MIL-PRF-38534 AND 38535 CERTIFIED FACILITY
M.S.KENNEDY CORP.
RAD HARD ULTRA LOW
DROPOUT ADJUSTABLE
POSITIVE LINEAR REGULATOR
5900RH
FEATURES:
Total Dose Hardened to 100 Krads(Si) (Method 1019.7 Condition A)
Ultra Low Dropout for Reduced Power Consumption
External Shutdown/Reset Function
Latching Overload Protection
Adjustable Output Using Two External Resistors
Output Current Limit
Surface Mount Package
Available as SMD 5962R05220
RAD Certified by DLA
DESCRIPTION:
The MSK5900RH is a rad hard adjustable linear regulator capable of delivering 4.0 amps of output current. Typical
dropout is only 0.30 volts with a 1.5 amp load. An external shutdown/reset function is ideal for power supply sequencing.
This device also has latching overload protection that requires no external current sense resistor. The MSK5900RH is
specifically designed for many space/satellite applications. The device is packaged in a hermetically sealed 12 pin flatpack
that is lead formed for surface mount applications.
EQUIVALENT SCHEMATIC
TYPICAL
APPLICATIONS
TYPICAL APPLICATIONS
PIN-OUT INFORMATION
1
2
3
4
5
6
Satellite System Power Supplies
Switching Power Supply Post Regulators
Constant Voltage/Current Regulators
Microprocessor Power Supplies
VIN A
12 VOUT A
VIN B
11 VOUT B
VIN C
10 VOUT C
GND 1
9 GND 2
LATCH
8 GND 2
SHUTDOWN 7 FB
CASE=ISOLATED
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8548-17 Rev. Q 6/14
9
ABSOLUTE MAXIMUM RATINGS
+VIN
VSD
IOUT
TC
Supply Voltage
+10V
Shutdown Voltage
10V
Output Current 7
4A
Case Operating Temperature Range
MSK5900RH K/H
-55°C to +125°C
MSK5900RH
-40°C to +85°C
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TST
TLD
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PD
TC
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ELECTRICAL SPECIFICATIONS
Input Voltage Range 2 8
Feedback Voltage
Line Regulation
Load Regulation
Dropout Voltage
Output Voltage Range 2
Output Current Limit
7
Shutdown Threshold
Shutdown Hysteresis
Ripple Rejection 2
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300°C
See SOA Curve
150°C
Class 2
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MSK5900K/H
MSK5900
Units
Subgroup
Min.
Typ.
Max.
Min.
Typ.
Max.
1
2.9
-
7.5
2.9
-
7.5
V
2,3
2.9
-
7.5
-
-
-
V
1
1.225
1.265
1.265
1.328
V
2,3
1.225
-
1.305
-
-
-
V
1
1.215
-
1.315
-
-
-
V
VFB=1.265V 10mA ≤ IOUT ≤ 1.0A
1,2,3
0
-
5.0
0
-
5.0
μA
VIN=7.5V
1
-
14
20
-
14
20
mA
Not Including IOUT
2,3
-
14
20
-
-
-
mA
IOUT=10mA 2.9V ≤ VIN ≤ 7.5V
1
-
-
0.01
R1=187Ω
2,3
-
±0.50
-
-
10mA ≤ IOUT ≤ 1.0A
1
-
±0.06 ±0.80
-
0.06
2,3
-
-
±0.80
-
-
-
%VOUT
1
-
0.22
0.70
-
0.22
0.75
V
2,3
-
0.26
0.70
-
-
-
V
2.9V ≤ VIN ≤ 7.5V
1
-
8
10
-
8
10
mA
R1=187Ω
2,3
-
9
10
-
-
-
mA
VIN=7.5V
-
1.5
-
6.8
1.5
-
6.7
V
1
1.5
1.75
2.0
1.3
1.75
2.2
A
2,3
1.3
1.75
2.2
-
-
-
A
VOUT ≤ 0.2V (OFF)
1
1.0
1.3
1.6
1.0
1.3
1.6
V
VOUT=Nominal (ON)
2,3
1.0
1.3
1.6
-
-
-
V
Difference between voltage
1
-
0.02
0.2
-
0.02
0.2
V
threshold of VSDI (ON) and VSDI (OFF)
2,3
-
0.03
0.2
-
-
-
V
f=1KHz to 10KHz
4
20
-
-
20
-
-
