[ Obsolete product ] Agilent has a new name Keysight Technologies. Keysight Technologies Inc. is the world's leading electronic measurement company, transforming today's measurement experience through innovations in wireless, modular, and software solutions. With its HP and Agilent legacy, Keysight delivers solutions in wireless communications, aerospace and defense and semiconductor markets with world-class platforms, software and consistent measurement science. Alldatasheet.com Agilent HFBR-7924 and HFBR-7924E/H/EH Four-Channel Pluggable Parallel Fiber Optic Transceiver Part of the Agilent METRAK family Data Sheet Description The HFBR-7924 transceiver is a high performance fiber optic module for parallel optical data communication applications. It incorporates 8 independent data channels (4 for transmit and 4 for receive) operating from 1 to 2.7 Gb/s per channel providing a cost effective solution for very short reach applications requiring 10.8 Gb/s aggregate bandwidth. The module is designed to operate on multimode fiber systems at a nominal wavelength of 850 nm. It incorporates high performance, highly reliable, short wavelength optical devices coupled with proven circuit technology to provide long life and consistent service. The HFBR-7924 transceiver module incorporates a 4 channel VCSEL (Vertical Cavity Surface Emitting Laser) array together with a custom 4 channel laser driver integrated circuit providing IEC-825 and CDRH Class 1M laser eye safety. It also contains a 4 channel PIN photodiode array coupled with a custom preamplifier / post amplifier integrated circuit. Operating on 3.3 V power supply this module provides LVTTL/LVCMOS control interfaces and CML compatible high speed data lines which simplify external circuitry. The transceiver is housed in MTP®/ MPO receptacled package with integral finned heatsink. Electrical connections to the device are achieved by means of a pluggable 10x10 connector array. Ordering Information The HFBR-7924 product is available for production orders through the Agilent Component Field Sales Office. HFBR-7924 No EMI Nose Shield HFBR-7924E With Extended EMI Nose Shield HFBR-7924H No heatsink, No EMI Nose Shield HFBR-7924EH No heatsink, with EMI Nose Shield Features • Four Transmit and Four Receive Channels; 1 to 2.7 GBd per channel • Compatible with SONET scrambled and 8B10B encoded data formats • 850 nm VCSEL array source • Conforms to “POP4” Four-Channel Pluggable Optical Transceiver Multisource Agreement • 50/125 µm multimode fiber operation • Distance up to 300 m with 500 MHz.km fiber at 2.5 Gb/s • Distance up to 600 m with 2000 MHz.km fiber at 2.5 Gb/s • Pluggable package • Outputs (Tx & Rx) are squelched for loss of signal • Control I/O is compatible with LVTTL and LVCMOS • Standard MTP® MPO ribbon fiber connector interface • Integrated heat sink • Manufactured in an ISO 9002 certified facility • Rx Signal Detect Applications • Telecom and Datacom Switch/ Router Rack-to-Rack Connections • OC-192 Very Short Reach (VSR), OIF-VSR4-03.0, Interconnects • Computer Cluster Interconnects 4 Channels DIN Ch 0 - 3 + Input Stage VCSEL Array Driver DIN Ch 0 - 3 - TX_DIS TX_EN TX_FAULT* TX_RESET* SD DOUT Ch 0 - 3 + Vcc_TX GND_TX Control Vcc_RX GND_RX 4 Channels PIN Array Input Stage Driver DOUT Ch 0 - 3 - Figure 1 Block Diagram (dimensions in mm) POINT FOR TAKING MODULE TEMPERATURE e er Cod umtb BaPrartgN en A il Figure 2 - Case temperature measurement Module Case Temperature Rise Above Ambient ( C) 25 20 15 10 5 0 0 0.5 1 Air Velocity (m/s) Figure 3 - Ambient air temperature and air flow for TC = +80 °C 2 1.5 2 Package Dimensions Notes: 1. Module mass approximately 20 grams. Figure 4A - HFBR-7924 Package dimensions (dimensions in mm) Figure 4B - HFBR-7924E Package dimensions (dimensions in mm) 3 Figure 5A - HFBR-7924H Package Dimensions (dimensions in