TI1 LM98725CCMTX/NOPB 3 channel, 16-bit, 81 msps analog front end Datasheet

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
LM98725 3 Channel, 16-Bit, 81 MSPS Analog Front End with LVDS/CMOS Output,
Integrated CCD/CIS Sensor Timing Generator and Spread Spectrum Clock Generation
1 Features
3 Description
•
•
The LM98725 is a fully integrated, high performance
16-Bit, 81 MSPS signal processing solution for digital
color copiers, scanners, and other image processing
applications. The LM98725 achieves high-speed
signal throughput with an innovative architecture
utilizing Correlated Double Sampling (CDS), typically
employed with CCD arrays, or Sample and Hold
(S/H) inputs (for higher speed CCD or CMOS image
sensors). The signal paths utilize 8 bit Programmable
Gain Amplifiers (PGA), a ±9-Bit offset correction
DAC, and independently controlled Digital Black
Level correction loops for each input. The
independently programmed PGA and offset DAC
allow unique values of gain and offset for each of the
three analog inputs. The signals are then routed to a
81 MHz high performance analog-to-digital converter
(ADC). The fully differential processing channel
shows exceptional noise immunity with a very low
noise floor of –74 dB. The 16-bit ADC has excellent
dynamic performance making the LM98725
transparent in the image reproduction chain.
1
•
•
•
•
•
•
LVDS/CMOS Outputs
LVDS/CMOS/Crystal Clock Source with PLL
Multiplication
Integrated Flexible Spread Spectrum Clock
Generation
CDS or S/H Processing for CCD or CIS Sensors
Independent Gain/Offset Correction for Each
Channel
Automatic per-Channel Gain and Offset
Calibration
Programmable Input Clamp Voltage
Flexible CCD/CIS Sensor Timing Generator
2 Applications
•
•
•
•
•
Multi-Function Peripherals
High-speed Currency/Check Scanners
Flatbed or Handheld Color Scanners
High-speed Document Scanners
Key Specifications:
– Maximum Input Level
– 1.2 or 2.4 Volt Modes
– (Both with + or - Polarity Option)
– ADC Resolution: 16-Bit
– ADC Sampling Rate: 81 MSPS
– INL: +17/- 28 LSB (typ)
– Channel Sampling Rate: 30/30/27 MSPS
– PGA Gain Steps: 256 Steps
– PGA Gain Range: 0.62 to 8.3x
– Analog DAC Resolution: ±9 Bits
– Analog DAC Range: ±307 mV or ±614 mV
– Digital DAC Resolution: ±6 Bits
– Digital DAC Range: -2048 LSB to + 2016 LSB
– SNR: –74dB (@0 dB PGA Gain)
– Power Dissipation: 755 mW (LVDS)
– Operating Temp: 0 to 70°C
– Supply Voltage: 3.3 V Nominal (3.0-V to 3.6-V
Range)
A very flexible integrated Spread Spectrum Clock
Generation (SSCG) modulator is included to assist
with EM compliance and reduce system costs.
Device Information(1)
PART NUMBER
LM98725
PACKAGE
TSSOP (56)
BODY SIZE (NOM)
14.0 mm × 6.10 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
System Block Diagram
CCD/CIS Sensor
Analog Front End
SPI
LM98725
Sensor Drivers
CCD Timing
Generator
Data Output
CLK
SSCG
Image Processor/
ASIC
Motor
Controllers
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
7
1
1
1
2
3
6
Absolute Maximum Ratings ...................................... 6
Handling Ratings....................................................... 6
Recommended Operating Conditions....................... 6
Electrical Characteristics........................................... 7
AC Timing Specifications ........................................ 11
Serial Interface Timing Details ................................ 13
Detailed Description ............................................ 14
7.1
7.2
7.3
7.4
7.5
Overview .................................................................
Functional Block Diagrams .....................................
Feature Description.................................................
Device Functional Modes........................................
Register Maps .........................................................
14
15
16
24
88
8
Layout ................................................................. 136
9
Device and Documentation Support................ 137
8.1 Layout Example .................................................... 136
9.1
9.2
9.3
9.4
Trademarks ...........................................................
Device Support......................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
137
137
137
137
10 Mechanical, Packaging, and Orderable
Information ......................................................... 137
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (October 2014) to Revision H
Page
•
Changed "29" to "33" for Pin number 32 in Pin Functions ..................................................................................................... 4
•
Deleted "Boldface limits apply..." statement in Electrical Characteristics and AC Timing Specifications ............................. 7
•
Changed "internal" to "external" and "external" to "internal" for "SH_R Capture Clock Select (Page 0, Register 0x00,
Bit 5)" heading in Clock Sources - Additional Settings and Flexibility ................................................................................. 18
•
Changed 25 MHz to 27 MHz and 75 MHz to 81 MHz for Table 3 ...................................................................................... 24
•
Changed "Page 2" to "Page 0" in CCD Timing Generator Master/Slave Modes ................................................................ 63
•
Changed "Page 2" to "Page 0" in Master Timing Generator Mode ..................................................................................... 63
•
Changed "1100 0000" to " 1100 0010" in Table 18............................................................................................................ 101
Changes from Revision F (January 2014) to Revision G
Page
•
Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions;
Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering Information ....................................... 1
•
Added "Note" in Serial Interface ........................................................................................................................................... 84
Changes from Revision E (April 2013) to Revision F
•
Added content from System Overview section to end of document. .................................................................................. 16
Changes from Revision D (April 2009) to Revision E
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 13
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
5 Pin Configuration and Functions
56-Pin TSSOP
Package DGG
Top View
PHIC2
1
56
SH5
PHIC1
2
55
SH4
SH1
3
54
PHIB2
CE
4
53
PHIB1
CAL
5
52
VC
RESET
6
51
DGND
SH_R
7
50
PHIA2
SDI
8
49
PHIA1
SDO
9
48
CP
SCLK
10
47
RS
SEN
11
46
SH3
VA
12
45
CLKOUT/SH2
AGND
13
44
VC
VA
14
VREFB
56 Pin TSSOP
(not to scale)
43
VD
15
42
DGND
VREFT
16
41
DOUT0/TXOUT0-
VA
17
40
DOUT1/TXOUT0+
AGND
18
39
DOUT2/TXOUT1-
VCLP
19
38
DOUT3/TXOUT1+
VA
20
37
DOUT4/TXOUT2-
IBIAS
21
36
DOUT5/TXOUT2+
AGND
22
35
DOUT6/TXCLK-
OSR
23
34
DOUT7/TXCLK+
AGND
24
33
INCLK-
OSG
25
32
INCLK+
AGND
26
31
DVB
OSB
27
30
CPOFILT1
CPOFILT2
28
29
DGND
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
3
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Pin Functions
PIN
NO.
4
NAME
I/O
TYP
RES
DESCRIPTION
1
PHIC2
O
D
Configurable high speed sensor timing output.
2
PHIC1
O
D
Configurable high speed sensor timing output.
3
SH1
O
D
Configurable low speed sensor timing output.
4
CE
I
D
Chip Serial Interface Address Setting Input
CE Level
Address
VD
01
Float
10
DGND
00
5
CAL
I
D
PD
Initiate calibration sequence. Leave unconnected or tie to DGND if unused.
6
RESET
I
D
PU
Active-low master reset. NC when function not being used.
7
SH_R
I
D
PD
External request for an SH pulse.
8
SDI
I
D
PD
Serial Interface Data Input. Can be tied to SDO for compatibility with LM98714 designs.
9
SDO
O
D
10
SCLK
I
D
PD
Serial Interface shift register clock.
11
SEN
I
D
PU
Active-low chip enable for the Serial Interface.
12
VA
P
Analog power supply. Bypass voltage source with 4.7μF and pin with 0.1μF to AGND.
13
AGND
P
Analog ground return.
14
VA
P
Analog power supply. Bypass voltage source with 4.7μF and pin with 0.1μF to AGND.
15
VREFB
O
A
Bottom of ADC reference. Bypass with a 0.1μF capacitor to ground.
16
VREFT
O
A
Top of ADC reference. Bypass with a 0.1μF capacitor to ground.
17
VA
P
Analog power supply. Bypass voltage source with 4.7μF and pin with 0.1μF to AGND.
18
AGND
P
Analog ground return.
19
VCLP
A
Input Clamp Voltage. Normally bypassed with a 0.1μF , and a 4.7μF capacitor to AGND.
An external reference voltage may be applied to this pin.
20
VA
P
Analog power supply. Bypass voltage source with 4.7μF and pin with 0.1μF to AGND.
21
IBIAS
A
Bias setting pin. Connect a 9.0 kΩ 1% resistor to AGND.
22
AGND
P
Analog ground return.
23
OSR
A
Analog input signal. Typically sensor Red output AC-coupled thru a capacitor.
24
AGND
P
Analog ground return.
25
OSG
A
Analog input signal. Typically sensor Green output AC-coupled thru a capacitor.
26
AGND
P
Analog ground return.
27
OSB
A
Analog input signal. Typically sensor Blue output AC-coupled thru a capacitor.
28
CPOFILT2
A
Charge Pump Filter Capacitor. Bypass this supply pin with a 0.1μF capacitor to
CPOFILT1.
29
DGND
P
Digital ground return.
30
CPOFILT1
A
Charge Pump Filter Capacitor.
Bypass this supply pin with a 0.1μF capacitor to CPOFILT2.
31
DVB
O
D
Digital Core Voltage bypass. Not an input. Bypass with 0.1μF capacitor to DGND.
32
INCLK+
I
D
Clock Input.
When XTALEN=0
Non-Inverting input for LVDS clocks or CMOS clock input. CMOS clock is selected when
pin 33 is held at DGND. Otherwise clock is configured for LVDS operation.
When XTALEN=1
Connection to terminal 2 of crystal.
An 18 pF capacitor should be connected from terminal 1 of the crystal to ground.
33
INCLK-
I
D
Clock Input.
When XTALEN=0
Inverting input for LVDS clocks, connect to DGND for CMOS clock.
When XTALEN=1
Connection to terminal 1 of crystal. A 18 pF capacitor should be connected from terminal 1
of the crystal to ground.
IO
O
I
I
I
Serial Interface Data Output. Can be tied to SDI for compatibility with LM98714 designs.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Pin Functions (continued)
PIN
NO.
34
NAME
DOUT7/
I/O
TYP
RES
DESCRIPTION
O
D
Bit 7 of the digital video output bus in CMOS Mode, LVDS Frame Clock+ in LVDS Mode.
O
D
Bit 6 of the digital video output bus in CMOS Mode, LVDS Frame Clock- in LVDS Mode.
O
D
Bit 5 of the digital video output bus in CMOS Mode, LVDS Data Out2+ in LVDS Mode.
O
D
Bit 4 of the digital video output bus in CMOS Mode, LVDS Data Out2- in LVDS Mode.
O
D
Bit 3 of the digital video output bus in CMOS Mode, LVDS Data Out1+ in LVDS Mode.
O
D
Bit 2 of the digital video output bus in CMOS Mode, LVDS Data Out1- in LVDS Mode.
O
D
Bit 1 of the digital video output bus in CMOS Mode, LVDS Data Out0+ in LVDS Mode.
O
D
Bit 0 of the digital video output bus in CMOS Mode, LVDS Data Out0- in LVDS Mode.
TXCLK+
35
DOUT6/
TXCLK-
36
DOUT5/
TXOUT2+
37
DOUT4/
TXOUT2-
38
DOUT3/
TXOUT1+
39
DOUT2/
TXOUT1-
40
DOUT1/
TXOUT0+
41
DOUT0/
TXOUT0-
42
DGND
p
Digital ground return.
43
VD
O
P
Power supply for the digital circuits. Bypass this supply pin with 0.1μF capacitor. A single
4.7μF capacitor should be used between the supply and the VD, VR and VC pins.
44
VC
P
Power supply for the sensor control outputs. Bypass this supply pin with 0.1μF capacitor.
45
CLKOUT/SH2
O
D
Output clock for registering output data when using CMOS outputs, or a configurable low
speed sensor timing output.
46
SH3
O
D
Configurable low speed sensor timing output.
47
RS
O
D
Configurable high speed sensor timing output.
48
CP
O
D
Configurable high speed sensor timing output.
49
PHIA1
O
D
Configurable high speed sensor timing output.
50
PHIA2
O
D
Configurable high speed sensor timing output.
51
DGND
P
Digital ground return.
52
VC
P
Power supply for the sensor control outputs.
Bypass this supply pin with 0.1μF capacitor.
53
PHIB1
O
D
Configurable high speed sensor timing output.
54
PHIB2
O
D
Configurable high speed sensor timing output.
55
SH4
O
D
Configurable low speed sensor timing output.
56
SH5
O
D
Configurable low speed sensor timing output.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
5
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings (1) (2) (3)
MIN
Any Positive Supply Voltage (VA, VR, VD, VC)
−0.3
Voltage on Any Input or Output Pin (except DVB) (Not to exceed 4.2V)
DVB Output Voltage
Input Current at any pin
(4)
MAX
UNIT
4.2
V
4.2
V
2.0
V
±25
mA
Package Input Current (4)
±50
mA
Package Dissipation at TA = 25°C (5)
1.9
W
235
°C
Soldering Temperature, Infrared, 10 seconds
(1)
(2)
(3)
(4)
(5)
(6)
(6)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not
recommended.
All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the
power supplies with an input current of 25 mA to two.
The absolute maximum junction temperature (TJMAX) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJMAX, the junction to ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJMAX - TA)/RθJA. The values for maximum power dissipation listed will be reached only when the LM98725 is operated in a
severe faulty condition.
See AN450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any
post 1986 Texas Instruments Semiconductor Linear Data Book, for other methods of soldering surface mount devices.
6.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
(2)
(3)
Electrostatic discharge (1)
MIN
MAX
UNIT
−65
+150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (2)
2500
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (3)
250
V
Human body model is 100 pF capacitor discharged through a 1.5-kΩ resistor. Machine model is 220-pF discharged through 0Ω.
JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions (1) (2)
MIN
Operating Temperature Range
All Supply Voltage
(1)
(2)
6
+3.0
MAX
UNIT
0 ≤ TA ≤ +70
°C
+3.6
V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not
recommended.
All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
6.4 Electrical Characteristics
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. all other limits TA = 25°C. (1)
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
CMOS DIGITAL INPUT DC SPECIFICATIONS (RESETb, SH_R, SCLK, SENb)
VIH
Logical “1” Input Voltage
VIL
Logical “0” Input Voltage
VIHYST
Logic Input Hysteresis
2.0
V
0.8
V
0.6
V
100
nA
VIH = VD:
IIH
RESET, SEN
Logical “1” Input Current
SH_R, SCLK, SDI, CAL
65
CE
30
μA
VIL = DGND:
IIL
RESET, SEN
Logical “0” Input Current
SH_R, SCLK, SDI, CAL
CE
–65
μA
–100
nA
–30
μA
CMOS DIGITAL OUTPUT DC SPECIFICATIONS (SH1 to SH5, RS, CP, PHIA, PHIB, PHIC)
VOH
Logical “1” Output Voltage
IOUT = -0.5 mA
VOL
Logical “0” Output Voltage
IOUT = 1.6 mA
IOS
Output Short Circuit Current
VOUT = DGND
3.0
18
VOUT= VD
IOZ
CMOS Output TRI-STATE
Current
V
0.21
mA
–25
VOUT = DGND
20
VOUT = VD
V
nA
–25
CMOS DIGITAL OUTPUT DC SPECIFICATIONS (CMOS DATA OUTPUTS)
VOH
Logical “1” Output Voltage
IOUT = -0.5 mA
2.3
V
VOL
Logical “0” Output Voltage
IOUT = 1.6 mA
0.12
V
IOS
Output Short Circuit Current
VOUT = DGND
12
VOUT= VD
IOZ
CMOS Output TRI-STATE
Current
mA
–14
VOUT = DGND
20
VOUT = VD
nA
–25
LVDS/CMOS CLOCK RECEIVER DC SPECIFICATIONS (INCLK+ and INCLK-PINS)
VIHL
Differential LVDS Clock
High Threshold Voltage
VILL
Differential LVDS Clock
200
–200
Low Threshold Voltage
VIHC
CMOS Clock
High Threshold Voltage
VILC
CMOS Clock
mV
2.0
V
INCLK- = DGND
Low Threshold Voltage
IIHL
CMOS Clock
230
Input High Current
IILC
CMOS Clock
–135
Input Low Current
(1)
(2)
(3)
mV
RL = 100 Ω
VCM (LVDS Input Common Mode Voltage)= 1.25 V
0.8
V
260
μA
–120
μA
The analog inputs are protected as shown in Figure 2. Input voltage magnitudes beyond the supply rails will not damage the device,
provided the current is limited per Note 4 under the Absolute Maximum Ratings Table. However, input errors will be generated If the
input goes above VA and below AGND.
Test limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).
Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
7
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Electrical Characteristics (continued)
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. all other limits TA = 25°C.(1)
PARAMETER
MIN (2)
TEST CONDITIONS
TYP (3)
MAX (2)
UNIT
LVDS OUTPUT DC SPECIFICATIONS
VOD
Differential Output Voltage
VOS
LVDS Output Offset Voltage
IOS
Output Short Circuit Current
RL = 100 Ω
280
390
490
1.08
1.20
1.33
mV
V
VOUT = 0 V, RL = 100 Ω
8.5
LVDS Output Data Format
152
180
mA
LVDS Output Data Format
(Powerdown)
3.6
6
mA
CMOS Output Data Format
(40 MHz)
136
168
mA
LVDS Output Data Format
76
94
mA
LVDS Output Data Format
(Powerdown)
8.5
17
mA
CMOS Output Data Format
(ATE Loading of CMOS Outputs > 50 pF) (40 MHz)
46
68
mA
1
4
mA
LVDS Output Data Format
755
885
mW
LVDS Output Data Format
(Powerdown)
40
70
mW
600
740
mW
mA
POWER SUPPLY SPECIFICATIONS
IA
ID
IC
PWR
VA Analog Supply Current
VD Digital Output Driver
Supply Current
VC CCD Timing Generator
Output Driver Supply Current
Average Power Dissipation
Typical sensor outputs: SH1-SH5, PHIA, PHIB, PHIC,
RS, CP (ATE Loading of CMOS Outputs > 50 pF)
CMOS Output Data Format
(ATE Loading of CMOS Outputs > 50 pF) (40 MHz)
INPUT SAMPLING CIRCUIT SPECIFICATIONS
VIN
IIN_SH
Input Voltage Level
Sample and Hold Mode
Input Leakage Current
(Vclamp = Default = 2.6 V)
CDS Gain=1x, PGA Gain=1x
2.3
CDS Gain=2x, PGA Gain= 1x
1.22
Vp-p
Source Followers Off
CDS/SH Gain = 1x
OSX = VA (OSX = AGND)
(–200)
32
(-165)
50
μA
Source Followers Off
CDS/SH Gain = 2x
OSX = VA (OSX = AGND)
(–290)
55
(–240)
70
μA
Source Followers On
CDS/SH Gain = 2x
OSX = VA (OSX = AGND)
(–250)
20
(–50)
250
nA
Sample/Hold Mode
Equivalent Input Capacitance
(see Figure 12)
CDS Gain = 1x
2.5
pF
CSH
CDS Gain = 2x
4
pF
IIN_CDS
CDS Mode
Input Leakage Current
Source Followers Off
OSX = VA (OSX = AGND)
RCLPIN
CLPIN Switch Resistance
(OSX to VCLP Node in
Figure 9)
8
Submit Documentation Feedback
(–250)
10
(–50)
250
nA
16
55
Ω
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Electrical Characteristics (continued)
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. all other limits TA = 25°C.(1)
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
VCLP REFERENCE CIRCUIT SPECIFICATIONS
VVCLP
ISC
VCLP Voltage 000
VCLP Voltage Setting = 000
0.85VA
V
VCLP Voltage 001
VCLP Voltage Setting = 001
0.9VA
V
VCLP Voltage 010
VCLP Voltage Setting = 010
0.95VA
V
VCLP Voltage 011
VCLP Voltage Setting = 011
0.6VA
V
VCLP Voltage 100
VCLP Voltage Setting = 100
0.55VA
V
VCLP Voltage 101
VCLP Voltage Setting = 101
0.4VA
V
VCLP Voltage 110
VCLP Voltage Setting = 110
0.35VA
V
VCLP Voltage 111
VCLP Voltage Setting = 111
0.15VA
VCLP DAC Short Circuit
Output Current
V
mA
30
BLACK LEVEL OFFSET DAC SPECIFICATIONS
Resolution
10
Monotonicity
Bits
Ensured by
characterization
CDS Gain = 1x
Offset Adjustment Range
Referred to AFE Input
Offset Adjustment Range
Referred to AFE Output
DAC LSB Step Size
DNL
INL
Minimum DAC Code = 0x000
–614
Maximum DAC Code = 0x3FF
614
mV
CDS Gain = 2x
Minimum DAC Code = 0x000
–307
Maximum DAC Code = 0x3FF
307
mV
Minimum DAC Code = 0x000
–17500
–16130
Maximum DAC Code = 0x3FF
+16130
+17500
CDS Gain = 1x
Referred to AFE Output
Differential Non-Linearity
Integral Non-Linearity
LSB
1.2
mV
(32)
(LSB)
–0.84
+0.74/
–0.37
+2.4
–2.5
+0.72/
–0.56
+2.5
LSB
LSB
PGA SPECIFICATIONS
Gain Resolution
8
Monotonicity
Maximum Gain
Minimum Gain
PGA Function
Channel Matching
Bits
Ensured by
characterization
CDS Gain = 1x
7.7
8.3
8.8
V/V
CDS Gain = 1x
17.7
18.4
18.9
dB
CDS Gain = 1x
0.58
0.62
0.67
V/V
CDS Gain = 1x
–4.7
–4.2
–3.5
dB
Gain (V/V) = (180/(277-PGA Code))
Gain (dB) = 20LOG10(180/(277-PGA Code))
Minimum PGA Gain
3%
Maximum PGA Gain
12.7%
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
9
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Electrical Characteristics (continued)
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. all other limits TA = 25°C.(1)
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
ADC SPECIFICATIONS
VREFT
Top of Reference
2.07
V
VREFB
Bottom of Reference
0.89
V
VREFT VREFB
Differential Reference Voltage
1.06
Over range Output Code
1.18
1.30
V
65535
Under range Output Code
0
DIGITAL OFFSET “DAC” SPECIFICATIONS
Resolution
Digital Offset DAC LSB Step
Size
7
Referred to AFE Output
32
Min DAC Code =7'b0000000
Offset Adjustment Range
Referred to AFE Output
Bits
LSB
–2048
Mid DAC Code =7'b1000000
0
Max DAC Code = 7'b1111111
LSB
+2016
FULL CHANNEL PERFORMANCE SPECIFICATIONS
DNL
INL
Differential Non-Linearity
Integral Non-Linearity
See
(4)
See
(4)
Minimum PGA Gain (4)
SNR
Total Output Noise
Maximum PGA Gain (4)
Channel to Channel Crosstalk
(4)
10
-0.999
+0.8/
–0.7
2.5
–75
+18/
–25
75
LSB
LSB
–76
dB
10
LSB
RMS
26
–56
dB
96
LSB
RMS
Mode 3
26
Mode 2
17
LSB
This parameter ensured by design and characterization.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
6.5 AC Timing Specifications
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. All other limits TA = 25°C. (1)
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
INPUT CLOCK TIMING SPECIFICATIONS
INCLK = PIXCLK (Pixel Rate Clock)
fINCLK
27
(Mode 3)
1
30
(Mode 2)
1
30
(Mode 1)
2
81
(Mode 3)
2
60
(Mode 2)
2
30
(Mode 1)
Input Clock Frequency
INCLK = ADCCLK (ADC Rate Clock)
Tdc
0.66
Input Clock Duty Cycle
40/60%
50/50%
MHz
MHz
60/40%
FULL CHANNEL LATENCY SPECIFICATIONS
tLAT3
tLAT2
tLAT1
(1)
(2)
(3)
3 Channel Mode Pipeline Delay
PIXPHASE0
24
Figure 54 (LVDS)
PIXPHASE1
23.5
Figure 59 (CMOS)
PIXPHASE2
23
PIXPHASE3
22.5
2 Channel Mode Pipeline Delay
PIXPHASE0
21
Figure 55 (LVDS)
PIXPHASE1
20.5
Figure 60 (CMOS)
PIXPHASE2
20
PIXPHASE3
19.5
1 Channel Mode Pipeline Delay
PIXPHASE0
19
Figure 56 (LVDS)
PIXPHASE1
18.5
Figure 61 (CMOS)
PIXPHASE2
18
PIXPHASE3
17.5
TADC
TADC
TADC
The analog inputs are protected as shown in Figure 2. Input voltage magnitudes beyond the supply rails will not damage the device,
provided the current is limited per Note 4 under the Absolute Maximum Ratings Table. However, input errors will be generated If the
input goes above VA and below AGND.
Test limits are specified to AOQL (Average Outgoing Quality Level).
Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of product characterization. The typical
specifications are not ensured.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
11
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
AC Timing Specifications (continued)
The following specifications apply for VA = VD = VR = VC = 3.3 V, CL = 10 pF, and fINCLK = 27 MHz unless otherwise
specified. All other limits TA = 25°C.(1)
PARAMETER
TEST CONDITIONS
MIN (2)
TYP (3)
MAX (2)
UNIT
SH_R TIMING SPECIFICATIONS (Figure 44)
tSHR_S
SH_R Setup Time
2
ns
tSHR_H
SH_R Hold Time
2
ns
LVDS OUTPUT TIMING SPECIFICATIONS (Figure 53)
TXpp0
TXCLK to Pulse Position 0
-0.26
0
0.26
ns
TXpp1
TXCLK to Pulse Position 1
1.50
1.76
2.02
ns
TXpp2
TXCLK to Pulse Position 2
3.26
3.53
3.79
ns
TXpp3
TXCLK to Pulse Position 3
5.03
5.29
5.55
ns
TXpp4
TXCLK to Pulse Position 4
6.80
7.06
7.32
ns
TXpp5
TXCLK to Pulse Position 5
8.56
8.82
9.08
ns
TXpp6
TXCLK to Pulse Position 6
10.32
10.58
10.84
ns
2
4.5
9
ns
CMOS OUTPUT TIMING SPECIFICATIONS
tCRDO
CLKOUT Rising Edge to CMOS Output
Data Transition
fINCLK = 40 MHz, INCLK = ADCCLK
(ADC Rate Clock)
SERIAL INTERFACE TIMING SPECIFICATIONS
fSCLK
Input Clock Frequency
fSCLK <= fINCLK,
INCLK = PIXCLK
(Pixel Rate Clock)
Mode 3/2/1
27/30/30
MHz
fSCLK <= fINCLK,
INCLK = ADCCLK
(ADC Rate Clock)
Mode 3/2/1
81/60/30
MHz
SCLK Duty Cycle
50/50
ns
tIH
Input Hold Time
1.5
ns
tIS
Input Setup Time
2.5
ns
tSENSC
SCLK Start Time after SEN Low
1.5
ns
tSCSEN
SEN High after last SCLK Rising Edge
2.5
tSENW
SEN Pulse Width
tOD
Output Delay Time
tHZ
Data Output to High Z
(4)
(5)
12
INCLK present (4) (5)
6
INCLK stopped (4) (5)
50
ns
TINCLK
ns
11
14
ns
0.5
TSCLK
If the input INCLK is divided down to a lower internal clock rate via the PLL, the parameter tSENW will be increased by the same factor.
When the Spread Spectrum Clock Generation feature is enabled, tSENW should be increased by 1.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
6.6 Serial Interface Timing Details
tSENSC
tSCSEN
tIS
SCLK
tHZ
tOD
tIH
SEN
SDIO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
(R) CE CE
1 [1] [0] A4 A3 A2 A1 A0
x
x
x
x
x
x
x
DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2]
x
tSENW
INCLK
Figure 1. Serial Interface Specification Diagram
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
13
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7 Detailed Description
7.1 Overview
The LM98725 is a 16-bit, three-input, complete Analog Front End (AFE) for digital color copier and Multi-Function
Peripheral (MFP) applications. The system block diagram of the LM98725, shown in LM98725 Overall Chip
Block Diagram highlights the main features of the device. Each input has its own Input Bias and Clamping
Network which are routed through a selectable Sample/Hold (S/H) or Correlated Double Sampler (CDS)
amplifier. A ±9-Bit Offset DAC applies independent offset correction for each channel. A -3 to 17.9dB
Programmable Gain Amplifier (PGA) applies independent gain correction for each channel. The LM98725 also
provides independent Digital Black Level Correction Feedback Loops for each channel. The Black Level
Correction Loop can be configured to run in Manual Mode (where the user inputs their own values of DAC offset)
or in Automatic Mode where the LM98725 calculates each channel’s Offset DAC value during optical black pixels
and then adjusts the Offset register accordingly. The signals are routed to a single high performance 16-bit,
81MHz analog-to-digital converter.
The analog inputs are protected as shown in Figure 2. Input voltage magnitude up to 500 mV beyond the supply
rails will not damage this device. However, input errors will be generated if the input goes above VA and below
AGND.
VA
I/O
To Internal Circuitry
AGND
Figure 2. Analog Input Protection
14
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
OSB
OSG
OSR
VCLP Reference
Configuration
M
U
X
Black
Level
Offset
DAC
Black
Level
Offset
DAC
Black
Level
Offset
DAC
VCLP
Reference
DAC
CDS
or
Sample/Hold
Amplifier
COLOR3ODDDAC[9:0]
COLOR3EVENDAC[9:0]
Input Bias/
Clamping
M
U
X
CDS
or
Sample/Hold
Amplifier
COLOR2ODDDAC[9:0]
Input Bias/
Clamping
M
U
X
CDS
or
Sample/Hold
Amplifier
COLOR2EVENDAC[9:0]
Input Bias/
Clamping
COLOR1ODDDAC[9:0]
COLOR1EVENDAC[9:0]
VA AGND
Reference
Generator
PGA
COLOR3PGA[7:0]
PGA
COLOR2PGA[7:0]
PGA
COLOR1PGA[7:0]
3:1
MUX
Digital
Offset
16 Bit ADC
Red Ch
Black Level
White Level
Correction
VD DGND DVB
Blue Ch
Black Level
White Level
Correction
Config
Registers
CCD Timing Generator
16
Green Ch
Black Level
White Level
Correction
CAL
CLKOUT/
VC
SH2
Data Out
Config
(CMOS/LVDS)
Serial
Interface
INCLK-
INCLK+
DOUT0/
TXOUT0-
DOUT1/
TXOUT0+
DOUT2/
TXOUT1-
DOUT3/
TXOUT1+
DOUT4/
TXOUT2-
DOUT5/
TXOUT2+
DOUT6/
TXCLK-
DOUT7/
TXCLK+
CE
SCLK
SDO
SDI
SEN
RESET
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
LM98725
7.2 Functional Block Diagrams
7.2.1 LM98725 Overall Chip Block Diagram
SH5
SH4
SH3
SH1
RS
CP
PHIC2
PHIC1
PHIB2
PHIB1
PHIA2
PHIA1
SH_R
VREFT
VREFB
VCLP
Figure 3. Chip Block Diagram
Submit Documentation Feedback
15
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Functional Block Diagrams (continued)
CCD/CIS Sensor
Analog Front End
SPI
LM98725
Sensor Drivers
CCD Timing
Generator
Data Output
Image Processor/
ASIC
Motor
Controllers
CLK
SSCG
Figure 4. System Block Diagram
7.3 Feature Description
7.3.1 Modes of Operation Introduction
The LM98725 can be configured to operate in several different operating modes. The following sections are a
brief introduction to these modes of operation. A more rigorous explanation of the operating modes is contained
in the Device Functional Modes section, including input sampling diagrams for each mode as well as a
description of the operating conditions.
7.3.2 Mode 3 - Three Channel Input/Synchronous Pixel Sampling
OSB, OSG, and OSR inputs are sampled synchronously at a pixel rate. The sampled signals are processed with
each channel’s offset and gain adjusted independently via the control registers. The order in which pixels are
processed from the input to the ADC is fully programmable and is synchronized by the SH pulse. In this mode,
the maximum channel speed is 27MSPS per channel with the ADC running at 81MSPS yielding a three color
throughput of 81MSPS.
7.3.3 Mode 2 - Two Channel Input/Synchronous Pixel Sampling
Mode 2 is useful for CCD sensors with a Black and White mode with Even and Odd outputs. In its default
configuration, Mode 2 samples the Even output via the OSB channel input, and the Odd output via the OSG
channel input. Sampling of the Even and Odd pixels is performed synchronously at a maximum sample rate of
30MSPS per input with the ADC running at 60MSPS.
7.3.4 Mode 1 - One Channel Input
In Mode 1, all pixels are processed through a single input (OSR, OSG, or OSB) chosen through the control
register setup. This mode is useful in applications where only one input channel is used. The selected input is
programmable through the control register.
7.3.5 CIS Lamp and Coefficient Modes
In additional to Modes 3, 2, and 1 above, two different CIS sensor modes (CISa and CISb) can be enabled.
These allow color sequential lamp control, as well as synchronized color sequential gain/offset coefficient usage
for multi-output color sequential sensors.
7.3.6 Clock Sources
7.3.6.1 User Provided Clock Signal
When XTALEN = 0 (Page 0, Register 0, Bit 2) the clock input to the LM98725 can be a differential LVDS clock
on the INCLK+ and INCLK- pins or a CMOS level clock applied to the INCLK+ pin with the INCLK- pin connected
to DGND. The external clock signal format is auto sensed internally.
16
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Feature Description (continued)
7.3.6.2 Crystal Oscillator Driver On-Chip
When XTALEN = 1 (Page 0, Register 0, Bit 2), an on-chip crystal oscillator driver circuit can be paired with an
external crystal. Terminal 2 of the crystal should connect to INCLK+ and terminal 1 of the crystal should connect
to INCLK-. 18 pF capacitors should connect from each terminal of the crystal to ground.
7.3.6.3 Clock Multiplication - Basic
For any of the available clock sources, the input clock can be applied at the Pixel frequency (PIXCLK) or at the
ADC frequency (ADCCLK). The LM98725 can perform internal clock multiplication when a Pixel frequency clock
is applied, or no multiplication when an ADC frequency clock is applied. The internal configuration registers need
to be written to perform the proper setup of the input clock. The available input clock configurations for each
operating mode are outlined in Table 1.
Table 1. Input Clock Configurations for Operating Modes
AFE
MODE
INPUT CLOCK TYPE
INTERNAL
MULTIPLIER
INCLK
MAX
FREQ.
CONFIGURATION
REGISTER
SETTINGS
Mode 3
INCLK = Pixel Freq. (PIXCLK)
INCLK = ADC Freq. (ADCCLK)
3x
1x
27MHz
81MHz
TBD
TBD
Mode 2
INCLK = Pixel Freq. (PIXCLK)
INCLK = ADC Freq. (ADCCLK)
2x
1x
30MHz
60MHz
TBD
TBD
Mode 1
INCLK = Pixel Freq. = ADC Freq
(ADCCLK = PIXCLK in Mode 1)
1x
30MHz
TBD
7.3.6.4 Clock Multiplication - Flexible
There are a variety of situations where it is desirable to multiply the base frequency by a selected amount to
achieve the proper pixel frequency for a given application and set of system conditions.
• Applications using the onchip Crystal Oscillator driver will have much more flexibility of pixel frequencies.
• Reducing the input MCLK frequency can significantly reduce the EMI generated by the MCLK signals being
sent up the cable from the host board to the imaging board.
To ease this task a flexible multiplying PLL architecture is incorporated. When the 2 PLL architecture is enabled
(Page 2, Register 0x1Bh, Bit 1=0) the source clock frequency is multiplied by the ratio M/N. Two registers are
used to set these values:
M = Value(Page 2, Register 0x1Ch) + 1
N = Value(Page 2, Register 0x1Dh) + 1
N(max) = 64
M/N(max) = 64
M/N(min) = 1/64
Note: Since the 8 bit register values can be from 0 to 255, the resulting Numerator and Denominator values
could be from 1 to 256. However, the maximum recommended multiply or divide ratios are 64x or x/64. In
addition, the maximum recommended value for N is 64.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
17
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Fout
Clock to CCDTG
and AFE
PLL1
Fout = Fin x (M/N)
Clock
Receiver
Fin
Crystal
Oscillator
Driver
SSCG LVDS Only, 2
M PLL Mode
U
X Spread All, 1 PLL Mode
INCLK+
Crystal or
INCLK from Host
INCLK-
Data from AFE
SSCG
Enable
2 PLLs – Use M/N, Use M/N
and SSCG All, SSCG LVDS
M Only
U
X
1 PLL – No M/N and SSCG
All, No M/N and no SSCG
PLL2
SSCG modulation
21
FIFO
Use FIFO M
U
Bypass FIFO X
21
LVDS
Serializer
Clock/Data to Host
Clock System Configuration Options
Source
INCLK
INCLK
INCLK
INCLK
INCLK
PLL (Dual/Single)
Single
Single
Dual (Use M/N)
Dual (Use M/N)
Dual (Use M/N)
Spreading (On/Off)
ON
OFF
ON
ON
OFF
SpreadMode (LVDS/All)
ALL
N/A
LVDS*
ALL
N/A
XTAL
XTAL
XTAL
XTAL
XTAL
Single
Single
Dual (Use M/N)
Dual (Use M/N)
Dual (Use M/N)
ON
OFF
ON
ON
OFF
ALL
N/A
LVDS*
ALL
N/A
*If SpreadMode is LVDS, then FIFO is used to move data from CCDTG/AFE clock domain to LVDS clock domain.
Figure 5. Clock System Block Diagram
7.3.7 Clock Sources - Additional Settings and Flexibility
To support the new crystal oscillator feature, some additional flexibility was added. In Crystal Oscillator mode, the
master clock source is now on the AFE (rather than in the system ASIC or main processor). If Slave Timing
Mode (see CCD Timing Generator Master/Slave Modes) is still needed (to synchronize the AFE to the line timing
of the system), the external SH_R signal must now be captured with the internal clock source. The SH_R
Capture Clock Select bit has been added to support this case.
In addition, in these systems, it may be difficult to adjust the host SH_R timing to get the best Setup and Hold
times with respect to the internal CLK. The SH_R, INCLK Monitor Override and SH_R Capture Edge Select
controls have been added to support these needs. The INCLK Monitor Override allows the internal SH_R and
CLK signals to be monitored, to aid in selected the best edge (rising or falling) of CLK to latch the SH_R signal.
• SH_R Capture Clock Select (Page 0, Register 0x00, Bit 5)
– 0 - Use internal INCLK source to latch SH_R
– 1 - Use external CLK source to latch SH_R
• SH_R Capture Edge Select (Page 0, Register 0x00, Bit 4)
18
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
•
SNAS474H – APRIL 2009 – REVISED MARCH 2015
– 0 - Use rising edge of selected clock source
– 1 - Use falling edge of selected clock source
SH_R and INCLK Monitor Override (Page 0, Register 0x14, Bit 6)
– 0 - Timing monitor selections unaltered
– 1 - Timing monitors for CLAMPB and SAMPB are replaced with monitor of SH_R_Internal and SH_R
Capture_Clock_Internal.
7.3.8 Spread Spectrum Clock Generation (SSCG)
NOTE
When using SSCG, ensure that INCLK = ADCCLK is selected at Page 0, Register 0x02,
Bit 2 = 0. Then set the flexible clock multiplication PLL settings to achieve the desired
internal clock frequency from the applied clock.
EMI is a problem faced by any system designer. In a typical imaging system, data must be sent over a relatively
long cable to the main system board. To minimize the amount of measured EMI caused by system clocking and
data transmission, a flexible Spread Spectrum Clock Generation system is included in the LM98725.
The spread spectrum feature is configured by the registers at Page 2, Registers 0x1Ah, 0x1Bh and 0x1Eh.
The following key SSCG modes of operation and features are provided:
• Spread output data/clock only (Internal FIFO used to transfer data between clock domains) or spread internal
system clock as well as output data/clock
• Spread synchronized to CCD line length (SH period or frequency) or unsychronized.
• Spread widths of 0.625, 1.25, 2.5 and 5 % selectable
• Spread gain of 1x to 2x can double the selected spread widths
• 3 selectable modulation frequency multipliers to increase the spreading modulation frequency
• Spread “boost” provides a cleaner spread for 1 channel and 2 channel modes of AFE operation.
• Spread MaxRate allows the most effective spreading modulation for Output Only spreading. When this bit is
set, the spreading waveform is NOT synchronized to the CCD line timing.
• Spreading modulation waveform and FIFO reset by SH_R event. (Page 8, Register 0x1Eh, Bit 7) This
ensures that the spreading waveform is synchronized to the CCD line timing, even if SH_R to SH_R period is
varied by system ASIC.
• Spreading SH_R Reset can be delayed from SH_R event by a “Holldoff” amount. (Page 8, Register 0x1Eh,
Bits6:0)
7.3.9 Typical EMI Cases and Recommended SSCG Settings
• Case 1: Majority of EMI coming from LVDS outputs
– Usage: Spread output data/clock only. FIFO used to move data between non-spread and spread clock
domains. If Slave Mode is also used, ensure that the Line Length and Line Length Multiplier settings
correspond to the SH_R period. If the SH_R period may vary, then set FIFO Reset (Page 2, Register
0x1Bh, Bit 6 =1) to ensure the FIFO counters are reset every SH Interval.
• Case 2: EMI from LVDS outputs and CCD timing signals - Master Mode Application
– Usage: Spread internal system clock as well as output data/clock. Synchronize spread waveform to SH
Interval. Best to use Master mode timing to ensure spread waveform is always smoothly synchronized to
the SH Interval timing.
• Case 3: EMI from LVDS outputs and CCD timing signals - Slave Mode Application
– Usage: Spread internal system clock as well as output data/clock. Use minimal amount of spreading to
reduce CCD timing emissions, in combination with data scrambling to further reduce data cable emissions.
The small amount of spreading minimizes effects on image data, therefore, spreading is not required to be
synchronized with SH Intervals.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
19
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.3.10 Recommended Master/Slave, Clock Source and SSCG Combinations and Settings
7.3.10.1 Master Mode Operation (LM98725 Controls Line Timing)
(These are easiest cases to implement SSCG)
Clock from host board
1. Use SSCG - Spread All
2. Use SSCG - Spread LVDS Only
3. No SSCG
Clock from local crystal
1. Use SSCG - Spread All
2. Use SSCG - Spread LVDS Only
3. No SSCG
7.3.10.2 Slave Mode Operation (Host FPGA or ASIC Controls Line Timing)
NOTE: These SSCG cases are more challenging as received LVDS data timing will not be synchronous with the
clock of the FPGA/ASIC. Clock from host board. If a local clock is present on the FPGA/ASIC, an internal FIFO
must be implemented to transfer the received data from the spread LVDS clock domain, to the internal
FPGA/ASIC clock domain. If the AFE LVDS clock is used as the system clock, care must be taken to ensure that
settings are not loaded which disable this clock, and therefore lock up the system.)
1. Use SSCG - Spread All - Need spreading start to be SH gated, and SH period to be consistent to ensure
consistent capture of SH_R by the spread INCLK.
2. Use SSCG - Spread LVDS Only - In this case ensure that Line Length Register is set to same number of
pixels as that or SH_R period. In addition, if SH_R period will vary, set FIFO Reset (Page 2, Register 0x1Bh,
Bit 6 = 1) to reset FIFO at SH Interval.
3. No SSCG
Clock from local crystal (Not recommended, difficult to meet CLK to SH_R setup and hold times. Use Master
Mode instead)
1. Use SSCG - Spread All
2. Use SSCG - Spread LVDS Only
3. No SSCG
7.3.10.3 SSCG Configuration/Usage Flow
•
•
•
•
•
•
•
•
•
•
•
20
Unlock Registers (Page 0, Register 0, Bit 0 = 0)
Ensure PIXCLK/ADCCLK Configuration is set to ADCCLK. Page 0, Register 0x02, Bit 2 = 0.
Set Override PLL2 Lock Detector (Page 2, Register 0x1B, Bit 4) = 1
Set PLL2 Charge Pump Current Control (Page 2, Register 0x19, Bits 4:3) = 00
Set PLL2 Filter Bandwidth Control (Page 2, Register 0x19, Bits 2:0) = 111
Set SSCG Spread Boost (Page 2, Register 0x1A, Bit 5) = 0 or 1 (0 = default, recommended for most
applications)
Set SSCG Spread Gain (Page 2, Register 0x1A, Bit 4) = 0 or 1 (0 = default, recommended for most
applications)
Set SSCG Spread Width (Page 2, Register 0x1A, Bits 3:2) = 0.625% to 2.5% (Beyond 2.5% most LVDS
deserializers will not track the clock properly)
Set SSCG SH Sync Enable (Page 2, Register 0x1A, Bit 1) = 0 or 1 (Set to 1 for Spread All)
Set PLL Mode Select (Page 2, Register 0x1B, Bits 1:0) = 00, 01 or 11. Spread Output Only or Spread All
Clocks
If PLL Clock Multiplication Enabled, Set Clock Mult M (Page 2, Register 0x1C) and N (Page 2, Register 0x1D)
to desired values. If a pixel rate clock is applied, set the PLL multiplication to the same factor as the AFE
Mode selected at Page 0, Register 0x03, Bits 7:6. ie. The multiplication factor should be 3x for Mode 3, 2x for
Mode 2 and 1x for Mode 1.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
•
•
•
•
•
•
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Set SSCG Enable (Page 2, Register 0x1A, Bit 0) = 1 (enable spreading, load spreading state machines)
Lock Registers (Page 0, Register 0, Bit 0 = 1)
If spreading is synchronized to SH interval, the spreading function will wait until the next SH Interval before
beginning.
Set SSCG Enable (Page 2, Register 0x1A, Bit 0) = 1 (enable spreading, load spreading state machines)
Lock Registers (Page 0, Register 0, Bit 0 = 1)
If spreading is synchronized to SH interval, the spreading function will wait until the next SH Interval before
beginning.
7.3.10.4 Changing SSCG Settings
To Change SSCG Settings:
• Un-Lock Registers ((Page 0, Register 0, Bit 0 = 0)
• Set SSCG Enable = 0 (disable spreading)
• Change desired SSCG settings.
• Set SSCG Enable = 1 (enable spreading, reload spreading state machines)
• Lock Registers (Page 0, Register 0, Bit 0 = 1)
Table 2. SSCG and Clock Multiplication Register Settings
PAGE
2
REGISTER
24
18
DEFAULT
1111 1000
BITS
NAME
[7:5]
DESCRIPTION
Master PLL Range Setting for PLL1 and PLL2 when
Autorange is off. Set to 111.
[4:3]
PLL Control 1
[2:0]
PLL1 Charge Pump Current Control
Default = 11
PLL1 Filter Bandwidth Control
Default = 000
2
25
19
0001 1000
[7:5]
Reserved
Default = 000
[4:3]
PLL2 Charge Pump Current Control
PLL Control 2
[2:0]
Default = 11
Set to 00 when using SSCG.
PLL2 Filter Bandwidth Control
Default = 000
Set to 111 when using SSCG.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
21
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 2. SSCG and Clock Multiplication Register Settings (continued)
PAGE
2
REGISTER
26
1A
DEFAULT
0000 0000
BITS
NAME
[7:6]
DESCRIPTION
Spread Rate Multiplier
(Increases modulation frequency in low pixel frequency
applications)
00 1x - Default
01 2x
10 4x
11 Reserved
[5]
SSCG Spread Boost
0 Normal, PLL divide step is 1/28
1 Boost, PLL divide step is 1/56. Narrower and cleaner
spread for 1ch and 2ch modes, but limits max pixel freq
to 25 MHz.
[4]
SSCG Spread Gain
0 Spread widths as specified in [3:2]
SSCG Control 1
[3:2]
1 Spread widths are 2x [3:2] settings
SSCG Spread Width (Fmod = Fcenter+/- Width/2)
00 5%
01 2.5%
10 1.25%
11 0.625%
[1]
SSCG SH Sync Enable
0 Spread unsynched, once SSCG Enable and Register
Lock Control are set, SSCG wil begin immediately.
1 Spread synched to SH interval, once SSCG Enable is
set, the SSCG will begin at the first SH Interval.
[0]
SSCG Enable
0 Spread off
1 Spread on
22
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 2. SSCG and Clock Multiplication Register Settings (continued)
PAGE
2
REGISTER
27
1B
DEFAULT
0000 0010
BITS
NAME
[7]
DESCRIPTION
Load SSCG state machine
(SSCG Enable 0->1 also performs this function)
0 Normal
1 Load state machine (self clearing)
[6]
FIFO Reset at SH_R
0 FIFO is only reset when SSCG started
1 FIFO is reset at SH_R. Only useful in Slave Mode
with Spread LVDS Only set. Ensures that FIFO
counters are centered if SH_R period is consistenly
shorter or longer than Line Length settings.
[5]
Spread Waveform Reset at SH_R
0 Spread waveform not reset by SH_R
1 Spread waveform reset by SH_R
[4]
Override PLL2 Lock Detector
0 PLL2 Lock Detector Normal
SSCG Control 2
1 Force PLL2 Lock Detect = 1. Set to 1 when using
SSCG.
[3]
Override PLL1 Lock Detector
0 PLL1 Lock Detector Normal
1 Force PLL1 Lock Detect = 1. Useful only if using a
large multiplication factor and a lot of jitter is present in
the source clock.
[2]
Spread MaxRate
0 Spread Normal
1 Force Spreading to highest modulation frequency
instead of tied to Line Length Setting.
