OKI Semiconductor MK70110/MK70120 PEDLMK70-02 Issue Date: Apr. 24, 2002 Preliminary Bluetooth Module GENERAL DESCRIPTION The MK70110 and MK70120 are Bluetooth modules that operate in the 2.4 GHz band. Mounted on the board of each of these modules are Bluetooth baseband & RF transceiver IC, RF filter, flash memory, and TCXO. Lower protocol stacks up to the HCI are already installed in these modules as software. These modules can be connected to user’s board product by using the connector the modules have. Since the modules are provided not only with the UART and USB interfaces as communication control interfaces but with a PCM interface as a voice control interface, they can cope with any application for data and voice communication. The MK70110 is equipped with an RF coaxial connector, and the MK70120 has a chip antenna built-in. By utilizing the MK70110/MK70120, the development TAT for products equipped with Bluetooth can be shortened very effectively. FEATURES • • • • • • Conforms to the Bluetooth Specification Version 1.1 Optimized design where originally developed LSI chips and authorized Oki software are used HCI full module includes Bluetooth baseband IC & RF transceiver IC, flash memory and TCXO RF output power: Class 2 RF I/O: MK70110: RF coaxial connector / MK70120: Internal chip antenna Interfaces provided UART interface* (up to 921.6 kbps) USB interface* (USB1.1-conformed) PCM interface (selectable between PCM Linear/A-law/µ-law) * Supports HCI commands. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development. 1/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 BLOCK DIAGRAM 20-Pin Connector ANT Chip MK70120 GND VDD Voltage Regulator RESET ** XCLK BB_LSI ML70Q511LA CPU ARM7TDMI ANT Connector RF_LSI ML7050LA Baseband Core 4 Mbit Flash ROM ~ PCM I/F 32 KB SRAM Osc. 13 MHz VBUS TEST1 PCM_IN PCM_OUT PCM_CLK PCM_SYNC UART_RD UART_TD * UART_CTS * UART_RTS PCM I/F BPF MK70110 (32 kHz ±200 ppm) USB_D+ USB_D– USB I/F Note: * indicates that the pin will be supported later. ** XCLK is optional ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power supply voltage VDD Ta = 25°C –0.3 to 4.5 V Input voltage VIN Ta = 25°C –0.3 to 4.5 V Input RF power — Ta = 25°C 20 dBm Storage temperature Tstg — –20 to +70 °C 2/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Typ. Max. Unit Power supply voltage VDD — 3.2 — 3.45 V “H” level input voltage Vih — 2.2 — 3.6 V “L” level input voltage Vil — 0 — 0.8 V Operating temperature TOP — 0 25 50 °C ELECTRICAL CHARACTERISTICS Specifications in this section are fulfilled under the conditions that VDD = 3.3 V ±0.1 V, Ta = 0 to 50°C. Values of the RF characteristics represent those specified at the edge of the module for both the MK70110 and the MK70120. General Specifications Items Conformance Specifications Power Class Frequency range Specification Bluetooth Specification Version 1.1 Note — Class 2 — 2,402 to 2,480 MHz — Number of channels 79ch — Channel separation 1 MHz — Modulation method RF input-output impedance Symbol Rate GFSK — Nominal 50 Ω 2,402 to 2,480 MHz 1 Mbps — 3/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 DC Characteristics Output voltage (Applies to digital pins except USB ports) Symbol Min. Typ. Max. Unit “H” level output voltage Parameter Voh 2.4 — — V “L” level output voltage Vol — — 0.4 V Symbol Min. Typ. Max. Unit “H” level output voltage Voh 2.8 — 3.6 V “L” level output voltage Vol — — 0.3 V Output voltage (Applies to USB ports (USB_D+, USB_D–)) Parameter Power consumption (UART interface, with 32 kHz XCLK) Typ. Max. Unit Initialize (Stop mode) Mode 10 — mA Idle (Cold standby) 6 — mA Hold mode (Slave) 40 — mA Sniff mode (Slave) 40 — mA ACL connection DH1 103 125 mA SCO connection HV1 113 135 mA RF Transmission Characteristics Min. Max. Unit Output power Parameter –6 +4 dBm Frequency deviation –50 +50 kHz DH1 –25 +25 kHz DH3, DH5 –40 +40 kHz ∆f1avg: payload = 11110000 140 175 kHz ∆f2max: payload = 1010… 115 — kHz ∆f2avg/∆f1avg 80 — % 20 dB band width — 1 MHz Freq. offset = ±2 MHz — –20 dBm Freq. offset ≥ ±3 MHz — –40 dBm 30 MHz ≤ f < 1GHz — –36 dBm 1 GHz ≤ f ≤ 12.75 GHz — –30 dBm 1.8 GHz ≤ f ≤ 1.9 GHz — –47 dBm 5.15 GHz ≤ f ≤ 5.30 GHz — –47 dBm Remarks Frequency drift Frequency shift Measured by peak detection In-band spurious emission Out-of-band spurious emission 4/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 Reception Characteristics Parameter Reception sensitivity Min. Max. Unit — 0.1 % Remarks at –70 dBm input Specification at ordinary temperature C/I characteristics Co-channel — 14 