mm) Figure 5B - HFBR-7924EH Package Dimensions (dimensions in mm) 4 2 x ∅ 2.54 MIN. PAD KEEP-OUT ∅ 0.1 A B-C 2 x ∅ 1.7 ± 0.05 HOLES ∅ 0.1 A B-C 3 x ∅ 4.17 MIN. PAD KEEP-OUT 6.73 ∅ 0.1 A B-C B 3 x ∅ 2.69 ± 0.05 HOLES FOR #2 SCREW A ∅ 0.1 A B-C SYM. 13.72 18 REF. 100 PIN FCI MEG-Array® RECEPTACLE CONNECTORS 18.42 MIN. C SYM. 9 x 1.27 TOT = 11.43 END OF MODULE FRONT (10 x 10 =) 100 x ∅ 0.58 ± 0.05 PADS ∅ 0.05 A B-C 6.73 50 KEEP-OUT AREA FOR MPO CONNECTOR 9 x 1.27 TOT = 11.43 1.89 REF. 30.23 8.95 REF. PCB TOP VIEW NOTE: The host electrical connector attached to the PCB must be a 100-position FCI Meg-Array ® plug (FCI PN: 84512-102) or equivalent. Figure 6 - Package Board Footprint (dimensions in mm) 0.50 max 19.02 min PCB 15.70 ± 0.25 Figure 7 - Host Frontplate Layout (dimensions in mm) 5 3.60 ± 0.2 13.40 ± 0.2 Front Panel PCB 35.31+/- 0.20 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Minimum Maximum Unit Storage Temperature TS -40 +100 ºC Supply Voltage VCC -0.5 4.6 V Data/Control Signal Input Voltage VI -0.5 VCC + 0.5 V Transmitter Differential Input Voltage | VD | 2 V Output Current (dc) ID 25 mA Relative Humidity (Non Condensing) RH 95 % 5 Reference 1 Recommended Operating Conditions Recommended Operating Conditions specify conditions for which the optical and electrical characteristics hold. Optical and electrical characteristics are not specified for operation beyond the Recommended Operating Conditions, reliability is not implied and damage to the device may occur for such operation over an extended time period. Parameter Symbol Minimum Typical Maximum Unit Reference Case Temperature TC 0 +80 ºC 2, Figures 2, Supply Voltage VCC Figure 8 Signaling Rate/Channel DVDINP-P 3.465 V 1 3.135 3.3 2.7 GBd 175 1600 mVP-P 160 ps V Data Input Differential Peak-to-Peak Voltage Swing Data Input Rise & Fall Time (20-80%) tr, tf Control Input Voltage High VIH 2.0 VCC Control Input Voltage Low VIL VEE 0.8 V Power Supply Noise NP 200 mVP-P 3, Figures 11,12 4, Figure 8 Data I/O Coupling Capacitors CAC 0.1 µF 5, Figure 9 Receiver Differential Data Output Load RDL 100 W Figure 9 Notes: 1. This is the maximum voltage that can be applied across the Transmitter Differential Data Inputs without damaging the input circuit. 2. Case Temperature is measured as indicated in Figure 2. 3. Data inputs are CML compatible. Coupling capacitors are required to block dc. DVDIN p-p = DVDINH - DVDINL, where DVDINH = High State Differential Data Input Voltage and DVDINL = Low State Differential Data Input Voltage. 4. Power Supply Noise is defined at the supply side of the recommended filter for all VCC supplies over the frequency range from 500 Hz to 2700 MHz with the recommended power supply filter in place. 5. For data patterns with restricted run lengths, e.g. 8B10B encoded data, smaller value capacitors may provide acceptable results. 6 Transmitter Electrical Characteristics (Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%) Parameter Symbol Minimum Typical Maximum Unit Differential Input Impedance Zin 80 120 FAULT* Assert time TOFF 100 µs Figure 13 RESET* Assert time TOFF 7.5 µs Figure 14 RESET* De-assert time TON 18 ms Figure 14 Transmit Enable (TX_EN) Assert time TON 18 ms Figure 15 Transmit Enable (TX_EN) De-assert time TOFF 7.5 µs Figure 15 Transmit Disable (TX_DIS) Assert time TOFF 7.5 µs Figure 15 Transmit Disable (TX_DIS) De-assert time TON 18 ms Figure 15 Power-On Initiation Time 100 21 Control I/Os Input Current High | IIH | TX _DIS, TX_EN, Input Current Low | IIL | TX_FAULT*, Output Voltage Low VOL VEE TX_RESET* Output Voltage High VOH 2.4 W Reference 6, Figure 9 ms Figure 17 0.5 mA 2.0 V < VIH < VCC 0.5 mA VEE < VIH < 0.8 V 0.4 V IOL = 4.0 mA VCC V IOH = -0.5 mA Transmitter Optical Characteristics (Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%) Parameter Symbol Minimum Typical Maximum Unit Reference Output Optical Power 50/125 µm, Fiber NA = 0.2 Extinction Ratio POUT -8.0 -4.5 -2.0 dBm avg. 7 ER 6 7.5 dB 8 Center Wavelength lC 830 850 860 Spectral Width - rms s 0.85 nm rms Rise, Fall Time tr, tf 60 150 ps 9 50 100 ps 10 RIN -127 -121 dB/Hz Deterministic DJ 20 50 psp-p 11 Total TJ 45 120 psp-p 12 Inter-channel Skew Relative Intensity Noise Jitter Contribution nm Notes: 6. Differential impedance is measured between DIN + and DIN - over the range 4 MHz to 2 GHz. 7. The specified optical output power, measured at the output of a 2 meter test cable, will be compliant with IEC 60825-1 Amendment 2, Class 1M Accessible Emission Limits, AEL Regulatory Compliance section. 8. Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state and is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg). The transmitter is driven with a 550 MBd, 101010 pattern. 9. These are unfiltered 20% - 80% values measured with a 550 MBd 101010 pattern. 10. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. 11. Deterministic Jitter (DJ) is defined as the combination of Duty Cycle Distortion (Pulse-Width Distortion) and Data Dependent Jitter. Deterministic Jitter is measured at the 50% signal threshold level using a 2500 MBd Pseudo Random Bit Sequence of length 223-1 (PRBS-23), or equivalent, test pattern with zero skew between the differential data input signals. 12. Total Jitter (TJ) includes Deterministic Jitter and Random Jitter (RJ). Total Jitter is specified at a BER of 10-12 for the same 2.5 GBd test pattern as for DJ and is measured with all channels operating. 7 Receiver Electrical Characteristics (Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%) Parameter Symbol Differential Output Impedance ZOUT Data Output Differential Peak-to-Peak Voltage Swing DVDOUTP-P Minimum Typical Maximum Unit 100 500 Inter-channel Skew Data Output Rise, Fall Time tr, tf Control I/O Output Voltage Low VOL VEE 2.4 Reference W 13, Figure 9 650 800 mVP-P 14, Figure 10 50 100 ps 15 120 150 ps 16 0.4 V IOL = 4.0 mA Signal Detect Output Voltage High VOH V IOH = -0.5 mA LVTTL & LVCMOS Assert Time (OFF-to-ON) tSDA 50 µs 17 Compatible De-assert Time (ON-to-OFF) tSDD 50 µs 18 VCC Receiver Optical Characteristics (Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%) Parameter Symbol Input Optical Power - Sensitivity PIN MIN Minimum Typical Input Optical Power - Saturation PIN MAX -2.0 Operating Center Wavelength lC 830 -18 Maximum Unit Reference -16.0 dBm avg. 19 860 nm dBm avg. dBm 20 Stressed Receiver Eye Opening Stressed Receiver Sensitivity 111 ps 21 Return Loss 12 dB 22 dBm avg. 23 Signal Detect -11.7 -22 -17 Asserted PA Deasserted PD -31 -27 dBm avg. Hysteresis PA - PD 0.5 1.0 dB Notes: 13. Measured over the range 4 MHz to 2 GHz. 14. DVDOUTP-P = DVDOUTH - DVDOUTL, where DVDOUTH = High State Differential Data Output Voltage and DVDOUTL = Low State Differential Data Output Voltage. DVDOUTH and DVDOUTL = VDOUT+ - V DOUT-, measured with a 100 W differential load connected with the recommended coupling capacitors and with a 2500 MBd, 101010 pattern. 15. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. 16. Rise and Fall Times are measured between the 20% and 80% levels using a 550 MHd square wave signal. 17. The Signal Detect output will change from logic “0” (Low) to “1” (High) within the specified assert time for a step transition in optical input power from the deasserted condition to the specified asserted optical power level. 18. The Signal Detect output will change from logic “1” (High) to “0” (Low) within the specified de-assert time for a step transition in optical input power from the specified asserted optical power level to the deasserted condition. 19. Sensitivity is defined as the average input power with the worst case, minimum, Extinction Ratio necessary to produce a BER < 10 -12 at the center of the Baud interval. For this parameter, input power is equivalent to that provided by an ideal source, i.e. one with RIN and switching attributes that do not degrade the sensitivity measurement. All channels not under test are operating receiving data with an average input power of up to 6 dB above PIN MIN. Sensitivity at signal rates from 1 to 2.7 GBd is defined for a PRBS 2 23-1 test pattern. 20. The stressed receiver sensitivity is measured using 2.6 dB Inter-Symbol Interference, ISI, (min), 30 ps Duty Cycle Dependent Deterministic Jitter, DCD DJ (min) and 6 dB ER (ER Penalty = 2.23 dB). All channels not under test are operating receiving data with an average input power of up to 6 dB, above PIN MIN. 21. The stressed receiver eye opening is measured using 2.6 dB ISI (min), 30 ps DCD DJ (min), 6 dB ER (ER Penalty = 2.23 dB) and an average input optical power of -11.7 dBm. All channels not under test are operating receiving data with an average input power of up to 6 dB above PIN MIN. 22. Return loss is defined as the ratio, in dB, of the received optical power to the optical power reflected back down the fiber. 23. Signal Detect assertion requires all optical inputs to exhibit a minimum 6 dB Extinction Ratio at PA = -17 dBm. All channels not under test are operating with PRBS 223-1patterns, asynchronous with the channel under test, and average input power of up to 6 dB above the specified PIN MIN. 8 General/Control Electrical Characteristics (Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%) Parameter Symbol Supply Current ICCT 300 400 mA Power Dissipation PDIST 1.0 1.39 W Regulatory Compliance The overall equipment design will determine the certification level. The module performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. The first case is during handling of the module prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, workbenches and floor mats in ESD controlled areas. The module performance has been shown to provide adequate performance in typical industry production environments. The second case to consider is static discharges to the exterior of the equipment chassis containing the module parts. To the extent that the MT-based connector receptacle is exposed to the outside of the equipment chassis it may be subject to whatever system-level ESD test criteria that the equipment is intended to meet. The module performance exceeds typical industry equipment requirements of today. 9 Minimum Typical Electromagnetic Interference (EMI) Most equipment designs using these high-speed modules from Agilent will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. These modules, with their shielded design, perform to the limits listed in Table 1 to assist the designer in the management of the overall equipment EMI performance. Immunity Equipment utilizing these modules will be subject to radio frequency electromagnetic fields in some environments. These modules have good immunity to such fields due to their shielded design. Eye Safety These 850 nm VCSEL-based transceiver modules provide eye safety by design. The HFBR-7924 has been registered with CDRH and certified by TUV as a Class 1M device under Amendment 2 of IEC 60825-1. See the Regulatory Compliannce Table for further detail. If Class 1M exposure is possible, a safety-warning label should be placed on the product stating the following: LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS. CLASS 1M LASER PRODUCT Maximum Unit Reference MTP®(MPO) Optics Cleaning Statement The optical port has recessed optics that are visible through the nose of the port. The port plug provided should be installed whenever a fiber cable is not connected. This ensures the optics remain clean and no cleaning should be necessary. In the event of the optics being contaminated, forced nitrogen or dry clean air at less than 20 psi is the recommended cleaning agent. The features of the optical port and guide pins preclude the use of any solid instrument. Liquids are not advised due to potential damage. Application of wave soldering, reflow soldering and/or aqueous wash processes with the HFBR7924 modules device on board is not recommended as damage may occur. Normal handling precautions for electrostatic sensitive devices should be taken (see ESD section). Table 1 - Regulatory Compliance Feature Test Method Electrostatic Discharge (ESD to JEDEC Human Body (HBM) (JESD22-A114- the Electrical Pads) B) JEDEC Machine Model (MM) Variation of IEC 61000-4-2 Electrostatic Discharge (ESD to the Connector Receptacle) Electromagnetic Interference FCC Class B (EMI) Immunity CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1 Variation of IEC 61000-4-3 Laser Eye Safety IEC 60825-1 Amendment 2 and Equipment Type Testing CFR 21 Section 1040 Component Recognition Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment. Performance Module > 1000 V Module > 50 V Typically withstand at least 6 kV (module biased) without damage when the connector receptacle is contacted by a Human Body Model probe Typically pass with 5 dB margin. (See Notes 24 and 25) Typically show no measurable effect from a 10 V/m field swept from 80 MHz to 1 GHz applied to the module without a chassis enclosure. IEC AEL & US FDA CDRH Class 1M CDRH Accession Number: 9720151-22 TUV Bauart License: E2171095.04 UL File Number: E173874 Notes: 24. EMI performance only refers to shielded version (HFBR-7924E and HFBR-7924HE). 25. EMI performance could be improved by connecting the following pads to electrical ground : C9, G7 and H9. 10 4+4 Transceiver Module Pad Assignment - HFBR-7924 K F E D C B A VEE RX DOUT03+ VEE RX VEE RX VEE TX VEE TX DIN03- VEE TX DIN00+ 2 DOUT00+ VEE RX DOUT03- VEE RX VEE RX VEE TX VEE TX DIN03+ VEE TX DIN00- 3 VEE RX VEE RX VEE RX VEE RX VEE RX VEE TX VEE TX VEE TX VEE TX VEE TX 4 DOUT1+ VEE RX DOUT02- DNC DNC DNC DNC DIN02+ VEE TX DIN01- 5 DOUT1- VEE RX DOUT02+ DNC DNC DNC DNC DIN02- VEE TX DIN01+ 6 VEE RX VEE RX DNC DNC DNC DNC VEE TX VEE TX VEE TX DNC DNC DNC DNC VCC TX VCC TX VCC TX 1 7 DOUT00- J H VEE RX VCCB RX VCCB RX VCCB RX G 8 DNC Reserved Reserved Reserved TBD MSA TBD MSA TBD MSA DNC TX_DIS TX_EN DNC DNC DNC 9 DNC Reserved Reserved TBD MSA TBD MSA SD DNC RESET* FAULT* DNC DNC DNC DNC DNC DNC DNC VEE TX VCC TX VCC TX 10 VCCA RX VCCA RX VEE RX TOP VIEW (PCB LAYOUT) (10 x 10 ARRAY) 11 Table 2. Transceiver Module Pad Description Symbol Functional Description Din Ch 0 - 3 +/- through Din Ch 0 - 3 +/- Transmitter differential data inputs for channels 0 through 3: Data inputs are CML compatible. TX_DIS Transmitter Disable: LVCMOS Input (Internal pull down). Control input used to turn off the transmitter optical outputs. High Active. VCSEL array is off when High. Normal operation is enabled when Low. TX_EN Transmitter Enable: LVCMOS Input (Internal pull up). Control input used to enable the transmitter optical outputs. High Active. VCSEL array is off when Low. Normal operation is enabled when High. TX_FAULT* Transmitter Fault: LVCMOS Output. Transmitter status output indicating an eye-safety over-current condition for any VCSEL, an out of temperature range condition and/or a calibration data corruption detection. High output state indicates normal operation. Low output state indicates the fault condition. An asserted FAULT* condition disables the VCSEL array and is cleared by TX_RESET*. TX_RESET* Transmitter Reset: LVCMOS Input (Internal pull up). Control input used to reset the transmitter logic functions. Active Low. VCSEL array is off when Low. Normal operation is enabled when High. VEE_TX Transmitter signal common. All transmitter voltages are referenced to this potential unless otherwise stated. Directly connect these pads to the PC board