[1:0]
PLL Mode Select
11 Spread All System Clocks, No Multiplication
10 PLLs and SSCG Disabled - Default
01 Spread All System Clocks, Multiplication Enabled
00 Spread Output Clocks Only, Multiplication Enabled
2
28
1C
0000 0000
2
29
1D
0000 0000
2
30
1E
0000 0000
Clock Mult M
Clock Mult N
[7]
Multiplying PLL. Fout = Fin x M/N
M = mmmmmmmm + 1 (1 to 256)
Multiplying PLL. Fout = Fin x M/N
N = nnnnnnnn + 1 (1 to 256)
FIFO Reset
0 FIFO normal operating
1 Force reset of FIFO (self clearing)
[6:0]
SSCG Control 3
FIFO and Spread Waveform SH_R Reset Holdoff
Delay reset of FIFO and Spread Waveform from 0 to
127 ADC clock cycles after the internal synchronized
SH_R. To allow this event to occur during SH Interval
after all valid pixels in the pipeline have been processed.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
23
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4 Device Functional Modes
7.4.1 Mode 3 - Three Channel Input/Synchronous Pixel Sampling
In Mode 3, the OSR, OSG, and OSB input channels are sampled synchronously. The sampled input signals are
then processed in parallel through their respective channels with each channel offset and gain adjusted by their
respective control registers. The signals are then routed through a 3-1 MUX to the ADC. The order in which
pixels are processed through the MUX to the ADC is programmable (OSR-OSG-OSB, or OSB-OSG-OSR) and is
synchronized by the SH pulse.
COLOR1DAC[9:0]
OSR
Input Bias/
Clamping
COLOR3DAC[9:0]
OSB
Input Bias/
Clamping
COLOR1PGA[7:0]
CDS
or
Sample/Hold
Amplifier
Input Bias/
Clamping
COLOR2DAC[9:0]
OSG
Black
Level
Offset
DAC
Black
Level
Offset
DAC
PGA
COLOR2PGA[7:0]
CDS
or
Sample/Hold
Amplifier
Black
Level
Offset
DAC
PGA
3:1
MUX
COLOR3PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Figure 6. Synchronous Three Channel Pixel Mode Signal Routing
Table 3. Mode 3 Operating Details
DETAIL
Channels Active
OSB & OSG & OSR
Channel Sample Rate
ADC Sample Rate
fADC: fINCLK
Output Sequencing
24
3 channel synchronous pixel sampling
27
MSPS per Channel (max)
81
MSPS (max)
Internal 3x Clock Selected
3:1
fINCLK = 27 MHz (max)
Internal 1x Clock Selected
1:1
fINCLK = 81 MHz (max)
SH Signal --> R-G-B-R-G-B-R-G-B→
or
SH Signal --> B-G-R-B-G-R-B-G-R→
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.2 Mode 2 - Two Channel Input/Synchronous Pixel Sampling
Mode 2 is useful for CCD sensors with a Black and White line with Even and Odd pixels. In its default
configuration, Mode 2 samples Even sensor pixels via the Blue Channel Input, and Odd sensor pixels via the
Green Channel Input. The selection of Even/Odd inputs can be changed through the serial interface registers.
Sampling of the Even and Odd inputs is performed synchronously.
Black
Level
Offset
DAC
COLOR1DAC[9:0]
OSR
Input Bias/
Clamping
CDS
or
Sample/Hold
Amplifier
Black
Level
Offset
DAC
COLOR2DAC[9:0]
OSG
Input Bias/
Clamping
Input Bias/
Clamping
PGA
COLOR2PGA[7:0]
CDS
or
Sample/Hold
Amplifier
Black
Level
Offset
DAC
COLOR3DAC[9:0]
OSB
COLOR1PGA[7:0]
PGA
3:1
MUX
COLOR3PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Figure 7. Mode 2 Signal Routing
Table 4. Mode 2 Operating Details
DETAIL
Channels Active
OSG and OSB (Default)
or
OSR and OSG
or
OSB and OSR
Channel Sample Rate
Two inputs synchronously
processed as Even and Odd
Pixels. Channel inputs are
configurable.
30
MSPS per Channel (max)
ADC Sample Rate
60
MSPS (max)
fADC: fINCLK
2:1
fINCLK = 30 MHz (max)
1:1
fINCLK = 60 MHz (max)
Output Sequencing
Internal 2x Clock Selected
Internal 1x Clock Selected
SH Signal --> Even-Odd-Even-Odd-Even-Odd-Even→
or
SH Signal --> Odd-Even-Odd-Even-Odd-Even-Odd→
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
25
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.3 Mode 1 - One Channel Input
In Mode 1a, all pixels are processed through a single input (OSR, OSG, or OSB) chosen through the control
register setup. This mode is useful in applications where only one input channel is used. The selected input is
programmable through the control register. In this mode, the maximum channel speed is 30MSPS per channel
with the ADC running at 30MSPS.
COLOR1DAC[9:0]
OSR
Input Bias/
Clamping
COLOR2DAC[9:0]
OSG
Input Bias/
Clamping
COLOR3DAC[9:0]
OSB
Input Bias/
Clamping
Black
Level
Offset
DAC
COLOR1PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Black
Level
Offset
DAC
COLOR2PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Black
Level
Offset
DAC
3:1
MUX
COLOR3PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Figure 8. Mode 1a Signal Routing
Table 5. Mode 1 Operating Details
DETAIL
Channels Active
Channel Sample Rate
OSR or OSG or OSB
ADC Sample Rate
fADC: fINCLK
Output Sequencing
26
One color active for all lines.
30
Internal 1x Clock Selected
MSPS per Channel (max)
30
MSPS (max)
1:1
fINCLK = 25MHz (max)
SH Signal → Color 1 → Color 1 → Color 1 → Color 1 → Color 1 →
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 6. Modes of Operation Register Settings Table
SAMPLING
INPUT(S)
SIGNAL
PATH(S)
Mode3-RGB Forward
OSR||OSG||OSB
RGB
PixelR→ PixelG→ PixelB→
Mode3-RGB Reverse
OSR||OSG||OSB
RGB
PixelB → PixelG → PixelB →
Mode2-RG Forw.
OSR||OSG
RG
PixelR → PixelG →
Mode2-RG Rev.
OSR||OSG
RG
PixelG→ PixelR →
Mode2-GB Forw.
OSG||OSB
GB
PixelG→ PixelB→
Mode2-GB Rev.
OSG||OSB
GB
PixelB→ PixelG→
Mode2-RB Forw.
OSR||OSB
RB
PixelR → PixelB →
Mode2-RB Rev.
OSR||OSB
RB
PixelB → PixelR →
Mode1-R Mono
OSR
R
Color Line Seq: R→R→R→R→
Mode1-G Mono
OSG
G
Color Line Seq: G→G→G→G→
Mode1-B Mono
OSB
B
Color Line Seq: B→B→B→B→
Mode 1 or 2 or 3
Any
OPERATING MODE
CISa
OUTPUT SEQUENCING
MODE 3 AND 2 = PIXEL SEQ
2, 3, or 4 lines in sequence
Gain and Offset are channel specific.
LM98714 style CB bits indicate channel used to process
data. Additional CB bits can be used to identify current line in
sequence.
CISb
Mode 1 or 2 or 3
Any
2 or 3 lines in sequence
Gain and Offset for all channels are common, and change
from line to line based on current color in sequence.
LM98714 style CB bits indicate channel used to process
data. Additional CB bits can be used to identify current line in
sequence.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
27
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.4 Input Bias and Clamping
VA
Input Bias Enable
Configuration 3, Bit[6]
VBIAS
SAMPLE
20kΩ
OSR or
OSG or
OSB
Source Follower Enable
Configuration 3, Bit[7]
20kΩ
CS
Auto CLPIN Enable
Configuration 4, Bit[5]
SAMPLE
CLPIN
AGND
HOLD
VA
CLPIN Gating Enable
Configuration 4, Bit[4]
VBIAS
CLAMP
VCLP
CS
VCLP
VCLP Reference Select
Configuration 4, Bits[3:0]
Sampling Mode Select
(CDS or Sample/Hold Mode)
Configuration 2, Bit[1]
Pixel rate switches to sample OS signal and reference voltages .
Optional line rate switch to clamp OS input to VCLP node .
Static switches controlled by Configuration Registers
SAMPLE, CLAMP, HOLD, CLPIN are internally generated timing signals .
Figure 9. Input Bias and Clamping Diagram
28
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.4.1 Input Bias and Clamping - AC Coupled Applications
The inputs to the LM98725 are typically AC coupled through a film capacitor and can be sampled in either
Sample and Hold Mode (S/ H Mode) or Correlated Double Sampling Mode (CDS Mode). In either mode, the DC
bias point for the LM98725 side of the AC coupling capacitor is set using the circuit of Figure 8 which can be
configured to operate in a variety of different modes. A typical CCD waveform is shown in Figure 9. Also shown
in Figure 9 is an internal signal “SAMPLE” which can be used to “gate” the CLPIN signal so that it only occurs
during the “signal” portion of the CCD pixel waveform.
SH
Dummy Pixels
Optical Black Pixels
Invalid
Pixels
Valid Pixels
OSX
Auto CLPIN Start Register
Page 2, Reg. 6, Bits[7:0]
Auto CLPIN End Register
Page 2, Reg. 7, Bits[7:0]
CLPIN
SAMPLE
CLPINGATED
Figure 10. Typical CCD Waveform and LM98725 Input Clamp Signal (CLPIN)
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
29
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.5 Sample/Hold Mode
SAMPLE
OSR or
OSG or
OSB
CPAR
CS
HOLD
CLAMP
VCLP
CPAR
CS
Figure 11. Sample and Hold Mode Simplified Input Diagram
Proper DC biasing of the CCD waveform in Sample and Hold mode is critical for realizing optimal operating
conditions. In Sample/ Hold mode, the Signal Level of the CCD waveform is compared to the DC voltage on the
VCLP pin. In order to fully utilize the range of the input circuitry, it is desirable to cause the Black Level signal
voltage to be as close to the VCLP voltage as possible, resulting in a near zero scale output for Black Level
pixels.
In Sample/Hold Mode, the DC bias point of the input pin is typically set by actuating the input clamp switch (see
Figure 9) during optical black pixels which connects the input pins to the VCLP pin DC voltage. The signal
controlling this switch is an auto-generated pulse, CLPIN. CLPIN is generated with a programmable pixel delay
with respect to the SH Interval and a programmable # of pixels Duration. These parameters are available through
the serial interface control registers.
Actuating the input clamp will force the average value of the CCD waveform to be centered around the VCLP DC
voltage. During Optical Black Pixels, the CCD output has roughly three components. The first component of the
pixel is a “Reset Noise” peak followed by the Reset (or Pedestal) Level voltage, then finally the Black Level
voltage signal. Taking the average of these signal components will result in a final “clamped” DC bias point that
is close to the Black Level signal voltage.
To provide a more precise DC bias point (that is, a voltage closer to the Black Level voltage), the CLPIN pulse
can be “gated” by the internally generated SAMPLE clock. This resulting CLPINGATED signal is the logical “AND”
of the SAMPLE and CLPIN signals as shown in Figure 10. By using the CLPINGATED signal, the higher Reset
Noise peak will not be included in the clamping period and only the average of the Reset Level and Black Level
components of the CCD waveform will be centered around VCLP.
30
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.6 DC Coupled Applications
In some applications, particularly with CIS sensors, the output voltage is within a voltage range that will allow DC
coupling of the signal. When using Sample/Hold mode, DC coupling eliminates any problems with signal droop
across the line caused by voltage changes across the coupling capacitor. When DC coupling, the Auto CLPIN
should be disabled.
There are two ways of setting the proper DC levels in this type of application. If the sensor has a Vref output pin,
this can be connected to the VCLP pin of the LM98725. The internal VCLP generation should be disabled to
allow this external reference to set the Black Level for the chip close to the black pixel level of the sensor.
Many CIS sensors will not have a Vref output. In these applications, the internal VCLP voltage of the LM98725
can be set to the level that is closest to the black pixel level of the sensor.
OSR or
OSG or
OSB
fPIXEL
CSH
VCLP
Figure 12. Equivalent Input Switched Capacitance S/H Mode
In Sample and Hold Mode, the impedance of the analog input pins is dominated by the switched capacitance of
the CDS/Sample and Hold amplifier. The amplifier switched capacitance, shown as CS in Figure 11, and internal
parasitic capacitances can be estimated by a single capacitor switched between the analog input and the VCLP
reference pin for Sample and Hold mode. During each pixel cycle, the modeled capacitor, CSH, is charged to the
OSX-VCLP voltage then discharged. The average input current at the OSX pin can be calculated knowing the
input signal amplitude and the frequency of the pixel. If the application requires AC coupling of the CCD output to
the LM98725 analog inputs, the Sample and Hold Mode input bias current may degrade the DC bias point of the
coupling capacitor. To overcome this, Input Source Follower Buffers are available to isolate the larger Sample
and Hold Mode input bias currents from the analog input pin (as discussed in the following section). As shown in
CDS Mode, the input bias current is much lower for CDS mode, eliminating the need for the source follower
buffers.
7.4.7 Input Source Follower Buffers
The OSR, OSG, OSB inputs each have an optional Source Follower Buffer which can be selected with Main
Configuration Register 3 at Page 0, Register 3, Bit[7]. These source followers provide a much higher impedance
seen at the inputs. In some configurations, such as Sample and Hold Mode with AC coupled inputs, the DC bias
point of the input nodes must remain as constant as possible over the entire length of the line to ensure a
uniform comparison to reference level (VCLP in this case). The Source Followers effectively isolate the AC input
coupling capacitor from the switched capacitor network internal to the LM98725’s Sample and Hold/ CDS
Amplifier. This results in a greatly reduced charge loss or gain on the AC Input coupling capacitor over the length
of a line, thereby preserving its DC bias point.
The Source Followers should only be used in the 1.2V input range (that is, Gain Mode Register at Page 1,
Register 0, Bit[0] = 1, CDS Gain = 2x). Using the Source Followers in the 2.4V (that is, Gain Mode Register at
Page 1, Register 0, Bit[0] = 0, CDS Gain = 1x). input range will result in a loss of performance (mainly linearity
performance at the high and low ends of the input range).
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
31
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.8 CDS Mode
SAMPLE
OSR or
OSG or
OSB
CPAR
CS
HOLD
CLAMP
CPAR
CS
Figure 13. CDS Mode Simplified Input Diagram
Correlated Double Sampling mode does not require as precise a DC bias point as does Sample and Hold mode.
This is due mainly to the nature of CDS itself, that is, the Video Signal voltage is referenced to the Reset Level
voltage instead of the static DC VCLP voltage. The common mode voltage of these two points on the CCD
waveform have little bearing on the resulting differential result. However, the DC bias point does need to be
established to ensure the CCD waveform’s common mode voltage is within rated operating ranges.
The CDS mode biasing can be performed in the same way as described in the Sample/Hold Mode , or, an
alternative method is available which precludes the need for a CLPIN pulse. Internal resistor dividers can be
switched in across the OSR, OSG, and/or OSB inputs to provide the DC bias voltage.
SAMPLE
OSR or
OSG or
OSB
IBIAS
CPAR
CS
HOLD
CLAMP
CPAR
CS
Figure 14. CDS Mode Input Bias Current
Unlike in Sample and Hold Mode, the input bias current in CDS Mode is relatively small. Due to the architecture
of CDS switching, the average charge loss or gain on the input node is ideally zero over the duration of a pixel.
This results in a much lower input bias current, whose main source is parasitic impedances and leakage
currents.
As a result of the lower input bias current in CDS Mode, maintaining the DC Bias point the input node over the
length of a line will require a much smaller AC input coupling capacitor.
32
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.9 VCLP DAC
The VCLP pin provides the reference level for incoming signals in Sample and Hold Mode. The pin’s voltage can
be set by writing to the VCLP Configuration Register on register page 0. By default, the VCLP pin voltage is
established by an internal resistor divider which sets the voltage to 0.85 VA.
The VCLP buffer can also be disconnected and the pin driven externally by the another voltage in the
application, such as Vref from some CIS sensors.
Table 7. VCLP Voltage Setting
VCLP CONFIGURATION
PAGE 0, REGISTER 0x04, BITS[2:0
TYPICAL VCLP OUTPUT
(FINAL SILICON TARGETS)
000
0.85VA (Default)
001
0.9 VA
010
0.95 VA
011
0.6 VA
100
0.55 VA
101
0.4 VA
110
0.35 VA
111
0.15 VA
7.4.10 Gain and Offset Correction
Each input channel has individual settings for offset (DAC) and gain (PGA and CDS/SH gain).
7.4.10.1 Analog Offset
Analog offset (DAC) settings are individually adjustable for each color. In addition, there are (optionally) separate
settings for Even and Odd pixels being processed through each color channel. This feature is designed to
support specific CCD sensors that have two CCD transfer arrays per color, which may introduce different offset
for the Even versus Odd pixels.
COLOR1EVENDAC[9:0]
M
U
X
COLOR1ODDDAC[9:0]
OSR
Input Bias/
Clamping
Black
Level
Offset
DAC
COLOR1PGA[7:0]
CDS
or
Sample/Hold
Amplifier
PGA
Figure 15. Analog Offset Applied Prior to POA
The Black Level Offset DACs are set with a 9 bit plus sign value. This gives an approximate adjustment range of
±300 mV or ±600mV when the CDS/SH Gain is set to 1x or 2x.
The analog offset registers are found at Page 1, Registers 0x04h to 0x0Fh.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
33
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.10.2 Digital Offset
In addition, digital offset can be added to color data at the output of the ADC in the Digital Offset block. The
digital offsets are a ±6 bit value. This value is summed with the upper 11 bits of the ADC output. Therefore, the
effective offset range is from +2016 to -2048 lsbs of the ADC output.
The digital offset registers are found at Page 1, Registers 0x10h to 0x15h.
16 Bit ADC
16
Digital
Offset
Figure 16. Digital Offset Applied to ADC Output
7.4.10.3 Even/Odd Offset Coefficients
Certain CCD sensors may have different offset voltages for the Even versus the Odd pixels. To optimize the
image processing of these pixels, separate coefficients can be stored, and applied for the Even and Odd pixels.
The Even/Odd offset feature is enabled by setting Page 0, Register 0x02h, Bit 0 = 1. Bimodal correction,
discussed below, is automatically disabled when Even/Odd offset coefficients are enabled.
Color 1 Even Offset
Color 2 Even Offset
Color 3 Even Offset
Color 1 Odd Offset
Color 1 Odd Offset
Color 1 Odd Offset
Figure 17. Digital Offset - Details of Color and Even/Odd Coefficients
•
•
•
34
Analog Gain
– The gain of each input channel can be adjusted at two points in the signal chain.
CDS/SH Gain - Page 1, Register 0x00h
– A 1x or 2x gain setting is available in the CDS/SH amplifier.
– By default, one common CDS/SH gain setting is used for all input channels. If desired, individual CDS/SH
gain settings can be used for each input. To enable this feature, set Page 1, Register 0x00h, Bit 2 = 1.
PGA Gain - Page 1, Registers 0x01h, 0x02h, 0x03h
– An 8 bit PGA (Programmable Gain Amplifier) is also available. The PGA gain curve is non-linear for
optimal performance in imaging applications, and is shown on the following plot. The approximate gain
equation is: Gain (V/V) = 180/(277-PGA_Code), Gain (dB) = 20log10(180/(277-PGA_Code)).
The gain setting registers are found at Page 1, Registers 0x00h, 0x01h, 0x02h and 0x03h.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
18
17
16
15
14
13
Gain (V/V) =
(180/(277-PGA Code))
12
11
Overall PGA Gain
10
9
Gain (dB) =
20LOG10(180/(277-PGA Code))
8
7
6
5
4
3
2
1
0
-1
0
32
64
96
128
160
192
224
-2
-3
-4
PGA Register Value
Overall Gain (dB)
Overall Gain (V/V)
Figure 18. PGA Gain vs. PGA Gain Code
•
Dual Gain Mode - Page 1, Register 0x00h, Bit 1, and Registers 0x16h, 0x17h, 0x18h
– In many scanning systems, the system illumination and optics characteristics will result in a much higher
optical efficiency in the pixels near the middle of the sensor, compared with the pixels at the beginning
and end of the sensor. If a single gain setting is used for all pixels, the middle pixels will be near clipping,
while the ones at the edges can be at 1/2 scale or lower. This results in lower signal to noise for the edge
pixels. To combat this problem, the LM98725 incorporates an optional Dual Gain system. When enabled,
the system provides a second set of PGA gain registers to set the “high” gain for each input channel. The
“normal” gain settings will be applied during the “active/white” pixels, while the “high” gain settings will be
applied for all pixels before and after the “active/white” pixels (see LM98725 Typical Line Timing and Pixel
Gain Regions ).
– The Dual Gain enable bit is found at Page 1, Register 0x00h, Bit 1. The High Gain PGA settings are found
at Page 1, Registers 0x16h to 0x18h.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
35
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.11 LM98725 Typical Line Timing and Pixel Gain Regions
Figure 19. Typical Line Timing and Pixel Gain Regions
7.4.12 Automatic Black and White Level Calibration Loops
7.4.12.1 Calibration Overview
The offset and gain settings in the AFE will normally be set to optimize the range of the sensor output signal
within the ADC input range. These settings can be calculated in a host ASIC and loaded into the AFE during the
calibration procedure. To reduce the processing required to do these calculations, the LM98725 has built in
feedback or calibration loops that will automatically adjust the offset and gain settings. A number of register
values must be initially set to optimize the calibration for the particular application.
7.4.12.2 Different Modes for Different Needs
The calibration features of the LM98725 are not intended to be used during active scanning, but rather before
scanning begins, or in the page gap between images. Generally, more time is available to perform the initial
calibration before scanning begins. Page gap calibration must be necessariliy short to ensure the process
finishes in the limited number of scan lines available.
The Black and White Fine Tuning, and Black Calibration Only modes can be used during the page gap to adjust
for small differences in offset/gain that occur over time.
Black and White Full Calibration should be run before the initial scanning process, or periodically between major
jobs to take care of larger shifts in offset/gain of the input signal.
36
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.12.3 Calibration Initiation
Once these settings have been made, the Register Lock Control bit (Page 0, Register 0, Bit 0) should be set to
begin converting pixels. Once the sensor data from the test image is stable the calibration process can be started
by either setting the CAL register bit at Page 0, Register 0x01h, Bit 5, or by applying a logic high to the CAL input
pin. (Both of these inputs are active when the Register Lock Control is set.) The CAL input pin is particularly
useful for implementing page gap calibration.
7.4.12.4 Key Calibration Settings
Table 8. Key Calibration Settings
● General Settings
● Calibration Mode
Page 2, Register 0, Bits[1:0]
Black Calibration Only
00
Black and White Full Calibration
01
Black and White Fine Tuning
10
● Number of Lines
Page 2, Register 1
● Black Loop Specific Settings
● # Black Pixels Averaged
Page 2, Register 2, Bits[1:0]
● B lack Target
Page 2, Register 3
● Black Pixels Start
Page 2, Register 8
● ADAC Scaling
Page 2, Register 2, Bits[3:2]
● DDAC Scaling
Page 2, Register 2, Bits[5:4]
● DDAC enable/disable
Page 2, Register 0, Bit 2
● White Loop Specific Settings
● White Target
Page 2, Register 5
● White Loop Tolerance
Page 2, Register 4, Bits[6:3]
● White Pixel Averaging Window Size
Page 2, Register 4, Bits[2:0]
● Active/White Pixels Start
Page 2, Register 0x09h, 0x0Ah
● Active/White Pixels End
Page 2, Registers 0x0Bh, 0x0Ch
The calibration loops are intended to be used prior to scanning the page or between pages being scanned. The
black loop calibrates the channel offset such that the ADC outputs the desired code for Optical Black Pixels. The
white loop calibrates the channel gain such that the ADC outputs the desired maximum white value when
scanning a white target image.
The Black Loop and White loop will both update until the # Lines setting is met. Settings of 1 to 254 lines will
cause the loops to run for that many lines, and then stop. A setting of 255 will cause the calibration loops to run
indefinitely.
While using the Auto Black Level Correction Loop, the DAC registers are re-written as required every line the
loop is running.
While using the Auto White Level Correction Loop, the PGA registers are re-written as required every line the
loop is running.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
37
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.12.5 General Black Loop Operation
During calibration, the following general process is performed:
• Beginning at Black Pixels Start, the selected number of black pixels are averaged.
• This Black Average value is compared with the Black Target to give the Black Error value.
• In general, if the Black Average > Black Target, the new DAC values will be lower than the previous ones. If
the Black Average < Black Target the new DAC values will be higher than the previous ones.
• The ADAC Scaling and DDAC Scaling values are used to balance the speed of convergence against the
tolerance for noise in the data. The smallest (1/8) scaling values will give slower convergence, but will make
the system respond more slowly to noisy data. The highest (1/2) will result in the fastest convergence, but will
respond more quickly to noisy data. The DDAC scaling factor of Linear - 1LSB adjust will result in a maximum
change of one lsb of the DDAC value, regardless of how great the difference between Black Average and
Black Target
• The number of Black Pixels to be processed by the algorithm is set at Page 2, Register 2, Bits[1:0]. 4, 8, 16
or 32 pixels can be averaged together to determine the current Black Value. Averaging the highest number of
pixels possible for the sensor in use will improve the accuracy and repeatability of the Black Average value.
