Material Content Data Sheet Sales Product Name BC 857BL3 E6327 MA# MA000081590 Package PG-TSLP-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material non noble metal noble metal organic material plastics inorganic material noble metal noble metal < 10% tin gold silicon nickel gold carbon black epoxy resin silicondioxide gold gold 7440-31-5 7440-57-5 7440-21-3 7440-02-0 7440-57-5 1333-86-4 60676-86-0 7440-57-5 7440-57-5 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 0.53 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.001 0.23 2327 0.005 0.90 9022 0.039 7.34 8.47 73405 84755 0.071 13.37 13.37 133669 133669 0.012 2.32 2.32 23238 23238 0.004 0.73 0.082 15.32 0.303 56.89 72.94 568930 729399 0.008 1.45 1.45 14470 14470 0.008 1.45 1.45 14470 7295 153174 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com Sum [ppm] 14470 1000000