LM1458, LM1558 www.ti.com SNOSBU4D – APRIL 1998 – REVISED MARCH 2013 LM1458/LM1558 Dual Operational Amplifier Check for Samples: LM1458, LM1558 FEATURES 1 • • • 2 No Frequency Compensation Required Short-Circuit Protection Wide Common-Mode and Differential Voltage Ranges • • • Low-Power Consumption 8-Lead TO-99 and 8-Lead PDIP No Latch Up When Input Common Mode Range is Exceeded DESCRIPTION The LM1458 and the LM1558 are general purpose dual operational amplifiers. The two amplifiers share a common bias network and power supply leads. Otherwise, their operation is completely independent. The LM1458 is identical to the LM1558 except that the LM1458 has its specifications guaranteed over the temperature range from 0°C to +70°C instead of −55°C to +125°C. Connection Diagram Figure 1. TO-99 Package (Top View) See Package Number LMC (O-MBCY-W8) Figure 2. Dual-In-Line Package (Top View) See Package Number D (R-PDSO-G8) or P (R-PDIP-T8) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated LM1458, LM1558 SNOSBU4D – APRIL 1998 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) Supply Voltage LM1558 ±22V LM1458 ±18V Power Dissipation (4) LM1558H/LM1458H 500 mW LM1458N 400 mW Differential Input Voltage Input Voltage ±30V (5) ±15V Output Short-Circuit Duration Continuous Operating Temperature Range LM1558 LM1458 −55°C to +125°C 0°C to +70°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec.) 260°C Soldering Information PDIP Package Soldering (10 seconds) 260°C SOIC Package Vapor Phase (60 seconds) 215°C Infrared (15 seconds) 220°C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. ESD tolerance (1) (2) (3) (4) (5) (6) (6) 300V “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Refer to RETS 1558V for LM1558J and LM1558H military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. The maximum junction temperature of the LM1558 is 150°C, while that of the LM1458 is 100°C. For operating at elevated temperatures, devices in the LMC package must be derated based on a thermal resistance of 150°C/W, junction to ambient or 20°C/W, junction to case. For the PDIP the device must be derated based on a thermal resistance of 187°C/W, junction to ambient. For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage. Human body model, 1.5 kΩ in series with 100 pF. Electrical Characteristics (1) Parameter Conditions LM1558 Min Typ LM1458 Max Min Typ Units Max Input Offset Voltage TA = 25°C, RS ≤ 10 kΩ 1.0 5.0 1.0 6.0 mV Input Offset Current TA = 25°C 80 200 80 200 nA Input Bias Current TA = 25°C 200 500 200 500 Input Resistance TA = 25°C Supply Current Both Amplifiers TA = 25°C, VS = ±15V Large Signal Voltage Gain TA = 25°C, VS = ±15V 0.3 1.0 3.0 50 0.3 5.0 160 1.0 3.0 20 nA MΩ 5.6 160 mA V/mV VOUT = ±10V, RL ≥ 2 kΩ Input Offset Voltage RS ≤ 10 kΩ Input Offset Current Input Bias Current Large Signal Voltage Gain 6.0 7.5 mV 500 300 nA 1.5 VS = ±15V, VOUT = ±10V 25 0.8 15 μA V/mV RL ≥ kΩ Output Voltage Swing (1) 2 VS = ±15V, RL = 10 kΩ ±12 ±14 ±12 ±14 V RL = 2 kΩ ±10 ±13 ±10 ±13 V These specifications apply for VS = ±15V and −55°C ≤ TA ≤ 125°C, unless otherwise specified. With the LM1458, however, all specifications are limited to 0°C ≤ TA ≤ 70°C and VS = ±15V. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM1458 LM1558 LM1458, LM1558 www.ti.com SNOSBU4D – APRIL 1998 – REVISED MARCH 2013 Electrical Characteristics (1) (continued) Parameter Conditions LM1558 Min Typ LM1458 Max Min Typ Units Max Input Voltage Range VS = ±15V ±12 Common Mode Rejection Ratio RS ≤ 10 kΩ ±12 V 70 90 70 90 dB Supply Voltage Rejection Ratio RS ≤ 10 kΩ 77 96 77 96 dB SCHEMATIC DIAGRAM Numbers in parentheses are pin numbers for amplifier B. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM1458 LM1558 3 LM1458, LM1558 SNOSBU4D – APRIL 1998 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D • 4 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 3 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM1458 LM1558 PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM1458 MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 85 LM1458M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 1458M LM1458M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM 1458M LM1458MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM 1458M LM1458N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM1458N LM1558H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM1558H ~ LM1558H) LM1558H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H ~ LM1558H) MC1458CP1 OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70 LM1458N MC1458P1 OBSOLETE PDIP P 8 TBD Call TI Call TI 0 to 70 LM1458N MC1558G ACTIVE TO-99 LMC 8 TBD Call TI Call TI -55 to 125 500 ( LM1558H ~ LM1558H) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Jul-2016 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1458MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM1458MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1458MX SOIC D 8 2500 367.0 367.0 35.0 LM1458MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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