NSR02F30MX 200 mA, 30 V Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current that offers the most optimal power dissipation in applications. They are housed in a spacing saving x3DFN 0201 package ideal for space constraint applications. www.onsemi.com Features • • Low Forward Voltage Drop − 500 mV (Typ.) @ IF = 200 mA Low Reverse Current – 20 mA (Typ.) @ VR = 30 V 200 mA of Continuous Forward Current ESD Rating − Human Body Model: Class 2 − Machine Model: Class M3 − CDM: Class IV High Switching Speed These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 Cathode 2 Anode MARKING DIAGRAM PIN 1 J • • • • X3DFN2 CASE 152AF M Typical Applications • • • • • J LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc−dc Converters Reverse Voltage and Current Protection Clamping and Protection M ORDERING INFORMATION MAXIMUM RATINGS Rating = Specific Device Code = (Rotated 180°) = Month Code Symbol Value Unit Reverse Voltage VR 30 V Forward Current (DC) IF 200 mA Forward Surge Current (60 Hz @ 1 cycle) IFSM 2 A Repetitive Peak Forward Current (Pulse Wave = 1 sec, Duty Cycle = 66%) IFRM 1 A ESD Rating: Human Body Model Machine Model ESD 2−4 >400 kV V Device Package Shipping† NSR02F30MXT5G X3DFN (Pb−Free) 10000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2016 April, 2016 − Rev. 1 1 Publication Order Number: NSR02F30MX/D NSR02F30MX Table 1. THERMAL CHARACTERISTICS Rating Symbol Max Unit Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25_C RθJA PD 695 180 °C/W mW Storage Temperature Range Tstg −55 to +125 °C TJ +125 °C Junction Temperature 1. Mounted onto a 4 in square FR−4 board 100 mm sq. 2 oz. Cu 0.06″ thick single sided. Operating to steady state. Table 2. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Test Conditions Parameter Symbol Min Typ Max Unit Reverse Leakage VR = 10 V IR − − 15 mA Reverse Leakage VR = 30 V IR − 20 50 mA Forward Voltage IF = 1 mA VF − 155 Forward Voltage IF = 10 mA VF − 250 290 mV Forward Voltage IF = 100 mA VF − 375 490 mV Forward Voltage IF = 200 mA VF − 500 600 mV Total Capacitance VR = 1.0 V, f = 1.0 MHz CT − 6 8 pF Reverse Recovery Time IF = IR = 10 mA, IR(REC) = 1.0 mA, Figure 2 trr − 2.4 3 ns Figure 1. Recovery Time Equivalent Test Circuit Figure 2. Peak Forward Recover Voltage Definition www.onsemi.com 2 mV NSR02F30MX TYPICAL CHARACTERISTICS 1.E−01 125°C IR, REVERSE CURRENT (A) IF, FORWARD CURRENT (mA) 1000 100 125°C 150°C 10 85°C 25°C −25°C 1 1.E−02 1.E−04 25°C 1.E−05 1.E−06 −25°C 1.E−07 1.E−08 0.1 0 0.1 0.2 0.3 0.4 0 0.5 5 10 15 20 25 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Forward Voltage Figure 4. Leakage Current 10 30 12 9 TA = 25°C prior to surge Based on square wave current TA = 25°C 10 8 7 8 6 IFSM (A) CT, TOTAL CAPACITANCE (pF) 85°C 1.E−03 5 4 6 4 3 2 2 1 0 0 0 5 10 15 20 25 0.001 0.01 30 0.1 1 10 100 VR, REVERSE VOLTAGE (V) TP (mSec) Figure 5. Total Capacitance Figure 6. Forward Surge Current 1000 1000 Duty Cycle = 50% R(t) (°C/W) 100 20% 10% 5% 2% 10 1% 1 Single Pulse 0.1 0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) Figure 7. Thermal Response www.onsemi.com 3 1 10 100 1000 NSR02F30MX PACKAGE DIMENSIONS X3DFN2, 0.62x0.32, 0.355P, (0201) CASE 152AF ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. A B D PIN 1 INDICATOR (OPTIONAL) DIM A A1 b D E e L2 E TOP VIEW 0.05 C A RECOMMENDED MOUNTING FOOTPRINT* 0.05 C 2X A1 SIDE VIEW MILLIMETERS MIN MAX 0.25 0.33 −−− 0.05 0.22 0.28 0.58 0.66 0.28 0.36 0.355 BSC 0.17 0.23 C SEATING PLANE 0.74 2X 0.30 1 e 2X 1 b 2 2X 0.31 DIMENSIONS: MILLIMETERS 2X 0.05 M 0.05 L2 M C A B See Application Note AND8398/D for more mounting details C A B BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NSR02F30MX/D