± SLLS350L − APRIL 1999 − REVISED MARCH 2004 D Single-Chip and Single-Supply Interface for D D D D D D D D D D D D D D DB, DW, OR PW PACKAGE (TOP VIEW) IBM PC/AT Serial Port RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Three Drivers and Five Receivers Operates Up To 250 kbit/s Designed to Transmit at a Data Rate of 250 kbit/s Low Standby Current . . . 1 µA Typical External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Always-Active Noninverting Receiver Output (ROUT2B) Alternative High-Speed Pin-Compatible Device (1 Mbit/s) − SNx5C3243 Serial-Mouse Driveability Auto-Powerdown Feature to Disable Driver Outputs When No Valid RS-232 Signal Is Sensed Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment C2+ C2− V− RIN1 RIN2 RIN3 RIN4 RIN5 DOUT1 DOUT2 DOUT3 DIN3 DIN2 DIN1 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 C1+ V+ VCC GND C1− FORCEON FORCEOFF INVALID ROUT2B ROUT1 ROUT2 ROUT3 ROUT4 ROUT5 description/ordering information The MAX3243 consists of three line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD (HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. AT, IBM, and PC are trademarks of International Business Machines Corporation. Copyright 2004, Texas Instruments Incorporated !"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(, %$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"() )('"0'%0 3'%%'"(4 %$0+*(!$" -%$*,))!"5 0$,) "$( ",*,))'%!/4 !"*/+0, (,)(!"5 $# '// -'%'&,(,%) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 description/ordering information (continued) Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than −2.7 V or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE† TA SOIC (DW) 0°C to 70°C SSOP (DB) TSSOP (PW) SOIC (DW) −40°C to 85°C SSOP (DB) TSSOP (PW) Tube of 20 MAX3243CDW Reel of 1000 MAX3243CDWR Tube of 50 MAX3243CDB Reel of 2000 MAX3243CDBR Tube of 50 MAX3243CPW Reel of 2000 MAX3243CPWR Tube of 20 MAX3243IDW Reel of 1000 MAX3243IDWR Tube of 50 MAX3243IDB Reel of 2000 MAX3243IDBR Tube of 50 MAX3243IPW Reel of 2000 MAX3243IPWR TOP-SIDE MARKING MAX3243C MAX3243C MA3243C MAX3243I MAX3243I MB3243I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Function Tables EACH DRIVER INPUTS OUTPUT DOUT DRIVER STATUS X Z Powered off Normal operation with auto-powerdown disabled DIN FORCEON FORCEOFF VALID RIN RS-232 LEVEL X X L L H H X H H H H X L L L H Yes H H L H Yes L L L H No Z H L H No Z H = high level, L = low level, X = irrelevant, Z = high impedance 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 EACH RECEIVER INPUTS OUTPUTS RIN2 RIN1, RIN3−RIN5 FORCEOFF VALID RIN RS-232 LEVEL L X L H X L L L L H H L ROUT2B ROUT X L Z X H Z H Yes L H H Yes L L H Yes H H RECEIVER STATUS Powered off while ROUT2B is active H H H Yes H L Open Open H No L H Normal operation with auto-powerdown disabled/enabled H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off logic diagram (positive logic) DIN1 DIN2 DIN3 FORCEOFF FORCEON ROUT1 ROUT2B ROUT2 14 9 13 10 12 11 DOUT1 DOUT2 DOUT3 22 23 21 Auto-powerdown 19 4 20 5 kΩ 18 5 INVALID RIN1 RIN2 5 kΩ ROUT3 17 6 RIN3 5 kΩ ROUT4 7 16 RIN4 5 kΩ ROUT5 8 15 RIN5 5 kΩ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 6) VCC = 3.3 V VCC = 5 V Supply voltage VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VIL VI Driver and control low-level input voltage DIN, FORCEOFF, FORCEON Driver and control input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage TA VCC = 3.3 V VCC = 5 V MAX3243C Operating free-air temperature MAX3243I MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 V 2.4 0.8 V 0 5.5 V −25 25 V 0 70 −40 85 °C NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER II Input leakage current TEST CONDITIONS FORCEOFF, FORCEON Auto-powerdown disabled ICC Supply current Powered off VCC = 3.3 V or 5 V, 25 C TA = 25°C Auto-powerdown enabled No load, FORCEOFF and FORCEON at VCC No load, FORCEOFF at GND No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded, All DIN are grounded MIN TYP‡ MAX ±0.01 ±1 µA 0.3 1 mA 1 10 1 10 ‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT µA ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER VOH VOL VO IIH IIL TEST CONDITIONS MIN TYP† MAX UNIT High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 V Low-level output voltage All DOUT at RL = 3 kΩ to GND −5 −5.4 V Output voltage (mouse driveability) DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3, DOUT1 = DOUT2 = 2.5 mA ±5 High-level input current VI = VCC VI at GND Low-level input current IOS Short-circuit output current‡ VCC = 3.6 V, VCC = 5.5 V, ro Output resistance VCC, V+, and V− = 0 V, VO = 0 V VO = 0 V VO = ±2 V VO = ±12 V, 300 V ±0.01 ±1 µA ±0.01 ±1 µA ±35 ±60 mA Ω 10M ±25 VCC = 3 V to 3.6 V µA VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. ‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. Ioff Output leakage current FORCEOFF = GND switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER TEST CONDITIONS Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew§ CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ MIN TYP† 150 250 kbit/s 100 ns MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 UNIT V/µs † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 6) PARAMETER VOH VOL TEST CONDITIONS High-level output voltage IOH = −1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.3 V VCC = 5 V VIT− Negative-going input threshold voltage VCC = 3.3 V VCC = 5 V Vhys Ioff Input hysteresis (VIT+ − VIT−) MIN TYP† VCC−0.6 V VCC−0.1 V MAX V 0.4 1.6 2.4 1.9 2.4 0.6 1.1 0.8 1.4 ±0.05 FORCEOFF = 0 V ri Input resistance VI = ±3 V to ±25 V 3 5 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. V V V 0.5 Output leakage current (except ROUT2B) UNIT V ±10 µA 7 kΩ switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4) PARAMETER TEST CONDITIONS tPLH tPHL Propagation delay time, low- to high-level output ten tdis Output enable time Propagation delay time, high- to low-level output Output disable time Pulse skew‡ CL = 150 pF, See Figure 3 CL = 150 pF, RL = 3 kΩ, kΩ See Figure 4 MIN TYP† POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT 150 ns 150 ns 200 ns 200 ns tsk(p) See Figure 3 50 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. ‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. 6 MAX ns ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 AUTO-POWERDOWN SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT−(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC −2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC −0.3 VOH INVALID high-level output voltage IOH = −1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC TYP† MAX UNIT 2.7 V V 0.3 V VCC−0.6 V 0.4 V † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER tvalid tinvalid MIN TYP† MAX UNIT Propagation delay time, low- to high-level output 1 µs Propagation delay time, high- to low-level output 30 µs 100 µs ten Supply enable time † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 Ω RL 0V CL (see Note A) tTHL 3V FORCEOFF TEST CIRCUIT Output SR(tr) + 6V t THL or t TLH tTLH 3V −3 V 3V −3 V VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω Input 0V CL (see Note A) RL 1.5 V 1.5 V tPHL tPLH VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V FORCEON 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) 3V FORCEOFF tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 3V Input 3 V or 0 V FORCEON VCC S1 1.5 V 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V GND VOH Output 50% Output CL (see Note A) FORCEOFF Generator (see Note B) 0.3 V tPLZ (S1 at VCC) 50 Ω tPZL (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION 2.7 V 2.7 V 0V Receiver Input 0V 50 Ω −2.7 V −2.7 V ROUT Generator (see Note B) 3V −3 V tvalid tinvalid VCC INVALID Output Autopowerdown 50% VCC 0V ten INVALID CL = 30 pF (see Note A) ≈V+ V+ 0.3 V VCC 0V 0.3 V Supply Voltages FORCEOFF FORCEON 50% VCC DIN DOUT ≈V− V− TEST CIRCUIT VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ 2.7 V Indeterminate 0.3 V 0V If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† −0.3 V Indeterminate −2.7 V Valid RS-232 Level, INVALID High † Auto-powerdown disables drivers and reduces supply current to 1 µA. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 5. INVALID Propagation Delay Times and Supply Enabling Time POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 ± SLLS350L − APRIL 1999 − REVISED MARCH 2004 APPLICATION INFORMATION C1+ 1 + C2 − 2 3 V− GND C1− RIN2 RIN3 RIN4 RIN5 DOUT1 RS-232 Outputs VCC + RIN1 RS-232 Inputs C2− DOUT2 4 27 + − 26 25 C3† + CBYPASS − = 0.1 µF + − C1 24 23 FORCEON 5 Autopowerdown C4 − V+ C2+ 28 6 7 22 FORCEOFF 8 21 9 20 10 19 INVALID ROUT2B ROUT1 5 kΩ DOUT3 11 18 ROUT2 5 kΩ DIN3 12 Logic Outputs 17 ROUT3 5 kΩ Logic Inputs DIN2 13 16 ROUT4 5 kΩ DIN1 14 15 ROUT5 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 6. Typical Operating Circuit and Capacitor Values 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3243CDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDBE4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDWE4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243CPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDBE4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDW ACTIVE SOIC DW 28 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IDWRE4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3243IPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243IPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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