NZ9F2V4ST5G SERIES Zener Voltage Regulators 200 mW SOD−923 Surface Mount This series of Zener diodes is packaged in a SOD−923 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. http://onsemi.com Specification Features • Standard Zener Breakdown Voltage Range −2.4 V to 18 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: • • • • 1 Cathode 0.039″ x 0.024″ (1.00 mm x 0.60 mm) Low Body Height: 0.016″ (0.40 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ These are Pb−Free Devices 2 Anode MARKING DIAGRAM 2 1 SOD−923 CASE 514AB Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic 1 X MG G 2 X = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements ORDERING INFORMATION MAXIMUM RATINGS Rating Total Device Dissipation FR−5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction−to−Ambient Junction and Storage Temperature Range Symbol Max Unit 200 1.5 mW mW/°C RqJA 635 °C/W TJ, Tstg −65 to +150 °C PD NZ9FxxxST5G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 Minimum Pad. © Semiconductor Components Industries, LLC, 2008 May, 2008 − Rev. 0 Device 1 Package Shipping† SOD−923 (Pb−Free) 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. Publication Order Number: NZ9F2V4S/D NZ9F2V4ST5G SERIES ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol I IF Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IR Reverse Leakage Current @ VR VR Reverse Voltage IF Forward Current VF Forward Voltage @ IF QVZ Maximum Temperature Coefficient of VZ C Max. Capacitance @VR = 0 and f = 1 MHz VZ VR IR VF IZT Figure 1. Zener Voltage Regulator 100 POWER DISSIPATION (%) 80 60 40 20 0 0 25 50 75 100 125 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 2 150 V NZ9F2V4ST5G SERIES ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ ZZT IZ = IZT @ 10% Mod W Max ZZK IZ = 1.0 mA W Max IZK mA mA V Min Max CpF Max @ VR = 0 f = 1 MHz Max IR @ VR dVZ/dt (mV/k) @ IZT1 = 5 mA Device Device Marking Min Max Test Current Izt mA NZ9F2V4ST5G 2* 2.43 2.63 5 100 1000 1 50 1 −3.5 0 210 NZ9F2V7ST5G 3* 2.67 2.91 5 100 1000 1 20 1 −3.5 0 210 NZ9F3V0ST5G 4* 2.94 3.26 5 100 1000 1 10 1 −3.5 0 210 NZ9F3V3ST5G 5* 3.32 3.53 5 100 1000 1 10 1 −3.5 0 210 NZ9F3V6ST5G 6* 3.6 3.85 5 100 1000 1 10 1 −3.5 0 210 NZ9F3V9ST5G A** 3.89 4.16 5 100 1000 1 5 1 −3.5 −2.5 210 NZ9F4V3ST5G D** 4.17 4.43 5 100 1000 1 5 1 −3.5 0 210 NZ9F4V7ST5G E** 4.55 4.75 5 100 800 0.5 2 1 −3.5 0.2 150 NZ9F5V1ST5G F** 4.989 5.2 5 80 500 0.5 2 1.5 −2.7 1.2 130 NZ9F5V6ST5G J** 5.49 5.73 5 60 200 0.5 1 2.5 −2.0 2.5 115 NZ9F6V2ST5G K** 6.06 6.33 5 60 100 0.5 1 3 0.4 3.7 110 NZ9F6V8ST5G L** 6.65 6.93 5 40 60 0.5 0.5 3.5 1.2 4.5 105 NZ9F7V5ST5G P** 7.28 7.6 5 30 60 0.5 0.5 4 2.5 5.3 100 NZ9F8V2ST5G Q** 8.02 8.36 5 30 60 0.5 0.5 5 3.2 6.2 90 NZ9F9V1ST5G R** 8.85 9.23 5 30 60 0.5 0.5 6 3.8 7 80 NZ9F10VST5G T** 9.77 10.21 5 30 60 0.5 0.1 7 4.5 8 80 NZ9F11VST5G V** 10.76 11.22 5 30 60 0.5 0.1 8 5.4 9 80 NZ9F12VST5G Y** 11.74 12.24 5 30 80 0.5 0.1 9 6 10 80 NZ9F13VST5G 2** 12.91 13.49 5 37 80 0.5 0.1 10 7 11 75 NZ9F15VST5G 3** 14.34 14.98 5 42 80 0.5 0.1 11 9.2 13 70 NZ9F16VST5G 4** 15.85 16.51 5 50 80 0.5 0.1 12 10.4 14 65 NZ9F18VST5G 5** 17.56 18.35 5 50 80 0.5 0.1 14 12.4 16 60 *Rotated 90°. **Rotated 180°. http://onsemi.com 3 NZ9F2V4ST5G SERIES PACKAGE DIMENSIONS SOD−923 CASE 514AB−01 ISSUE B D −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. −Y− E 1 b 2 2X 0.08 (0.0032) X Y DIM A b c D E HE L A c L HE MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006 SOLDERING FOOTPRINT* 0.90 0.40 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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