LMH0002 www.ti.com SNLS215E – JANUARY 2006 – REVISED APRIL 2013 LMH0002 SMPTE 292M / 259M Serial Digital Cable Driver Check for Samples: LMH0002 FEATURES APPLICATIONS • • 1 2 • • • • • • • • • • • SMPTE 292M, SMPTE 344M and SMPTE 259M Compliant Supports DVB-ASI at 270 Mbps Data Rates to 1.485 Gbps Differential Input 75Ω Differential Output Selectable Slew Rate Adjustable Output Amplitude Single 3.3V Supply Operation Operating Temperature Range: Commercial 0°C to +70°C (LMH0002MA) or Industrial −40°C to +85°C (LMH0002TMA and LMH0002SQ) Typical Power Consumption: 125 mW in SD Mode and 149 mW in HD Mode 8–pin SOIC or 16–pin WQFN Package Replaces the GS1528, GS1528A, or GS1578A • • • • • • SMPTE 292M, SMPTE 344M, and SMPTE 259M Serial Digital Interfaces Sonet/SDH and ATM Interfaces Digital Routers and Switches Distribution Amplifiers Buffer Applications Set Top Boxes Security Cameras DESCRIPTION The LMH0002 SMPTE 292M / 259M serial digital cable driver is a monolithic, high-speed cable driver designed for use in SMPTE 292M / 259M serial digital video and ITU-T G.703 serial digital data transmission applications. The LMH0002 drives 75Ω transmission lines (Belden 8281, Belden 1694A or equivalent) at data rates up to 1.485 Gbps. The LMH0002 provides two selectable slew rates for SMPTE 259M and SMPTE 292M compliance. The output voltage swing is adjustable via a single external resistor. The LMH0002 is powered from a single 3.3V supply. Power consumption is typically 125 mW in SD mode and 149 mW in HD mode. The LMH0002 is available in an 8-pin SOIC or 16-pin WQFN package. Typical Application VCC 75: SD/HD VCC 75: 0.1 PF 5.6 nH 4.7 PF 1.0 PF SDI VCC SD/HD 50: LMH0002 RREF Differential Input 1.0 PF 50: 75: SDO SDO 75: 4.7 PF SDI VEE VCC 5.6 nH 0.1 PF 750: 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2013, Texas Instruments Incorporated LMH0002 SNLS215E – JANUARY 2006 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) −0.5V to 3.6V Supply Voltage: −0.3V to VCC+0.3V Input Voltage (all inputs) Output Current 28 mA −65°C to +150°C Storage Temperature Range Junction Temperature +150°C Lead Temperature (Soldering 4 Sec) +260°C Package Thermal Resistance θJA 8-pin SOIC θJA 16-pin WQFN θJC 8-pin SOIC θJC 16-pin WQFN +160°C/W +78.9°C/W +105°C/W +42.7°C/W ESD Rating (HBM) 5kV ESD Rating (MM) (1) 250V "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values. The table of Electrical Characteristics specifies acceptable device operating conditions. Recommended Operating Conditions Supply Voltage (VCC – VEE): 3.3V ±5% Operating Free Air Temperature (TA) LMH0002MA LMH0002TMA and LMH0002SQ 2 0°C to +70°C −40°C to +85°C Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH0002 LMH0002 www.ti.com SNLS215E – JANUARY 2006 – REVISED APRIL 2013 DC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2). Symbol Parameter VCMIN Input Common Mode Voltage VSDI Input Voltage Swing Conditions Reference SDI, SDI Typ 1.6 + VSDI/2 Differential 100 VCMOUT Output Common Mode Voltage VSDO Min SDO, SDO Output Voltage Swing SD/HD Input Voltage Max Units VCC – VSDI/2 V 2000 mVP−P VCC – VSDO V Single-ended, 75Ω load, RREF = 750Ω 1% 750 800 850 mVP-P Single-ended, 75Ω load, RREF = 590Ω 1% 900 1000 1100 mVP-P Min for SD SD/HD 2.4 V Max for HD SD/HD Input Current ICC (1) (2) (3) 0.8 V 3.7 Supply Current µA SD/HD = 0 (3) 45 49 mA SD/HD = 1 (3) 38 43 mA Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 Volts. Typical values are stated for VCC = +3.3V and TA = +25°C. Maximum ICC is measured at VCC = +3.465V and TA = +70°C. AC Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1). Symbol Parameter Conditions DRSDI Input Data Rate . tjit Additive Jitter 1.485 Gbps tr,tf Output Rise Time, Fall Time Reference (2) SDO, SDO Typ Max Units 1485 Mbps 26 psP-P 270 Mbps 18 SD/HD = 0, 20% – 80%, (3) 120 220 ps 560 800 ps SD/HD = 1, 20% – 80% 400 (2) psP-P Mismatch in Rise/Fall Time . 30 ps Duty Cycle Distortion SD/HD = 0, (2) 30 ps SD/HD = 1, (2) 100 ps tOS Output Overshoot . (2) RLSDO Output Return Loss . (4) (1) (2) (3) (4) Min SDI, SDI 8 15 20 % dB Typical values are stated for VCC = +3.3V and TA = +25°C. Specification is ensured by characterization. Specification is ensured by characterization and verified by test. Output return loss is dependent on board design. The LMH0002 meets this specification on the SD002 evaluation board from 5MHz to 1.5GHz. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH0002 3 LMH0002 SNLS215E – JANUARY 2006 – REVISED APRIL 2013 www.ti.com 1 2 3 4 SDI SDI VEE RREF LMH002MA CONNECTION DIAGRAM SDO SDO SD/HD VCC 8 7 6 5 VEE 3 RREF 4 NC NC NC 13 LMH0002SQ (top view) 5 6 7 8 NC 2 14 NC SDI 15 NC 1 16 NC SDI NC Figure 1. 8-Pin SOIC See D Package 12 SDO 11 SDO 10 SD/HD 9 VCC Figure 2. 16-Pin WQFN See RUM0016A Package Table 1. PIN DESCRIPTIONS SOIC Pin # WQFN Pin # 1 1 SDI Serial data true input. 2 2 SDI Serial data complement input. 3 3 VEE Negative power supply (ground). 4 4 RREF Output driver level control. Connect a resistor to VCC to set output voltage swing. 5 9 VCC Positive power supply (+3.3V). 6 10 SD/HD Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M when high. 7 11 SDO Serial data complement output. 8 12 SDO Serial data true output. — — 4 Name 5, 6, 7, 8, NC 13, 14, 15, 16 DAP VEE Description No connect. Connect exposed DAP to negative power supply (ground). Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH0002 LMH0002 www.ti.com SNLS215E – JANUARY 2006 – REVISED APRIL 2013 APPLICATION INFORMATION Device Operation INPUT INTERFACING The LMH0002 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are selfbiased at approximately 2.1V with VCC = 3.3V. Figure 3 shows the differential input stage for SDI and SDI. VCC SDI SDI VCC 5 k: 10 k: 80: 10 k: 10 k: Figure 3. Differential Input Stage for SDI and SDI. OUTPUT INTERFACING The LMH0002 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the RREF resistor connected between the RREF pin and VCC. The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane layers below the RREF network should be removed to minimize parasitic capacitance. OUTPUT SLEW RATE CONTROL The LMH0002 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise and fall times, or SMPTE 292M compliance, SD/HD is set low. REPLACING THE GENNUM GS1528, GS1528A, and GS1578A The LMH0002MA is form-fit-function compatible with the Gennum GS1528 and GS1528A. The LMH0002SQ is form-fit-function compatible with the Gennum GS1578A. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH0002 5 LMH0002 SNLS215E – JANUARY 2006 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH0002 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH0002MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 L002 LMH0002MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002 LMH0002MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002 LMH0002SQ NRND WQFN RUM 16 1000 TBD Call TI Call TI L002 LMH0002SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQ/S250 ACTIVE WQFN RUM 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002SQX/NOPB ACTIVE WQFN RUM 16 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM L002 LMH0002TMA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 L002T LMH0002TMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002T LMH0002TMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L002T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH0002MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH0002SQ WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQ/S250 WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002SQX/NOPB WQFN RUM 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LMH0002TMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH0002MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH0002SQ WQFN RUM 16 1000 210.0 185.0 35.0 LMH0002SQ/NOPB WQFN RUM 16 1000 210.0 185.0 35.0 LMH0002SQ/S250 WQFN RUM 16 250 210.0 185.0 35.0 LMH0002SQE/NOPB WQFN RUM 16 250 210.0 185.0 35.0 LMH0002SQX/NOPB WQFN RUM 16 4500 367.0 367.0 35.0 LMH0002TMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA RUM0016A SQB16A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated