MC14511B BCD-to-Seven Segment Latch/Decoder/Driver The MC14511B BCD−to−seven segment latch/decoder/driver is constructed with complementary MOS (CMOS) enhancement mode devices and NPN bipolar output drivers in a single monolithic structure. The circuit provides the functions of a 4−bit storage latch, an 8421 BCD−to−seven segment decoder, and an output drive capability. Lamp test (LT), blanking (BI), and latch enable (LE) inputs are used to test the display, to turn−off or pulse modulate the brightness of the display, and to store a BCD code, respectively. It can be used with seven−segment light−emitting diodes (LED), incandescent, fluorescent, gas discharge, or liquid crystal readouts either directly or indirectly. Applications include instrument (e.g., counter, DVM, etc.) display driver, computer/calculator display driver, cockpit display driver, and various clock, watch, and timer uses. http://onsemi.com SOIC−16 D SUFFIX CASE 751B SOEIAJ−16 F SUFFIX CASE 966 MARKING DIAGRAMS 16 16 Features • • • • • • • • • • • • • • Low Logic Circuit Power Dissipation High−Current Sourcing Outputs (Up to 25 mA) Latch Storage of Code Blanking Input Lamp Test Provision Readout Blanking on all Illegal Input Combinations Lamp Intensity Modulation Capability Time Share (Multiplexing) Facility Supply Voltage Range = 3.0 V to 18 V Capable of Driving Two Low−power TTL Loads, One Low−power Schottky TTL Load, or Two HTL Loads Over the Rated Temperature Range Chip Complexity: 216 FETs or 54 Equivalent Gates Triple Diode Protection on all Inputs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant SO−16 WB DW SUFFIX CASE 751G MC14511B ALYWG 14511BG AWLYWW 1 1 SOIC−16 SOEIAJ−16 16 14511B AWLYYWWG 1 SO−16 WB A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1) Parameter Symbol Value Unit −0.5 to +18.0 V VDD DC Supply Voltage Range Vin Input Voltage Range, All Inputs −0.5 to VDD + 0.5 V I DC Current Drain per Input Pin 10 mA PD Power Dissipation, per Package (Note 2) 500 mW TA Operating Temperature Range −55 to +125 °C Tstg Storage Temperature Range −65 to +150 °C IOHmax Maximum Output Drive Current (Source) per Output 25 mA POHmax Maximum Continuous Output Power (Source) per Output (Note 3) 50 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Maximum Ratings are those values beyond which damage to the device may occur. 2. Temperature Derating: “D/DW” Packages: –7.0 mW/°C From 65°C to 125°C 3. POHmax = IOH (VDD − VOH) © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 12 1 Publication Order Number: MC14511B/D MC14511B This device contains protection circuitry to protect the inputs against damage due to high static voltages or electric fields. However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high−impedance circuit. A destructive high current mode may occur if Vin and Vout are not constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Due to the sourcing capability of this circuit, damage can occur to the device if VDD is applied, and the outputs are shorted to VSS and are at a logical 1 (See Maximum Ratings). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). PIN ASSIGNMENT B 1 16 VDD C 2 15 f LT 3 14 g BI 4 13 a LE 5 12 b D 6 11 c A 7 10 d VSS 8 9 e a f g e b c d DISPLAY 0 1 2 3 4 5 6 7 8 9 TRUTH TABLE LE BI LT X X 0 X 0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 1 1 1 Inputs D C X X X X 0 0 0 0 0 0 0 0 0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 1 1 1 1 1 1 1 1 X X B X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 X A X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X a 1 0 1 0 1 1 0 1 0 1 1 1 0 0 0 0 0 0 b 1 0 1 1 1 1 1 0 0 1 1 1 0 0 0 0 0 0 c 1 0 1 1 0 1 1 1 1 1 1 1 0 0 0 0 0 0 d 1 0 1 0 1 1 0 1 1 0 1 0 0 0 0 0 0 0 * Outputs e f 1 1 0 0 1 1 0 0 1 0 0 0 0 1 0 1 1 1 0 0 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 X = Don’t Care * Depends upon the BCD code previously applied when LE = 0 http://onsemi.com 2 g 1 0 0 0 1 1 1 1 1 0 1 1 0 0 0 0 0 0 Display 8 Blank 0 1 2 3 4 5 6 7 8 9 Blank Blank Blank Blank Blank Blank * MC14511B ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) − 55°C 25°C VDD 125°C Symbol Vdc Min Max Min Typ (Note 4) “0” Level VOL 5.0 10 15 − − − 0.05 0.05 0.05 − − − 0 0 0 0.05 0.05 0.05 − − − 0.05 0.05 0.05 Vdc “1” Level VOH 5.0 10 15 4.1 9.1 14.1 − − − 4.1 9.1 14.1 4.57 9.58 14.59 − − − 4.1 9.1 14.1 − − − Vdc Input Voltage # “0” Level (VO = 3.8 or 0.5 Vdc) (VO = 8.8 or 1.0 Vdc) (VO = 13.8 or 1.5 Vdc) VIL 5.0 10 15 − − − 1.5 3.0 4.0 − − − 2.25 4.50 6.75 1.5 3.0 4.0 − − − 1.5 3.0 4.0 “1” Level VIH 5.0 10 15 3.5 7.0 11 − − − 3.5 7.0 11 2.75 5.50 8.25 − − − 3.5 7.0 11 − − − 5.0 4.1 − 3.9 − 3.4 − − − − − − − 4.1 − 3.9 − 3.4 − 4.57 4.24 4.12 3.94 3.70 3.54 − − − − − − 4.1 − 3.5 − 3.0 − − − − − − − (IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) 10 9.1 − 9.0 − 8.6 − − − − − − − 9.1 − 9.0 − 8.6 − 9.58 9.26 9.17 9.04 8.90 8.70 − − − − − − 9.1 − 8.6 − 8.2 − − − − − − − Vdc (IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) 15 14.1 − 14 − 13.6 − − − − − − − 14.1 − 14 − 13.6 − 14.59 14.27 14.18 14.07 13.95 13.70 − − − − − − 14.1 − 13.6 − 13.2 − − − − − − − Vdc 5.0 10 15 0.64 1.6 4.2 − − − 0.51 1.3 3.4 0.88 2.25 8.8 − − − 0.36 0.9 2.4 − − − 15 − ± 0.1 − ± 0.00001 ± 0.1 − ± 1.0 Characteristic Output Voltage Vin = VDD or 0 Vin = 0 or VDD (VO = 0.5 or 3.8 Vdc) (VO = 1.0 or 8.8 Vdc) (VO = 1.5 or 13.8 Vdc) Output Drive Voltage (IOH = 0 mA) (IOH = 5.0 mA) (IOH = 10 mA) (IOH = 15 mA) (IOH = 20 mA) (IOH = 25 mA) Output Drive Current (VOL = 0.4 V) (VOL = 0.5 V) (VOL = 1.5 V) Max Min Max Unit Vdc Vdc VOH Source Vdc IOL Sink Input Current Iin mAdc mAdc Input Capacitance Cin − − − − 5.0 7.5 − − pF Quiescent Current (Per Package) Vin = 0 or VDD, Iout = 0 mA IDD 5.0 10 15 − − − 5.0 10 20 − − − 0.005 0.010 0.015 5.0 10 20 − − − 150 300 600 mAdc Total Supply Current (Notes 5 & 6) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT 5.0 10 15 IT = (1.9 mA/kHz) f + IDD IT = (3.8 mA/kHz) f + IDD IT = (5.7 mA/kHz) f + IDD mAdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Noise immunity specified for worst−case input combination. Noise Margin for both “1” and “0” level = 1.0 Vdc min @ VDD = 5.0 Vdc 2.0 Vdc min @ VDD = 10 Vdc 2.5 Vdc min @ VDD = 15 Vdc 5. The formulas given are for the typical characteristics only at 25°C. 6. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + 3.5 x 10–3 (CL – 50) VDDf where: IT is in mA (per package), CL in pF, VDD in Vdc, and f in kHz is input frequency. http://onsemi.com 3 MC14511B SWITCHING CHARACTERISTICS (Note 7) (CL = 50 pF, TA = 25°C) VDD Vdc Min Typ Max 5.0 10 15 − − − 40 30 25 80 60 50 5.0 10 15 − − − 125 75 65 250 150 130 5.0 10 15 − − − 640 250 175 1280 500 350 5.0 10 15 − − − 720 290 200 1440 580 400 5.0 10 15 − − − 600 200 150 750 300 220 5.0 10 15 − − − 485 200 160 970 400 320 5.0 10 15 − − − 313 125 90 625 250 180 tPHL 5.0 10 15 − − − 313 125 90 625 250 180 Setup Time tsu 5.0 10 15 100 40 30 − − − − − − ns Hold Time th 5.0 10 15 60 40 30 − − − − − − ns tWL 5.0 10 15 520 220 130 260 110 65 − − − ns Characteristic Symbol Output Rise Time tTLH = (0.40 ns/pF) CL + 20 ns tTLH = (0.25 ns/pF) CL + 17.5 ns tTLH = (0.20 ns/pF) CL + 15 ns tTLH Output Fall Time tTHL = (1.5 ns/pF) CL + 50 ns tTHL = (0.75 ns/pF) CL + 37.5 ns tTHL = (0.55 ns/pF) CL + 37.5 ns tTHL Data Propagation Delay Time tPLH = (0.40 ns/pF) CL + 620 ns tPLH = (0.25 ns/pF) CL + 237.5 ns tPLH = (0.20 ns/pF) CL + 165 ns tPHL = (1.3 ns/pF) CL + 655 ns tPHL = (0.60 ns/pF) CL + 260 ns tPHL = (0.35 ns/pF) CL + 182.5 ns tPLH Blank Propagation Delay Time tPLH = (0.30 ns/pF) CL + 585 ns tPLH = (0.25 ns/pF) CL + 187.5 ns tPLH = (0.15 ns/pF) CL + 142.5 ns tPHL = (0.85 ns/pF) CL + 442.5 ns tPHL = (0.45 ns/pF) CL + 177.5 ns tPHL = (0.35 ns/pF) CL + 142.5 ns tPLH Lamp Test Propagation Delay Time tPLH = (0.45 ns/pF) CL + 290.5 ns tPLH = (0.25 ns/pF) CL + 112.5 ns tPLH = (0.20 ns/pF) CL + 80 ns tPHL = (1.3 ns/pF) CL + 248 ns tPHL = (0.45 ns/pF) CL + 102.5 ns tPHL = (0.35 ns/pF) CL + 72.5 ns tPLH ns ns ns tPHL ns tPHL Latch Enable Pulse Width Unit ns 7. The formulas given are for the typical characteristics only. http://onsemi.com 4 MC14511B Input LE low, and Inputs D, BI and LT high. f in respect to a system clock. All outputs connected to respective CL loads. 20 ns 20 ns 90% 50% 1 2f A, B, AND C VDD 10% VSS 50% DUTY CYCLE VOH 50% ANY OUTPUT VOL Figure 1. Dynamic Power Dissipation Signal Waveforms 20 ns 20 ns 20 ns VDD 90% 50% 10% INPUT C 10% th VDD VOH 90% INPUT C 50% VSS 50% OUTPUT g VSS tsu VSS tPHL tPLH LE VDD 90% 50% 10% VOL VOH OUTPUT g tTHL tTLH VOL (b) Input D low, Inputs A, B, BI and LT high. (a) Inputs D and LE low, and Inputs A, B, BI and LT high. 20 ns 20 ns LE VDD 90% 50% 10% tWL (c) Data DCBA strobed into latches. Figure 2. Dynamic Signal Waveforms http://onsemi.com 5 VSS MC14511B CONNECTIONS TO VARIOUS DISPLAY READOUTS LIGHT EMITTING DIODE (LED) READOUT VDD VDD COMMON ANODE LED COMMON CATHODE LED ≈ 1.7 V ≈ 1.7 V VSS VSS INCANDESCENT READOUT VDD FLUORESCENT READOUT VDD VDD ** DIRECT (LOW BRIGHTNESS) FILAMENT SUPPLY VSS VSS VSS OR APPROPRIATE VOLTAGE BELOW VSS. (CAUTION: Maximum working voltage = 18.0 V) GAS DISCHARGE READOUT VDD LIQUID CRYSTAL (LCD) READOUT APPROPRIATE VOLTAGE EXCITATION (SQUARE WAVE, VSS TO VDD) VDD 1/4 OF MC14070B VSS VSS ** A filament pre−warm resistor is recommended to reduce filament thermal shock and increase the effective cold resistance of the filament. Direct DC drive of LCD’s not recommended for life of LCD readouts. http://onsemi.com 6 MC14511B BI4 13a A7 12b 11c B1 10d 9e 15f C2 14g LT3 D6 VDD = PIN 16 VSS = PIN 8 LE5 Figure 3. Logic Diagram ORDERING INFORMATION Package Shipping† MC14511BDG SOIC−16 (Pb−Free) 48 Units / Rail MC14511BDR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel MC14511BDWR2G SO−16 WB (Pb−Free) 1000 / Tape & Reel NLV14511BDWR2G* SO−16 WB (Pb−Free) 1000 / Tape & Reel MC14511BFG SOEIAJ−16 (Pb−Free) 50 Units / Rail MC14511BFELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 7 MC14511B PACKAGE DIMENSIONS SOIC−16 PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC14511B PACKAGE DIMENSIONS SOIC−16 WB CASE 751G−03 ISSUE D A D 9 1 8 h X 45 _ E 0.25 16X M T A MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ S B S L A 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. B B 14X e A1 H 8X M B M 16 q C T SEATING PLANE SOLDERING FOOTPRINT 16X 0.58 11.00 1 16X 1.27 PITCH 1.62 DIMENSIONS: MILLIMETERS http://onsemi.com 9 MC14511B PACKAGE DIMENSIONS SOEIAJ−16 CASE 966 ISSUE A 16 LE 9 Q1 M_ E HE 1 L 8 DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC14511B/D