Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 1/7 CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET MTN9971J3 BVDSS ID RDSON 60V 25A 36 mΩ Features • Low Gate Charge • Simple Drive Requirement • Repetitive Avalanche Rated • Fast Switching Characteristic • RoHS compliant package Symbol Outline TO-252 MTN9971J3 G：Gate D：Drain S：Source G D S Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @VGS=10V, TC=25°C Continuous Drain Current @VGS=10V, TC=100°C Pulsed Drain Current Total Power Dissipation (TC=25℃) Linear Derating Factor Operating Junction and Storage Temperature Note : *1. Pulse width limited by safe operating area MTN9971J3 Symbol VDS VGS ID ID IDM Pd Tj, Tstg Limits 60 ±20 25 16 80 *1 39 0.31 -55~+150 Unit V V A A A W W/°C °C CYStek Product Specification Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 2/7 CYStech Electronics Corp. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Value 3.2 110 Unit °C/W °C/W Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Static BVDSS 60 ∆BVDSS/∆Tj VGS(th) 1.0 GFS IGSS IDSS IDSS *RDS(ON) *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *trr *Qrr - Typ. Max. Unit Test Conditions 0.05 17 - 3.0 ±100 1 25 36 50 V V/°C V S nA μA μA mΩ mΩ VGS=0, ID=250μA Reference to 25°C, ID=1mA VDS = VGS, ID=250μA VDS =10V, ID=18A VGS=±20 VDS =60V, VGS =0 VDS =48V, VGS =0, Tj=150°C VGS =10V, ID=18A VGS =4.5V, ID=12A 18 6 11 9 24 26 7 1700 160 110 30 2700 - nC ID=18A, VDS=48V, VGS=4.5V ns VDS=30V, ID=18A, VGS=10V, RG=3.3Ω, RD=1.67Ω pF VGS=0V, VDS=25V, f=1MHz 37 38 1.2 - V ns nC IS=25A, VGS=0V IS=18A, VGS=0, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTN9971J3 MTN9971J3 Package TO-252 (RoHS compliant) Shipping Marking 2500 pcs / Tape & Reel 9971 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 3/7 Characteristic Curves MTN9971J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 4/7 Characteristic Curves(Cont.) MTN9971J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 5/7 Reel Dimension Carrier Tape Dimension MTN9971J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 6/7 Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3°C/second max. (Tsmax to Tp) Preheat 100°C −Temperature Min(TS min) −Temperature Max(TS max) 150°C −Time(ts min to ts max) 60-120 seconds Time maintained above: −Temperature (TL) 183°C − Time (tL) 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C Time within 5°C of actual peak 10-30 seconds temperature(tp) Ramp down rate 6°C/second max. 6 minutes max. Time 25 °C to peak temperature Pb-free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260 +0/-5 °C 20-40 seconds 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTN9971J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C415J3 Issued Date : 2008.08.14 Revised Date : 2009.02.04 Page No. : 7/7 TO-252 Dimension C A D B Device Name Date code G F L Marking: 9971 □□□□ 3 H E K 2 I Style: Pin 1.Gate 2.Drain 3.Source 1 J 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 *: Typical Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2441 0.2677 0.2125 0.2283 DIM A B C D E F Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.20 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0449 0.0346 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 1.14 0.88 5.20 5.50 1.40 1.60 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : KFC; tin plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN9971J3 CYStek Product Specification