CYStech Electronics Corp. Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 1/6 Low Vcesat PNP Epitaxial Planar Transistor D45H11FP Features • Low VCE(sat) • High BVCEO • Excellent current gain characteristics • Pb-free lead plating package Symbol Outline D45H11FP TO-220FP (C forming) TO-220FP (S forming) B C E B C E B：Base C：Collector E：Emitter Ordering Information Device D45H11FP-0-UB-S Package TO-220FP (RoHS compliant package) Shipping 50 pcs/tube, 20 tubes/box, 4 boxes / carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, UB : 50 pcs / tube, 20 tubes/box Product rank, zero for no rank products Product name D45H11FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 2/6 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation @ TA=25℃ Power Dissipation @ TC=25℃ Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature VCBO VCEO VEBO IC ICP PD PD RθJA RθJC Tj Tstg Limits -80 -80 -5 -10 -20 (Note 1) 2 50 62.5 2.5 150 -55~+150 Unit V V V A W °C/W °C/W °C °C Note : 1. Single Pulse , Pw≦380μs,Duty≦2%. Characteristics (Ta=25°C) Symbol BVCEO(SUS) ICEO ICES IEBO *VCE(sat) *VBE(sat) *hFE *hFE fT Cob Min. -80 60 40 - Typ. -0.6 -1.0 40 230 Max. -10 -10 -50 -1.0 -1.5 - Unit V μA μA μA V V MHz pF Test Conditions IC=-30mA, IB=0 VCE=-80V, IB=0 VCE=-80V, VBE=0 VEB=-5V, IC=0 IC=-8A, IB=-0.4A IC=-8A, IB=-0.8A VCE=-1V, IC=-2A VCE=-1V, IC=-4A VCE=-10V, IC=-500mA, f=20MHz VCB=-10V, f=1MHz *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% D45H11FP CYStek Product Specification Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 3/6 CYStech Electronics Corp. Typical Characteristics Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 10000 Saturation Voltage---(mV) Current Gain---HFE VCE(SAT) 100 VCE=2V VCE=1V 1000 IC=50IB 100 10 IC=10IB 1 10 1 10 100 1000 1 10000 Saturation Voltage vs Collector Current 100 1000 10000 On Vottage vs Collector Current 10000 1000 VBE(SAT) @ IC=10IB On Voltage---(mV) Saturation Voltage---(mV) 10 Collector Current---IC(mA) Collector Current---IC(mA) 1000 100 VBE(ON)@VCE=1V 100 1 10 100 1000 Collector Current---IC(mA) 10000 1 Power Derating Curve 10 100 1000 Collector Current---IC(mA) 10000 Power Derating Curve 2.5 60 2 50 Power Dissipation---PD(W) Power Dissipation---PD(W) IC=20IB 1.5 1 0.5 40 30 20 10 0 0 0 D45H11FP 50 100 150 Ambient Temperature---TA(℃) 200 0 50 100 150 200 Case Temperature---TC(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 4/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature D45H11FP Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 5/6 TO-220FP (C Forming) Dimension Marking: Device Name Date Code D45H11 □□ Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *Typical Inches Min. Max. 0.169 0.185 0.051 REF 0.110 0.126 0.098 0.114 0.020 0.030 0.043 0.053 0.059 0.069 0.020 0.030 0.392 0.408 DIM A A1 A2 A3 b b1 b2 c D Millimeters Min. Max. 4.300 4.700 1.300 REF 2.800 3.200 2.500 2.900 0.500 0.750 1.100 1.350 1.500 1.750 0.500 0.750 9.960 10.360 DIM E e F Φ h L L1 L2 Inches Min. Max. 0.583 0.598 0.100* 0.106 REF 0.138 REF 0.000 0.012 1.102 1.118 0.067 0.075 0.075 0.083 Millimeters Min. Max. 14.800 15.200 2.540* 2.700 REF 3.500 REF 0.000 0.300 28.000 28.400 1.700 1.900 1.900 2.100 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. D45H11FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C607FP Issued Date : 2008.04.07 Revised Date : 2013.10.29 Page No. : 6/6 TO-220FP (S Forming) Dimension Marking: Device Name Date Code D45H11 □□ Style: Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *Typical Inches Min. Max. 0.171 0.183 0.051 REF 0.112 0.124 0.102 0.110 0.020 0.030 0.031 0.041 0.047 REF 0.020 0.030 0.396 0.404 0.583 0.598 0.100 * 0.106 REF DIM A A1 A2 A3 b b1 b2 c D E e F Millimeters Min. Max. 4.35 4.65 1.300 REF 2.85 3.15 2.60 2.80 0.50 0.75 0.80 1.05 1.20 REF 0.500 0.750 10.06 10.26 14.80 15.20 2.54* 2.70 REF DIM G H H1 H2 J K L L1 L2 M N Inches Min. Max. 0.246 0.258 0.138 REF 0.055 REF 0.256 0.272 0.031 REF 0.020 1.102 1.118 0.043 0.051 0.036 0.043 0.067 REF 0.012 REF Millimeters Min. Max. 6.25 6.55 3.50 REF 1.40 REF 6.50 6.90 0.80 REF 0.50 REF 28.00 28.40 1.10 1.30 0.92 1.08 1.70 REF 0.30 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. D45H11FP CYStek Product Specification