Material Content Data Sheet Sales Product Name TLE6208-6G Issued MA# MA001406856 Package PG-DSO-28-41 16. September 2015 Weight* 835.40 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 14.614 1.75 0.073 0.01 0.292 0.03 349 5.837 0.70 6987 237.007 28.37 29.11 283706 291129 1.265 0.15 0.15 1514 1514 1.131 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.75 17494 17494 87 1354 52.026 6.23 512.339 61.32 67.69 613287 676917 4.975 0.60 0.60 5955 5955 1.897 0.23 0.23 2271 2271 0.986 0.12 2.958 0.35 62276 1180 0.47 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3540 4720 1000000