TI LM3414HVMRX 1a 60w common anode capable constant current buck led driver requires no Datasheet

LM3414, LM3414HV
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SNVS678E – JUNE 2010 – REVISED MAY 2013
1A 60W Common Anode Capable Constant Current Buck LED Driver Requires No
External Current Sensing Resistor
Check for Samples: LM3414, LM3414HV
FEATURES
DESCRIPTION
•
The LM3414 and LM3414HV are 1A 60W (see Note
below) common anode capable constant current buck
LED drivers. They are exceptionally suitable to drive
single string of 3W HBLED with up to 96% efficiency.
They accept input voltages from 4.5VDC to 65VDC
and deliver up to 1A average LED current with ±3%
accuracy. The integrated low-side N-channel power
MOSFET and current sensing element realize simple
and low component count circuitry as no
bootstrapping capacitor and external current sensing
resistor are required. An external small-signal resistor
to ground provides very fine LED current adjustment,
analog dimming as well as thermal fold-back
functions.
1
2
•
•
•
•
•
•
•
•
•
•
•
Support LED Power up to 60W (see Note under
Description): 18x 3W HBLEDs
Requires NO External Current Sensing
Resistor
±3% LED Current Accuracy
Up to 96% Efficiency
High Contrast Ratio (Minimum Dimming
Current Pulse Width <10 µS)
Integrated Low-Side N-Channel MOSFET
Adjustable Constant LED Current From 350mA
to 1000mA
Support Analog Dimming and Thermal FoldBack
Wide Input Voltage Range:
– 4.5V to 42V (LM3414)
– 4.5V to 65V (LM3414HV)
Constant Switching Frequency Adjustable
from 250 kHz to 1000 kHz
Thermal Shutdown Protection
Power Enhanced SOIC-8 or 3mm x 3mm
WSON-8 Package
APPLICATIONS
•
•
•
•
Constant switching frequency operation eases EMI.
No external loop compensation network is needed.
The proprietary Pulse-Level-Modulation (PLM) control
method benefits in high conversion efficiency and true
average LED current regulation. Fast response time
realizes fine LED current pulse fulfilling the 240 Hz
256-step dimming resolution requirement for general
lighting.
The LM3414 and LM3414HV are available in SOIC-8
and 3mm x 3mm WSON-8 packages.
Note: Thermal de-rating applies according to actual
operation conditions
High Power LED Driver
Architectural Lighting, Office Troffer
Automotive Lighting
MR-16 LED Lamp
Simplified Application Schematic
High power LED Array
Vin
D1
LM3414/14HV
CVCC
VCC
PGND
VIN
4.5V ± 42 VDC (LM3414)
Iout = 1A
CIN
4.5V ± 65 VDC (LM3414HV)
GND
L1
LX
IADJ
DIM
GND
FS
PWM dimming signal
GND
RIADJ
* DAP connect to GND
RFS
GND
GND
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LM3414, LM3414HV
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Connection Diagram
VCC
1
8
VIN
PGND
2
7
LX
DIM
IADJ
3
6
DIM
FS
GND
4
5
FS
VCC
1
8
VIN
PGND
2
7
LX
IADJ
3
6
5
EP
GND
4
Top View
8-Lead Plastic SOIC-8
Package Number DDA
EP
Top View
8-Lead Plastic WSON-8
Package Number NGQ
PIN DESCRIPTIONS
Pin
Name
Description
1
VCC
Application Information
Internal Regulator Output Pin
This pin should be bypassed to ground by a ceramic capacitor with a minimum
value of 1µF.
2
PGND
Power Ground Pin
Ground for power circuitry. Reference point for all stated voltages. Must be
externally connected to EP and GND.
3
IADJ
Average Output Current
Adjustment Pin
Connect resistor RIADJ from this pin to ground to adjust the average output current.
4
GND
Analog Ground Pin
Analog ground connection for internal circuitry, must be connected to PGND
external to the package.
5
FS
Switching Frequency Setting Pin
Connect resistor RFS from this pin to ground to set the switching frequency.
6
DIM
PWM Dimming Control Pin
Apply logic level PWM signal to this pin controls the intend brightness of the LED
string.
7
LX
Drain of N-MOSFET Switch
Connect this pin to the output inductor and anode of the schottky diode.
8
VIN
Input Voltage Pin
The input voltage should be in the range of 4.5V to 42V (LM3414) or 4.5V to 65V
(LM3414HV).
EP
EP
Thermal Pad (Power Ground)
Used to dissipate heat from the package during operation. Must be electrically
connected to PGND external to the package.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (LM3414)
(1)
VIN to GND
-0.3V to 42V
VIN to GND (Transient)
45V (500 ms)
LX to PGND
-0.3V to 42V
LX to PGND (Transient)
-3V(2 ns) to 45V (500 ms)
FS, IADJ to GND
-0.3V to 5V
DIM to GND
-0.3V to 6V
ESD Rating. Human Body Model (2)
2kV
Storage Temp. Range
-65°C to 125°C
Soldering Information
Lead Temperature (Soldering 10s)
260°C
Infrared/Convection Reflow (20sec)
235°C
(1)
(2)
2
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
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Operating Ratings (LM3414)
VIN
4.5V to 42V
−40°C to +125°C
Junction Temperature Range
Thermal Resistance θJA
SOIC-8 Package
45°C/W
WSON-8 Package
54°C/W
Absolute Maximum Ratings (LM3414HV)
(1) (2)
VIN to GND
-0.3V to 65V
VIN to GND (Transient)
67V (500 ms)
LX to PGND
-0.3V to 65V
LX to PGND (Transient)
-3V(2 ns) to 67V (500 ms)
FS, IADJ to GND
-0.3V to 5V
DIM to GND
-0.3V to 6V
ESD Rating, Human Body Model (3)
2kV
Storage Temp. Range
-65°C to 125°C
Soldering Information
Lead Temperature (Soldering 10s)
260°C
Infrared/Convection Reflow (20sec)
235°C
(1)
(2)
(3)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Operating Ratings (LM3414HV)
VIN
4.5V to 65V
−40°C to +125°C
Junction Temperature Range
Thermal Resistance θJA
SOIC-8 Package
45°C/W
WSON-8 Package
54°C/W
Electrical Characteristics (LM3414)
VIN = 24V unless otherwise indicated. Typical and limits appearing in plain type apply for TA=TJ= +25°C (1). Limits appearing in
boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are obtained under device
test mode and specified by design, test, or statistical analysis.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
SYSTEM PARAMETERS
IIN-DIM-HIGH
Operating Current
4.5V ≤ Vin ≤ 42V
RIADJ = 3.125 kΩ
VDIM = High
2.2
3.2
3.5
mA
IIN-DIM-LOW
Standby Current
4.5V ≤ Vin ≤ 42V
RIADJ = 3.125 kΩ
VDIM = Low
0.8
1.15
1.4
mA
ILX-OFF
LX Pin Current
Main Switch Turned OFF
VLX = VIN = 42V
(1)
6
µA
Typical specification represent the most likely parametric norm at 25°C operation.
Electrical Characteristics (LM3414HV)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
4.5V ≤ Vin ≤ 65V
RIADJ = 3.125 kΩ
VDIM = High
2.2
3.3
3.6
mA
SYSTEM PARAMETERS
IIN-DIM-HIGH
Operating Current
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Electrical Characteristics (LM3414HV) (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
IIN-DIM-LOW
Standby Current
4.5V ≤ Vin ≤ 65V
RIADJ = 3.125 kΩ
VDIM = Low
0.8
1.2
1.45
mA
ILX-OFF
LX Pin Current
Main Switch Turned OFF
VLX = VIN= 65V
6.5
µA
Electrical Characteristics (LM3414/LM3414HV)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RIADJ = 3.125 kΩ
TA = 25°C
0.97
1
1.03
A
RIADJ = 3.125 kΩ
TA = –40°C to 125°C
0.95
1
1.05
A
VCC Decreasing
3.60
3.75
3.90
SYSTEM PARAMETERS
ILED
Average LED Current
VCC-UVLO
Vcc UVLO Threshold
VCC-UVLO-HYS
Vcc UVLO Hysteresis
VIADJ
IADJ Pin voltage
VDIM
DIM Pin Threshold
VDIM-HYS
DIM Pin Hysteresis
fSW
Switching Frequency Range
fSW-TOL
Switching Frequency Tolerance
tON-MIN
Minimum On-time
300
1.230
VDIM Increasing
1.255
1.280
V
1.0
1.2
V
100
RFS = 40 kΩ
V
mV
mV
250
500
1000
kHz
420
500
580
kHz
400
ns
6.0
V
INTERNAL VOLTAGE REGULATOR
VCC Regulator Output Voltage (1)
VCC
CVCC = 1µF, No Load to IVCC = 2mA
4.7
5.4
Vin = 4.5V, 2 mA Load
3.8
4.2
V
MAIN SWITCH
RLX
Resistance Across LX and GND
Main Switch Turned ON
1.8
Ω
THERMAL PROTECTION
TSD
Thermal Shutdown Temperature
TJ Rising
170
°C
TSD-HYS
Thermal Shutdown Temperature
Hysteresis
TJ Falling
10
°C
SOIC-8 package
45
°C/W
WSON-8 package
54
°C/W
THERMAL RESISTANCE
θJA
(1)
(2)
4
Junction to Ambient,
0 LFPM Air Flow (2)
VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading to the pin.