dB Adjacent channel C/I = 1 MHz — 4 dB Adjacent channel C/I = 2 MHz — –30*1 dB Adjacent channel C/I ≥ 3 MHz — –40*1 dB *2 (Bluetooth Ver.1.1 Test Specification) Image frequency — –6 dB Image frequency ±1 MHz*2 — –16 dB 30 MHz ≤ f < 2,000 MHz –10 — dBm 2,000 MHz ≤ f ≤ 2,399 MHz –27 — dBm 2,498 MHz ≤ f < 3,000 MHz –27 — dBm 3,000 MHz ≤ f ≤ 12.75 GHz –10 — dBm Intermodulation characteristic –25 — dB Specification at ordinary temperature — 0.1 % Specification at ordinary temperature, at –20 dBm input 30 MHz ≤ f < 1 GHz — –57 dBm 1 GHz ≤ f ≤ 12.75 GHz — –47 dBm Specification at ordinary temperature Out-of-band blocking Maximum input level Limit of collateral radio waves Spurious emission during inquiry scan operation *1 Relaxed C/I specification On five spurious response frequencies with a distance of ≥ 2 MHz from the wanted signal (except for image frequency and image ±1 MHz), a relaxed interference requirement C/I = –17 dB is applied. (According to Bluetooth Specification 1.1, Part A Radio Specification) *2 Image Frequencies and adjacent interference to image Image frequency = Co-channel –4 MHz ±1 MHz adjacent interference to image frequency = Co-channel –3 MHz, Co-channel –5 MHz 5/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 MECHANICAL CHARACTERISTICS Weight Specifications Model Name Weight MK70120 (antenna built-in type) 3.6 g (Max.) MK70110 (RF coaxial connector type) 3.5 g (Max.) RF I/O Pin Specifications The following chip antenna and RF coaxial connector are mounted: Model Name RF I/O Type Manufacturer / Model Name MK70120 Chip antenna MURATA MFG. / ANCM12G45 MK70110 RF coaxial connector HIROSE ELECTRIC / U.FL-R-SMT Connector Specifications The following board-to-board connector is mounted: Interface Type Board-to-board connector Manufacturer / Series Name Matsushita Electric Works / AXK6F20345 A header is mounted on the module side. It is therefore recommended that a 2.0 mm high socket (AXK5F20545) be used against the socket insertion side of the connector. Board-to-board Connector Detail 6/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 CONNECTOR PIN DESCRIPTIONS Pin Symbol Type Description 5, 6, 7 VDD — Power supply pin 15, 16 GND — Ground pin 1 UART_RTS O If Not Used *1 — — *2 UART Ready To Send (transmission data ready) *2 Pull_up or VDD 19 UART_CTS I UART Clear To Send (transmission ready) 2 UART_TD O UART transmission data Pull_down or GND Pull_up or VDD 20 UART_RD I UART receive data Pull_up or VDD 12 USB_D+ I/O USB Data + Open 9 USB_D– I/O USB Data – Open HCI transport selection pin 13 VBUS I 4 PCM_OUT O H: USB is used as HCI L: UART is used as HCI — adhering to the above logic at power-on 17 PCM_IN I PCM data output PCM data input Open *5 Open *5 3 PCM_CLK O PCM clock output (64 kHz/128 kHz) 18 PCM_SYNC O PCM synchronous signal input (8 kHz) I Reset signal input pin Reset = L Effective reset pulse width > 10 µsec *6 Open *5 Open 8 RESET Pull_up 14 XCLK I Subclock input pin 32 kHz*3 GND 11 TEST1 I Test pin for our company's use*4 Open 10 N.C — N.C. Open *1 Mount an approximately 10 µF tantalum or electrolytic capacitor to the power supply input pin. The capacitor should be mounted as close to the power supply pin of the module as possible. *2 At present, this pin is not supported. Must be left open. *3 At present, this pin does not support a 32 kHz sub-clock. Connect to GND. *4 Test pin for our company’s use. Must be left open. *5 The PCM_IN, CLK, and SYNC pins are pulled-down internally. *6 Setting the reset signal input pin RESET to a “L” level can reset the LSI. The reset state of the LSI is held for a duration of 10 msec even after the reset signal is switched to a “H” level. 7/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 INTERFACE SPECIFICATIONS USB Interface • Conforms to USB1.1 • Supports 12 Mbps Parameter Symbol Rise time TR Fall time TF Condition [1], [2], [3] CL = 50 pF Min. Typ. Max. 4 — 20 4 — 20 Unit ns Output signal crossover voltage VCRS CL = 50 pF 1.3 — 2 V Driver output resistance ZDRV When being driven in a steady state 28 — 44 Ω 11.97 — 12.03 Mbps Data rate [1] TDRATE Average bit rate (12 Mbps ±0.25%) TR and TF are the intervals of the transition time from 10% to 90% (TR) or from 90% to 10% (TF) of an amplitude. [2] Input signal crossover point (When USB connector is not attached) VDD 0V 0.8VDD 0.8VDD 0.2VDD 0.2VDD UART Interface Various settings can be made for the UART interface by using the Vendor specific command (refer to the ML70110/MK70120 User’s Manual). The default values are as follows: • Baud rate: 115.2 kbps • Parity: Non-parity • Data length: 8 bits • Stop bit: 1 bit • Flow control: off PCM Interface • Application format PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/µ-law • Bluetooth format CVSD/A-law/µ-law 8/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 8 bits or 16 bits PCMCLK (64kHz or 128kHz) LSB MSB DATA DATA DATA LSB MSB DATA LSB MSB DATA PCMOUT Data is output at the timing of CLK rise. PCMSYNC 125 µs (8 kHz) PCM Output Timing 8 bits or 16 bits PCMCLK (64kHz or 128kHz) LSB MSB DATA DATA DATA PCMIN Data is captured at the timing of CLK fall. PCMSYNC 125 µs (8 kHz) PCM Input Timing 9/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 PCM Timing Specifications Parameter Symbol Condition Min. Typ. Max. PCMIN setup time to PCMCLK (input) fall tPC0 500 — — PCMIN hold time to PCMCLK (input) fall tPC1 500 — — PCMOUT setup time to PCMCLK (input) rise tPC2 500 — — PCMOUT hold time to PCMCLK (input) rise tPC3 500 — — PCMSYNC (input) setup time to PCMCLK (input) rise tPC4 500 — — PCMSYNC (input) hold time to PCMCLK (input) rise tPC5 500 — — Delay time from PCMCLK (input) rise to PCMSYNC (output) tPC6 — — 500 PCMIN setup time to PCMCLK (output) fall tPC7 500 — — PCMIN hold time to PCMCLK (output) fall tPC8 500 — — PCMOUT setup time to PCMCLK (output) rise tPC9 500 — — PCMOUT hold time to PCMCLK (output) rise tPC10 500 — — PCMSYNC (input) setup time to PCMCLK (output) rise tPC11 500 — — PCMSYNC (input) hold time to PCMCLK (output) rise tPC12 500 — — Delay time from PCMCLK (output) rise to PCMSYNC (output) tPC13 — — 500 CL = 50 pF Unit ns PCMCLK (input) PCMIN tPC0 tPC1 PCMOUT tPC2 tPC3 tPC2 tPC3 tPC4 tPC5 tPC4 tPC5 PCMSYNC (input) PCMSYNC (output) tPC6 PCMCLK (output) PCMIN tPC7 tPC8 PCMOUT tPC9 tPC10 tPC9 tPC10 tPC11 tPC12 tPC11 tPC12 PCMSYNC (input) PCMSYNC (output) tPC13 PCM Timing 10/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 MOUNTING MODULE Recommended Module Fixing Method When this module is fixed on a product, our recommended method is to fit the module board-to-board connector (header) into the board-to-board connector (socket) mounted on the product board, and to solder the module shielding case to the product board. Soldering Pattern 25.1 3.6 9.5 3.0 Pattern inhibiting zone 4.2 17.5 13.2 4.0 Pad dimension Unit: [mm] 11.7 Board-to-board connector (AXK5F20545) 30.5 29.4 26.4 7.9 4.9 1.5 mm maximum (three soldering points) The pattern inhibiting zone is applied to the MK70120 (antenna built-in type). : Soldering points Unit: [mm] Soldering points in the shielding case for fixation on a product board 11/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 Notes on Mounting the Module 1. This module is not adaptable to reflow mounting. When soldering the shielding case to a product board, use a soldering iron. 2. If metal is placed around the antenna, the antenna characteristics may deteriorate. Do not place copper foil in the pattern inhibiting zone shown in the above section. Do not place metal around the antenna if possible. (Only for MK70120). 3. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding case and the pattern. For example, apply resist on the entire surface that touches the shielding case. 4. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the connection with better electrical characteristics in the module mounted state. CAUTIONS IN USE This module consists of precision electronic components. Therefore, note the following when handling the module: 1. In a case of decomposition or recomposition of this module, the operations in these specifications are not assured. 2. This module is not waterproof or drip-proof. Do not use the module in wet locations. 3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty places. 12/16 RF Coaxial Connector Case Board to Board Connector Lot No. Label Board to Board Connector Assignment PEDLMK70-02 OKI Semiconductor MK70110/MK70120 MODULE OUTLINE Outline of MK70110 13/16 Chip Antenna Case Board to Board Connector Lot No. Label Board to Board Connector Assignment PEDLMK70-02 OKI Semiconductor MK70110/MK70120 Outline of MK70120 14/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 REVISION HISTORY Document No. PEDLMK70-01 Page Date Previous Edition Current Edition Aug. 2001 – – Description Preliminary edition 1 Preliminary edition 2 PEDLMK70-02 Apr. 24, 2002 – – Owing to the device name change from MK70 Series to MK70110/MK70120, the contents have been changed throughout the document. 15/16 PEDLMK70-02 OKI Semiconductor MK70110/MK70120 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd. 16/16