ON MC100LVEP11DR2 2.5v / 3.3v ecl 1:2 differential fanout buffer Datasheet

MC10LVEP11, MC100LVEP11
2.5V / 3.3VECL 1:2
Differential Fanout Buffer
The MC10/100LVEP11 is a differential 1:2 fanout buffer. The
device is pin and functionally equivalent to the EP11 device. With AC
performance the same as the EP11 device, the LVEP11 is ideal for
applications requiring lower voltage. Single−ended CLK input
operation is limited to a VCC w 3.0 V in PECL mode, or VEE v
−3.0 V in NECL mode.
The 100 Series contains temperature compensation.
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MARKING
DIAGRAMS*
• 240 ps Typical Propagation Delay
• Maximum Frequency > 3.0 GHz Typical
• PECL Mode Operating Range: VCC = 2.375 V to 3.8 V
8
•
SOIC−8
D SUFFIX
CASE 751
8
8
HYP11
AYWW
1
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = −2.375 V to −3.8 V
Open Input Default State
•
• Q Output Will Default LOW with Inputs Open or at VEE
• LVDS Input Compatible
1
1
8
8
1
TSSOP−8
DT SUFFIX
CASE 948R
H
K
A
L
Y
W
KYP11
AYWW
8
HU11
ALYW
1
KU11
ALYW
1
= MC10
= MC100
= Assembly Location
= Wafer Lot
= Year
= Work Week
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
 Semiconductor Components Industries, LLC, 2005
February, 2005 − Rev. 7
1
Publication Order Number:
MC10LVEP11/D
MC10LVEP11, MC100LVEP11
Table 1. PIN DESCRIPTION
Q0
Q0
1
8
2
7
PIN
VCC
D
FUNCTION
D*, D**
ECL Data Inputs
Q0, Q0, Q1, Q1
ECL Data Outputs
VCC
Positive Supply
VEE
Negative Supply
*Pins will default to 2/3 VCC when left open.
**Pins will default LOW when left open.
Q1
3
6
D
Q1
4
5
VEE
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
ESD Protection
37.5 kW
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 4 kV
> 200 V
> 2 kV
Level 1
UL 94 V−0 @ 0.125 in
110 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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2
MC10LVEP11, MC100LVEP11
Table 3. MAXIMUM RATINGS
Rating
Unit
VCC
Symbol
PECL Mode Power Supply
Parameter
VEE = 0 V
Condition 1
Condition 2
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
265
°C
VI v VCC
VI w VEE
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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3
MC10LVEP11, MC100LVEP11
Table 4. 10LVEP DC CHARACTERISTICS, PECL VCC = 2.5 V, VEE = 0 V (Note 2)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
24
30
36
24
30
36
25
31
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 3)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VOL
Output LOW Voltage (Note 3)
565
740
865
630
805
930
690
865
990
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 4)
1.2
2.5
1.2
2.5
1.2
2.5
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.
3. All loading with 50 W to VCC − 2.0 V.
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
Table 5. 10LVEP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 5)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
24
30
36
24
30
36
25
31
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 6)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 6)
1365
1540
1665
1430
1605
1730
1490
1665
1790
mV
VIH
Input HIGH Voltage (Single−Ended)
(Note 7)
2090
2415
2155
2480
2215
2540
mV
VIL
Input LOW Voltage (Single−Ended)
(Note 7)
1365
1690
1430
1755
1490
1815
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 8)
1.2
3.3
1.2
3.3
1.2
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.
6. All loading with 50 W to VCC − 2.0 V.
7. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
8. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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4
MC10LVEP11, MC100LVEP11
Table 6. 10LVEP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −3.8 V to −2.375 V (Note 9)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
24
30
36
24
30
36
25
31
38
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 10)
−1135
−1010
−885
−1070
−945
−820
−1010
−885
−760
mV
VOL
Output LOW Voltage (Note 10)
−1935
−1760
−1635
−1870
−1695
−1570
−1810
−1635
−1510
mV
VIH
Input HIGH Voltage (Single−Ended)
(Note 11)
−1210
−885
−1145
−820
−1085
−760
mV
VIL
Input LOW Voltage (Single−Ended)
(Note 11)
−1935
−1610
−1870
−1545
−1810
−1485
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 12)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
VEE+1.2
0.0
VEE+1.2
0.0
150
D
D
0.5
−150
VEE+1.2
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with VCC.
10. All loading with 50 W to VCC − 2.0 V.
11. Single−Ended input CLK pin operation is limited to VEE v −3.0 V in NECL mode.
12. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 7. 100LVEP DC CHARACTERISTICS, PECL VCC = 2.5 V, VEE = 0 V (Note 13)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
25
31
37
29
35
41
32
38
45
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 14)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
VOL
Output LOW Voltage (Note 14)
555
730
900
555
730
900
555
730
900
mV
VIH
Input HIGH Voltage (Single−Ended)
1335
1620
1335
1620
1335
1620
mV
VIL
Input LOW Voltage (Single−Ended)
555
900
555
900
555
900
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 15)
1.2
2.5
1.2
2.5
1.2
2.5
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
13. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.
14. All loading with 50 W to VCC − 2.0 V.
15. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
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5
MC10LVEP11, MC100LVEP11
Table 8. 100LVEP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 16)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
25
31
37
29
35
41
32
38
45
mA
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 17)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 17)
1355
1530
1700
1355
1530
1700
1355
1530
1700
mV
VIH
Input HIGH Voltage (Single−Ended)
(Note 18)
2135
2420
2135
2420
2135
2420
mV
VIL
Input LOW Voltage (Single−Ended)
(Note 18)
1355
1700
1355
1700
1355
1700
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 19)
1.2
3.3
1.2
3.3
1.2
3.3
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
150
D
D
150
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
16. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.
17. All loading with 50 W to VCC − 2.0 V.
18. Single−Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.
19. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 9. 100LVEP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = −3.8 V to −2.375 V (Note 20)
−40°C
Symbol
Min
Characteristic
25°C
Typ
Max
Min
Typ
85°C
Max
Min
Typ
Max
Unit
IEE
Power Supply Current
25
31
37
29
35
41
32
38
45
mA
VOH
Output HIGH Voltage (Note 21)
−1145
−1020
−895
−1145
−1020
−895
−1145
−1020
−895
mV
VOL
Output LOW Voltage (Note 21)
−1945
−1770
−1600
−1945
−1770
−1600
−1945
−1770
−1600
mV
VIH
Input HIGH Voltage (Single−Ended)
(Note 22)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single−Ended)
(Note 22)
−1945
−1600
−1945
−1600
−1945
−1600
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 23)
0.0
V
IIH
Input HIGH Current
150
mA
IIL
Input LOW Current
−1425
VEE+1.2
0.0
VEE+1.2
150
D
D
0.5
−150
−1425
0.0
VEE+1.2
150
0.5
−150
−1425
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20. Input and output parameters vary 1:1 with VCC.
21. All loading with 50 W to VCC − 2.0 V.
22. Single−Ended input CLK pin operation is limited to VEE −3.0 V in NECL mode.
23. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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6
MC10LVEP11, MC100LVEP11
Table 10. AC CHARACTERISTICS VCC = 0 V; VEE = −3.8 V to −2.375 V or VCC = 2.375 V to 3.8 V; VEE = 0 V (Note 24)
−40°C
Symbol
Min
Characteristic
fmax
Maximum Frequency (Figure 2)
tPLH,
tPHL
Propagation Delay
(Differential Configuration)
tSKEW
Typ
25°C
Max
Min
3
170
Typ
85°C
Max
Min
3
230
300
Within Device Skew
Q, Q
Device to Device Skew (Note 25)
5.0
tJITTER
CLOCK Random Jitter (RMS)
@ v3.0 GHz (Figure 2)
VPP
Input Voltage Swing
(Differential Configuration)
tr
tf
Output Rise/Fall Times
(20% − 80%)
180
Typ
Max
3
240
310
20
130
5.0
0.2
1
150
800
1200
70
110
170
210
Unit
GHz
270
360
ps
20
130
5.0
20
150
ps
0.2
1
0.2
1
ps
150
800
1200
150
800
1200
mV
80
120
180
100
140
200
ps
CLK to Q, Q
Q, Q
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
24. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
25. Skew is measured between outputs under identical transitions.
1000
3.3 V
VOUTpp (mV)
900
2.5 V
800
700
600
500
400
300
200
100
0
0
1000
2000
FREQUENCY (MHz)
Figure 2. Fmax Typical
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7
3000
4000
MC10LVEP11, MC100LVEP11
Zo = 50 W
Q
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device
Shipping †
Package
MC10LVEP11D
SOIC−8
98 Units / Rail
MC10LVEP11DR2
SOIC−8
2500 / Tape & Reel
MC10LVEP11DT
TSSOP−8
100 Units / Rail
MC10LVEP11DTR2
TSSOP−8
2500 / Tape & Reel
MC100LVEP11D
SOIC−8
98 Units / Rail
MC100LVEP11DR2
SOIC−8
2500 / Tape & Reel
MC100LVEP11DT
TSSOP−8
100 Units / Rail
MC100LVEP11DTR2
TSSOP−8
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1642/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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8
MC10LVEP11, MC100LVEP11
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AE
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
H
0.10 (0.004)
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10LVEP11, MC100LVEP11
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
S
M
T U
S
V
0.25 (0.010)
B
−U−
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
M
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
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