The delay from the end of the SH Interval to the first Black Pixel to be processed is set at Page 2, Register 8. A
delay of up to 255 pixels can be set.
7.4.12.6 ADAC/DDAC Convergence
At the beginning of the calibration process, the ADAC will be used to reduce the Black Error as much as
possible. Once further adjustments of the ADAC can no longer reduce the Black Error, the ADAC adjustments
will stop and the DDAC will be used. *If users would rather apply digital offset corrections in their ASIC, the
DDAC corrections can be omitted by setting the DDAC disable bit at Page 2, Register 0x00h, Bit 2.
Figure 20. Black Loop Timing
38
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.12.7 General White Loop Operation
The White Peak value is determined by a moving window average done throughout the Active/White pixels
region of the line (Refer to LM98725 Typical Line Timing and Pixel Gain Regions). The size of the moving
window is set at Page 2, Register 4, Bits[2:0]. 4, 8, 16 or 32 (default) pixels are averaged together at a time and
compared with the previous Peak White value. If the new White Average is greater than the previous Peak White
value, then the Peak White value is set equal to the White Average. The window is then shifted over to the next
group of pixels (one window width) and a new average is calculated. This process is repeated until the
Active/White Pixels End value is reached. The final Peak White value is then compared with the White Target
value (Page 2, Register 5). The gain settings are then adjusted to make the Peak White value closer to the White
Target value.
7.4.12.8 White Loop Modes
• White Full Calibration (Cold start or Pre-Job) - In this mode, the gain settings are completely reset to
default at the beginning of the loop. The first change or gain decision is whether the CDS/SH gain setting will
be 1x or 2x. Subsequent decisions are made to adjust the PGA setting to the provide the Peak White value
that is closest to the White Target value.
• White Fine Tuning (Page Gap Calibration) - In this mode, the previous gain settings are used as the
starting point. The CDS/ SH gain setting will not be changed. The PGA gain will be increased or decreased
by one step at a time, to fine tune the gain. This mode is normally used where only minor changes in the
white level are expected.
7.4.12.9 Bimodal (Automatic) Correction
Due to the architecture of the ADC used in the LM98725, it is possible that a small offset in the resulting data will
be present between the Even and Odd pixels processed by the device. This offset is referred to as a Bimodal
distribution in the data. It can occur because the signals being procesed go through two different paths to
achieve the required throughput. Each of these paths can give a slightly different signal offset, resulting in the
bimodal distribution in output data, for a given fixed input voltage.
When the automatic Black Level (offset) correction circuit is engaged, a portion of that circuitry automatically
corrects the bimodal distribution. The bimodal correction applied is stored at Page 1, Registers 0x1Ch, 0x1Dh,
and 0x1Eh. The stored value is divided by two. Half is added to the Even pixels, and half is subtracted from the
Odd pixels.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
39
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.13 Coarse Pixel Phase Alignment
Precise placement of the CCD video signal sampling point is a critical aspect in any typical imaging application.
Many factors such as logic gate propagation delays and signal skew increase the difficulty in properly aligning
the CCD pixel output signals with the AFE input sampling points. The LM98725 provides two powerful features to
aid the system level designer in properly sampling the CCD video signal under a large range of conditions. The
first feature, discussed in this section, is the Coarse Pixel Phase Alignment block. As the name implies, this block
provides a very coarse range of timing adjustment to align the phase of the CCD Pixel output with the phase of
the LM98725 sample circuit. The second feature, discussed in Internal Sample Timing, is the block which is
designed for fine tuning of the sampling points within the selected Coarse Pixel Alignment Phase. A small portion
of a typical imaging application is shown in Figure 21.
SH
φ1Α
LM98724 CCD
Timing Generator
Outputs
φ2Α
OS3
CCD/CIS
Sensor
OS2
LM98724
Output Data Bus
OS1
Input Clock
(INCLK)
Figure 21. Typical AFE/CCD Interface
As shown in Figure 21, the LM98725 provides the timing signals to drive the CCD using external logic gates to
drive the high capacitance CCD clock pins. The pixels are shifted out of the CCD, through the emitter follower
buffers and received by the LM98725 inputs for processing.
40
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
In an ideal application, depicted in Figure 22, the Pixel output signal would be in phase with the timing signals
that drove the CCD. The LM98725 input sampling clocks (CLAMP and SAMPLE) are adjustable within a pixel
period. By default, the pixel period (or pixel “phase”) is defined to be in line with the input clock. As shown in the
ideal case in Figure 22, CLAMP and SAMPLE can be properly adjusted to their ideal positions within the pixel
phase, shown below at the stable region near the end of the pedestal and data phases.
Figure 22. Clock Alignment in an Ideal Application
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
41
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
However, in a real system , propagation delays exist in all stages of the signal chain. These propagation delays
will lead to a shift in the CCD Pixel outputs with respect to the LM98725 input clock. The phase shift of the CCD
Pixel output, demonstrated in Figure 23, can lead to significant sample timing issues if not properly corrected.
Figure 23. CCD Output Phase Shift in a Real Application
In the default mode, the LM98725 sampling is performed during a clock period whose phase is aligned with the
input clock (ignoring any clock tree skew for the moment). The actual sampling clocks are adjustable within the
clock period, as shown in Figure 23 (shown for CDS mode in the diagram) and further described in the Internal
Sample Timing section. As shown in the diagram, the delay of the CCD Pixel output is shifted far enough that the
fine CLAMP and SAMPLE clocks cannot be placed in a stable portion of the waveform. To remedy this situation,
the LM98725’s Coarse Pixel Phase Alignment feature allows the designer to shift the entire phase of the analog
front end with respect to the input clock. This allows the designer to choose one of four sampling phases which
best matches the delay in the external circuitry. Once the “Coarse Pixel Phase” has been chosen, the designer
can then fine tune the sampling clocks using the fine adjustment (see Internal Sample Timing.)
The four available Coarse Pixel Phases (PIXPHASE0 - PIXPHASE3) are depicted in Figure 24 (Mode 3),
Figure 25 (Mode 2) and Figure 26 (Mode 1). Also shown in the diagrams are the external input clock (INCLK)
and a typical CCD output delayed from the input clock.
42
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 24. Mode 3 Coarse Pixel Adjustment
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
43
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 25. Mode 2 Coarse Pixel Phase Adjustment
44
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 26. Mode 1 Coarse Pixel Phase Adjustment
7.4.14 Internal Sample Timing
A typical CCD input signal is depicted in Figure 27 and Figure 28. Also shown are the internally generated
SAMPLE and CLAMP pulses. These signals provide the sampling points of the input signal (OSX). The timing of
SAMPLE and CLAMP is derived from an internal system clock (SYSCLK).
The pixel’s reference level input (depicted as VREF) is captured by the falling edge of the CLAMP pulse. In
Sample/Hold Mode the VREF input is a sample of the VCLP DC voltage. In CDS Mode the CLAMP pulse samples
the pedestal Level of the CCD output waveform.
The pixel’s signal level input (depicted as VSIG) is captured by the SAMPLE pulse. In either Sample/Hold or CDS
Mode, the VSIG input is the signal level of the CCD output waveform.
The LM98725 provides fine adjustment of the CLAMP and SAMPLE pulse placement within the pixel period. This
allows the user to program the optimum location of the CLAMP and SAMPLE falling edges. The available fine
tuning locations for CLAMP and SAMPLE are shown in Figure 29 and Figure 30 for each sampling mode (CDS
or S/H) and channel mode (3, 2, or 1 Channel).
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
45
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 27. Pixel Sampling in CDS Mode
46
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 28. Pixel Sampling in S/H Mode
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
47
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 29. 3 Channel (Mode 3) CLAMP and SAMPLE Timing
48
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 30. 1 or 2 Channel (Mode 1, Mode 2) CLAMP and SAMPLE Timing
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
49
50
Submit Documentation Feedback
Product Folder Links: LM98725
LS PIX 8-12 have one set of programmed ON/OFF points
during each line (during pixels)
LS PIX12
LS PIX11
LS PIX10
LS PIX9
LS PIX8
LS PIX7
LS PIX6
LS PIX5
LS PIX4
LS PIX3
LS PIX2
LS PIX1
LS PIX0
CCDTG
(low speed signals)
Out
Sequence Invert Control has 1 bit for each signal times 4 lines.
This is updated to the next value in the sequence at the end* of
each SH interval (end of final state, but before pixel clocking
begins)
This bit can be a 0 (normal) or 1 (invert) based on the stored
register settings
*Invert happens during transition from SH interval to pixels
timing to avoid glitches.
HSPIX Generator Block
Out
PhiA HSPIX Generator Block
Outb
Out
CP HSPIX Generator Block
Outb
Out
RS HSPIX Generator Block
Outb
Outb
Out
PhiB HSPIX Generator Block
Outb
PhiC HSPIX Generator Block
HSTG
(high speed signals)
Pin
Output
Polarity
/State
Output
Polarity
/State
Output
Polarity
/State
Output
Polarity
/State
Output
Polarity
/State
Output
Polarity
/State
Output
Polarity
/State
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Pin
Output
Polarity
/State
Output
Polarity
/State
Pin
Pin
Output
Polarity
/State
Output
Polarity
/State
Pin
Pin
Output
Polarity
/State
Output
Polarity
/State
SH5
SH4
SH3
SH2/CLKOUT
SH1
RS
CP
PHIA2
PHIA1
PHIB2
PHIB1
PHIC2
PHIC1
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.14.1 CCD Timing Generation
A flexible internal timing generator is included to provide clocking signals to CCD and CIS sensors. A block
diagram of the CCD Timing Generator is shown in Figure 32.
Figure 31. CCD Timing Generation
Figure 32. CCD Timing Generator Block Diagram
Copyright © 2009–2015, Texas Instruments Incorporated
Pixel Interval Sequence
Invert Control
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Examples of the various operating modes and settings are shown in Figure 33 through Figure 36. The detailed
pixel timing is somewhat dependent on the operating modes of the AFE circuitry regarding the number of
adjustment points for the on and off points of the different timing outputs.
NOTE: In addition to the timing adjustments shown, the polarity of all sensor clock signals can be adjusted by
register control.
Figure 33. Pixel Timing - 42 Timing Points Per Pixel in Mode 3
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
51
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 34. Pixel Timing - 28 Timing Points Per Pixel in Mode 2 and Mode 1
52
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 35. Pixel Timing - Normal or 1/2 Rate Timing for High Resolution Sensors
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
53
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 36. Pixel Timing - Independent Inversion of Each Output
54
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.14.2 SH Interval Details - Multiple States Defined within SH Interval
In the LM98725, each SH Interval (the period when the high speed pixel timing is stopped) can have a selected
number of “States”, with each “State” having a specified duration. In the most common usage, each SH Interval
is the same, and there can be as many as 31 defined States within the SH Interval. During each State, the logic
level of each output signal can be defined as 1 or 0. The duration of the State, and the logic levels of the signals
are defined in configuration registers on register pages 3, 4 and 5.
Each State basic duration can be from 1 to 255 pixel periods. There is also a multiplier of 2x, 4x, 8x or 16x (Page
2, Register 0x17) that will increase SH State durations for sensors that require long SH pulse widths.
If less than the maximum number of states are required, the first 0 duration State in the SH Interval will terminate
processing. At the end of the SH Interval, a glitchless transition to pixel timing will occur. Similarly, at the end of
the pixel timing, a glitchless transition to the first state in the SH Interval will occur.
Some more complex sensors require different SH Interval timing in some sequence. The LM98725 can support
up to 4 different SH Interval Timings. The available 31 states are divided as follows when higher numbers of SH
Intervals are used:
Table 9. States within SH Intervals
AVAILABLE STATES
# of SH Intervals
SH Interval 1
SH Interval 2
SH Interval 3
SH Interval 4
1
2
0 to 30
n/a
n/a
n/a
0 to14
15 to 30
n/a
n/a
3
0 to 9
10 to 19
20 to 30
n/a
4
0 to 6
7 to 14
15 to 22
23 to 30
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
55
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 37. Sensor Timing SH Interval Details - Single SH Interval
56
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
An example showing a 4 SH Interval sequence is shown in Figure 38 through Figure 41.
Figure 38. Sensor Timing SH Interval Details - Multiple SH Intervals - 1 of 4
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
57
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 39. Sensor Timing SH Interval Details - Multiple SH Intervals - 2 of 4
58
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 40. Sensor Timing SH Interval Details - Multiple SH Intervals - 3 of 4
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
59
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 41. Sensor Timing SH Interval Details - Multiple SH Intervals - 4 of 4
60
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.14.3 SH Outputs - Low Speed Line Timing Usage
While the PHI, RS and CP outputs generate high speed timing during the pixel portion of the line, the SH outputs
can be used to generate low frequency signals during this period. This can be useful to generate “mode” or
“resolution” control signals for certain sensors.
Each SH output has a programmed ON and OFF point within the line. These points are programmed with a 16
bit value that sets the pixel number where the transition occurs.
Programming ON and OFF in different orders will allow pulses that are normally low or normally high, always
high, always low, and so on. A common 1x, 2x, or 4x multiplier (Page 2, Register 0x15) can be used to increase
the range (and reduce the resolution) of these ON/ OFF points, as well as the White/Active and Line Length
pixels settings.
SH Interval
Waveform set by SH
Interval Sequence
ON < OFF
ON
OFF
ON > OFF
OFF
ON
ON < OFF
ON
OFF
ON < OFF, OFF = 0xFFFFFFFF
ON
ON > OFF, ON = 0xFFFFFFFF
OFF
ON = 0, OFF = 0xFFFFFFFF
OFF = 0, ON = 0xFFFFFFFF
ON
OFF
Figure 42. Sensor Timing SH ON/OFF Details - Example Settings and Waveforms
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
61
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.14.4 Controlled Inversion
When using multiple SH Intervals, it is possible to invert the pixel portion of the line for any of the output signals
in any of the 4 Lines in the sequence. There is one bit per signal (or pair of signals for PHIA, PHIB and PHIC),
for each of the 1 to 4 lines in the sequence. Setting the bit for a particular output and line in the sequence will
cause the pixel portion of that line to be inverted. The transition to the next line in the sequence occurs at the
end of the SH Interval. Inversion can affect both the high speed timing signals (PHIx, RS, CP) and the low speed
ON/OFF behavior of the SH signals.
Below is an example of Polarity Override with a 2 Line sequence. Note that the PHIA1, SH1, SH2 and SH3
signals are inverted in Line 2, while all other signals are at the default polarity for both lines.
SH Interval 1
Line 1
SH Interval 2
Line 2
SH Interval 1
RS
0
0
0
1
0
1
0
1
0
0
0
0
PHIA1
SH1
SH2
SH3
SH4
SH5
0
0
Polarity
Override
Settings
Polarity
Override
Settings
SH Interval signal levels are set by SH Interval Information
Polarity for pixel portion of lines can be adjusted by Polarity Override Settings – Page 7, Registers 0x14 to 0x1D
Figure 43. Sensor Timing Mode Pin Output Details - Active Programmed Transition
62
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.15 CCD Timing Generator Master/Slave Modes
The internal Sensor Timing generator is capable of operating in Master Mode or in Slave Mode. The
Master/Slave operation is configured with the Master Mode Select bit (Page 0, Register 0x00, bit 1). In either
Master or Slave Mode, control bit data can be included in the LM98725 output data to indicate when each new
scan is starting as well as pixel information such as color, type (active, black, dummy, and so on), and the
beginning of each line.
7.4.15.1 Master Timing Generator Mode
In Master Timing Mode (Page 0, Register 0x00, bit 1 = 1), the LM98725 controls the entire CCD Timing
Generation based on INCLK and the Register Lock Bit (Page 0, Register 0, Bit 0) state. The Register Lock bit is
set by the user to initiate a new scan. The LM98725 controls when each new line of the scan begins and ends
based on the CCD Timing Generator register settings. Scanning is enabled as long as the Register Lock bit = 1.
The period of the line (integration time) is controlled by the SH Interval State Length settings (Page 3 Registers)
and the Line Length setting (Page 3, Registers 0x0D and 0x0E) as well as the Pixel Multiplier Factor (Page 2,
Register 0x0F) and SH State Length Multiplier (Page 2, Register 0x11) .
The line period from end of one SH Interval to the end of the next SH Interval is equal to:
Line Period = (Sum of SH Interval States x SH State Length Multiplier) + (Line Length Setting x Pixel Multiplier
Factor) pixels
7.4.15.2 Slave Timing Generator Mode
In Slave Timing Mode (Page 2, Register 0x00, bit 1 = 0), the LM98725 CCD Timing Generator is controlled by
the external SH_R pin. Each new line of a scan is initiated by an SH_R pulse. The period of the line (integration
time) is mainly controlled by the period of the incoming SH_R signal. The minimum period between SH_R pulses
should be at least the SH Interval duration as calculated above, plus the number of pixels to be clocked out of
the CCD or CIS sensor.
tSHR_S
tSHR_H
SH_R
INCLK
Figure 44. SH_R to INCLK (PIXCLK or ADCCLK) Timing
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
63
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.15.3 Multiple SH Intervals
Multiple SH Intervals are supported for those CCD sensors that has different waveform and timing requirements
during successive SH Intervals. Up to 4 different SH Intervals are supported.
In the Multiple SH Interval mode, the Line Period can be different for each line, due to the possible different
settings for SH Interval duration. In that case the Line Periods would be calculated as follows:
Line Period1 = (Sum of SH Interval States1 x SH State Length Multiplier) + (Line Length Setting x Pixel Multiplier
Factor) pixels
Line Period2 = (Sum of SH Interval States2 x SH State Length Multiplier) + (Line Length Setting x Pixel Multiplier
Factor) pixels
Line Period3 = (Sum of SH Interval States3 x SH State Length Multiplier) + (Line Length Setting x Pixel Multiplier
Factor) pixels
Line Period4 = (Sum of SH Interval States4 x SH State Length Multiplier) + (Line Length Setting x Pixel Multiplier
Factor) pixels
In multiple SH Interval mode, the SH Interval States are subdivided as follows:
Table 10. SH Interval States Subdivision
64
# SH INTERVALS
SH INTERVAL 1
STATES
SH INTERVAL 2
STATES
1
0 to 30
2
0 to 14
15 to 30
3
0 to 9
10 to 19
20 to 30
4
0 to 6
7 to 14
15 to 22
Submit Documentation Feedback
SH INTERVAL 3
STATES
SH INTERVAL 4
STATES
23 to 30
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.15.4 Support for CIS Sensors
In CIS Sensor modes, the SH (LampR), SH2 (LampG), SH3 (LampB) and SH4 (LampIR) outputs are configured
as Lamp illumination control outputs. In CIS mode, the number of lines/colors in the lamp sequence is selected
by the Multiple SH Interval setting at Page 2, Register 10h, Bits 1:0. Sequences of 2, 3 or 4 lines/colors are
supported in CIS mode. By definition, the standard CCD timing mode is equivalent to a CIS mode with length =
1.
Two different CIS modes are supported (CISa and CISb, selected at Page 2, Register 0x10h, Bits 4:3):
In CISa, there can be 2, 3 or 4 colors in the sequence, to support sensors with as many as 4 different lamp
colors. In this mode, the PGA and DAC settings are controlled by the channel settings, regardless of what line in
the sequence is being processed.
Figure 45. Mode 3, 3 Color Sequence, CISa Default
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
65
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
In CISb, there are 2 or 3 colors in the sequence. In this mode, the PGA and DAC settings are controlled by the
color in the sequence that is being processed. For example, when a Red line of data (exposed using the SH1 or
LampR output) is being processed, the Red channel PGA and DAC settings are used for all input channels.
When the SH2/LampG (Green) line of data is being processed, the Green PGA and DAC settings are used for all
input channels. and so on.
Figure 46. Mode 3, 3 Color Sequence, CISb
66
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
In CISb, when a 2 line sequence is selected, it is necessary to choose which coefficients are used during the 2
different lines in the sequence. this selection is made with the CISb Color Coefficient Select at Page 2, Register
10h, Bits 6:5. Following is an example of a 2 color sequence, where Red and Green are the selected colors:
Use Page 2, Register 10h, Bits 6:5 to choose which SHx Lampx outputs are used, and which coefficients are used in
CISb 2 color sequence.
Figure 47. Mode 3, 2 Color Sequence, CISb
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
67
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
To support monochrome scanning with an RGB CIS, select Mode 3, and a 1 line sequence. The LampR, LampG
and LampB On/Off times will apply for every line. The On/Off times and relative channel gains can both be
adjusted to achieve the desired white balance. Lamps can be on either simultaneously if the CIS and power
budget allow, or sequentially.
Figure 48. Mode 3, Mono – 1 Color, CCD Timing Lamps can be on simultaneously , or sequentially within
each line
7.4.15.5 LVDS Output Format - LM98714 Mode
7 Bit Frame
TXCLK
TXOUT2
CB[1]n-1
CB[0]n-1
DB[15]n-1
DB[14]n-1
CB[4]n
CB[3]n
CB[2]n
CB[1]n
CB[0]n
DB[15]n
DB[14]n
TXOUT1
DB[10]n-1
DB[9]n-1
DB[8]n-1
DB[7]n-1
DB[13]n
DB[12]n
DB[11]n
DB[10]n
DB[9]n
DB[8]n
DB[7]n
TXOUT0
DB[3]n-1
DB[2]n-1
DB[1]n-1
DB[0]n-1
DB[6]n
DB[5]n
DB[4]n
DB[3]n
DB[2]n
DB[1]n
DB[0]n
Pixel “n-1”
Pixel “n”
Figure 49. LVDS Output Bit Alignment and Data Format
68
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.16 LVDS Control Bit Coding - LM98714 Mode
The 5 control bits included in the LVDS data stream are coded as follows:
The "active" and "black" pixel tags are programmable tags that the LM98725 provides in order to identify how
many pixels have been processed since the falling edge of SH.
Which pixels are given "Active" and "Black" CB tags is controlled by Page 2, Registers 0x02, 0x08-0x0C, and
0x0F. (# Black Pixels Averaged, Black Pixels Start, Active/White Pixels Start, Active/White Pixels End, and Line
Length Multiplier).
The LM98725 counts the number of pixel periods after the SH Interval: If the number of pixel periods after the
SH Interval is greater than (Black Pixels Start) and less than (Black Pixels Start + # Black Pixels Averaged) the
CB bits will indicate that the pixel is a Black pixel. If the number of pixel periods after the falling edge of SH is
between Active/White Pixels Start and Active/White Pixels End, the CB bits will indicate that the pixel is an Active
pixel.
7.4.16.1 Latency Compensation of CB Bits
By default, the CB bits will be compensated for the latency through the AFE signal chain. This compensation can
be turned off by setting Page 8, Register 0x08, Bit 2 = 1.
Table 11. Latency Compensation of CB Bits, CB[4]
CB[4]
DESCRIPTION
0
Not the beginning of line
1
Beginning of Line (This bit is high during the SH Interval)
Table 12. Latency Compensation of CB Bits, CB[3:0]
CB[3:0]
DESCRIPTION
0000
Dummy Pixels
0001
Red Active Pixels
0010
Green Active Pixels
0011
Blue Active Pixels
0100
IR1 Active Pixels
0101
IR2 Active Pixels
0110
Red Black Pixels
0111
Green Black Pixels
1000
Blue Black Pixels
1001
IR1 Black Pixels
1010
IR2 Black Pixels
1111
Beginning of Scan
(This bit is high during the SH Interval of the first line after the Lock Bit transitions from low to high)
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
69
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.17 Flexible LVDS Formatting Mode: Mapping
7 Bit Frame
TXCLK
TXOUT2
DB[12]n-1
DB[11]n-1
DB[10]n-1
DB[9]n-1
DB[15]n
DB[14]n
DB[13]n
DB[12]n
DB[11]n
DB[10]n
DB[9]n
TXOUT1
DB[4]n-1
DB[7]n-1
DB[3]n-1
DB[2]n-1
DB[8]n
DB[7]n
DB[6]n
DB[5]n
DB[4]n
DB[3]n
DB[2]n
TXOUT0
CB[3]n-1
CB[2]n-1
CB[1]n-1
CB[0]n-1
DB[1]n
DB[0]n
CB[4]n
CB[3]n
CB[2]n
CB[1]n
CB[0]n
Pixel “n-1”
Pixel “n”
Figure 50. LVDS Output Bit Alignment and Data Format
In Flexible LVDS Formatting Mode, the values highlighted in red can be substituted with other CB tag
information. The table below shows the different CB information that can be selected:
Table 13. Selectable CB Tag Information
SETTING
70
CB TAG INFORMATION
0000
Original CB or Data
0001
CBO0 from LM98714 definition
0010
CBO1 from LM98714 definition
0011
CBO2 from LM98714 definition
0100
CBO3 from LM98714 definition
0101
CBO4 from LM98714 definition
0110
R - High for a red channel pixel
0111
G - High for a green channel pixel
1000
B - High for a blue channel pixel
1001
Parity - 21 bit if TXOUT0 Enabled, 14 bit if TXOUT0 Disabled
1010
Ping - High for pixels processed by the Ping section of a channel, low for Pong
1011
Line# lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100
Line# msb
1101
Black Loop Pixels - High for pixels processed by the Black Loop
1100
White Loop Pixels - High for pixels process by the White Loop
1111
CLP Pixels - High for pixels where the input CLP switch is closed
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.17.1 TXOUT0 Disable
The TXOUT0 data pair can be disabled. In combination with the new Flexible LVDS Formatting Mode, this can
support applications where only the upper 14 MSB of data are required. This will save one pair of LVDS wires in
the cable, and reduce the LM98725 slightly.
In addition, if fewer than 14 bits are required, the D2 and D3 bits can be replaced with the desired CB
information, selected from the above table.
7.4.17.2 Parity
A parity bit is available for use as one of the CB bits. Parity is calculated based on all bits being sent via the 21
or 14 bit LVDS link except:
• If any bit is selected to transmit CB Parity, it will not be used in the calculation
• If any bit is transmitting a scrambler key bit when scrambler mode 2 is selected, it will not be used in the
calculation.
The total parity across the 21 or 14 output bits (excluding any scrambler key bit) will be even.
7.4.17.3 Latency Compensation of CB Bits
By default, the CB bits will be compensated for the latency through the AFE signal chain. This compensation can
be turned off by setting Page 8, Register 0x08, Bit 2 = 1.
7.4.18 LVDS Data Randomization for EMI Reduction
While LVDS transmissions will inherently reduce the amount of electromagnetic energy, further reductions can be
achieved by randomizing the data being sent over the link. A built in “scrambler” feature provides a number of
different modes to suit different applications and host processing capabilities. One key part of the scrambler is a
linear feedback shift register (LFSR) implementation to provide pseudo-random sequence “keys” to randomize
the image data. The basic implementation of an LFSR is shown below:
XOR
20 19 18
...
2
1
0
Figure 51. LFSR Implementation
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
71
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
The LFSR algorithm used in the LM98725 is an n=21 maximal length right-shift implementation as shown above.
As a reference for FPGA and ASIC developers, the sequence is the same as that created by the Synopsys DW
component DW03_lfsr_load with inverted outputs. The preload or starting value for the sequence is 0x000001h.
If the prs (serial-type) output is selected (MODE = 01, SUB_MODE = 0X), the 21 bits of the LFSR are shifted one
position to the right on each TXCLK.
For clarity, the first 11 values in the prs sequence are:
0x000001h
0x100000h
0x080000h
0x040000h
0x020000h
0x010000h
0x008000h
0x004000h
0x002000h
0x001000h
0x000800h
If the pprs (parallel-type) output is selected (MODE = 01, SUB_MODE = 1X), the next 21 coefficients of the shiftin term are calculated in parallel, and the LFSR is loaded with these coefficients: the effect is equivalent to
clocking the LFSR 21 times in serial mode. For clarity, the first 11 values in the pprs sequence are:
0x000001h
0x080001h
0x020001h
0x0A8001h
0x002001h
0x082801h
0x022201h
0x0AAA81h
0x000021h
0x080029h
0x120023h
72
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
A summary and description of each of the modes and submodes is shown in Table 14.
Table 14. Mode and Submode Summary
MODE
PAGE 0
REGISTER 0x05
BITS 4:3
SUB_MODE
PAGE 0
REGISTER 0x05
BITS 2:1
DESCRIPTION
00
Scrambler Disabled
full scrambler enabled. sub-mode settings select:
01
00
send lvds_data[20:0] bitwise XOR with prs[20:0]
01
send prs[20:0]
10
send lvds_data[20:0] bitwise XOR with pprs[20:0]
11
send pprs[20:0]
1 bit scrambler with key of prs[0]
send lvds_data[20:0] bitwise XOR with prs[0], with lvds_data[k] = 0
send prs[0] on lvds_out[k]
k is selected with following settings:
10
00
k = 0 (DB0 in CMOS and 714 modes, CB0 in flexible, 16 bit mode)
01
k = 5 (DB0 (LSB) in flexible, 16 bit mode)
01
k = 7 (DB2 (LSB) in flexible, 14 bit mode)
10
k = 16 (CB0 in 714 mode)
11
k = 20 (CB4 in 714 mode)
1 bit scrambler with key of lvds_data[k].
send lvds_data[20:0] bitwise XOR with lvds_data[k]
with lvds_out[k] = lvds_data[k]
00
11
k = 0 (DB0 in CMOS and 714 modes, CB0 in flexible, 16 bit mode)
01 (TXOUT0 Disable = 0) k = 5 (DB0 (LSB) in flexible, 16 bit mode)
01 (TXOUT0 Disable = 1) k = 7 (DB2 (LSB) in flexible, 14 bit mode)
10
k = 16 (CB0 in 714 mode)
11
k = 20 (CB4 in 714 mode)
7.4.18.1 Mode 00: Scrambler Disabled
Mode 00: Scrambler Disabled
7.4.18.2 Mode 01: Full Scrambler Using the full 21-bit Pseudo Random Sequence
There are 4 sub-modes: (a) the 21-bit output will be bit-wise XORed with the 21-bit serial pseudo-random
sequence. that is, lvds_data[20:0] ^ prs[20:0]; (b) the 21-bit serial pseudo random sequence will be output
directly; (c) the 21-bit output will be bit-wise XORed with the 21-bit parallel pseudo-random sequence. that is,
lvds_data[20:0] ^ pprs[20:0]; (d) the 21-bit parallel pseudo random sequence will be output directly. In all submodes, the sequences start m clock cycles after the de-assertion of the bol where m is defined as the analog
latencies in 1-ch, 2-ch and 3-ch modes. In other words, the output starts the same way as the up-count test
pattern mode. Unlike the up-count test pattern mode, the 21-bit pseudo-random sequence runs at the ADC
(same as TXCLK) rate, not pixel or line rate.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
73
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.18.3 Mode 10: One Bit Scrambler Using the PRS Shift Bit Only, Sending This Bit Out on a CB Bit
Each bit of lvds_data[20:0] is XORed with prs[0]. One selected bit, lvds_data[k] is replaced with 0 before the
XOR procedure. The resulting output lvds_out[20:0] has bit k replaced by prs[0]. The bit k selection is flexible to
support different mappings of lvds_out depending on output settings as follows:
• LVDS Mapping - 714 Default Mode versus Flexible Mode (Since the location of CB bits changes depending
on which is selected) Mapping select is at Page 8, Register 8, Bit 0.
• CMOS Mode versus LVDS Mode (since only lvds_out[15:0] are available in CMOS mode) CMOS/LVDS mode
select at Page 0, Register 5, Bit 7.
• LVDS 3 Pair Mode versus LVDS 2 Pair Mode (Since TXOUT0 pair is disabled in 2 Pair Mode(txout0_dis=1))
TXOUT0 Disable at Page 8, Register 8, Bit 1.
(1)
If an output bit is replaced with the scrambler key, that bit position/value is excluded from the calculation of the parity.
Figure 52. lvds_out[20:0] Mapping in Different Modes
74
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.18.4 Mode 11: “LSB” Scrambler
The “LSB” selected from lvds_data[k] is used to scramble the output. The lvds_data[20:0] key bit k, as selected
in Mode 10 above is used (as the “LSB”) to XOR the other bits. The key bit itself is not replaced.
7.4.18.5 Scrambler Inhibit Bit Select
This feature allows individual bits in the LVDS output stream to be non-scrambled. This can be used as a setup
and debugging aid during initial system development, or as a permanent feature to simplify the data decoding
task. The tradeoff will be somewhat compromised EMI reduction over a fully scrambled LVDS data stream.
The controls for this feature are located as follows:
Scrambler Inhibit 0 - Page 8, Register 0x12h, Bits 6:0 - LVDS[6:0]
Scrambler Inhibit 1 - Page 8, Register 0x13h, Bits 6:0 - LVDS[13:7]
Scrambler Inhibit 2 - Page 8, Register 0x14h, Bits 6:0 - LVDS[20:14]
7.4.19 LVDS Drive Strength Adjust
The LVDS outputs may be decreased in strength to reduce EMI generation, or increased in strength to improve
noise immunity.
Page 8, Register 8, Bits 5:4 can be adjusted as follows (in terms of VOD into 100 Ω termination):
Table 15. LVDS Strength
00
Decrease of approximately 100 mV
01
Decrease of approximately 50 mV
10
Default - approximately 350 mV
11
Increase of approximately 50 mV
7.4.20 LVDS Output Timing Details
INCLK
tIDO
7 Bit Frame Period
TXCLK
(single ended)
Pixel “n-1”
Pixel “n”
TXOUT2
CB[1]n-1
(single ended)
CB[0]n-1
DB[15]n-1
DB[14]n-1
CB[4]n
CB[3]n
CB[2]n
CB[1]n
CB[0]n
DB[15]n
DB[14]n
TXOUT1
DB[10]n-1
(single ended)
DB[9]n-1
DB[8]n-1
DB[7]n-1
DB[13]n
DB[12]n
DB[11]n
DB[10]n
DB[9]n
DB[8]n
DB[7]n
TXOUT0
(single ended)
DB[2]n-1
DB[1]n-1
DB[0]n-1
DB[6]n
DB[5]n
DB[4]n
DB[3]n
DB[2]n
DB[1]n
DB[0]n
DB[3]n-1
TXpp0
TXpp1
TXpp2
TXpp3
TXpp4
TXpp5
TXpp6
Figure 53. LVDS Data Output Mode Specification Diagram
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
75
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.20.1 Optional TXCLK Delay
The LM98725 includes a selectable (off by default) delay of TXCLK. This delay can be enabled (Page 8, Register
0x08, Bit 3) to improve timing margin between the TXCLK and TXOUTx signals when using certain LVDS
deserializers. The default/off setting is intended to be compatible with the LM98714 LVDS timing.
7.4.21 LVDS Data Latency Diagrams
Figure 54. Mode 3 LVDS Data Latency
76
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Figure 55. Mode 2 LVDS Data Latency
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
77
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Figure 56. Mode 1 LVDS Data Latency
78
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.22 Data Test Patterns
The data test patterns present different data to the input of the LVDS serializer block. There are two basic groups
of test patterns:
• LVDS Output Pattern Modes - These patterns are applicable to all 21 bits of the LVDS interface.
• AFE Output Pattern Modes (Default) - These patterns are applicable to the 16 bit AFE data sent to the LVDS
interface.
• All Test Pattern Modes are selected at Page 0, Register 6.
7.4.22.1 LVDS Output Pattern Modes
7.4.22.1.1 Worst Case Transitions (Alternating 0x2A/0x55 on Each LVDS Pair)
This test mode provides an LVDS output with the maximum possible transitions. This mode is useful for system
EMI evaluations, and for ATE timing tests.
The effective data values are an alternating pattern between 21’b101010101010101010101 (0x155555) and
21’b010101010101010101010 (0x0AAAAA). This test pattern resets to 0x155555 at the selected event (BOL or
BOS).
Figure 57. LVDS Output Pattern Modes
7.4.22.1.2 Fixed Output Data
This mode sends a fixed repeating data pattern to each of the indicated LVDS output pairs. This is useful for
system debugging of the LVDS link and receiver circuitry. There are 4 different choices within this mode:
• 0x2A (0101010b) (All 3 data pairs)
• 0x55 (1010101b) (All 3 data pairs)
• (0000000b) (*All 3 data pairs + clock pair)
• 0x7F (1111111b) (*All 3 data pairs + clock pair)
*Since the 0x00 and 0x7F patterns also affect the clock pair, they cannot be used for deserializer and
downstream testing. They are useful for DC measurements of the LVDS outputs.
7.4.22.2 AFE Output Pattern Modes
There are 3 different types of AFE Output Patterns:
• Normal ADC/AFE output (Default)
• Up-Counter Data
• Fixed AFE Patterns
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
79
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.22.2.1 Up-Counter Data
The counter will be reset to 0xFFFF during the BOS (Beginning Of Scan) SH Interval. When the AFE up-counter
is selected, the ramp begins at the BOS, and increments by 1 at either the pixel rate or at the line rate (every
BOL). This data can be useful as it can provide a grayscale image that increases in intensity down the “page”.
Alternately, it can provide data that increments at the pixel rate. Either of these forms can be very useful in
debugging the downstream data processing system.
7.4.22.2.2 Fixed AFE Pattern
The fixed AFE patterns allow the CB coding information to be sent normally, while specific data is used to
replace the AFE output. This can be useful in debugging portions of the downstream data processing system.
• 0xFF00 (0x1111111100000000b) fixed data
• 0xAA55 (0x1010101001010101b) fixed data
• 0x0000 (0x0000000000000000b) fixed data
• 0xFFFF (0x1111111111111111b) fixed data
• 0x00FF (0x0000000011111111b) fixed data
• 0x55AA (0x0101010110101010b) fixed data
7.4.23 CMOS Output Format
Figure 58. CMOS Data Output Format (Mode 3 Shown)
80
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.24 CMOS Output Data Latency Diagrams
INCLK =
ADCCLK
tLAT3
PIXPHASE0
tLAT3
PIXPHASE1
tLAT3
PIXPHASE2
tLAT3
PIXPHASE3
OSR
OSG
OSB
CLKOUT
DOUTx
MSB
LSB
Data latency shown is for Mode 3 in relation to PIXPHASE0 with the processing order set to OS RDOSGDOS B. If the incoming pixels are not aligned with
PIXPHASE0, one of the remaining PIXPHASEs can be selected as the sampling phase without effecting the output data location.
Figure 59. Mode 3 CMOS Output Latency
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
81
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
INCLK =
ADCCLK
tLAT2
PIXPHASE0
tLAT2
PIXPHASE1
tLAT2
PIXPHASE2
tLAT2
PIXPHASE3
OSR
OSG
OSB
CLKOUT
DOUTx
MSB
LSB
Data latency shown is for Mode 2 in relation to PIXPHASE0 with the processing order set to OS GDOS B. If the incoming pixels are not aligned with
PIXPHASE0, one of the remaining PIXPHASEs can be selected as the sampling phase without effecting the output data location.
Figure 60. Mode 2 CMOS Output Latency
82
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
INCLK =
ADCCLK
tLAT1
PIXPHASE0
tLAT1
PIXPHASE1
tLAT1
PIXPHASE2
tLAT1
PIXPHASE3
OSR
OSG
OSB
CLKOUT
DOUTx
MSB
LSB
Data latency shown is for Mode 1 in relation to PIXPHASE0 with the processing channel configured to OS R. If the incoming pixels are not aligned with
PIXPHASE0, one of the remaining PIXPHASEs can be selected as the sampling phase without effecting the output data location.
Figure 61. Mode 1 CMOS Output Latency
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
83
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.4.25 Serial Interface
A serial interface is used to write and read the configuration registers. The interface is a four wire interface using
SCLK, SEN, SDI and SDO connections. SDI and SDO can be connected together to support the same format
and connectivity as previous LM98714 designs. The CE pin should be tied to GND to support LM98714
compatible communications. This will set the device address bits to 00.
Table 16. Serial Interface "CE" Pin Definition
CE LEVEL
ADDRESS
VD
01
Float
10
GND
00
The main input clock (INCLK) to the LM98725 can be active or stopped when accessing the Serial Interface.
Care should be taken to avoid stopping or starting the INCLK during Serial Interface communication.
NOTE
After either starting or stopping INCLK, or after Software Reset (Register Page 0, Address
1, [4:3]), users should wait for 50 ms to allow the internal PLL and logic to stabilize before
resuming Serial Interface communications.
7.4.25.1 Serial Interface Operating Modes
• LM98714 Compatible Mode (Default) - By default the serial interface is compatible with the LM98714
interface, allowing SDI and SDO to be connected and driving by a single pin on the host.
• LM98725 4 Wire 16+ Clock Mode (Default) - The 4 Wire 16+ Clock Mode is essentially the same as the
LM98714 Compatible Mode, but using all 4 wires, with separate SDO and SDI signals between the Host and
Slave. This requires additional wires, but removes the need for a bidirectional signal. A valid transaction is
recognized after a minimum of 16 SCLK while SEN is low.
• LM98725 25+ Clock Mode (Selected when Page 0, Register 0x01h, Bit 7=1) - This mode forces the serial
interface logic to only process a transaction with 25 or more SCLK while SEN is low. This mode can be used
with either 3 or 4 wire connections.
In all of the above cases, the final 16 bits on SDI (before the rising edge of SEN) are processed by the serial
interface logic. Any earlier information on SDI is ignored.
7.4.25.2 Serial Interface in Absence of MCLK
• Clockless (MCLK stopped) Mode (always enabled if MCLK stopped) - When the input MCLK is stopped,
Data Read operation is exactly the same as MCLK present mode. The Data Write operation no longer
provides a free readback of the previously written data. See Figure 64 and Figure 66.
7.4.25.3 Writing to the Serial Registers
To write to the serial registers, the timing diagram shown in Figure 62 must be met. First, SEN is toggled low.
The *previously addressed device assumes control of the SDO pin during the first eight clocks of the command.
During this period, data is clocked out of the device at the rising edge of SCLK. At the rising edge of ninth clock,
the LM98725 releases control of the SDO pin. At the falling edge of the ninth clock period, the master should
assume control of the SDI pin and begin issuing the new command. SDI is clocked into the LM98725 at the
rising edge of SCLK. The remaining bits are composed of the “write” command bit (a zero), two device address
bits (00, 01 or 10 for the LM98725), five bit register address to be written, and the eight bit register value to be
written. When SEN toggles high, the register is written to, and the LM98725 now functions with this new data.
*The previously addressed device could be another device on a shared serial interface or this device. If the
previous command was to this device, and was a read, then the SDO pin will be driven during the first eight
clocks. If the previous command was to this device and was a write, then the SDO pin will only be driven if the
serial interface is in “MCLK active” mode.
84
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
7.4.25.4 Reading the Serial Registers
To read to the serial registers, the timing diagram shown in Figure 63 must be met. First, SEN is toggled low.
The LM98725 assumes control of the SDO pin during the first eight clocks of the command. During this period,
data is clocked out of the device at the rising edge of SCLK. The eight bit value clocked out is the contents of the
previously addressed register, regardless if the previous command was a read or a write. At the rising edge of
ninth clock, the LM98725 releases control of the SDO pin. At the falling edge of the ninth clock period, the
master should assume control of the SDI pin and begin issuing the new command. SDI is clocked into the
LM98725 at the rising edge of SCLK. The remaining bits are composed of the “read” command bit (a one), two
device address bits (zeros for the LM98725), five bit register address to be read, and the eight bit “don’t care”
bits. When SEN toggles high, the register is not written to, but its contents are staged to be outputted at the
beginning of the next command.
Examples of Serial Writes and Reads in the various modes are shown in Figure 62 through Figure 67.
7.4.25.5 LM98714 Compatible 3 Wire Serial Signaling
Figure 62. Serial Write - LM98714 Compatible Connection
1
9
n-15
n
SCLK
SEN
SDIO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
Previously addressed slave
outputting register contents from
previous command.
X
X
1
(R)
CE CE
A4
1
0
A3
A2
A1
A0
DI
[7]
DI
[6]
DI
[5]
DI
[4]
DI
[3]
DI
[2]
DI
[1]
DI
[0]
Master issues “read” bit (1), 2 “chip enable” bits (00, 01 or 10), five bit register
address, and eight “don’t care” bits. Register contents are not altered.
Only final 16 bits of SDI data before rising edge of /SEN are processed.
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
X
X
Device outputting register contents
addressed in read command.
Figure 63. Serial Read - LM98714 Compatible Connection
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
85
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
1
9
www.ti.com
n-15
n
SCLK
SEN
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
SDO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
Device outputting register contents from this
write command if MCLK is present.
If MCLK is not present, no data output will occur.
Previously addressed slave
outputting register contents from
previous command.
(W)
SDI
X
X
X
X
X
X
X
X
X
X
X
X
0
CE CE
A4
1
0
A3
A2
A1
A0
DI
[7]
DI
[6]
DI
[5]
DI
[4]
DI
[3]
DI
[2]
DI
[1]
DI
[0]
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Master issues “write” bit (0), 2 “chip enable” bits (00, 01 or 10), five bit
register address, and eight bit register value to be written.
Only final 16 bits of SDI data before rising edge of /SEN are processed.
Figure 64. Serial Write - 4 Wire Connection - 25+ Clock Mode
1
9
n-15
n
SCLK
SEN
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
SDO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
Device outputting register contents
addressed in read command.
Previously addressed slave
outputting register contents from
previous command.
SDI
X
X
X
X
X
X
X
X
X
X
X
X
1
(R)
CE CE
A4
1
0
A3
A2
A1
A0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Master issues “read” bit (1), 2 “chip enable” bits (00, 01 or 10), five bit register
address, and eight “don’t care” bits. Register contents are not altered.
Only final 16 bits of SDI data before rising edge of /SEN are processed.
Figure 65. Serial Read - 4 Wire Connection - 25+ Clock Mode
86
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
1
9
n-15
n
SCLK
SEN
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
SDO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
Previously addressed slave outputting
register contents from last command.
Device outputting register contents from this write
command if MCLK is present.
If MCLK is not present, no data output will occur.
(W)
SDI
X
X
X
X
X
X
X
X
X
CE CE
1
0
0
A4
A3
A2
A1
A0
DI
[7]
DI
[6]
DI
[5]
DI
[4]
DI
[3]
DI
[2]
DI
[1]
DI
[0]
X
X
X
Master issues “write” bit (0), 2 “chip enable” bits (00, 01 or 10), five bit
register address, and eight bit register value to be written.
Only final 16 bits of SDI data before rising edge of /SEN are processed.
Figure 66. Serial Write - 4 Wire Connection - 16+ Clock Mode
1
n-15
9
n
SCLK
SEN
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
SDO
DO DO DO DO DO DO DO DO
[7] [6] [5] [4] [3] [2] [1] [0]
Previously addressed slave outputting
register contents from last command.
SDI
X
X
X
X
X
X
X
X
X
1
(R)
CE CE
1
0
A4
A3
Device outputting register contents
addressed in read command.
A2
A1
A0
DI
[7]
DI
[6]
DI
[5]
DI
[4]
DI
[3]
DI
[2]
DI
[1]
DI
[0]
X
X
X
Master issues “read” bit (1), 2 “chip enable” bits (00, 01 or 10), five bit register
address, and eight “don’t care” bits. Register contents are not altered.
Only final 16 bits of SDI data before rising edge of /SEN are processed.
Figure 67. Serial Read - 4 Wire Connection - 16+ Clock Mode
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
87
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
7.5 Register Maps
7.5.1 Configuration Registers
The LM98725 operation is very flexible to support a wide variety of sensors and system designs. This flexibility is
controlled through configuration registers which are first summarized, then described in full in the following
tables. Because the serial interface only allows 5 address bits, a register paging system is used to support the
larger number of required registers.
The page register is present at the highest address (1Fh or 11111b) of the currently selected page. The power
on default setting of the page register is 00. Writing other values to this register allows the other pages to be
accessed.
Once all registers are written, the Register Lock Control bit (Page 0, Register 0, Bit 0) is set to 1 to start the state
machines and initiate the converting of pixels. If Slave mode is selected, SH_R pulses must also be input to
trigger this process.
NOTE
When Register Lock Control = 1, many registers are locked to prevent state machines
from becoming corrupted, while others are accessible to allow control of necessary
functions. The registers and bits that are still writable are indicated in Boldface print in the
Bits and Register Description columns of the Register Definition Details table.
Operational Setup Sequence:
Ensure Lock Bit (Page 0, Register 0, Bit 0) = 0 for following setting writes
Apply either no INCLK or a stable INCLK to ensure accurate serial communications
Page 0
• Set AFE mode (# of input channels)
• Set output data format
• Enable data outputs
• Set AFE biasing
• Set AFE Clamp and Sample timing
• Setup Slave or Master Mode
Page 1
• Set Gain Mode (Singe or Dual)
• Set CDS/SH Gain
• Set PGA
• Set DAC settings
Page 2
• Set Input Clamping Settings
• Set Black Pixel Start and # Black Pixels Averaged
• Set Active White Pixels Start and End
• Set Line Length (Master Mode Only)
• Set # Pixel Multiplier, SH Line Sequence # and SH State Length Multiplier
• Set PHI, RS, CP On and Off delay settings
• Set Spread Spectrum control settings
88
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Register Maps (continued)
Page 3
Set SH Slate Length Settings
Page 4
Set SH Interval State Settings for PHI, RS, CP
Page 5
Set SH Interval State Settings for SH1 to SH5
Page 6
Set PHI, RS. CP pattern bit fields and rate (normal or 1/2 rate)
Page 7
• Set SHx On, Off settings if needed
• Set CLK invert settings for multi-line sequences if needed
Page 8
• Set CLK output activity, polarity, enable
• Set LVDS output format
• Set CB coding
• Set PHI, RS, CP, SH unlock output state
Begin Scanning:
• Ensure stable INCLK applied and PLL is locked (read back Page 0, Register 0, Bit 7)
• Set Register Lock Control bit = 1
• In Master Mode, conversions will begin after the Lock Bit is set. In Slave Mode, SH_R pulses can begin af ter
the Lock Bit is set. SH Intervals will be generated in response to the SH_R input pulses.