Tested on a 4 layer JEDEC board. Four vias provided under the exposed pad. See JESD51-5 and JESD51-7. The value of the θJA for
the WSON package is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For
improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401).
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Typical Performance Characteristics
All curves taken at VIN = 48V with configuration in typical application for driving twelve power LEDs with ILED = 1A shown in
this datasheet. TA = 25°C, unless otherwise specified.
IOUT vs VIN, (4 - 8 LED)
LM3414HV
IOUT vs VIN, (10 - 18 LED)
LM3414HV
Figure 1.
Figure 2.
Efficiency vs VIN, (4 - 8 LED)
LM3414HV
Efficiency vs VIN, (10 - 18 LED)
LM3414HV
Figure 3.
Figure 4.
IOUT vs Temperature (TA)
(6 LED, VIN = 24V), LM3414HV
IOUT vs Temperature (TA)
(12 LED, VIN = 48V), LM3414HV
Figure 5.
Figure 6.
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Typical Performance Characteristics (continued)
All curves taken at VIN = 48V with configuration in typical application for driving twelve power LEDs with ILED = 1A shown in
this datasheet. TA = 25°C, unless otherwise specified.
6
VCC vs Temperature (TA)
LM3414HV
VIADJ vs Temperature (TA)
LM3414HV
Figure 7.
Figure 8.
IOUT and VLX
LM3414HV
ILX and VDIM
LM3414HV
Figure 9.
Figure 10.
LED Current with PWM Dimming (VDIM Rising)
LM3414HV
LED Current with PWM Dimming (VDIM Falling)
LM3414HV
Figure 11.
Figure 12.
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Typical Performance Characteristics (continued)
All curves taken at VIN = 48V with configuration in typical application for driving twelve power LEDs with ILED = 1A shown in
this datasheet. TA = 25°C, unless otherwise specified.
LED Current with PWM Dimming
(9µs dimming pulse), LM3414HV
Figure 13.
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Block Diagram
Operation Description
OVERVIEW
The LM3414/14HV is a high power floating buck LED driver with wide input voltage ranges. It requires no
external current sensing elements and loop compensation networks. The integrated power N-MOSFET enables
high output power with up to 1000 mA output current. The combination of Pulse Width Modulation (PWM) control
architecture and the proprietary Pulse Level Modulation (PLM) ensures accurate current regulation, good EMI
performance and provides high flexibility on inductor selection. High speed dimming control input allows precision
and high resolution brightness control for applications require fine brightness adjustment.
8
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APPLICATION INFORMATION
SETTING THE SWITCHING FREQUENCY
Both the LM3414 and LM3414HV are PWM LED drivers that contain a clock generator to generate constant
switching frequency for the device. The switching frequency is determined by the resistance of an external
resistor RFS in the range of 250 kHz to 1 MHz. Lower resistance of RFS results in higher switching frequency. The
switching frequency of the LM3414/14HV is governed by the following equation:
fSW =
20 x 106
kHz
RFS
(1)
Figure 14. Switching Frequency vs RFS
Table 1. Examples for fSW Settings
fSW (kHz)
RFS (kΩ)
250
80
500
40
1000
20
To ensure accurate current regulation, the LM3414/14HV should be operated in continuous conduction mode
(CCM) and the on time should not be shorter than 400 ns under all operation condition.
SETTING LED CURRENT
The LM3414/14HV requires no external current sensing resistor for LED current regulation. The average output
current of the LM3414/14HV is adjustable by varying the resistance of the resistor, RIADJ that connects across the
IADJ and GND pins. The IADJ pin is internally biased to 1.255V. The LED current is then governed by the
following equation:
ILED =
3125 x 103
mA
RIADJ
where
•
350 mA < ILED < 1A
(2)
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1.4
1.2
ILED(A)
1.0
0.8
0.6
0.4
0.2
0.0
0
1
2
3 4 5 6
RIADJ(k )
7
8
9
Figure 15. LED Current vs RIADJ
Table 2. Examples for IOUT Settings
IOUT (mA)
RIADJ (kΩ)
350
8.93
500
6.25
700
4.46
1000
3.13
The LED current can be set to any level in the range from 350 mA to 1A. In order to provide accurate LED
current, RIADJ should be a resistor with no more than 0.5% tolerance. If the IADJ pin is accidentally shorted to
GND (RIADJ = 0), the output current will be limited to avoid damaging the circuit. When the over current protection
is activated, current regulation cannot be maintained until the over-current condition is cleared.