dB
10mA ≤ IOUT ≤ 1.0A 1.0V=VIN-VOUT
5,6
20
-
-
-
-
-
dB
70
70
-
degrees
10mA ≤ IOUT ≤ 1.0A
Delta FB=1% IOUT=1.0A
Minimum Output Current 2
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Group A
Post Radiation
Quiescent Current
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-65°C to +150°C
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10mA ≤ IOUT ≤ 1.0A R1=187Ω
Feedback Pin Current 2
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Test Conditions 1 10
Parameter
Storage Temperature Range
Lead Temperature Range
(10 Seconds)
Power Dissipation
Junction Temperature
ESD Rating
VIN=4.4V
VOUT=3.3V
1.305 1.202
±0.01 ±0.50
-
±0.60 %VOUT
-
%VOUT
±1.0 %VOUT
Phase Margin 2
IOUT=450mA
4,5,6
30
-
30
Gain Margin 2
IOUT=450mA
4,5,6
10
18
-
10
18
-
dB
Referred to Feedback Pin
4,5,6
-
-
50
-
-
50
μVRMS
Junction to Case @ 125°C Output Device
-
-
6.9
7.5
-
6.9
7.8
°C/W
Equivalent Noise Voltage 2
Thermal Resistance 2
NOTES:
1
2
3
4
5
6
7
8
9
10
11
Unless otherwise specified, VIN=5.0V, R1=1.62K, VSHUTDOWN=0V and IOUT=10mA. See Figure 2, typical application circuit.
Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only.
Industrial grade devices shall be tested to subgroups 1 and 4 unless otherwise requested.
Military grade devices ("H" suffix) shall be 100% tested to subgroups 1,2,3 and 4.
Subgroup 5 and 6 testing available upon request.
Subgroup 1,4 TC=+25°C
Subgroup 2,5 TC=+125°C
Subgroup 3,6 TA=-55°C
Output current limit is dependent upon the values of VIN and VOUT. See Figure 1 and typical performance curves.
Minimum VIN at -55°C and IOUT=1.0A is 4.0V due to current limit circuitry.
Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.
Pre and post irradiation limits at 25°C, up to 100Krad TID, are identical unless otherwise specified.
Reference DLA SMD 5962R05220 for electrical specifications for devices purchased as such.
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8548-17 Rev. Q 6/14
APPLICATION NOTES
PIN FUNCTIONS
OUTPUT CAPACITOR SELECTION
VIN A,B,C - These pins provide power to all internal circuitry
including bias, start-up, thermal limit and overcurrent latch. Input
voltage range is 2.9V to 7.5V. All three pins must be connected
for proper operation.
Low ESR output capacitors are required to maintain regulation
and stability. Four CWR29FB227 (AVX PN TAZH227K010L)
tantalum capacitors in parallel with ceramic decoupling capacitors
(0.1μF typical) provides sufficient gain and phase margin for most
applications. The maximum ESR specification for the
CWR29FB227 capacitor is 180mΩ at 100kHz and is sufficient
for many applications. MSK has found through full WCCA on the
MSK5820RH-1.5 that screening for a maximum ESR of 57mΩ
ensures EOL stability criteria to be met for many applications with
the most stringent requirements. Analysis of the final design is
recommended to ensure stability requirements are met.
GND1 - Internally connected to input ground, these pins should
be connected externally by the user to the circuit ground and the
GND2 pins.