• Registers and Bits marked in Boldface print may be adjusted while scanning is in progress. More major
changes (that is, color mode, CCDTG details) should be done by writing a 0 to the Register Lock Control Bit
to pause scanning.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
89
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Register Maps (continued)
7.5.1.1 Register Summary Table
Table 17. Register Summary Table
Default
(binary)
Register Title
0
0010 0000
Main Configuration 0
1
1
0100 0000
Main Configuration 1
0
2
2
1100 0000
Main Configuration 2
0
3
3
1000 0010
Main Configuration 3
0
4
4
0011 0000
Main Configuration 4
0
5
5
0000 0000
Main Configuration 5
0
6
6
0000 0000
Configuration 6
0
7
7
0000 0000
Configuration 7
0
8
8
0000 0000
OSR CLAMP Start Edge
Page (dec)
Addr (dec)
Addr (hex)
0
0
0
PAGE 0
90
0
9
9
0001 0000
OSR CLAMP Stop Edge
0
10
A
0000 0000
OSG CLAMP Start Edge
0
11
B
0001 0000
OSG CLAMP Stop Edge
0
12
C
0000 0000
OSB CLAMP Start Edge
0
13
D
0001 0000
OSB CLAMP Stop Edge
0
14
E
0001 0110
OSR SAMPLE Start Edge
0
15
F
0010 0110
OSR SAMPLE Stop Edge
0
16
10
0001 0110
OSG SAMPLE Start Edge
0
17
11
0010 0110
OSG SAMPLE Stop Edge
0
18
12
0001 0110
OSB SAMPLE Start Edge
0
19
13
0010 0110
OSB SAMPLE Stop Edge
0
20
14
0000 0000
Sample & Clamp Monitor 0
0
21
15
0000 0000
Sample & Clamp Monitor 1
0
22 to 29
16 to 1D
0
30
1E
XX00 0011
Revision
0
31
1F
0000 0000
Page Register
Reserved
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
Gain Mode
PAGE 1
1
0
0
0000 0000
1
1
1
0110 0001
Red PGA
1
2
2
0110 0001
Green PGA
1
3
3
0110 0001
Blue PGA
1
4
4
1000 0000
Red Even DAC MSB
1
5
5
0000 0000
Red Even DAC LSB
1
6
6
1000 0000
Green Even DAC MSB
1
7
7
0000 0000
Green Even DAC LSB
1
8
8
1000 0000
Blue Even DAC MSB
1
9
9
0000 0000
Blue Even DAC LSB
1
10
A
1000 0000
Red Odd DAC MSB
1
11
B
0000 0000
Red Odd DAC LSB
1
12
C
1000 0000
Green Odd DAC MSB
1
13
D
0000 0000
Green Odd DAC LSB
1
14
E
1000 0000
Blue Odd DAC MSB
1
15
F
0000 0000
Blue Odd DAC LSB
1
16
10
0100 0000
Red Even Digital Offset
1
17
11
0100 0000
Green Even Digital Offset
1
18
12
0100 0000
Blue Even Digital Offset
1
19
13
0100 0000
Red Odd Digital Offset
1
20
14
0100 0000
Green Odd Digital Offset
1
21
15
0100 0000
Blue Odd Digital Offset
1
22
16
0110 0001
Red High Gain PGA
1
23
17
0110 0001
Green High Gain PGA
1
24
18
0110 0001
Blue High Gain PGA
1
28
1C
0100 0000
Red Channel Bimodal
1
29
1D
0100 0000
Green Channel Bimodal
1
30
1E
0100 0000
Blue Channel Bimodal
1
31
1F
0000 0000
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
91
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Default
(binary)
Addr (hex)
Register Title
PAGE 2
92
2
0
0
0000 0000
Calibration Mode
2
1
1
0000 0000
Calibration # Lines
2
2
2
0001 0100
Black Cal Config
2
3
3
0100 0000
Black Target
2
4
4
0100 0011
White Cal Config
2
5
5
1000 0000
White Target
2
6
6
0000 0100
AutoCLPIN Start
2
7
7
0000 1100
AutoCLPIN End
2
8
8
0001 0000
Black Loop Start
2
9
9
0000 0000
Active/White Pixels Start - MSB
2
10
A
0001 0100
Active/White Pixels Start - LSB
2
11
B
0001 0000
Active/White Pixels End - MSB
2
12
C
0000 0000
Active/White Pixels End - LSB
2
13
D
0001 0000
Line Length MSB
2
14
E
0100 0000
Line Length LSB
2
15
F
0000 0000
Line Length Multiplier
2
16
10
0000 0000
Line Mode
2
17
11
0000 0000
SH State Length Multiplier
2
18
12
0000 0000
PHIA/B/C Delays
2
19
13
0000 0000
RS/CP Delays
2
20 to 23
14 to 17
2
24
18
1111 1000
PLL Control 1
2
25
19
0001 1000
PLL Control 2
2
26
1A
0000 0000
SSCG Control 1
2
27
1B
0000 0010
SSCG Control 2
2
28
1C
0000 0000
Clock Mult M
2
29
1D
0000 0000
Clock Mult N
2
30
1E
0000 0000
SSCG Control 3
2
31
1F
Reserved
Submit Documentation Feedback
Page Register
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
PAGE 3
3
0
0
0000 0000
SH State 0 Length
3
1
1
0000 0000
SH State 1 Length
3
2
2
0000 0000
SH State 2 Length
3
3
3
0000 0000
SH State 3 Length
3
4
4
0000 0000
SH State 4 Length
3
5
5
0000 0000
SH State 5 Length
3
6
6
0000 0000
SH State 6 Length
3
7
7
0000 0000
SH State 7 Length
3
8
8
0000 0000
SH State 8 Length
3
9
9
0000 0000
SH State 9 Length
3
10
A
0000 0000
SH State 10 Length
3
11
B
0000 0000
SH State 11 Length
3
12
C
0000 0000
SH State 12 Length
3
13
D
0000 0000
SH State 13 Length
3
14
E
0000 0000
SH State 14 Length
3
15
F
0000 0000
SH State 15 Length
3
16
10
0000 0000
SH State 16 Length
3
17
11
0000 0000
SH State 17 Length
3
18
12
0000 0000
SH State 18 Length
3
19
13
0000 0000
SH State 19 Length
3
20
14
0000 0000
SH State 20 Length
3
21
15
0000 0000
SH State 21 Length
3
22
16
0000 0000
SH State 22 Length
3
23
17
0000 0000
SH State 23 Length
3
24
18
0000 0000
SH State 24 Length
3
25
19
0000 0000
SH State 25 Length
3
26
1A
0000 0000
SH State 26 Length
3
27
1B
0000 0000
SH State 27 Length
3
28
1C
0000 0000
SH State 28 Length
3
29
1D
0000 0000
SH State 29 Length
3
30
1E
0000 0000
SH State 30 Length
3
31
1F
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
93
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
PAGE 4
94
4
0
0
0000 0000
SH State 0 PHI, RS, CP
4
1
1
0000 0000
SH State 1 PHI, RS, CP
4
2
2
0000 0000
SH State 2 PHI, RS, CP
4
3
3
0000 0000
SH State 3 PHI, RS, CP
4
4
4
0000 0000
SH State 4 PHI, RS, CP
4
5
5
0000 0000
SH State 5 PHI, RS, CP
4
6
6
0000 0000
SH State 6 PHI, RS, CP
4
7
7
0000 0000
SH State 7 PHI, RS, CP
4
8
8
0000 0000
SH State 8 PHI, RS, CP
4
9
9
0000 0000
SH State 9 PHI, RS, CP
4
10
A
0000 0000
SH State 10 PHI, RS, CP
4
11
B
0000 0000
SH State 11 PHI, RS, CP
4
12
C
0000 0000
SH State 12 PHI, RS, CP
4
13
D
0000 0000
SH State 13 PHI, RS, CP
4
14
E
0000 0000
SH State 14 PHI, RS, CP
4
15
F
0000 0000
SH State 15 PHI, RS, CP
4
16
10
0000 0000
SH State 16 PHI, RS, CP
4
17
11
0000 0000
SH State 17 PHI, RS, CP
4
18
12
0000 0000
SH State 18 PHI, RS, CP
4
19
13
0000 0000
SH State 19 PHI, RS, CP
4
20
14
0000 0000
SH State 20 PHI, RS, CP
4
21
15
0000 0000
SH State 21 PHI, RS, CP
4
22
16
0000 0000
SH State 22 PHI, RS, CP
4
23
17
0000 0000
SH State 23 PHI, RS, CP
4
24
18
0000 0000
SH State 24 PHI, RS, CP
4
25
19
0000 0000
SH State 25 PHI, RS, CP
4
26
1A
0000 0000
SH State 26 PHI, RS, CP
4
27
1B
0000 0000
SH State 27 PHI, RS, CP
4
28
1C
0000 0000
SH State 28 PHI, RS, CP
4
29
1D
0000 0000
SH State 29 PHI, RS, CP
4
30
1E
0000 0000
SH State 30 PHI, RS, CP
4
31
1F
Submit Documentation Feedback
Page Register
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
PAGE 5
5
0
0
0000 0000
SH State 0 SH1-SH5
5
1
1
0000 0000
SH State 1 SH1-SH5
5
2
2
0000 0000
SH State 2 SH1-SH5
5
3
3
0000 0000
SH State 3 SH1-SH5
5
4
4
0000 0000
SH State 4 SH1-SH5
5
5
5
0000 0000
SH State 5 SH1-SH5
5
6
6
0000 0000
SH State 6 SH1-SH5
5
7
7
0000 0000
SH State 7 SH1-SH5
5
8
8
0000 0000
SH State 8 SH1-SH5
5
9
9
0000 0000
SH State 9 SH1-SH5
5
10
A
0000 0000
SH State 10 SH1-SH5
5
11
B
0000 0000
SH State 11 SH1-SH5
5
12
C
0000 0000
SH State 12 SH1-SH5
5
13
D
0000 0000
SH State 13 SH1-SH5
5
14
E
0000 0000
SH State 14 SH1-SH5
5
15
F
0000 0000
SH State 15 SH1-SH5
5
16
10
0000 0000
SH State 16 SH1-SH5
5
17
11
0000 0000
SH State 17 SH1-SH5
5
18
12
0000 0000
SH State 18 SH1-SH5
5
19
13
0000 0000
SH State 19 SH1-SH5
5
20
14
0000 0000
SH State 20 SH1-SH5
5
21
15
0000 0000
SH State 21 SH1-SH5
5
22
16
0000 0000
SH State 22 SH1-SH5
5
23
17
0000 0000
SH State 23 SH1-SH5
5
24
18
0000 0000
SH State 24 SH1-SH5
5
25
19
0000 0000
SH State 25 SH1-SH5
5
26
1A
0000 0000
SH State 26 SH1-SH5
5
27
1B
0000 0000
SH State 27 SH1-SH5
5
28
1C
0000 0000
SH State 28 SH1-SH5
5
29
1D
0000 0000
SH State 29 SH1-SH5
5
30
1E
0000 0000
SH State 30 SH1-SH5
5
31
1F
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
95
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
PAGE 6
96
6
0
0
0000 0000
PHIA0
6
1
1
0000 0000
PHIA1
6
2
2
0000 0000
PHIA2
6
3
3
0000 0000
PHIA3
6
4
4
0000 0000
PHIA4
6
5
5
0000 0000
PHIA5
6
6
6
0000 0000
PHIB0
6
7
7
0000 0000
PHIB1
6
8
8
0000 0000
PHIB2
6
9
9
0000 0000
PHIB3
6
10
A
0000 0000
PHIB4
6
11
B
0000 0000
PHIB5
6
12
C
0000 0000
PHIC0
6
13
D
0000 0000
PHIC1
6
14
E
0000 0000
PHIC2
6
15
F
0000 0000
PHIC3
6
16
10
0000 0000
PHIC4
6
17
11
0000 0000
PHIC5
6
18
12
0000 0000
RS0
6
19
13
0000 0000
RS1
6
20
14
0000 0000
RS2
6
21
15
0000 0000
RS3
6
22
16
0000 0000
RS4
6
23
17
0000 0000
RS5
6
24
18
0000 0000
CP0
6
25
19
0000 0000
CP1
6
26
1A
0000 0000
CP2
6
27
1B
0000 0000
CP3
6
28
1C
0000 0000
CP4
6
29
1D
0000 0000
CP5
6
30
1E
0000 0000
HSPIX Rate Select
6
31
1F
Submit Documentation Feedback
Page Register
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
SH1 PIXEL ON MSB
PAGE 7
7
0
0
0000 0000
7
1
1
0000 0000
SH1 PIXEL ON LSB
7
2
2
0000 0000
SH1 PIXEL OFF MSB
7
3
3
0000 0000
SH1 PIXEL OFF LSB
7
4
4
0000 0000
SH2 PIXEL ON MSB
7
5
5
0000 0000
SH2 PIXEL ON LSB
7
6
6
0000 0000
SH2 PIXEL OFF MSB
7
7
7
0000 0000
SH2 PIXEL OFF LSB
7
8
8
0000 0000
SH3 PIXEL ON MSB
7
9
9
0000 0000
SH3 PIXEL ON LSB
7
10
A
0000 0000
SH3 PIXEL OFF MSB
7
11
B
0000 0000
SH3 PIXEL OFF LSB
7
12
C
0000 0000
SH4 PIXEL ON MSB
7
13
D
0000 0000
SH4 PIXEL ON LSB
7
14
E
0000 0000
SH4 PIXEL OFF MSB
7
15
F
0000 0000
SH4 PIXEL OFF LSB
7
16
10
0000 0000
SH5 PIXEL ON MSB
7
17
11
0000 0000
SH5 PIXEL ON LSB
7
18
12
0000 0000
SH5 PIXEL OFF MSB
7
19
13
0000 0000
SH5 PIXEL OFF LSB
7
20
14
0000 0000
PHIA Polarity Override
7
21
15
0000 0000
PHIB Polarity Override
7
22
16
0000 0000
PHIC Polarity Override
7
23
17
0000 0000
RS Polarity Override
7
24
18
0000 0000
CP Polarity Override
7
25
19
0000 0000
SH1 Polarity Override
7
26
1A
0000 0000
SH2 Polarity Override
7
27
1B
0000 0000
SH3 Polarity Override
7
28
1C
0000 0000
SH4 Polarity Override
7
29
1D
0000 0000
SH5 Polarity Override
7
30
1E
0000 0000
7
31
1F
Reserved
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
97
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Register Maps (continued)
Table 17. Register Summary Table (continued)
Page (dec)
Addr (dec)
Addr (hex)
Default
(binary)
Register Title
PAGE 8
98
8
0
0
0000 0000
PHIA1, PHIA2 Polarity / State
8
1
1
0000 0000
PHIB1, PHIB2 Polarity / State
8
2
2
0000 0000
PHIC1, PHIC2 Polarity / State
8
3
3
0000 0000
RS, CP Polarity / State
8
4
4
0000 0000
SH1, SH2 Polarity / State
8
5
5
0000 0000
SH3, SH4 Polarity / State
8
6
6
0000 0000
SH5 Polarity / State
8
7
7
0000 0000
Reserved
8
8
8
0010 0000
LVDS Configuration
8
9
9
0000 0000
CB1/CB0 CB Mapping
8
10
A
0000 0000
CB3/CB2 CB Mapping
8
11
B
0000 0000
D2/CB4 CB Mapping
8
12
C
0000 0000
D4/D3 CB Mapping
8
13
D
0000 0000
D5 CB Mapping
8
14
E
0000 0000
Unlock State Output Values
PHIA, PHIB, PHIC, RS, CP
8
15
F
0000 0000
Unlock State Output Values
SH1, SH2, SH3, SH4, SH5
8
16 to 17
10 to 11
0000 0000
Reserved
8
18
12
0000 0000
Scrambler Inhibit 0 (LVDS[6:0])
8
19
13
0000 0000
Scrambler Inhibit 1 (LVDS[13:7])
8
20
14
0000 0000
Scrambler Inhibit 2 (LVDS[20:14])
8
16 to 30
15 to 1E
0000 0000
Reserved
8
31
1F
Submit Documentation Feedback
Page Register
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18 describes all available registers in the LM98725 register bank, and their functions .
NOTE: Registers and/or Bits Marked in Boldface are Writeable when Register 0, Bit 0 = 1. All others are
“Locked".
Table 18. Register Definitions
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
PAGE 0
0
0
0
0010 0000
[7]
PLL Locked (READ ONLY) Status Bit
0 PLL is not locked
1 PLL is locked
[6]
Not Used
[5]
SH_R Capture Clock Select
0 Use internal CLK from XTAL source.
1 Use external INCLK source.
[4]
SH_R Capture Edge Select
0 Use rising edge of selected Clock source.
1 Use falling edge of selected Clock source.
[3]
Main
Not Used
Configuration 0
[2]
XTALEN
0 Use autodetecting CMOS/LVDS clock receiver
1 Enable crystal driver. INCLK+ is output, INCLK- is input.
[1]
Master Mode Select Bit
0 Slave/SH_R
1 Master/Line Length
[0]
Register Lock Control
0 Registers are unlocked (i.e. writeable) and
CCDTG state machines are stopped
1 Registers are locked (default) and CCDTG state machines are
operating
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
99
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
1
1
DEFAULT
(BINARY)
BITS
0100 0000
REGISTER
TITLE
[7]
REGISTER DESCRIPTION
Serial Interface Mode Select
0 16+ Clock Mode [Default]
1 25+ Clock Mode
[6]
Enable PLL Range Autocalibration
0 PLL Range Autocal OFF
1 PLL Range Autocalibrates (Default)
[5]
Calibrate Gain/Offset (self clearing)
0 Calibration is off
1 Calibration is active
[4]
Main
Software Reset - FSM
Configuration 1 Set to 1 to reset all state machines. Self clearing.
[3]
Software Reset - FSM + Registers
Set to 1 to reset all state machines and registers. Self clearing.
[2]
Power Down CDS/SH Amplifier
[1]
Reference Buffer Power Down
[0]
Master Power Down
0 Master Power Down Disable
1 Master Power Down Enable
100
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
2
2
DEFAULT
(BINARY)
1100 0010
REGISTER
TITLE
BITS
[7:6]
REGISTER DESCRIPTION
Mode Select Bits
11 Mode 3 (Default) (3 Channel Mode)
10 Mode 2 (2 Channel Mode)
01 Mode 1 (1 Channel Mode)
00 Not Used
[5:4]
Color Select Bits. Used to determine the inputs sampled during a scan.
11 Reserved
10 Mode 2 = OSR & OSB Mode 1 = OSB
01 Mode 2 = OSG & OSB Mode 1 = OSG
00 Mode 2 = OSR & OSG Mode 1 = OSR
Color Order. Configures the sequence of the pixel processing
[3]
Main
0 Forward (default)
Configuration 2 1 Reverse
[2]
PIXCLK/ADCCLK Configuration.
Selects appropriate multiplier for given input clock frequency
Mode 3: ADC Frequency = 3x Pixel Frequency
Mode 2: ADC Frequency = 2x Pixel Frequency
Mode 1: ADC Frequency = 1x Pixel Frequency
0 User supplies ADC rate clock, LM98725 performs no multiplication.
1 User supplies Pixel rate clock, LM98725 performs clock multiplication.
[1]
Sampling Mode Select
0 Sample and Hold Mode
1 Correlated Double Sampling Mode (Default)
[0]
Even/Odd CCD Sensor Enable
Dedicated Even and Odd DACs and Digital Offsets would be applied to
every other pixels.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
101
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
3
3
DEFAULT
(BINARY)
BITS
1000 0010
REGISTER
TITLE
[7]
REGISTER DESCRIPTION
Source Follower Enable.
0 Disable
1 Enable (Default)
[6]
Input Bias Enable. Enables the Input Bias Resistor ladder.
0 Disable (Default)
1 Enable
[5]
Bit CLP mode enable (black clamping done in reference portion of
every pixel of line)
0 Disabled (Default)
1 Enable
Main
[4:2]
[1]
Configuration 3 Pixel Phase Clock Select. Coarse adjustment for Pixel phase
relative to INCLK. Useful in systems where Pixel inputs arrive with
significant delay relative to INCLK.
Sensor Polarity Select
0 Voltage increases with increasing white level
1 Voltage decreases with increasing white level
[0]
102
Reserved
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
4
4
DEFAULT
(BINARY)
0011 0000
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
[7]
Reserved
[6]
Enable VCLP Buffer
0 Use resistor divider voltages directly
1 Use buffered resistor divider voltage
[5]
Auto CLPIN Enable
0 Auto CLPIN Disabled
1 Auto CLPIN Enabled - (Default) - CLPIN generated according to Start
and End position settings at Page 2, Registers 0x06 and 0x07
[4]
CLPIN Gating Enable
0 Auto CLPIN not gated by the SAMPLE pulse timing
1 Auto CLPIN gated by the SAMPLE pulse timing
(Default)
[3]
Main
VCLP Power Down
Configuration 4 0 VCLP Normal Operation
1 No circuit is tied to the VCLP output and no current is drawn
[2:0]
VCLP Voltage Setting/Source
000 0.85VA (Default)
001 0.9VA
010 0.95VA
011 0.6VA
100 0.55VA
101 0.4VA
110 0.35VA
111 0.15VA
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
103
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
5
5
DEFAULT
(BINARY)
BITS
0000 0000
REGISTER
TITLE
[7]
REGISTER DESCRIPTION
Output Format
0 LVDS (Default)
1 CMOS
[6]
Output Enable. Enables the Data Output pins.
0 Disabled (Default)
1 Enable
[5]
CMOS Data CLK Override Enable
0 - SH2 output as normal
1 - CMOS Data CLK on SH2
[4:3]
Data Scrambler Enable/Mode
00 - Scrambler Disabled
01, 10, 11 - Scrambler Enabled see 1:0 description below for details:
[2:1]
Main
Data Scrambler Submode
Configuration 5
If Scrambler Mode = 01, Full scrambler enabled as follows:
00 Send lvds_data[20:0]^prs[20:0]
01 Send prs[20:0]
10 Send lvds_data[20:0]^pprs[20:0]
11 Send pprs[20:0]
If Scrambler Mode = 10, 1 bit scrambler with key of prs[0]
Send lvds_data[20:0]^prs[0], with lvds_data[k] = 0
00 k = 0 (DBO in CMOS and 714 modes, CB0 in flexible, 16 bit mode)
01, txout0 disable = 0, k = 5 (DB0(lsb) in flexible, 16 bit mode)
01, txout0 disable = 1, k = 7 (DB2(lsb) in flexible, 14 bit mode)
10 k = 16 (CB0 in 714 mode)
11 k = 20 (CB4 in 714 mode)
If Scrambler Mode = 11, 1 bit scrambler with key of lvds_data[k].