MINIMUM SWITCH ON-TIME
As the LM3414 features a 400 ns minimum ON time, it is essential to make sure the ON time of the internal
switch is not shorter than 400 ns when setting the LED driving current. If the switching ON time is shorter than
400 ns, the accuracy of the LED current may not maintain and exceed the rated current of the LEDs. The ratio of
the LED forward voltage to input voltage is restricted by the following restriction:
VLED
t 400 nS x fSW
VIN
(3)
PEAK SWITCH CURRENT LIMIT
The LM3414/14HV features an integrated switch current limiting mechanism that protects the LEDs from being
overdriven. The switch current limiter will be triggered when the switch current is three times exceeding the
current level set by RIADJ. Once the current limiter is triggered, the internal power switch turns OFF for 3.6 µs to
allow the inductor to discharge and cycles repetitively until the over current condition is removed. The current
limiting feature is exceptionally important to avoid permanent damage of the LM3414/14HV application circuit due
to short circuit of LED string.
10
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IL1
ILED = IL(AVERAGE) = Mid-point of ILX during tON
ILX
ILED
Time
1/fSW
tON
Figure 16. Waveforms of a Floating Buck LED Driver with PLM
INDUCTOR SELECTION
To ensure proper output current regulation, the LM3414/14HV must operate in Continuous Conduction Mode
(CCM). With the incorporation of PLM, the peak-to-peak inductor current ripple can be set as high as ±60% of
the defined average output current. The minimum inductance of the inductor is decided by the defined average
LED current and allowable inductor current ripple. The minimum inductance can be found by the equations
shown below:
Since:
'IL =
VIN - VLED
xDxT
L
(4)
Thus:
LMIN =
VIN -VLED VLED 1
x
x
1.2 x ILED VIN fSW
(5)
The LM3414/14HV can maintain LED current regulation without output filter capacitor. This is because the
inductor of the floating buck structure provides continuous current to the LED throughout the entire switching
cycle. When LEDs are driven without filter capacitor, the LED peak current must not set exceeding the rated
current of the LED. The peak LED current is governed by the following equation:
'IL =
(VIN -VLED) VLED
+ ILED(AVG)
2L x VIN x fSW
(6)
INTERNAL N_MOS POWER SWITCH
The LM3414/14HV features an integrated N-channel power MOSFET that connects between the LX and GND
pins for power switching. With the switch turned ON, the resistance across the LX and GND pins is 1.8Ω
maximum.
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INTERNAL VCC REGULATOR
The LM3414/14HV features a 5.4V internal voltage regulator that connects between the VIN and VCC pins for
powering internal circuitry and provide biases to external components. The VCC pin must be bypassed to the
GND pin with a 1µF ceramic capacitor, CVCC that connected to the pins as close as possible. When the input
voltage falls below 6V, the VCC voltage will drop below 5.4V and decrease proportionally as Vin decreases. The
device will shutdown as the VCC voltage falls below 3.9V. When the internal regulator is used to provide bias to
external circuitry, it is essential to ensure the current sinks from VCC pin does not exceed 2mA to maintain
correct voltage regulation.
CONTROL SCHEME
The main control circuitry of the LM3414/14HV is generally a Pulse-Width-Modulated (PWM) controller with the
incorporation of the Pulse-Level-Modulation (PLM) technology. PLM is a technology that facilitates true output
average current control without the need to sense the output current directly. In the LM3414/LM3414HV, the PLM
circuit senses the current of the internal switch through an integrated current sensing circuitry to realize average
output current control. The use of PLM reduces the power losses on current sensor as it needs current
information only when the switch is turned ON.
In general, the LED drivers with current sensing resistor at the output, the power dissipation on the current
sensing resistor is ILED2 x RISNS, where ILED is the average output current and RISNS is the resistance of the
current sensing resistor. In the LM3414/LM3414HV, because of the incorporation of PLM, power dissipates on
the RISNS only in ON period of the internal power switch. The power loss on RISNS becomes ILED2 x RISNS x D,
where D is the switching duty cycle. For example, when the switching duty cycle, D of a converter is 0.5, the
power loss on RISNS with PLM is half of those with conventional output current sensing.
PULSE-LEVEL-MODULATION (PLM) OPERATION PRINCIPLES
The Pulse-Level-Modulation is a patented method to ensure accurate average output current regulation without
the need of direct output current sensing. Figure 16 shows the current waveforms of a typical buck converter
under steady state, where, IL1 is the inductor current and ILX is the main switch current flowing into the LX pin.
For a buck converter operating in steady state, the mid-point of the RAMP section of the main switch current is
equal to the average level of the inductor current hence the average output current. In short, by regulating the
mid-point of the RAMP section of the main switch current with respect to a precise reference level, PLM achieves
output current regulation by sensing the main switch current solely.
PWM DIMMING CONTROL
The DIM pin of the LM3414/14HV is an input with internal pull-up that accepts logic signals for average LED
current control. Applying a logic high (above 1.2V) signal to the DIM pin or leaving the DIM pin open will enable
the device. Applying a logic low signal (below 0.9V) to the DIM pin will disable the switching activity of the device
but maintain VCC regulator active. The LM3414/14HV allows the inductor current to slew up to the preset
regulated level at full speed instead of charging the inductor with multiple restrained switching duty cycles. This
enables the LM3414/14HV to achieve high speed dimming and very fine dimming control as shown in Figure 17
and Figure 18:
12
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LE
D
cu
rre
nt
s
le
ws
up
ILED
ILED regulated
Time
0
LED dimmed OFF
ILED slew up time
Figure 17. LED Current Slews up with Multiple Switching Cycle
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LED c
urrent
s
lews u
p
ILED
ILED regulated
Time
0
LED dimmed OFF
ILED slew
up time
Figure 18. Shortened Current Slew up Time of the LM3414/14HV
To ensure normal operation of the LM3414/14HV, it is recommended to set the dimming frequency not higher
than 1/10 of the switching frequency. The minimum dimming duty cycle is limited by the 400 ns minimum ON
time. In applications that require high dimming contrast ratio, low dimming frequency should be used.
ANALOG DIMMING CONTROL
The IADJ pin can be used as an analog dimming signal input. As the average output current of the LM3414
depends on the current being drawn from the IADJ pin, thus the LED current can be increased or decreased by
applying external bias current to the IADJ pin. The simplified circuit diagram for facilitating analog dimming is as
shown in Figure 19.
14
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VCC
Current Mirror
VEXT
To LED current
setting circuitry
+
-
IEXT
+
-
IADJ
IIADJ
1.255V
RIADJ
LM3414/14HV
Figure 19. Analog LED Current Control Circuit
When external bias current IEXT is applied to the IADJ pin, the reduction of LED current follows the equations:
1.255
- IEXT x 2490 x 103 mA
RIADJ
ILED =
(7)
Provided that
IEXT <
1.255
RIADJ
(8)
ILED decreases linearly as IEXT increases.
This feature is exceptionally useful for the applications with analog dimming control signals such as those from
analog temperature sensors and ambient light sensors.
DESIGN EXAMPLE
Figure 20 shows an example circuit for analog dimming control using simple external biasing circuitry with a
variable resistor.
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VCC
VCC
IEXT
Q1
IADJ
R2
R1
LM3414
RIADJ
VR1
GND
GND
GND
Figure 20. Example Analog Dimming Control Circuit
In the figure, the variable resistor VR1 controls the base voltage of Q1 and eventually adjusts the bias voltage of
current to the IADJ pin (IEXT). As the resistance of VR1 increases and the voltage across VR1 exceeds 1.255V +
0.7V, the LED current starts to decrease as IEXT increases.
where
VCC ± 1.955
IEXT =
R2
R1
+1
VR1
R1
+1
VR1
mA
(9)
The analog dimming begins only when IEXT > 0.
DESIGN CONSIDERATIONS
The overall performance of the LED driver is highly depends on the PCB layout and component selection. To
minimize connection losses and parasitic inductance of the traces, the best practice is to keep the copper traces
connecting the inductor, power switch and rectifier short and thick . Long traces on critical power paths will
introduce voltage and current spikes to the LM3414/LM3414HV. If the voltage spike level exceeds the absolute
maximum pin voltage of the LM3414, it could damage the device and LEDs. To avoid physical damage of the
circuit, a Transient Voltage Suppressor (TVS) can be added across VIN and GND pins to suppress the spike
voltage. This also helps in absorbing the input voltage spike when the circuit is powered through physical switch
upon power up.
16
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Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3414 LM3414HV
LM3414, LM3414HV
www.ti.com
SNVS678E – JUNE 2010 – REVISED MAY 2013
Additional Application Circuit
Vin
Iout = 1000 mA (nom.)
100V
2.2 PF
CIN
CVCC
16V 1 PF
LM3414 / LM3414HV
VCC
VIN
PGND
IADJ
LED x 6
100V
2A
D1
24V ± 42 VDC (LM3414)
24V - 65 VDC (LM3414HV)
GND
L1 47 PH
LX
U1
DIM
GND
FS
GND
RIADJ
3.24k
* DAP connect to GND
RFS
40.2k
GND
GND
Figure 21. LM3414/14HV Design Example (IOUT = 500 mA)
Table 3. Bill of Materials
Designation
Description
Package
Manufacture Part #
Vendor
U1
LED Driver IC
LM3414 / LM3414HV
SOIC-8
LM3414 / LM3414HV
TI
L1
Inductor 47 µH
8 x 8 x 4.9 (mm)
MMD-08EZ-470M-SI
Mag.Layers
D1
Schottky Diode 100V 2.0A
SMP
SS2PH10-M3
Vishay
CIN
Cap MLCC 100V 2.2 µF X7R
1210
GRM32ER72A225KA35L
Murata
CVCC
Cap MLCC 16V 1.0 µF X5R
603
GRM39X5R105K16D52K
Murata
RIADJ
Chip Resistor 3.24 kΩ 1%
603
CRCW06033241F
Vishay
RFS
Chip Resistor 40.2 kΩ 1%
603
CRCW06034022F
Vishay
D1
LM3414 / LM3414HV
CVCC
VCC
R1
PGND
IADJ
GND
GND
Q1
Analog
temperature
sensor
GND
VIN
U1
GND
CIN
GND
LX
PWM
dimming signal
DIM
FS
* DAP connect to GND
R2
L1
High power LED Array
Vin
VCC
RFS
GND
RIADJ
GND
Figure 22. Application Circuit of LM3414/14HV with Temperature Fold-Back Circuitry and PWM Dimming
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM3414 LM3414HV
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17
LM3414, LM3414HV
SNVS678E – JUNE 2010 – REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (May 2013) to Revision E
•
18
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 17
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Product Folder Links: LM3414 LM3414HV
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jul-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM3414HVMR/NOPB
ACTIVE SO PowerPAD
DDA
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 125
L3414
HVMR
LM3414HVMRX/NOPB
ACTIVE SO PowerPAD
DDA
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 125
L3414
HVMR
LM3414HVSD/NOPB
ACTIVE
WSON
NGQ
8
1000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 125
L249B
LM3414HVSDX/NOPB
ACTIVE
WSON
NGQ
8
4500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 125
L249B
LM3414MR/NOPB
ACTIVE SO PowerPAD
DDA
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 125
L3414
MR
LM3414MRX/NOPB
ACTIVE SO PowerPAD
DDA
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 125
L3414
MR
LM3414SD/NOPB
ACTIVE
WSON
NGQ
8
1000
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 125
L248B
LM3414SDX/NOPB
ACTIVE
WSON
NGQ
8
4500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
-40 to 125
L248B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
19-Jul-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM3414HVMRX/NOPB
SO
Power
PAD
DDA
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM3414HVSD/NOPB
WSON
NGQ
8
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LM3414HVSDX/NOPB
WSON
NGQ
8
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LM3414MRX/NOPB
SO
Power
PAD
DDA
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM3414SD/NOPB
WSON
NGQ
8
1000
178.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
LM3414SDX/NOPB
WSON
NGQ
8
4500
330.0
12.4
3.3
3.3
1.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3414HVMRX/NOPB
LM3414HVSD/NOPB
SO PowerPAD
DDA
8
2500
367.0
367.0
35.0
WSON
NGQ
8
1000
210.0
185.0
35.0
LM3414HVSDX/NOPB
WSON
NGQ
8
4500
367.0
367.0
35.0
LM3414MRX/NOPB
SO PowerPAD
DDA
8
2500
367.0
367.0
35.0
LM3414SD/NOPB
WSON
NGQ
8
1000
210.0
185.0
35.0
LM3414SDX/NOPB
WSON
NGQ
8
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
DDA0008A
MRA08A (Rev D)
www.ti.com
MECHANICAL DATA
NGQ0008A
SDA08A (Rev A)
www.ti.com
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