RAM is retrieved (packet mode) or the TX
data is clocked in via the SPI (stream mode), formed into packets per the 802.15.4 PHY, spread, and then
up-converted to the transmit frequency.
If the MC13192 is in packet mode, data is processed as an entire packet. The data is first loaded into the
TX buffer. The MCU then requests that the MC13192 transmit the data. The MCU is notified via an
interrupt when the whole packet has successfully been transmitted.
In streaming mode, the data is fed to the MC13192 on a word-by-word basis with an interrupt serving as
a notification that the MC13192 is ready for more data. This continues until the whole packet is
transmitted.
5
Electrical Characteristics
5.1
Maximum Ratings
Table 1. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
VBATT, VDDINT
-0.3 to 3.6
Vdc
Vin
-0.3 to (VDDINT + 0.3)
Pmax
10
dBm
Junction Temperature
TJ
125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Power Supply Voltage
Digital Input Voltage
RF Input Power
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operating Conditions tables.
Note: ESD protection meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
7
Electrical Characteristics
5.2
Recommended Operating Conditions
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
VBATT,
VDDINT
2.0
2.7
3.4
Vdc
Input Frequency
fin
2.405
-
2.480
GHz
Ambient Temperature Range
TA
-40
25
85
°C
Logic Input Voltage Low
VIL
0
-
30%
VDDINT
V
Logic Input Voltage High
VIH
70%
VDDINT
-
VDDINT
V
SPI Clock Rate
fSPI
-
-
8.0
MHz
RF Input Power
Pmax
-
-
10
dBm
Power Supply Voltage (VBATT = VDDINT)1
Crystal Reference Oscillator Frequency (±40 ppm over
operating conditions to meet the 802.15.4 Standard.)
1
5.3
fref
16 MHz Only
If the supply voltage is produced by a switching DC-DC converter, ripple should be less than 100 mV peak-to-peak.
DC Electrical Characteristics
Table 3. DC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Ileakage
ICCH
ICCD
ICCI
ICCT
ICCR
-
0.2
1.0
35
500
30
37
1.0
6.0
102
800
35
42
µA
µA
µA
µA
mA
mA
Input Current (VIN = 0 V or VDDINT) (All digital inputs)
IIN
-
-
±1
µA
Input Low Voltage (All digital inputs)
VIL
0
-
30%
VDDINT
V
Input High Voltage (all digital inputs)
VIH
70%
VDDINT
-
VDDINT
V
Output High Voltage (IOH = -1 mA) (All digital outputs)
VOH
80%
VDDINT
-
VDDINT
V
Output Low Voltage (IOL = 1 mA) (All digital outputs)
VOL
0
-
20%
VDDINT
V
Power Supply Current (VBATT + VDDINT)
Off1
Hibernate1
Doze (No CLKO)1 2
Idle
Transmit Mode (0 dBm nominal output power)
Receive Mode
1
To attain specified low power current, all GPIO and other digital IO must be handled properly. See Section 8.4, “Low Power
Considerations.
2
CLKO frequency at default value of 32.786 kHz.
MC13192 Technical Data, Rev. 3.3
8
Freescale Semiconductor
Electrical Characteristics
5.4
AC Electrical Characteristics
NOTE
All AC parameters measured with SPI Registers at default settings except
where noted and the following registers over-programmed:
Register 08 = 0xFFF7 and Register 11 = 0x20FF
Table 4. Receiver AC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.
Parameters measured at connector J6 of evaluation circuit.)
Characteristic
Symbol
Min
Typ
Max
Unit
SENSper
-
-92
-
dBm
-
-92
-87
dBm
-
10
-
dBm
Channel Rejection for 1% PER (desired signal -82 dBm)
+5 MHz (adjacent channel)
-5 MHz (adjacent channel)
+10 MHz (alternate channel)
-10 MHz (alternate channel)
>= 15 MHz
-
25
31
42
41
49
-
dB
dB
dB
dB
dB
Frequency Error Tolerance
-
-
200
kHz
Symbol Rate Error Tolerance
-
-
80
ppm
Sensitivity for 1% Packet Error Rate (PER) (-40 to +85 °C)
Sensitivity for 1% Packet Error Rate (PER) (+25 °C)
Saturation (maximum input level)
SENSmax
Table 5. Transmitter AC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.
Parameters measured at connector J5 of evaluation circuit.)
Characteristic
Symbol
Min
Typ
Max
Unit
Power Spectral Density (-40 to +85 °C) Absolute limit
-
-47
-
dBm
Power Spectral Density (-40 to +85 °C) Relative limit
-
47
-
-3
0
3
Nominal Output Power1
Pout
Maximum Output Power2
4
Error Vector Magnitude
dBm
-
20
35
%
Output Power Control Range (-27 dBm to +4 dBm typical)
-
31
-
dB
Over the Air Data Rate
-
250
-
kbps
2nd Harmonic
-
-42
-
dBc
3rd Harmonic
-
-44
-
dBc
1
2
EVM
dBm
SPI Register 12 programmed to 0x00BC which sets output power to nominal (0 dBm typical).
SPI Register 12 programmed to 0x00FF which sets output power to maximum.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
9
Electrical Characteristics
Table 6. Digital Timing Specifications
(VBATT, VDDINT = 2.7 V, TA = 25 °C, frequency = 16 MHz, unless otherwise noted.
SPI timing parameters are referenced to Figure 8.
Symbol
Parameter
Min
Typ
Max
Unit
T0
SPICLK period
125
nS
T1
Pulse width, SPICLK low
50
nS
T2
Pulse width, SPICLK high
50
nS
T3
Delay time, MISO data valid from falling SPICLK
15
nS
T4
Setup time, CE low to rising SPICLK
15
nS
T5
Delay time, MISO valid from CE low
15
nS
T6
Setup time, MOSI valid to rising SPICLK
15
nS
T7
Hold time, MOSI valid from rising SPICLK
15
nS
RST minimum pulse width low (asserted)
250
nS
Figure 6 shows a typical AC parameter evaluation circuit.
J5
SMA
J6
SMA
2
Y1
TSX-10A@16Mhz
1
1
2
4
2
+
C1
220pF
+
C2
220pF
C6
0.1uF
L2
VDDA
VBATT
VDDVCO
VDDLO1
VDDLO2
XTAL2
XTAL1
GPIO7
U1
6.8nH
R2 200
L1
8.2nH
1
2
3
4
5
6
7
8
32
31
30
29
28
27
26
25
C8
10pF
RFINRFIN+
GND
GND
PAO+
PAOGND
GPIO4
MC13192
GPIO3
GPIO2
GPIO1
RST
RXTXEN
ATTN
CLKO
SPICLK
C7
10pF
J1
R1
47k
GPIO6
GPIO5
VDDINT
VDDD
IRQ
CE
MISO
MOSI
24
23
22
21
20
19
18
17
GPIO1
R3
10k
+
IRQ
C3
220pF
Baud SEL
9
10
11
12
13
14
15
16
4
2
3
T2
3
T1
2450BL15B200
2450BL15B200
C5
9pF
5
1
5
1
C4
9pF
RTXENi
MOSI
CE
VCC
RTXENi
GPIO2
R4
47k
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
J3
PA2
1
2
RXD
GPIO2
Wake Up
J4
16 MHz CLK
2
1
MCU RESET
ATTN
SPI_CLK
MISO
CLOCK Sel
J7
1
2
3
MCU Interface
GPIO1
ABEL RESET
CLKO
RESET
R5
47k
1
3
5
7
9
11
13
15
17
19
R6
47k
J2
2
4
6
8
10
12
14
16
18
20
HEADER 10X2
Figure 6. Parameter Evaluation Circuit
MC13192 Technical Data, Rev. 3.3
10
Freescale Semiconductor
Functional Description
6
Functional Description
6.1
MC13192 Operational Modes
The MC13192 has a number of operational modes that allow for low-current operation. Transition from
the Off to Idle mode occurs when RST is negated. Once in Idle, the SPI is active and is used to control the
IC. Transition to Hibernate and Doze modes is enabled via the SPI. These modes are summarized, along
with the transition times, in Table 7. Current drain in the various modes is listed in Table 3, DC Electrical
Characteristics.
Table 7. MC13192 Mode Definitions and Transition Times
Mode
Off
Definition
Transition Time
To or From Idle
All IC functions Off, Leakage only. RST asserted. Digital outputs are tri-stated including 10 - 25 ms to Idle
IRQ
Hibernate
Doze
Idle
Crystal Reference Oscillator Off. (SPI not functional.) IC Responds to ATTN. Data is
retained.
7 - 20 ms to Idle
Crystal Reference Oscillator On but CLKO output available only if Register 7, Bit 9 = 1
for frequencies of 1 MHz or less. (SPI not functional.) Responds to ATTN and can be
programmed to enter Idle Mode through an internal timer comparator.
(300 + 1/CLKO) µs
to Idle
Crystal Reference Oscillator On with CLKO output available. SPI active.
Receive
Crystal Reference Oscillator On. Receiver On.
144 µs from Idle
Transmit
Crystal Reference Oscillator On. Transmitter On.
144 µs from Idle
6.2
Serial Peripheral Interface (SPI)
The host microcontroller directs the MC13192, checks its status, and reads/writes data to the device
through the 4-wire SPI port. The transceiver operates as a SPI slave device only. A transaction between
the host and the MC13192 occurs as multiple 8-bit bursts on the SPI. The SPI signals are:
1. Chip Enable (CE) - A transaction on the SPI port is framed by the active low CE input signal. A
transaction is a minimum of 3 SPI bursts and can extend to a greater number of bursts.
2. SPI Clock (SPICLK) - The host drives the SPICLK input to the MC13192. Data is clocked into the
master or slave on the leading (rising) edge of the return-to-zero SPICLK and data out changes
state on the trailing (falling) edge of SPICLK.
NOTE
For Freescale microcontrollers, the SPI clock format is the clock phase
control bit CPHA = 0 and the clock polarity control bit CPOL = 0.
3. Master Out/Slave In (MOSI) - Incoming data from the host is presented on the MOSI input.
4. Master In/Slave Out (MISO) - The MC13192 presents data to the master on the MISO output.
A typical interconnection to a microcontroller is shown in Figure 7.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
11
Functional Description
MCU
MC13192
Shift Register
Baud Rate
Generator
RxD
MISO
TxD
MOSI
Sclk
SPICLK
Chip Enable (CE)
Shift Register
CE
Figure 7. SPI Interface
Although the SPI port is fully static, internal memory, timer and interrupt arbiters require an internal clock
(CLKcore), derived from the crystal reference oscillator, to communicate from the SPI registers to internal
registers and memory.
6.2.1
SPI Burst Operation
The SPI port of an MCU transfers data in bursts of 8 bits with most significant bit (MSB) first. The master
(MCU) can send a byte to the slave (transceiver) on the MOSI line and the slave can send a byte to the
master on the MISO line. Although an MC13192 transaction is three or more SPI bursts long, the timing
of a single SPI burst is shown in Figure 8.
SPI Burst
CE
1
2
3
4
5
6
7
8
SPICLK
T4
Valid
T6
T5
T2
T1
T3
T0
T7
MISO
MOSI
Valid
Valid
Figure 8. SPI Single Burst Timing Diagram
SPI digital timing specifications are shown in Table 6.
MC13192 Technical Data, Rev. 3.3
12
Freescale Semiconductor
Functional Description
6.2.2
SPI Transaction Operation
Although the SPI port of an MCU transfers data in bursts of 8 bits, the MC13192 requires that a complete
SPI transaction be framed by CE, and there will be three (3) or more bursts per transaction. The assertion
of CE to low signals the start of a transaction. The first SPI burst is a write of an 8-bit header to the
transceiver (MOSI is valid) that defines a 6-bit address of the internal resource being accessed and
identifies the access as being a read or write operation. In this context, a write is data written to the
MC13192 and a read is data written to the SPI master. The following SPI bursts will be either the write
data (MOSI is valid) to the transceiver or read data from the transceiver (MISO is valid).