Send lvds_data[20:0]^lvds_data[k], with lvds_out[k] = lvds_data[k]
00 k = 0 (DBO in CMOS and 714 modes, CB0 in flexible, 16 bit mode)
01, txout0 disable = 0, k = 5 (DB0(lsb) in flexible, 16 bit mode)
01, txout0 disable = 1, k = 7 (DB2(lsb) in flexible, 14 bit mode)
10 k = 16 (CB0 in 714 mode)
11 k = 20 (CB4 in 714 mode)
[0]
104
Reserved
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
6
6
DEFAULT
(BINARY)
0000 0000
REGISTER
TITLE
BITS
[7]
REGISTER DESCRIPTION
LVDS Test Pattern Synchronization Select
0 Synchronizes at (held at initial state during) BOL & BOS
1 Synchronizes at (held at initial state during) BOS only
[6:4]
LVDS Output Pattern Select
000 Select AFE output (normal operation) (Must be 00 for AFE Test
Patterns)
001 Select 0x2A & 0x55 alternating patterns (all 3 pairs)
010 Selects 0x2A (all 3 pairs)
011 Selects 0x55 (all 3 pairs)
100 Selects 0x00 (all 4 pairs) (Differential 0 on all outputs)
101 Selects 0x7F (all 4 pairs) (Differential 1 on all outputs)
[3]
AFE Test Pattern - Up-count Rate Select
0 Up-count at pixel rate
Configuration 6 1 Up-count at BOL
[2:0]
Test Pattern - AFE Data Select - (Bits 6:4 must be 000 for AFE Test
Patterns)
000 Selects ADC output (normal operation)
001 Selects up-counter output
010 Selects 0xFF00 - fixed data
011 Selects 0xAA55 - fixed data
100 Selects 0x0000 - fixed data
101 Selects 0xFFFF - fixed data
110 Selects 0x00FF - fixed data
111 Selects 0x55AA - fixed data
0
7
7
0000 0000
Timing Generator Output Driver Strength
[5]
0
0
8
9
8
9
0000 0000
0001 0000
0
10
A
0000 0000
0
11
B
0001 0000
0
0
0
12
13
14
C
D
E
0000 0000
0001 0000
0001 0110
PHIA1, PHIA2 - 0 = Normal, 1 = High
[4]
PHIB1, PHIB2 - 0 = Normal, 1 = High
[3]
Configuration 7 PHIC1, PHIC2 - 0 = Normal, 1 = High
[2]
RS - 0 = Normal, 1 = High
[1]
CP - 0 = Normal, 1 = High
[0]
SH1, SH2, SH3, SH4, SH5 - 0 = Normal, 1 = High
[7:6]
OSR CLAMP
[5:0]
Start Edge
[7:6]
OSR CLAMP
[5:0]
Stop Edge
[7:6]
OSG CLAMP
[5:0]
Start Edge
[7:6]
OSG CLAMP
[5:0]
Stop Edge
[7:6]
OSB CLAMP
[5:0]
Start Edge
[7:6]
OSB CLAMP
[5:0]
Stop Edge
[7:6]
OSR SAMPLE
[5:0]
Start Edge
Not Used
CLAMP_R Start Edge - Default = 0d
Not Used
CLAMP_R Stop Edge - Default = 16d
Not Used
CLAMP_G Start Edge - Default = 0d
Not Used
CLAMP_G Stop Edge - Default = 16d
Not Used
CLAMP_B Start Edge - Default = 0d
Not Used
CLAMP_B Stop Edge - Default = 16d
Not Used
SAMPLE_R Start Edge - Default = 22d
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
105
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
15
F
DEFAULT
(BINARY)
0010 0110
0
16
10
0001 0110
0
17
11
0010 0110
0
0
0
18
19
20
12
13
14
0001 0110
0010 0110
BITS
REGISTER
TITLE
[7:6]
OSR SAMPLE
[5:0]
Stop Edge
[7:6]
OSG SAMPLE
[5:0]
Start Edge
[7:6]
OSG SAMPLE
[5:0]
Stop Edge
[7:6]
OSB SAMPLE
[5:0]
Start Edge
[7:6]
OSB SAMPLE
[5:0]
Stop Edge
0000 0000
REGISTER DESCRIPTION
Not Used
SAMPLE_R Stop Edge - Default = 38d
Not Used
SAMPLE_G Start Edge - Default = 22d
Not Used
SAMPLE_G Stop Edge - Default = 38d
Not Used
SAMPLE_B Start Edge - Default = 22d
Not Used
SAMPLE_B Stop Edge - Default = 38d
[7]
Not Used
[6]
SH_R Capture Monitor Override
0 SAMPB=SAMPB, CLAMPB=CLAMPB - Default
1 SAMPB = INCLK, CLAMPB = SH_R
[5:3]
Selection bits for RS (user test mode)
000 Normal output
001 SAMPR Output
010 SAMPG Output
Sample &
011 SAMPB Output
Clamp
100 CLAMPR Output
Monitor 0
101 CLAMPG Output
110 CLAMPB Output
111 PIXPHASE Output
[2:0]
Selection bits for CP (user test mode)
000 Normal output
001 SAMPR Output
010 SAMPG Output
011 SAMPB Output
100 CLAMPR Output
101 CLAMPG Output
110 CLAMPB Output
111 PIXPHASE Output
106
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
0
21
15
DEFAULT
(BINARY)
0000 0000
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
[7:6]
Not Used
[5:3]
Selection bits for SH2 (user test mode)
000 Normal output
001 SAMPR Output
010 SAMPG Output
011 SAMPB Output
100 CLAMPR Output
Sample &
101 CLAMPG Output
Clamp
110 CLAMPB Output
Monitor 1
[2:0]
111 PIXPHASE Output
Selection bits for SH3 (user test mode)
000 Normal output
001 SAMPR Output
010 SAMPG Output
011 SAMPB Output
100 CLAMPR Output
101 CLAMPG Output
110 CLAMPB Output
111 PIXPHASE Output
0
22 to
29
16 to
1D
0000 0000
Reserved
0
30
1E
XX00 0011
[7:0]
0
31
1F
0000 0000
[3:0]
Revision
Used to select desired page of registers being accessed
0000 Page 0
0001 Page 1
0010 Page 2
Page
0011 Page 3
Register
0100 Page 4
0101 Page 5
0110 Page 6
0111 Page 7
1000 Page 8
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
107
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 1
1
0
0
0000 0000
[7]
CDS/SH Gain Blue - 0 = 1x Gain, 1 = 2x Gain
[6]
CDS/SH Gain Green - 0 = 1x Gain, 1 = 2x Gain
[5]
CDS/SH Gain Blue - 0 = 1x Gain, 1 = 2x Gain
[4:3]
Not used
[2]
Individual CDS/SH Gain Enable
Gain Mode
0 Use Bit 0 for CDS/SH Gain
1 Use Bits 7:5 for CDS/SH Gains
[1]
Dual Gain Mode Enable
0 Single Gain Setting Within Each Line
1 Two Gain Settings Within Each Line
[0]
Gain Select
0 1x CDS/SH Gain - Default
1 2x CDS/SH Gain
1
1
1
0110 0001
[7:0]
Red PGA
Default = 97d for Gain = 1
1
2
2
0110 0001
[7:0]
Green PGA
Default = 97d for Gain = 1
1
3
3
0110 0001
[7:0]
Blue PGA
Default = 97d for Gain = 1
1
4
4
1000 0000
[7:0]
Red Even
DAC[9:2]
DAC MSB
1
5
5
0000 0000
[7:2]
Red Even
Not Used
DAC LSB
[1:0]
1
6
6
1000 0000
[7:0]
DAC[1:0]
Green Even
DAC[9:2]
DAC MSB
1
7
7
0000 0000
[7:2]
Green Even
Not Used
DAC LSB
[1:0]
1
8
8
1000 0000
[7:0]
DAC[1:0]
Blue Even
DAC[9:2]
DAC MSB
1
9
9
0000 0000
[7:2]
Blue Even
Not Used
DAC LSB
[1:0]
1
10
A
1000 0000
[7:0]
DAC[1:0]
Red Odd
DAC[9:2]
DAC MSB
1
11
B
0000 0000
[7:2]
Red Odd
Not Used
DAC LSB
[1:0]
1
12
C
1000 0000
[7:0]
DAC[1:0]
Green Odd
DAC[9:2]
DAC MSB
1
13
D
0000 0000
[7:2]
Not Used
Green Odd
[1:0]
1
14
E
1000 0000
[7:0]
DAC LSB
DAC[1:0]
Blue Odd
DAC[9:2]
DAC MSB
108
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
1
15
F
DEFAULT
(BINARY)
0000 0000
BITS
REGISTER
TITLE
[7:2]
Blue Odd
REGISTER DESCRIPTION
Not Used
DAC LSB
[1:0]
1
16
10
0100 0000
[7]
DAC[1:0]
Red Even
Not Used
Digital
1
17
11
0100 0000
[6:0]
Offset
[7]
Green Even
Digital Offset
Not Used
Digital
1
18
12
0100 0000
[6:0]
Offset
[7]
Blue Even
Digital Offset
Not Used
Digital
1
19
13
0100 0000
[6:0]
Offset
[7]
Red Odd
Digital Offset
Not Used
Digital Offset
[6:0]
1
20
14
0100 0000
[7]
Digital Offset
Green Odd
Not Used
Digital
1
21
15
0100 0000
[6:0]
Offset
[7]
Blue Odd
Digital Offset
Not Used
Digital
1
22
16
0110 0001
[6:0]
Offset
[7:0]
Red
Digital Offset
PGA setting during high gain portion of line
High
when dual gain mode is enabled
Gain
PGA
1
23
17
0110 0001
[7:0]
1
24
18
0110 0001
[7:0]
1
28
1C
0100 0000
[7]
Green High
Default = 97d for Gain = 1
PGA setting during high gain portion of line when dual gain mode is
enabled
Gain PGA
Default = 97d for Gain = 1
Blue High
PGA setting during high gain portion of line when dual gain mode is
enabled
Gain PGA
Default = 97d for Gain = 1
Red
Not Used
Channel
1
29
1D
0100 0000
[6:0]
Bimodal
[7]
Green
Offset Binary Digital Offset for Bimodal Correction
Not Used
Channel
[6:0]
1
30
1E
0100 0000
[7]
Bimodal
Blue
Offset Binary Digital Offset for Bimodal Correction
Not Used
Channel
[6:0]
1
31
1F
0000 0000
[3:0]
Bimodal
Page
Offset Binary Digital Offset for Bimodal Correction
Used to select desired page of registers being accessed.
Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
109
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 2
2
0
0
0000 0000
[7:3]
Not Used
[2]
DDAC Disable
0 AFE output includes DDAC (digital DAC offset)
correction
1 AFE output does not include DDAC correction
Calibration
[1:0]
Mode
Calibration Mode
00 Black Calibration Only
01 White and Black Calibration - Full/Binary White Cal
10 White and Black Calibration - Fine Tuning
11 Reserved
2
1
1
0000 0000
[7:0]
Calibration is active for this number of lines
Calibration #
Lines
0 Reserved
1d to 254d sets number of lines
255d sets infinite calibration
2
2
2
0001 0100
[5:4]
DDAC Scaling
00 Linear - 1 LSB adjust
01 Scaling = 1/2
10 Scaling = 1/4
11 Scaling = 1/8
[3:2]
ADAC Scaling
00 Reserved (No scaling)
Black Cal
01 Scaling = 1/2
Config
10 Scaling = 1/4
11 Scaling = 1/8
[1:0]
Number of Black Pixels
Number of pixels averaged by Black Loop
00 4 pixels
01 8 pixels
10 16 pixels
11 32 pixels
2
3
3
0100 0000
[7:0]
Black Target
Target level for Black calibration.
Range is 0 to 255 at 11 bit level or 0 to 8160 at 16 bit level
(default = 64 or 2048 at 16 bit level)
110
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
2
4
4
DEFAULT
(BINARY)
0100 0011
BITS
REGISTER
TITLE
[6:3]
REGISTER DESCRIPTION
White Loop Tolerance
White Cal success if |White Peak - White Target| < White Loop
Tolerance
0 to 15 at 10 bit level - Default = 8
[2:0]
Number of White Pixels
Number of White Pixels processed in moving window average to find
White Peak in line between White Pixels Start and White Pixels End
White Cal
000 4 pixels
Config
001 8 pixels
010 16 pixels
011 32 pixels - Default
2
5
5
1000 0000
[7:0]
White Target
White Target = 768d + [7:0] at 10 bit level
White Target
Range is 768d to 1023d at 10 bit level or 49152 to
65472 at 16 bit level
(Default = 896d or 57344 at 16 bit level)
2
6
6
0000 0100
[7:0]
AutoCLPIN
Start
2
7
7
0000 1100
[7:0]
AutoCLPIN
End
2
8
8
0001 0000
[7:0]
Black Loop
Start
2
9
9
0000 0000
[7:0]
Active/White
Pixels Start MSB
2
10
A
0001 0100
[7:0]
Active/White
Pixels Start LSB
2
11
B
0001 0000
[7:0]
Active/White
Pixels End MSB
# of pixels from SH interval End to Start of Black Pixel
Clamping (Default = 4d)
# of pixels from SH interval End to End of Black Pixel
Clamping (Default = 12d)
# of pixels from SH interval End to Start of Black Loop
Pixels (Default = 16d)
# of Pixels between SH Interval End and first Valid
Data Pixel (Default = 64d)
# of Pixels between SH Interval End and last Valid Data
Pixel (Default = 4096)
2
12
C
0000 0000
[7:0]
Active/White
Pixels End LSB
2
13
D
0001 0000
[7:0]
Line Length
MSB
# of Pixel Periods between beginning of consecutive SH Intervals
(Default = 4160)
2
14
E
0100 0000
[7:0]
Line Length
# of Pixel Periods between beginning of consecutive SH Intervals
LSB
2
15
F
0000 0000
[7:2]
Not Used
[1:0]
Multiplier factor for Active/White, LSPIX ON/OFF and
Line Length
Multiplier
Line Length Pixels Register Settings
00 1x
01 2x
10 4x
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
111
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
2
16
10
DEFAULT
(BINARY)
BITS
0000 0000
REGISTER
TITLE
REGISTER DESCRIPTION
[7]
Not Used
6:5
CIS - 2 Color Coefficient Select
Select which color PGA/DAC coefficients are used in 2 color CIS
sequences
00 Red and Green Lamp/Coefficients Used
01 Green and Blue Lamp/Coefficients Used
10 Red and Blue Lamp/Coefficients Used
11 Reserved
4:3
CCD/CIS Mode Select
00 Normal CCD Timing
01 CISa (2, 3, or 4 color sequences)
10 CISb (2 or 3 color sequences)
Line Mode
[1:0]
11 Reserved
# SH Intervals. How many different SH intervals in a sequence of lines
00 1 SH Interval - Same SH timing every line
01 2 SH Intervals - 2 different SH interval timings
10 3 SH Intervals - 3 different SH interval timings
11 4 SH Intervals - 4 different SH interval timings
SH States are allocated as follows:
1 Interval 1 = 0 to 30
2 Interval 1 = 0 to 14, Interval 2 = 15 to 30
3 Int 1 = 0 to 9, Int 2 = 10 to 19, Int 3 = 20 to 30
4 Int 1 = 0 to 6, Int 2 = 7 to 14, Int 3 = 15 to 22, Int 4 =23 to 30
2
17
11
0000 0000
[7:3]
Not Used
[2:0]
SH State Length values are multiplied by this factor
SH State
000 SH Timings x1
Length
001 SH Timings x2
Multiplier
010 SH Timings x4
011 SH Timings x8
100 SH Timings x16
101 to 111 Reserved
112
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
2
18
12
DEFAULT
(BINARY)
0000 0000
BITS
REGISTER
TITLE
[7:6]
REGISTER DESCRIPTION
Not Used
[5]
PHIA On Delay
0 Normal
1 PHIA begins 1 pixel period late
[4]
PHIA Off Delay
0 Normal
1 PHIA stops 1 pixel period late
[3]
PHIB On Delay
0 Normal
1 PHIB begins 1 pixel period late
PHIA/B/C
Delays
[2]
PHIB Off Delay
0 Normal
1 PHIB stops 1 pixel period late
[1]
PHIC On Delay
0 Normal
1 PHIC begins 1 pixel period late
[0]
PHIC Off Delay
0 Normal
1 PHIC stops 1 pixel period late
2
19
13
0000 0000
[7:4]
Not Used
[3]
RS On Delay
0 Normal
1 RS begins 1 pixel period late
[2]
RS Off Delay
0 Normal
RS/CP Delays
[1]
1 RS stops 1 pixel period late
CP On Delay
0 Normal
1 CP begins 1 pixel period late
[0]
CP Off Delay
0 Normal
1 CP stops 1 pixel period late
2
20 to
23
14 to
17
Reserved
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
113
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
2
24
18
DEFAULT
(BINARY)
1111 1000
BITS
REGISTER
TITLE
[7:5]
REGISTER DESCRIPTION
Master PLL Range Setting for PLL1 and PLL2 when
Autorange is off. Set to 111.
[4:3]
PLL1 Charge Pump Current Control
PLL Control 1
[2:0]
Default = 11
PLL1 Filter Bandwidth Control
Default = 000
2
25
19
0001 1000
[7:5]
Reserved
Default = 000
[4:3]
PLL2 Charge Pump Current Control
Default = 11
PLL Control 2
[2:0]
Set to 00 when using SSCG.
PLL2 Filter Bandwidth Control
Default = 000
Set to 111 when using SSCG.
2
26
1A
0000 0000
[7:6]
Spread Rate Multiplier
(Increases modulation frequency in low pixel frequency applications)
00 1x - Default
01 2x
10 4x (Page 2, Register D,E max = 32,768)
11 Reserved
[5]
SSCG Spread Boost
0 Normal, PLL divide step is 1/28
1 Boost, PLL divide step is 1/56. Narrower and cleaner spread for 1ch
and 2ch modes, but limits max pixel freq to 25 MHz.
[4]
SSCG Spread Gain
0 Spread widths as specified in [3:2]
1 Spread widths are 2x [3:2] settings
[3:2]
SSCG Spread Width (Fmod = Fcenter+/- Width/2)
SSCG Control
1
00 5%
01 2.5%
10 1.25%
11 0.625%
[1]
SSCG SH Sync Enable
0 Spread unsynched, once SSCG Enable is set, SSCG wil begin
immediately.
1 Spread synched to SH interval, once SSCG Enable
is set, the SSCG will begin at the first SH Interval.
[0]
SSCG Enable
0 Spread Disabled
1 Spread Enabled
114
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
2
27
1B
DEFAULT
(BINARY)
0000 0010
REGISTER
TITLE
BITS
[7]
REGISTER DESCRIPTION
Load SSCG state machine
(SSCG Enable 0->1 also performs this function)
0 Normal
1 Load state machine (self clearing)
[6]
FIFO Reset at SH_R
0 FIFO is only reset when SSCG started
1 FIFO is reset at SH_R. Only useful in Slave Mode with Spread LVDS
Only set. Ensures that FIFO counters are centered if SH_R period is
consistenly shorter or longer than Line Length settings.
[5]
Spread Waveform Reset at SH_R
0 Spread waveform not reset by SH_R
1 Spread waveform reset by SH_R
[4]
Override PLL2 Lock Detector
0 PLL2 Lock Detector Normal
1 Force PLL2 Lock Detect = 1. Set to 1 when using
SSCG.
[3]
SSCG Control
2
Override PLL1 Lock Detector
0 PLL1 Lock Detector Normal
1 Force PLL1 Lock Detect = 1. Useful only if using a large multiplication
factor and a lot of jitter is present in the source clock.
[2]
Spread MaxRate
0 Spread Normal
1 Force Spreading to highest modulation frequency instead of tied to
Line Length Setting.
[1:0]
PLL Mode Select
11 Spread All System Clocks, No Multiplication
10 PLLs and SSCG Disabled - Default
01 Spread All System Clocks, Multiplication Enabled
00 Spread Output Clocks Only, Mutiplication Enabled
2
28
1C
0000 0000
Clock Mult M
Multiplying PLL. Fout = Fin x M/N M = mmmmmmmm + 1 (1 to 256)
2
29
1D
0000 0000
Clock Mult N
Multiplying PLL. Fout = Fin x M/N N = nnnnnnnn + 1 (1 to 256)
2
30
1E
0000 0000
[7]
FIFO Reset
0 FIFO normal operating
1 Force reset of FIFO (self clearing)
[6:0]
SSCG Control
3
FIFO and Spread Waveform SH_R Reset Holdoff
Delay reset of FIFO and Spread Waveform from 0 to
127 ADC clock cycles after the internal synchronized SH_R. To allow
this event to occur during SH Interval after all valid pixels in the pipeline
have been processed.