transmitter ground plane. VCC_TX Transmitter power supply. Dout Ch 0 - 3 +/- through Dout Ch 0 - 3 +/- Receiver differential data outputs for channels 0 through 3: Data outputs are CML compatible. Data outputs are squelched for de-asserted Signal Detect. SD Receiver Signal Detect: LVCMOS Output. Receiver status output indicating valid signal in all channels. High output state (asserted) indicates valid optical inputs to each and every channel. Low output state (de-asserted) indicates loss of signal at any of the monitored receiver inputs. All channels are monitored. DNC Do NOT Connect. Do not connect to any electrical potential. VEE_RX Receiver signal common. All receiver voltages are referenced to this potential unless otherwise stated. Directly connect these pads to the PC board receiver ground plane. VCCA_RX Pin preamplifier power supply rail. VCCB_RX Receiver quantizer power supply rail. VCCA_RX and VCCB_RX can be connected to the same power supply. However, to insure maximum receiver sensitivity and minimize the impact of noise from the power supply, it is recommended to keep the power supplies separate and to use the recommended power supply filtering network on VCCA_RX (see Figure 8). Module Case 12 Transceiver Case Common. Transceiver Case Common incorporates all exposed conductive surfaces and is electrically isolated from Transmitter Signal Common and Receiver Signal Common. HFBR-7924 R5 100 Ω 0603 R6 1.0 kΩ 0603 Vcc Tx L6 6.8 nH 0805 L5 1 µH 2220 VCC Vcc Tx Vcc Tx Vcc Tx C12 0.1 µF 0603 C11 0.1 µF 0603 C10 10 µF 1210 R4 1.0 kΩ 0603 C9 10 µF 1210 R3 100 Ω0603 VccA Rx L4 6.8 nH 0805 L3 1 µH 2220 VCC VccA Rx C8 0.1 µF 0603 C7 0.1 µF 0603 C6 10 µF 1210 C5 10 µF 1210 R1 100 Ω 0603 R2 1.0 kΩ 0603 VCC VccB Rx L2 6.8 nH 0805 L1 1 µH 2220 VccB Rx VccB Rx C4 0.1 µF 0603 Figure 8 - Recommended power supply filter 13 C3 0.1 µF 0603 C2 10 µF 1210 C1 10 µF 1210 DOUT+ DIN+ CAC RDL RECEIVER DOUT- ZIN DIN- CAC AC COUPLING CAPACITORS (DC BLOCKING CAPACITORS) SHOULD BE USED TO CONNECT DATA OUTPUTS TO THE LOAD. THE DIFFERENTIAL DATA PAIR SHOULD BE TERMINATED WITH A DIFFERENTIAL LOAD, RDL, OF 100 Ω USING EITHER AN INTERNAL LOAD, ZIN, AS SHOWN ABOVE, OR AN EXTERNAL LOAD, IF NECESSARY. Figure 9 - Recommended AC coupling and data signal termination DIN+ VDI/O+ + ∆VDIN TRANSMITTER ∆VDI/OH - ∆VDI/OL DINVDI/ODOUT+ + RECEIVER ∆VDOUT DOUT- ∆VDI/OH + ∆VDI/O P-P VDI/O REFERS TO EITHER VDIN OR VDOUT AS APPROPRIATE. ∆VDI/OL - Figure 10 - Differential signals VCC VCCT 50 Ω 50 Ω DOUT+ DIN+ 50 Ω ZIN 50 Ω VBIAS (NONIMAL 1.9V) DOUT- DINVEE VEE Figure 11 - Transmitter data input equivalent circuit 14 Figure 12 - Receiver data output equivalent circuit. NO FAULT DETECTED FAULT DETECTED < 100 µs ~ 100 ns FAULT* TX OUT Ch 0 - 3 Figure 13 - Transmitter FAULT* signal timing diagram RESET* FAULT* >100 ns 18 ms (max) ~4.2 ms TX_OUT Ch 0 SHUTDOWN ~4.6 ms (typ) TX_OUT Ch 1 TX_OUT Ch 2 TX_OUT Ch 3 7.5 µs (max) Figure 14 - Transmitter RESET* timing diagram 15 NORMAL TX_DIS TX_EN ~ 7.5 µs ~ 7.5 µs TX OUT Ch 0 - 3 Normal Shutdown TX OUT Ch 0 - 3 Normal (a) TX_EN [1] Shutdown (b) NOTE [1]: TX_DIS, WHICH IS NOT SHOWN, IS THE FUNCTIONAL COMPLEMENT OF TX_EN. ~18 ms ~4.2 ms ~4.6 ms TX OUT Ch 0 TX OUT Ch 1 TX OUT Ch 2 TX OUT Ch 3 (c) Figure 15 - Transmitter TX_EN and TX_DIS timing diagram > 1 ms ~18 ms TX_EN [1] ~ 200 ns FAULT* ~4.2 ms ~4.6 ms Tx OUT Ch 0 Tx OUT Ch 1 Tx OUT Ch 2 Tx OUT Ch 3 NOTE [1]. TX_DIS, WHICH IS NOT SHOWN, IS THE FUNCTIONAL COMPLEMENT OF TX_EN. Figure 16 - Transmitter fault recovery via TX_EN timing diagram 16 Vcc > 2.8V Vcc ~21 ms 6.5ms NORMAL TX_OUT 0 TX_OUT 1 TX_OUT 2 TX_OUT 3 NORMAL ~4.6ms ~4.6ms ~4.6ms Figure 17. Typical Transmitter Power-Up Sequence 17 NORMAL NORMAL www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 916-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. February 1, 2004 5989-0360EN