Although the SPI bus is capable of sending data simultaneously between master and slave, the MC13192
never uses this mode. The number of data bytes (payload) will be a minimum of 2 bytes and can extend to
a larger number depending on the type of access. After the final SPI burst, CE is negated to high to signal
the end of the transaction. Refer to the MC13192 Reference Manual, (MC13192RM) for more details on
SPI registers and transaction types.
An example SPI read transaction with a 2-byte payload is shown in Figure 9.
CE
Clock Burst
SPICLK
MISO
MOSI
Valid
Valid
Valid
Header
Read data
Figure 9. SPI Read Transaction Diagram
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
13
Pin Connections
7
Pin Connections
Table 8. Pin Function Description
Pin #
Pin Name
Type
Description
Functionality
1
RFIN-
RF Input
LNA negative differential input.
2
RFIN+
RF Input
LNA positive differential input.
3
Not Used
Tie to Ground.
4
Not Used
Tie to Ground.
5
PAO+
RF Output /DC Input
Power Amplifier Positive Output. Open drain. Connect
to VDDA.
6
PAO-
RF Output/DC Input
Power Amplifier Negative Output. Open drain.
Connect to VDDA.
7
SM
8
GPIO41
9
Test mode pin. Tie to Ground
Tie to Ground for
normal operation
Digital Input/ Output
General Purpose Input/Output 4.
See Footnote 1
GPIO31
Digital Input/ Output
General Purpose Input/Output 3.
See Footnote 1
10
GPIO21
Digital Input/ Output
General Purpose Input/Output 2. When gpio_alt_en,
Register 9, Bit 7 = 1, GPIO2 functions as a “CRC
Valid” indicator.
See Footnote 1
11
GPIO11
Digital Input/ Output
General Purpose Input/Output 1. When gpio_alt_en,
Register 9, Bit 7 = 1, GPIO1 functions as an “Out of
Idle” indicator.
See Footnote 1
12
RST
Digital Input
Active Low Reset. While held low, the IC is in Off Mode
and all internal information is lost from RAM and SPI
registers. When high, IC goes to IDLE Mode, with SPI
in default state.
13
RXTXEN2
Digital Input
Active High. Low to high transition initiates RX or TX See Footnote 2
sequence depending on SPI setting. Should be taken
high after SPI programming to start RX or TX
sequence and should be held high through the
sequence. After sequence is complete, return
RXTXEN to low. When held low, forces Idle Mode.
14
ATTN2
Digital Input
Active Low Attention. Transitions IC from either
Hibernate or Doze Modes to Idle.
15
CLKO
Digital Output
Clock output to host MCU. Programmable frequencies
of:
16 MHz, 8 MHz, 4 MHz, 2 MHz, 1 MHz, 62.5 kHz,
32.786+ kHz (default),
and 16.393+ kHz.
16
SPICLK2
Digital Clock Input
External clock input for the SPI interface.
See Footnote 2
17
MOSI2
Digital Input
Master Out/Slave In. Dedicated SPI data input.
See Footnote 2
18
MISO3
Digital Output
Master In/Slave Out. Dedicated SPI data output.
See Footnote 3
19
CE2
Digital Input
Active Low Chip Enable. Enables SPI transfers.
See Footnote 2
See Footnote 2
MC13192 Technical Data, Rev. 3.3
14
Freescale Semiconductor
Pin Connections
Table 8. Pin Function Description (continued)
Pin #
Pin Name
Type
Description
Functionality
20
IRQ
Digital Output
Active Low Interrupt Request.
Open drain device.
Programmable 40
kΩ internal pull-up.
Interrupt can be
serviced every 6 µs
with <20 pF load.
Optional external
pull-up must be >4
kΩ.
21
VDDD
Power Output
Digital regulated supply bypass.
Decouple to ground.
22
VDDINT
Power Input
Digital interface supply & digital regulator input.
Connect to Battery.
2.0 to 3.4 V.
Decouple to ground.
23
GPIO51
Digital Input/Output
General Purpose Input/Output 5.
See Footnote 1
24
GPIO61
Digital Input/Output
General Purpose Input/Output 6.
See Footnote 1
25
GPIO71
Digital Input/Output
General Purpose Input/Output 7.
See Footnote 1
26
XTAL1
Input
Crystal Reference oscillator input.
Connect to 16 MHz
crystal and load
capacitor.
27
XTAL2
Input/Output
Crystal Reference oscillator output
Note: Do not load this pin by using it as a 16 MHz
source. Measure 16 MHz output at Pin 15,
CLKO, programmed for 16 MHz. See the
MC13192 Reference Manual for details.
Connect to 16 MHz
crystal and load
capacitor.
28
VDDLO2
Power Input
LO2 VDD supply. Connect to VDDA externally.
29
VDDLO1
Power Input
LO1 VDD supply. Connect to VDDA externally.
30
VDDVCO
Power Output
VCO regulated supply bypass.
Decouple to ground.
31
VBATT
Power Input
Analog voltage regulators Input. Connect to Battery.
Decouple to ground.
32
VDDA
Power Output
Analog regulated supply Output. Connect to directly Decouple to ground.
VDDLO1 and VDDLO2 externally and to PAO±
through a frequency trap.
Note: Do not use this pin to supply circuitry external to
the chip.
EP
Ground
External paddle / flag ground.
Connect to ground.
1
The transceiver GPIO pins default to inputs at reset. There are no programmable pullups on these pins. Unused GPIO pins
should be tied to ground if left as inputs, or if left unconnected, they should be programmed as outputs set to the low state.
2 During low power modes, input must remain driven by MCU.
3 By default MISO is tri-stated when CE is negated. For low power operation, miso_hiz_en (Bit 11, Register 07) should be set
to zero so that MISO is driven low when CE is negated.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
15
Pin Connections
GPIO7
XTAL1
XTAL2
VDDLO2
VDDLO1
VDDVCO
VBATT
GPIO6
VDDD
EP
PAO+
IRQ
MC13192
PAO-
CE
SM
MISO
GPIO4
9
10
11
12
13
14
15
SPICLK
8
25
NC
CLKO
7
26
VDDINT
ATTN
6
27
NC
RXTXEN
5
28
RST
4
29
GPIO5
GPIO1
3
30
RFIN+
GPIO2
2
RFIN-
GPIO3
1
31
VDDA
32
MOSI
24
23
22
21
20
19
18
17
16
Figure 10. Pin Connections (Top View)
MC13192 Technical Data, Rev. 3.3
16
Freescale Semiconductor
Applications Information
8
Applications Information
This section provides application specific information regarding crystal oscillator reference frequency, a
basic design example for interfacing the MC13192 to an MCU and recommended crystal usage.
8.1
Crystal Oscillator Reference Frequency
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC13192 transceiver provides onboard crystal trim capacitors to assist in meeting this
performance.
The primary determining factor in meeting this specification is the tolerance of the crystal oscillator
reference frequency. A number of factors can contribute to this tolerance and a crystal specification will
quantify each of them:
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
Freescale requires the use of a 16 MHz crystal with a <9 pF load capacitance. The MC13192 does not
contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher
load capacitance is prohibited because a higher load on the amplifier circuit may compromise its
performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen
across the two terminals of the crystal. The oscillator amplifier configuration used in the MC13192
requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors
are seen to be in series by the crystal, so each must be <18 pF for proper loading.
In the reference schematic, the external load capacitors are shown as 6.8 pF each, used in conjunction with
a crystal that requires an 8 pF load capacitance. The default internal trim capacitor value (2.4 pF) and stray
capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value for the stray capacitance
was determined empirically assuming the default internal trim capacitor value and for a specific board
layout. A different board layout may require a different external load capacitor value. The on-chip trim
capability may be used to determine the closest standard value by adjusting the trim value via the SPI and
observing the frequency at CLKO. Each internal trim load capacitor has a trim range of approximately
5 pF in 20 fF steps.
Initial tolerance for the internal trim capacitance is approximately ±15%.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
17
Applications Information
Since the MC13192 contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
8.2
Design Example
Figure 11 shows a basic application schematic for interfacing the MC13192 with an MCU. Table 9 lists
the Bill of Materials (BOM).
The MC13192 has differential RF inputs and outputs that are well suited to balanced printed wire antenna
structures. Alternatively, as in the application circuit, a printed wire antenna, a chip antenna, or other
single-ended structures can be used with commercially available chip baluns or microstrip equivalents.
PAO+ and PAO- require a DC connection to VDDA (the analog regulator output) through AC blocking
elements. This is accomplished through the baluns in the referenced design.
The 16 MHz crystal should be mounted close to the MC13192 because the crystal trim default assumes
that the listed KDS Daishinku crystal (see Table 10) and the 6.8 pF load capacitors shown are used. If a
different crystal is used, it should have a specified load capacitance (stray capacitance, etc.) of
9 pF or less. Other crystals are listed in Section 8.3, “Crystal Requirements.
VDDA is an analog regulator output used to supply only the onboard PA (PAO+ and PAO-) and VDDLO1
and VDDLO2 pins. VDDA should not be used to power devices external to the transceiver chip. Bypassing
capacitors are critical and should be placed close to the device. Unused pins should be grounded as shown.
The SPI connections to the MCU include CE, MOSI, MISO, and SPICLK. The SPI can run at a frequency
of 8 MHz or less. Optionally, CLKO can provide a clock to the MCU. The CLKO frequency is
programmable via the SPI and has a default of 32.786+ kHz (16 MHz / 488). The ATTN line can be driven
by a GPIO from the MCU (as shown) or can also be controlled by a switch or other hardware. The latter
approach allows the MCU to be put into a sleep mode and then awakened by CLKO when the ATTN line
wakes up the MC13192. RXTXEN is used to initiate receive, transmit or CCA/ED sequences under MCU
control. RXTXEN must be controlled by an MCU GPIO with the connection shown. Device reset (RST)
is controlled through a connection to an MCU GPIO.
When the MC13192 is used in Stream Mode, as with 802.15.4 MAC/PHY software, the MC13192 GPIO1
functions as an “Out of Idle” indicator and GPIO2 functions as a “CRC Valid” / Clear Channel Assessment
(CCA) result indicator and are not available for general purpose use.
MC13192 Technical Data, Rev. 3.3
18
Freescale Semiconductor
Freescale Semiconductor
MCU
CLK
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
3V0_RF
R1 470K
C1
1μF
C2
100nF
VDDA
C3
100nF
C4
100nF
EP
32
29
28
21
30
31
22
15
14
13
12
20
IRQ
3V0_BB
19
18
17
16
SS
MISO
MOSI
SCLK
MC13192
GND
VDDA
VDDLO1
VDDLO2
VDDD
VDDVCO
VBATT
VDDINT
CLKO
ATTNB
RXTXEN
RSTB
IRQB
CEB
MISO
MOSI
SPICLK
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
IC1
XTAL2
XTAL1
Not Used
PAO_M
PAO_P
Not Used
Not Used
RIN_P
RIN_M
27
26
7
6
5
4
3
2
1
16.000MHz
X1
100_Ohm4
100_Ohm3
100_Ohm2
100_Ohm1
C6
6.8pF
C5
6.8pF
L2
8.2nH
L1
6.8nH
3
2
4
C8
10pF
VDDA
C7
10pF
1 50_Ohm1
1
5
6
50_Ohm2
LDB212G4020C-001
Z2
LDB212G4020C-001
5
6
3
Z1
2
4
C10
10pF
2
50_Ohm3 3
50_Ohm4 1
C9
10pF
μPG 2012TK-E2
OUT2 VDD
OUT1
IN
GND
VCONT
IC2
6
4
5
10pF
C11
L3
8.2nH
50_Ohm6
C12
0.5pF
R3
0
J1
SMA Receptacle, Female
2
3
4
5
ANT1
F_Antenna
50_Ohm7
R2 0
1
11
10
9
8
23
24
25
Applications Information
Figure 11. MC13192 Configured With a MCU
MC13192 Technical Data, Rev. 3.3
19
Applications Information
Table 9. MC13192 to MCU Bill of Materials (BOM)
8.3
Item
Quantity
Reference
Part
Manufacturer
1
1
ANT1
F_Antenna
Printed wire
2
1
C1
1 μF
3
3
C2, C3, C4
100 nF
4
2
C5, C6
6.8 pF
5
5
C7, C8, C9, C10,
C11
10 pF
6
1
C12
0.5 pF
7
1
IC1
MC13192
Freescale Semiconductor
8
1
IC2
μPG2012TK-E2
NEC
9
1
J1
SMA Receptacle,
Female
10
1
L1
6.8 nH
11
2
L2, L3
8.2 nH
12
1
R1
470 kΩ
13
2
R2, R3
0Ω
14
1
X1
16.000 MHz, Type
DSX321G, ZD00882
KDS, Daishinku Corp
15
2
Z1, Z2
LDB212G4020C-001
Murata
Crystal Requirements
The suggested crystal specification for the MC13192 is shown in Table 10. A number of the stated
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
Table 10. MC13192 Crystal Specifications1
Parameter
Frequency
Frequency tolerance (cut
tolerance)2
Frequency stability (temperature drift)3
Aging
4
Equivalent series resistance5
Load capacitance
6
Value
Unit
Condition
16.000000
MHz
± 10
ppm
at 25 °C
± 15
ppm
Over desired temperature range
±2
ppm
max
43
Ω
max
5-9
pF
MC13192 Technical Data, Rev. 3.3
20
Freescale Semiconductor
Applications Information
Table 10. MC13192 Crystal Specifications1 (continued)
Parameter
Shunt capacitance
Value
Unit
<2
pF
Mode of oscillation
1
2
3
4
5
6
8.4
•
Condition
max
fundamental
User must be sure manufacturer specifications apply to the desired package.
A wider frequency tolerance may acceptable if application uses trimming at production final test.
A wider frequency stability may be acceptable if application uses trimming at production final test.
A wider aging tolerance may be acceptable if application uses trimming at production final test.
Higher ESR may be acceptable with lower load capacitance.
Lower load capacitance can allow higher ESR and is better for low temperature operation in Doze mode.
Low Power Considerations
Program and use the modem IO pins properly for low power operation
— All unused modem GPIOx signals must be used one of 2 ways:
– If the Off mode is to be used as a long term low power mode, unused GPIO should be tied
to ground. The default GPIO mode is an input and there will be no conflict.
– If only Hibernate and/or Doze modes are used as long term low power modes, the GPIO
should programmed as outputs in the low state.
— When modem GPIO are used as outputs:
– Pullup resistors should be provided (can be provided by the MCU IO pin if tied to the MCU)
if the modem Off condition is to be used as a long term low power mode.
– During Hibernate and/or Doze modes, the GPIO will retain its programmed output state.
— If the modem GPIO is used as an input, the GPIO should be driven by its source during all low
power modes or a pullup resistor should be provided.
— Digital outputs IRQ, MISO, and CLKO:
– MISO - is always an output. During Hibernate, Doze, and active modes, the default
condition is for the MISO output to go to tristate when CE is de-asserted, and this can cause
a problem with the MCU because one of its inputs can float. Program Control_B Register
07, Bit 11, miso_hiz_en = 0 so that MISO is driven low when CE is de-asserted. As a result,
MISO will not float when Doze or Hibernate Mode is enabled.
– IRQ - is an open drain output (OD) and should always have a pullup resistor (typically
provided by the MCU IO). IRQ acts as the interrupt request output.
NOTE
It is good practice to have the IRQ interrupt input to the MCU disabled
during the hardware reset to the modem. After releasing the modem
hardware reset, the interrupt request input to the MCU can then be enabled
to await the IRQ that signifies the modem is ready and in Idle mode; this can
prevent a possible extraneous false interrupt request.
– CLKO - is always an output. During Hibernate CLKO retains its output state, but does not
toggle. During Doze, CLKO may toggle depending on whether it is being used.
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
21
Applications Information
•
If the MCU is also going to be used in low power modes, be sure that all unused IO are programmed
properly for low power operation (typically best case is as outputs in the low state). The MC13192
is commonly used with the Freescale MC9S08GT/GB 8-bit devices. For these MCUs:
— Use only STOP2 and STOP3 modes (not STOP1) with these devices where the GPIO states are
retained. The MCU must retain control of the MC13192 IO during low power operation.
— As stated above all unused GPIO should be programmed as outputs low for lowest power and
no floating inputs.
— MC9S08GT devices have IO signals that are not pinned-out on the package. These signals must
also be initialized (even though they cannot be used) to prevent floating inputs.
MC13192 Technical Data, Rev. 3.3
22
Freescale Semiconductor
Packaging Information
9
Packaging Information
PIN 1
INDEX AREA
0.1
0.1
C
2X
5
A
M
C
0.1
2X
C
G
1.0
0.8
1.00
0.75
0.05
C
5
5
(0.25)
0.05
0.00
(0.5)
C
SEATING PLANE
DETAIL G
VIEW ROTATED 90° CLOCKWISE
M
B
0.1
C
A
DETAIL M
PIN 1 INDEX
3.25
2.95
EXPOSED DIE
ATTACH PAD
25
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
PACKAGE IS: HF-PQFP-N.
4. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
5. COPLANARITY APPLIES TO LEADS, CORNER
LEADS, AND DIE ATTACH PAD.
6. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLE IS 12°.
B
32
24
1
0.25
3.25
2.95
0.1
A
C
B
0.217
0.137
16
32X
0.5
8
17
32X
0.3
VIEW M-M
0.217
0.137
N
9
0.5
28X
0.30
0.18
(0.25)
0.1
M
C
0.05
M
C
A
(0.1)
B
DETAIL S
PREFERRED BACKSIDE PIN 1 INDEX
(45 5)
32X
0.065
0.015
DETAIL S
0.60
0.24
(1.73)
0.60
0.24
(0.25)
DETAIL N
DETAIL N
PREFERRED CORNER CONFIGURATION
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
CORNER CONFIGURATION OPTION
4
4
5
1.6
1.5
DETAIL T
BACKSIDE
PIN 1 INDEX
(90 )
0.475
0.425
2X
R
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
0.39
0.31
0.25
0.15
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
2X
0.1
0.0
DETAIL T
BACKSIDE PIN 1 INDEX OPTION
Figure 12. Outline Dimensions for QFN-32, 5x5 mm
(Case 1311-03, Issue E)
MC13192 Technical Data, Rev. 3.3
Freescale Semiconductor
23
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
[email protected]
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
[email protected]
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
[email protected]
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064, Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-521-6274 or 303-675-2140
Fax: 303-675-2150
[email protected]
Document Number: MC13192
Rev. 3.3
04/2008
Information in this document is provided solely to enable system and software implementers to use
Freescale Semiconductor products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the information
in this document.
Freescale Semiconductor reserves the right to make changes without further notice to any products
herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters
that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating parameters,
including “Typicals”, must be validated for each customer application by customer’s technical
experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights
of others. Freescale Semiconductor products are not designed, intended, or authorized for use as
components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the Freescale Semiconductor
product could create a situation where personal injury or death may occur. Should Buyer purchase
or use Freescale Semiconductor products for any such unintended or unauthorized application,
Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other
product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2004, 2005, 2006, 2007, 2008. All rights reserved.