2
31
1F
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
115
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 3
3
0
0
0000 0000
[7:0]
SH State 0
Length
Sets length of this SH interval state
3
1
1
0000 0000
[7:0]
SH State 1
Length
Sets length of this SH interval state
3
2
2
0000 0000
[7:0]
SH State 2
Length
Sets length of this SH interval state
3
3
3
0000 0000
[7:0]
SH State 3
Length
Sets length of this SH interval state
3
4
4
0000 0000
[7:0]
SH State 4
Length
Sets length of this SH interval state
3
5
5
0000 0000
[7:0]
SH State 5
Length
Sets length of this SH interval state
3
6
6
0000 0000
[7:0]
SH State 6
Length
Sets length of this SH interval state
3
7
7
0000 0000
[7:0]
SH State 7
Length
Sets length of this SH interval state
3
8
8
0000 0000
[7:0]
SH State 8
Length
Sets length of this SH interval state
3
9
9
0000 0000
[7:0]
SH State 9
Length
Sets length of this SH interval state
3
10
A
0000 0000
[7:0]
SH State 10
Length
Sets length of this SH interval state
3
11
B
0000 0000
[7:0]
SH State 11
Length
Sets length of this SH interval state
3
12
C
0000 0000
[7:0]
SH State 12
Length
Sets length of this SH interval state
3
13
D
0000 0000
[7:0]
SH State 13
Length
Sets length of this SH interval state
3
14
E
0000 0000
[7:0]
SH State 14
Length
Sets length of this SH interval state
3
15
F
0000 0000
[7:0]
SH State 15
Length
Sets length of this SH interval state
3
16
10
0000 0000
[7:0]
SH State 16
Length
Sets length of this SH interval state
3
17
11
0000 0000
[7:0]
SH State 17
Length
Sets length of this SH interval state
3
18
12
0000 0000
[7:0]
SH State 18
Length
Sets length of this SH interval state
3
19
13
0000 0000
[7:0]
SH State 19
Length
Sets length of this SH interval state
3
20
14
0000 0000
[7:0]
SH State 20
Length
Sets length of this SH interval state
3
21
15
0000 0000
[7:0]
SH State 21
Length
Sets length of this SH interval state
3
22
16
0000 0000
[7:0]
SH State 22
Length
Sets length of this SH interval state
3
23
17
0000 0000
[7:0]
SH State 23
Length
Sets length of this SH interval state
3
24
18
0000 0000
[7:0]
SH State 24
Length
Sets length of this SH interval state
3
25
19
0000 0000
[7:0]
SH State 25
Length
Sets length of this SH interval state
3
26
1A
0000 0000
[7:0]
SH State 26
Length
Sets length of this SH interval state
116
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
3
27
1B
0000 0000
[7:0]
SH State 27
Length
Sets length of this SH interval state
3
28
1C
0000 0000
[7:0]
SH State 28
Length
Sets length of this SH interval state
3
29
1D
0000 0000
[7:0]
SH State 29
Length
Sets length of this SH interval state
3
30
1E
0000 0000
[7:0]
SH State 30
Length
Sets length of this SH interval state
3
31
1F
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
117
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 4
4
0
0
0000 0000
Controls whether these outputs are 1 or 0 during this
SH interval state
[7]
RS 0 = Low, 1 = High 1 0 = Low, 1 = High
[6]
CP 0 = Low, 1 = High
[5]
SH State 0
PHIA2 0 = Low, 1 = High
[4]
PHI, RS, CP
PHIA1 0 = Low, 1 = High
[3]
PHIB2 0 = Low, 1 = High
[2]
PHIB1 0 = Low, 1 = High
[1]
PHIC2 0 = Low, 1 = High
[0]
PHIC1 0 = Low, 1 = High
4
1
1
0000 0000
[7:0]
SH State 1
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
2
2
0000 0000
[7:0]
SH State 2
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
3
3
0000 0000
[7:0]
SH State 3
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
4
4
0000 0000
[7:0]
SH State 4
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
5
5
0000 0000
[7:0]
SH State 5
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
6
6
0000 0000
[7:0]
SH State 6
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
7
7
0000 0000
[7:0]
SH State 7
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
8
8
0000 0000
[7:0]
SH State 8
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
9
9
0000 0000
[7:0]
SH State 9
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
10
A
0000 0000
[7:0]
SH State 10
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
11
B
0000 0000
[7:0]
SH State 11
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
12
C
0000 0000
[7:0]
SH State 12
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
13
D
0000 0000
[7:0]
SH State 13
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
14
E
0000 0000
[7:0]
SH State 14
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
15
F
0000 0000
[7:0]
SH State 15
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
16
10
0000 0000
[7:0]
SH State 16
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
17
11
0000 0000
[7:0]
SH State 17
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
18
12
0000 0000
[7:0]
SH State 18
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
19
13
0000 0000
[7:0]
SH State 19
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
20
14
0000 0000
[7:0]
SH State 20
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
21
15
0000 0000
[7:0]
SH State 21
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
118
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
4
22
16
0000 0000
[7:0]
SH State 22
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
23
17
0000 0000
[7:0]
SH State 23
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
24
18
0000 0000
[7:0]
SH State 24
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
25
19
0000 0000
[7:0]
SH State 25
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
26
1A
0000 0000
[7:0]
SH State 26
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
27
1B
0000 0000
[7:0]
SH State 27
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
28
1C
0000 0000
[7:0]
SH State 28
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
29
1D
0000 0000
[7:0]
SH State 29
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
30
1E
0000 0000
[7:0]
SH State 30
PHI, RS, CP
Controls whether these outputs are 1 or 0 during this SH interval state
4
31
1F
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
119
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 5
5
0
0
0000 0000
[7:5]
Not Used
Controls whether these outputs are 1 or 0 during this
SH interval state
[4]
SH State 0
SH5 0 = Low, 1 = High
[3]
SH1-SH5
SH4 0 = Low, 1 = High
[2]
SH3 0 = Low, 1 = High
[1]
SH2 0 = Low, 1 = High
[0]
SH1 0 = Low, 1 = High
5
1
1
0000 0000
[4:0]
SH State 1
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
2
2
0000 0000
[4:0]
SH State 2
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
3
3
0000 0000
[4:0]
SH State 3
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
4
4
0000 0000
[4:0]
SH State 4
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
5
5
0000 0000
[4:0]
SH State 5
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
6
6
0000 0000
[4:0]
SH State 6
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
7
7
0000 0000
[4:0]
SH State 7
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
8
8
0000 0000
[4:0]
SH State 8
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
9
9
0000 0000
[4:0]
SH State 9
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
10
A
0000 0000
[4:0]
SH State 10
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
11
B
0000 0000
[4:0]
SH State 11
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
12
C
0000 0000
[4:0]
SH State 12
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
13
D
0000 0000
[4:0]
SH State 13
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
14
E
0000 0000
[4:0]
SH State 14
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
15
F
0000 0000
[4:0]
SH State 15
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
16
10
0000 0000
[4:0]
SH State 16
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
17
11
0000 0000
[4:0]
SH State 17
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
18
12
0000 0000
[4:0]
SH State 18
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
19
13
0000 0000
[4:0]
SH State 19
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
20
14
0000 0000
[4:0]
SH State 20
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
21
15
0000 0000
[4:0]
SH State 21
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
22
16
0000 0000
[4:0]
SH State 22
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
120
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
5
23
17
0000 0000
[4:0]
SH State 23
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
24
18
0000 0000
[4:0]
SH State 24
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
25
19
0000 0000
[4:0]
SH State 25
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
26
1A
0000 0000
[4:0]
SH State 26
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
27
1B
0000 0000
[4:0]
SH State 27
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
28
1C
0000 0000
[4:0]
SH State 28
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
29
1D
0000 0000
[4:0]
SH State 29
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
30
1E
0000 0000
[4:0]
SH State 30
SH1-SH5
Controls whether these outputs are 1 or 0 during this SH interval state
5
31
1F
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
121
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 6
6
0
0
0000 0000
[1:0]
PHIA0
Upper 2 MSb (first shifted out of HSTG)
6
1
1
0000 0000
[7:0]
PHIA1
Next 8
6
2
2
0000 0000
[7:0]
PHIA2
Next 8
6
3
3
0000 0000
[7:0]
PHIA3
Next 8
6
4
4
0000 0000
[7:0]
PHIA4
Next 8
6
5
5
0000 0000
[7:0]
PHIA5
Lower 8 LSb (last shifted out of HSTG)
6
6
6
0000 0000
[1:0]
PHIB0
Upper 2 MSb (first shifted out of HSTG)
6
7
7
0000 0000
[7:0]
PHIB1
Next 8
6
8
8
0000 0000
[7:0]
PHIB2
Next 8
6
9
9
0000 0000
[7:0]
PHIB3
Next 8
6
10
A
0000 0000
[7:0]
PHIB4
Next 8
6
11
B
0000 0000
[7:0]
PHIB5
Lower 8 LSb (last shifted out of HSTG)
6
12
C
0000 0000
[1:0]
PHIC0
Upper 2 MSb (first shifted out of HSTG)
6
13
D
0000 0000
[7:0]
PHIC1
Next 8
6
14
E
0000 0000
[7:0]
PHIC2
Next 8
6
15
F
0000 0000
[7:0]
PHIC3
Next 8
6
16
10
0000 0000
[7:0]
PHIC4
Next 8
6
17
11
0000 0000
[7:0]
PHIC5
Lower 8 LSb (last shifted out of HSTG)
6
18
12
0000 0000
[1:0]
RS0
Upper 2 MSb (first shifted out of HSTG)
6
19
13
0000 0000
[7:0]
RS1
Next 8
6
20
14
0000 0000
[7:0]
RS2
Next 8
6
21
15
0000 0000
[7:0]
RS3
Next 8
6
22
16
0000 0000
[7:0]
RS4
Next 8
6
23
17
0000 0000
[7:0]
RS5
Lower 8 LSb (last shifted out of HSTG)
6
24
18
0000 0000
[1:0]
CP0
Upper 2 MSb (first shifted out of HSTG)
6
25
19
0000 0000
[7:0]
CP1
Next 8
6
26
1A
0000 0000
[7:0]
CP2
Next 8
6
27
1B
0000 0000
[7:0]
CP3
Next 8
6
28
1C
0000 0000
[7:0]
CP4
Next 8
6
29
1D
0000 0000
[7:0]
CP5
Lower 8 LSb (last shifted out of HSTG)
6
30
1E
0000 0000
[7:5]
Not Used
Allows high speed generators to operate at 1/2 normal rate. So the full
sequence will be clocked out over 2 pixels instead of 1 pixel
[4]
PHIA 0 = Normal Rate, 1 = 1/2
[3]
HSPIX Rate
Rate PHIB 0 = Normal Rate, 1 = 1/2
[2]
Select
Rate PHIC 0 = Normal Rate, 1 = 1/2
[1]
Rate RS 0 = Normal Rate, 1 = 1/2
[0]
6
122
31
1F
[3:0]
Rate CP 0 = Normal Rate, 1 = 1/2 Rate
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
MSB of Pixel count where this signal goes low to high
Range is 0 to 65535
REGISTER DESCRIPTION
PAGE 7
7
0
0
0000 0000
[7:0]
SH1
PIXEL ON
MSB
1
1
0000 0000
[7:0]
SH1
PIXEL ON
LSB
LSB of Pixel count where this signal goes low to high
7
7
2
2
0000 0000
[7:0]
SH1
PIXEL OFF
MSB
MSB of Pixel count where this signal goes high to low
Range is 0 to 65535
3
3
0000 0000
[7:0]
SH1
PIXEL OFF
LSB
LSB of Pixel count where this signal goes high to low
7
7
4
4
0000 0000
[7:0]
SH2
PIXEL ON
MSB
MSB of Pixel count where this signal goes low to high
Range is 0 to 65535
5
5
0000 0000
[7:0]
SH2
PIXEL ON
LSB
LSB of Pixel count where this signal goes low to high
7
7
6
6
0000 0000
[7:0]
SH2
PIXEL OFF
MSB
MSB of Pixel count where this signal goes high to low
Range is 0 to 65535
7
7
0000 0000
[7:0]
SH2
PIXEL OFF
LSB
LSB of Pixel count where this signal goes high to low
7
7
8
8
0000 0000
[7:0]
SH3
PIXEL ON
MSB
MSB of Pixel count where this signal goes low to high
Range is 0 to 65535
9
9
0000 0000
[7:0]
SH3
PIXEL ON
LSB
LSB of Pixel count where this signal goes low to high
7
7
10
A
0000 0000
[7:0]
SH3
PIXEL OFF
MSB
MSB of Pixel count where this signal goes high to low
Range is 0 to 65535
11
B
0000 0000
[7:0]
SH3
PIXEL OFF
LSB
LSB of Pixel count where this signal goes high to low
7
7
12
C
0000 0000
[7:0]
SH4
PIXEL ON
MSB
MSB of Pixel count where this signal goes low to high
Range is 0 to 65535
13
D
0000 0000
[7:0]
SH4
PIXEL ON
LSB
LSB of Pixel count where this signal goes low to high
7
7
14
E
0000 0000
[7:0]
SH4
PIXEL OFF
MSB
MSB of Pixel count where this signal goes high to low
Range is 0 to 65535
15
F
0000 0000
[7:0]
SH4
PIXEL OFF
LSB
LSB of Pixel count where this signal goes high to low
7
7
16
10
0000 0000
[7:0]
SH5
PIXEL ON
MSB
MSB of Pixel count where this signal goes low to high
Range is 0 to 65535
17
11
0000 0000
[7:0]
SH5
PIXEL ON
LSB
LSB of Pixel count where this signal goes low to high
7
7
18
12
0000 0000
[7:0]
SH5
PIXEL OFF
MSB
MSB of Pixel count where this signal goes high to low
Range is 0 to 65535
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
123
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
SH5
PIXEL OFF
LSB
7
19
13
0000 0000
[7:0]
7
20
14
0000 0000
[7:4]
REGISTER DESCRIPTION
LSB of Pixel count where this signal goes high to low
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
PHIA Polarity
[2]
7
21
15
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
PHIB Polarity
[2]
7
22
16
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
PHIC Polarity
[2]
7
23
17
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
RS Polarity
[2]
7
24
18
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
CP Polarity
[2]
124
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
7
25
19
DEFAULT
(BINARY)
0000 0000
REGISTER
TITLE
BITS
[7:4]
REGISTER DESCRIPTION
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
SH1 Polarity
[2]
7
26
1A
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
SH2 Polarity
[2]
7
27
1B
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
SH3 Polarity
[2]
7
28
1C
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
SH4 Polarity
[2]
7
29
1D
0000 0000
Override
1 Signal Inverted
Polarity Override Line 2
[1]
Polarity Override Line 1
[0]
Polarity Override Line 0
[7:4]
Not Used
[3]
Polarity Override Line 3
0 Signal Not Inverted
SH5 Polarity
[2]
Override
[1]
30
1E
7
31
1F
Polarity Override Line 2
Polarity Override Line 1
[0]
7
1 Signal Inverted
Polarity Override Line 0
0000 0000
Reserved
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
125
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
PAGE 8
8
0
0
0000 0000
[7]
Not Used
[6]
PHIA1 Active (0 = Tristate, 1* = Active)
[5]
PHIA1 Source (0* = Timing, 1 = DC logic 1)
[4]
PHIA1,
PHIA1 Polarity (0* = Not Inverted, 1 = Inverted)
PHIA2,
[3]
Polarity /
Not Used
State
8
1
1
0000 0000
[2]
PHIA2 Active (0 = Tristate, 1* = Active)
[1]
PHIA2 Source (0* = Timing, 1 = DC logic 1)
[0]
PHIA2 Polarity (0* = Not Inverted, 1 = Inverted)
[7]
Not Used
[6]
PHIB1 Active (0 = Tristate, 1* = Active) PHIB1
[5]
Source (0* = Timing, 1 = DC logic 1) PHIB1
[4]
PHIB1,
[3]
Polarity /
Polarity (0* = Not Inverted, 1 = Inverted)
PHIB2,
Not Used
State
8
2
2
0000 0000
[2]
PHIB2 Active (0 = Tristate, 1* = Active)
[1]
PHIB2 Source (0* = Timing, 1 = DC logic 1)
[0]
PHIB2 Polarity (0* = Not Inverted, 1 = Inverted)
[7]
Not Used
[6]
PHIC1 Active (0 = Tristate, 1* = Active)
[5]
PHIC1 Source (0* = Timing, 1 = DC logic 1)
[4]
PHIC1
PHIC1 Polarity (0* = Not Inverted, 1 = Inverted)
PHIC2
[3]
Polarity /
Not Used
State
126
[2]
PHIC2 Active (0 = Tristate, 1* = Active)
[1]
PHIC2 Source (0* = Timing, 1 = DC logic 1)
[0]
PHIC2 Polarity (0* = Not Inverted, 1 = Inverted)
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
3
3
DEFAULT
(BINARY)
0000 0000
BITS
REGISTER
TITLE
REGISTER DESCRIPTION
[7]
Not Used
[6]
RS Active (0 = Tristate, 1* = Active)
[5]
RS Source (0* = Timing, 1 = DC logic 1)
[4]
RS Polarity (0* = Not Inverted, 1 = Inverted)
RS, CP
[3]
Polarity /
Not Used
State
8
4
4
0000 0000
[2]
CP Active (0 = Tristate, 1* = Active)
[1]
CP Source (0* = Timing, 1 = DC logic 1)
[0]
CP Polarity (0* = Not Inverted, 1 = Inverted)
[7]
Not Used
[6]
SH1 Active (0 = Tristate, 1* = Active)
[5]
SH1 Source (0* = Timing, 1 = DC logic 1)
[4]
SH1, SH2
SH1 Polarity (0* = Not Inverted, 1 = Inverted)
Polarity /
[3]
8
5
5
0000 0000
State
Not Used
[2]
SH2 Active (0 = Tristate, 1* = Active)
[1]
SH2 Source (0* = Timing, 1 = DC logic 1)
[0]
SH2 Polarity (0* = Not Inverted, 1 = Inverted)
[7]
Not Used
[6]
SH3 Active (0 = Tristate, 1* = Active)
[5]
SH3 Source (0* = Timing, 1 = DC logic 1)
[4]
SH3, SH4
SH3 Polarity (0* = Not Inverted, 1 = Inverted)
Polarity /
[3]
8
6
6
0000 0000
State
Not Used
[2]
SH4 Active (0 = Tristate, 1* = Active)
[1]
SH4 Source (0* = Timing, 1 = DC logic 1)
[0]
SH4 Polarity (0* = Not Inverted, 1 = Inverted)
[7]
Not Used
[6]
SH5 Active (0 = Tristate, 1* = Active)
SH5
[5]
Polarity /
SH5 Source (0* = Timing, 1 = DC logic 1)
State
[4]
SH5 Polarity (0* = Not Inverted, 1 = Inverted)
[3:0]
8
7
7
0000 0000
[7:0]
Not Used
Reserved
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
127
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
8
8
DEFAULT
(BINARY)
BITS
0010 0000
REGISTER
TITLE
[7]
REGISTER DESCRIPTION
LVDS TXCLK Disable
0 LVDS TXCLK Enabled - Default
1 LVDS TXCLK Disabled
[6]
CMOS CLKOUT Disable
0 CMOS CLKOUT Enabled - Default
1 CMOS CLKOUT Disabled
[5:4]
LVDS Drive Adjust
00 Reduce 100mV
01 Reduce 50 mV
10 Default
11 Increase 50 mV
[3]
LVDS
Configuration
LVDS TXCLK Delay
0 TXCLK timing normal
1 TXCLK delayed
[2]
BOL CB Bit Latency
0 Normal Compensation
1 No latency compensation
[1]
LVDS Disable TXOUT0
0 TXOUT0 LVDS Pair Enabled
1 TXOUT0 LVDS Pair Disabled
[0]
LVDS Mode Select
0 LM98714
1 Flexible CB Mapping
128
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
9
9
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
0000 0000
REGISTER DESCRIPTION
Selects CB Bit Mapping
[7:4]
CB1 Mapping
0000 CBO1 from LM98714 definition
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
CB1/CB0 CB
Mapping
[3:0]
CB0 Mapping
0000 CBO0 from LM98714 definition
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
129
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
10
A
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
0000 0000
REGISTER DESCRIPTION
Selects CB Bit Mapping
[7:4]
CB3 Mapping
0000 CBO30 from LM98714 definition
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
[3:0]
CB3/CB2 CB
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
Mapping
1111 CLP Pixels - High for pixels where the input CLP switch is closed
CB2 Mapping
0000 CBO2 from LM98714 definition
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if
TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
130
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
11
B
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
0000 0000
REGISTER DESCRIPTION
Selects CB Bit Mapping
[7:4]
D2 Mapping
0000 D2 (Normal output for particular bit position)
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
[3:0]
D2/CB4 CB
1110 Active White Loop Pixels - High for pixels processed by the White
Loop
Mapping
1111 CLP Pixels - High for pixels where the input CLP switch is closed
CB4 Mapping
0000 CBO4 from LM98714 definition
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
131
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
12
C
DEFAULT
(BINARY)
BITS
REGISTER
TITLE
0000 0000
REGISTER DESCRIPTION
Selects CB Bit Mapping
[7:4]
D4 Mapping
0000 D4 (Normal output for particular bit position)
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
D4/D3 CB
1111 CLP Pixels - High for pixels where the input CLP switch is closed
Mapping
[3:0]
D3 Mapping
0000 D4 (Normal output for particular bit position)
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
132
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
13
D
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
REGISTER DESCRIPTION
0000 0000
[7:4]
Not Used
Selects CB Bit Mapping
[3:0]
D5 Mapping
0000 D5 (Normal output for particular bit position)
0001 CBO0 from LM98714 definition
0010 CBO1 from LM98714 definition
0011 CBO2 from LM98714 definition
0100 CBO3 from LM98714 definition
0101 CBO4 from LM98714 definition
0110 R - High for a red channel pixel
0111 G - High for a green channel pixel
D5 CB
Mapping
1000 B - High for a blue channel pixel
1001 Parity - 21 bit if TXOUT0 enabled, 14 bit if TXOUT0 disabled
1010 Ping - High for pixels processed by the Ping section of a channel,
low for Pong
1011 Line#lsb - Line = 0 to 3 for lines 0 to 3 in multiline sequences
1100 Line#msb
1101 Black Loop Pixels - High for pixels processed by the Black Loop
1110 ActiveWhite Loop Pixels - High for pixels processed by the White
Loop
1111 CLP Pixels - High for pixels where the input CLP switch is closed
8
14
E
0000 0000
Select level of CLK outputs during register updating (UNLOCK state)
These can be modified during LOCK state to allow user to set up chip for
what happens during the next UNLOCK state
[7]
PHIA1 Unlock State
0 = Low, 1 = High
[6]
PHIA2 Unlock State
0 = Low, 1 = High
[5]
Unlock State
Output Values
PHIB1 Unlock State
0 = Low, 1 = High
PHIA, PHIB,
[4]
PHIC, RS, CP
PHIB2 Unlock State
0 = Low, 1 = High
[3]
PHIC1 Unlock State
0 = Low, 1 = High
[2]
PHIC2 Unlock State
0 = Low, 1 = High
[1]
RS Unlock State
0 = Low, 1 = High
[0]
CP Unlock State
0 = Low, 1 = High
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
133
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
15
F
DEFAULT
(BINARY)
0000 0000
BITS
REGISTER
TITLE
[7:5]
REGISTER DESCRIPTION
Not Used
Select level of CLK outputs during register updating (UNLOCK state)
These can be modified during LOCK state to allow user to set up chip for
what happens during the next UNLOCK state
[4]
SH1 Unlock State
Unlock State
0 = Low, 1 = High
Output Values
[3]
SH1, SH2,
SH2 Unlock State
SH3, SH4, SH5 0 = Low, 1 = High
[2]
SH3 Unlock State
0 = Low, 1 = High
[1]
SH4 Unlock State
0 = Low, 1 = High
[0]
SH5 Unlock State
0 = Low, 1 = High
8
16 to
17
10 to
11
0000 0000
8
18
12
0000 0000
Reserved
[7]
Reserved
Inhibit Scrambling Individual LVDS Bits if 1.
[6]
8
19
13
0000 0000
Do Not Scramble LVDS[6]
[5]
Scrambler
Do Not Scramble LVDS[5]
[4]
Inhibit 0
Do Not Scramble LVDS[4]
[3]
Do Not Scramble LVDS[3]
[2]
Do Not Scramble LVDS[2]
[1]
Do Not Scramble LVDS[1]
[0]
Do Not Scramble LVDS[0]
[7]
Reserved
Inhibit Scrambling Individual LVDS Bits if 1.
[6]
8
20
14
0000 0000
Do Not Scramble LVDS[13]
[5]
Scrambler
Do Not Scramble LVDS[12]
[4]
Inhibit 1
Do Not Scramble LVDS[11]
[3]
Do Not Scramble LVDS[10]
[2]
Do Not Scramble LVDS[9]
[1]
Do Not Scramble LVDS[8]
[0]
Do Not Scramble LVDS[7]
[7]
Reserved
Inhibit Scrambling Individual LVDS Bits if 1.
[6]
134
Do Not Scramble LVDS[20]
[5]
Scrambler
Do Not Scramble LVDS[19]
[4]
Inhibit 2
Do Not Scramble LVDS[18]
[3]
Do Not Scramble LVDS[17]
[2]
Do Not Scramble LVDS[16]
[1]
Do Not Scramble LVDS[15]
[0]
Do Not Scramble LVDS[14]
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
Table 18. Register Definitions (continued)
PAGE ADDR ADDR
(DEC) (DEC) (HEX)
8
21 to
30
15 to
1E
8
31
1F
DEFAULT
(BINARY)
REGISTER
TITLE
BITS
0000 0000
REGISTER DESCRIPTION
Reserved
[3:0]
Page Register
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
135
LM98725
SNAS474H – APRIL 2009 – REVISED MARCH 2015
www.ti.com
8 Layout
8.1 Layout Example
U1A
74AC04/SO
TP1
R1 150
2
1
1
U1B
TEST POINT
TP2
74AC04/SO
R2 4.7
U1C
4
74AC04/SO
3
1
TEST POINT
R3 4.7
6
5
U1D
74AC04/SO
R4 4.7
8
9
TP3
U1E
74AC04/SO
1
R5 10
10
TEST POINT
11
U1F
74AC04/SO
R6 10
12
13
U2A
74AC04/SO
R7 10
2
1
U2B
74AC04/SO
U3
R8 4.7
U2C
U5
12
13
14
15
16
17
18
19
20
21
22
+12V
C1
47uF/25V
U7
4
74AC04/SO
3
1
2
3
R10 4.7
PHI-TG2
PHI-TG1
PHI-1
PHI-2
NC
PHI-2
NC
PHI-SEL
V0D
VOUT1
VOUT2
GND
PHI-TG3
PHI-2
PHI-1
NC
NC
PHI-1
PHI-CLB
PHI-R
GND
VOUT3
11
10
9
8
7
6
5
4
3
2
1
6
5
U2D
8
CE
CAL
RESET#
SH_R
9
74AC04/SO
R13 47
10
11
U2F
SDIO
SCLK
SEN#
74AC04/SO
R14 47
12
13
12
13
14
15
16
17
18
19
20
21
VA
C2
0.1u
VREFB
VREFT
TP4
R18
100
R20
Q1
2SC945
100
C4
Q2
R21 2SC945
100
C5
47uF/25V
Q3
R22 2SC945
100
R24
2k
C6
tbd
C7
tbd
C8
tbd
22
23
24
25
26
27
28
VC
VD
DGND
VA
AGND
VA
VREFB
VREFT
VA
AGND
VCLP
VA
IBIAS
D0_TXOUT0D1_TXOUT0+
D2_TXOUT1D3_TXOUT1+
D4_TXOUT2D5_TXOUT2+
D6_TXCLKD7_TXCLK+
AGND
OSr
AGND
OSg
AGND
OSb
CPOFILT2
INCLKINCLK+
DVB
CPOFILT1
DGND
56
55
54
53
52
51
50
49
48
47
46
45
9
10
11
14
44
43
42
Pin 15
Pin 18
VA
VA
VC
VD
15
41
40
39
38
37
36
35
34
16
C14
0.1uF
Pin 21
17
22
33
32
31
30
29
12
20
7
13
18
19
21
C10
0.1uF
Pin 44
VD
C15
0.1uF
RXCLKIN-
R16
100
RXCLKIN+
PDN
LVDSVCC
PLLVCC
LVDSGND
LVDSGND
LVDSGND
PLLGND
PLLGND
RXCLKOUT
24
26
27
29
30
31
33
34
35
37
39
40
41
43
45
46
47
1
2
4
5
23
INCLKINCLK+
VA
C15
0.1uF
RXIN2+
RXOUT0
RXOUT1
RXOUT2
RXOUT3
RXOUT4
RXOUT5
RXOUT6
RXOUT7
RXOUT8
RXOUT9
RXOUT10
RXOUT11
RXOUT12
RXOUT13
RXOUT14
RXOUT15
RXOUT16
RXOUT17
RXOUT18
RXOUT19
RXOUT20
0.1
VREFB
C13
0.1uF
RXIN1+
RXIN2-
R15
100
R26
100
VA
RXIN0+
RXIN1-
R12
100
TP5 TP6 TP7
Pin 12
DS90CR218A/SO
RXIN0-
R9
100
VC
C20
R25
2k
1
R23
2k
R19
100
47uF/25V
VCLP
1
CE
CAL
RESET
SH_R
SDI
SDO
SCLK
SEN
1
C3
47uF/25V
R27
9.0k 1%
1
R17
100
4
5
6
7
8
9
10
11
8
SH5
SH4
PHIB2
PHIB1
VC
DGND
PHIA2
PHIA1
CP
RS
SH3
CLKOUT/SH2
74AC04/SO
R11 4.7
U2E
LM98725
PHIC2
PHIC1
SH1
C16
0.1uF
VREFT
Pin 52
VC
VCLP
C17
0.1uF
C18
0.1uF
C11
4.7uF
C19
0.1uF
J1
Install 100 Ohm for LVDS INCLK.
Install solder jumper for CMOS
INCLK
C12
0.1uF
Figure 68. Example Application Circuit
136
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
LM98725
www.ti.com
SNAS474H – APRIL 2009 – REVISED MARCH 2015
9 Device and Documentation Support
9.1 Trademarks
All trademarks are the property of their respective owners.
9.2 Device Support
For additional information, see Texas Instruments' E2E community resources: http://e2e.ti.com.
9.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
9.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: LM98725
137
PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM98725CCMT/NOPB
ACTIVE
TSSOP
DGG
56
34
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 70
LM98725CCMT
LM98725CCMTX/NOPB
ACTIVE
TSSOP
DGG
56
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
0 to 70
LM98725CCMT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Mar-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM98725CCMTX/NOPB
Package Package Pins
Type Drawing
TSSOP
DGG
56
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
14.5
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Mar-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM98725CCMTX/NOPB
TSSOP
DGG
56
1000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DGG0056A
TSSOP - 1.2 mm max height
SCALE 1.200
SMALL OUTLINE PACKAGE
C
8.3
TYP
7.9
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
54X 0.5
56
1
14.1
13.9
NOTE 3
2X
13.5
28
B
6.2
6.0
29
56X
0.27
0.17
0.08
1.2 MAX
C A
B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4222167/A 07/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05)
TYP
SYMM
28
29
(7.5)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222167/A 07/2015
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05) TYP
SYMM
29
28
(7.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4222167/A 07/2015
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated