EIC BYD17M General purpose controlled avalanche rectifier Datasheet

Certificate TH97/10561QM
BYD17D - BYD17M
Certificate TW00/17276EM
GENERAL PURPOSE CONTROLLED
AVALANCHE RECTIFIERS
PRV : 200 - 1000 Volts
Io : 1.5 Amperes
FEATURES :
*
*
*
*
*
Glass passivated
High maximum operating temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
MELF (Plastic)
Cathode Mark
φ 0.102 (2.6)
0.094 (2.4)
0.022(0.55)
0.205(5.2)
0.189(4.8)
Dimensions in inches and ( millimeters )
MECHANICAL DATA :
* Case : Molded plastic
* Terminals : Plated Terminals, solderable per
MIL-STD-750 Method 2026
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.116 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(Tj = 25 °C unless otherwise specified.)
SYMBOL
BYD
17D
BYD
17G
BYD
17J
BYD
17K
BYD
17M
UNIT
Maximum Repetitive Peak Reverse Voltage
VRRM
200
400
600
800
1000
V
Maximum Crest Working Reverse Voltage
VRWM
200
400
600
800
1000
V
VR
200
400
600
800
1000
V
V(BR)R-min
225
450
650
900
1100
V
RATING
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage at IR = 0.1 mA
Maximum Average Forward Current
Ttp = 105 °C
(Note 1)
Ta = 65 °C; PCB mounting
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)
IF(AV)
IFSM
1.5
0.6
A
20
A
1.05
V
Maximum Forward Voltage
at I F = 1 A , Tj = 25 °C
Maximum Reverse Current
at VR = VRRMmax , Tj = 25 °C
IR
1.0
μA
at VR = VRRMmax , Tj = 165 °C
IR(H)
100
μA
Trr
3
μs
at I F = 1 A , Tj = Tjmax
Typical Reverse Recovery Time (Note 3)
VF
0.93
Thermal Resistance from Junction to Tie-Point
Rth j-tp
30
K/W
Thermal Resistance from Junction to Ambient (Note 4)
Rth j-a
150
K/W
TJ
- 65 to + 175
°C
TSTG
- 65 to + 175
°C
Operating Junction Temperature Range
Storage Temperature Range
Notes :
(1) Averaged over any 20 ms period.
(2) t = 10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax
(3) Reverse Recovery Test Conditions : I F = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥ 40 μm
Page 1 of 2
Rev. 02 : November 7, 2006
Certificate TH97/10561QM
Certificate TW00/17276EM
RATING AND CHARACTERISTIC CURVES ( BYD17D - BYD17M )
FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
AVERAGE FORWARD CURRENT, I F(AV)
(A)
AVERAGE FORWARD CURRENT, I F(AV)
(A)
3.0
FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE
2.5
2.0
1.5
1.0
0.5
0
0
25
50
75
100
125
150
1.2
1.0
0.8
0.6
0.4
0.2
0
175
0
40
80
120
160
200
AMBIENT TEMPERATURE, Ta ( °C)
TIE-POINT TEMPERATURE, Ttp ( °C)
FIG.3 - FORWARD CURRENT AS FUNCTION
FIG.4 - REVERSE CURRENT AS FUNCTION
OF FORWARD VOLTAGE; MAXIMUM VALUES
OF JUNCTION TEMPERATURE; MAXIMUM VALUES
REVERSE CURRENT, IR (μA)
FORWARD CURRENT, I F (A)
6
4
TJ = 175 °C
2
TJ = 25 °C
1000
VR =V RRMmax
100
10
1
0
0
0
1
2
40
80
120
160
200
JUNCTION TEMPERATURE, T J ( °C)
FORWARD VOLTAGE, V F (V)
Page 2 of 2
Rev. 02 : November 7, 2006
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