LATCH - The MSK5900RH LATCH pin is used for both current
limit and thermal limit. A capacitor between the LATCH pin and
ground sets a time out delay in the event of an over current or
short circuit condition. The capacitor is charged to approximately
1.6V from a 7.2μA (nominal) current source. Exceeding the thermal limt charges the latch capacitor from a larger current source
for a near instant shutdown. Once the latch capacitor is charged
the device latches off until the latch is reset. Momentarily pull the
LATCH pin low, toggle the shutdown pin high then low or cycle
the power to reset the latch. Toggling the shutdown pin or cycling the power both disable the device during the reset operation
(see SHUTDOWN pin description). Pulling the LATCH pin low
immediately enables the device for as long as the LATCH pin is
held low plus the time delay to re-charge the latch capacitor whether
or not the fault has been corrected. Disable the latch feature by
tying the LATCH pin low. With the LATCH pin held low the
thermal limit feature is disabled and the current limit feature will
force the output voltage to droop but remain active if excessive
current is drawn.
START UP CURRENT
The MSK5900RH sinks increased current during startup to bring
up the output voltage. Reference the "Saturated Drive Current vs.
Input Voltage" graph in the typical performance curves of this
data sheet and the "Understanding Startup Surge Current With
MS Kennedy's RH1573 Based Rad Hard LDO Regulators" application note in the application notes section of the MS Kennedy
Web site for more information.
http://www.mskennedy.com/
OVERCURRENT LATCH-OFF/LATCH PIN CAPACITOR SELECTION
As previously mentioned, the LATCH pin provides over current/output short circuit protection with a timed latch-off circuit.
Reference the LATCH pin description note. The latch off time out
is determined with an external capacitor connected from the LATCH
pin to ground. The time-out period is equal to the time it takes to
charge this external capacitor from 0V to 1.6V. The latch charging current is provided by an internal current source. This current
is a function of input voltage and temperature (see latch charging
current curve). For instance, at 25°C, the latch charging current
is 7.2μA at VIN=3V and 8μA at VIN=7V.
In the latch-off mode, some additional current will be drawn from
the input. This additional latching current is also a function of
input voltage and temperature (see latching current curves).
SHUTDOWN - There are two functions to the SHUTDOWN pin.
It may be used to disable the output voltage or to reset the LATCH
pin. To activate the shutdown/reset functions the user must apply a voltage greater than 1.3V to the SHUTDOWN pin.The voltage applied to the SHUTDOWN pin can be greater than the input
voltage. The output voltage will turn on when the SHUTDOWN
pin is pulled below the threshold voltage. If the SHUTDOWN pin
is not used, it should be connected to ground.
FB - The FB pin is the inverting input of the internal error amplifier. The non-inverting input is connected to an internal 1.265V
reference. This error amplifier controls the drive to the output
transistor to force the FB pin to 1.265V. An external resistor
divider is connected to the output, FB pin and ground to set the
output voltage.
GND2 - Internally connected to output ground, these pins should
be connected externally by the user to the circuit ground and the
GND1 pins.
VOUT A,B,C - These are the output pins for the device. All three
pins must be connected for proper operation.
POWER SUPPLY BYPASSING
To maximize transient response and minimize power supply
transients it is recommended that a 33μF minimum tantalum capacitor is connected between VIN and ground. A 0.1μF ceramic
capacitor should also be used for high frequency bypassing.
FIGURE 1
The MSK5900RH current limit function is directly affected
by the input and output voltages. Figure 1 illustrates the relationship between VIN and ICL for three output voltages.
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8548-17 Rev. Q 6/14
APPLICATION NOTES CONT.
TYPICAL APPLICATIONS CIRCUIT
THERMAL LIMITING
The MSK5900RH control circuitry has a thermal shutdown temperature of approximately 150°C. This thermal
shutdown can be used as a protection feature, but for continuous operation, the junction temperature of the pass transistor must be maintained below 150°C. Proper heat sink
selection is essential to maintain these conditions. Exceeding the thermal limit activates the latch feature of the
MSK5900RH. See LATCH pin description for instructions
to reset the latch or disable the latch feature.
HEAT SINK SELECTION
To select a heat sink for the MSK5900RH, the following
formula for convective heat flow may be used.
VOUT=1.265(1+R1/R2)
Governing Equation:
OUTPUT VOLTAGE SELECTION
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
PD
RθJC
RθCS
RθSA
TA
=
=
=
=
=
=
As noted in the above typical applications circuit,
the formula for output voltage selection is
Junction Temperature
Total Power Dissipation
Junction to Case Thermal Resistance
Case to Heat Sink Thermal Resistance
Heat Sink to Ambient Thermal Resistance
Ambient Temperature
VOUT=1.265 1+ R1
R2
A good starting point for this output voltage selection is
to set R2=1K. By rearranging the formula it is simple to
calculate the final R1 value.
Power Dissipation=(VIN-VOUT) x IOUT
R1=R2
Next, the user must select a maximum junction temperature. The absolute maximum allowable junction temperature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (RθSA).
Table 1 below lists some of the most probable resistor
combinations based on industry standard usage.
TABLE 1
OUTPUT VOLTAGE
(V)
1.5
1.8
2.0
2.5
2.8
3.3
4.0
5.0
Example:
An MSK5900RH is connected for VIN=+5V and
VOUT=+3.3V. IOUT is a continuous 1A DC level. The ambient temperature is +25°C. The maximum desired junction
temperature is +125°C.
RθJC=7.5°C/W and RθCS=0.15°C/W for most thermal
greases
Power Dissipation=(5V-3.3V) x (1A)
=1.7Watts
Solve for RθSA:
RθSA=
VOUT -1
1.265
R2
(Ω
Ω)
1K
1K
1K
1K
1K
1K
1K
1K
R1 (nearest 1%)
Ω)
(Ω
187
422
576
976
1.21K
1.62K
2.15K
2.94K
TOTAL DOSE RADIATION TEST
PERFORMANCE
125°C - 25°C
-7.5°C/W - 0.15°C/W
1.7W
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS Kennedy.
These curves show performance trends throughout the TID
test process and can be located in the MSK5900RH radiation test report. The complete radiation test report is available in the RAD HARD PRODUCTS section on the MSK
website.
= 51.2°C/W
In this example, a heat sink with a thermal resistance
of no more than 51°C/W must be used to maintain a
junction temperature of no more than 125°C.
http://www.mskennedy.com/store.asp?pid=9951&catid=19680
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8548-17 Rev. Q 6/14
TYPICAL PERFORMANCE CURVES
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8548-17 Rev. Q 6/14
TYPICAL PERFORMANCE CURVES
GAIN AND PHASE RESPONSE
The gain and phase response curves are for the MSK typical application circuit and are representative of typical device
performance, but are for reference only. The performance should be analyzed for each application to insure individual
program requirements are met. External factors such as temperature, input and output voltages, capacitors, etc. all can be
major contributors. Please consult factory for additional details.
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8548-17 Rev. Q 6/14
TYPICAL PERFORMANCE CURVES CON'T
GAIN AND PHASE RESPONSE
The gain and phase response curves are for the MSK typical application circuit and are representative of typical device
performance, but are for reference only. The performance should be analyzed for each application to insure individual
program requirements are met. External factors such as temperature, input and output voltages, capacitors, etc. all can be
major contributors. Please consult factory for additional details.
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8548-17 Rev. Q 6/14
MECHANICAL SPECIFICATIONS
ESD TRIANGLE INDICATES PIN 1
WEIGHT=3.3 GRAMS TYPICAL
ALL DIMENSIONS ARE SPECIFIED IN INCHES
ORDERING INFORMATION
Part
Number
Screening Level
MSK5900RH
INDUSTRIAL
MSK5900HRH
MIL-PRF-38534 CLASS H
MSK5900KRH
MIL-PRF-38534 CLASS K
5962R05220
DLA SMD
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8548-17 Rev. Q 6/14
REVISION HISTORY
M.S. Kennedy Corp.
Phone (315) 701-6751
FAX (315) 701-6752
www.mskennedy.com
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make
changes to its products or specifications without notice, however, and assumes no liability for the use of its products.
Please visit our website for the most recent revision of this datasheet.
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