OKI MK70120 Bluetooth module Datasheet

OKI Semiconductor
MK70110/MK70120
PEDLMK70-02
Issue Date: Apr. 24, 2002
Preliminary
Bluetooth Module
GENERAL DESCRIPTION
The MK70110 and MK70120 are Bluetooth modules that operate in the 2.4 GHz band. Mounted on the board of
each of these modules are Bluetooth baseband & RF transceiver IC, RF filter, flash memory, and TCXO. Lower
protocol stacks up to the HCI are already installed in these modules as software. These modules can be connected
to user’s board product by using the connector the modules have. Since the modules are provided not only with the
UART and USB interfaces as communication control interfaces but with a PCM interface as a voice control
interface, they can cope with any application for data and voice communication.
The MK70110 is equipped with an RF coaxial connector, and the MK70120 has a chip antenna built-in.
By utilizing the MK70110/MK70120, the development TAT for products equipped with Bluetooth can be
shortened very effectively.
FEATURES
•
•
•
•
•
•
Conforms to the Bluetooth Specification Version 1.1
Optimized design where originally developed LSI chips and authorized Oki software are used
HCI full module includes Bluetooth baseband IC & RF transceiver IC, flash memory and TCXO
RF output power: Class 2
RF I/O: MK70110: RF coaxial connector / MK70120: Internal chip antenna
Interfaces provided
UART interface* (up to 921.6 kbps)
USB interface* (USB1.1-conformed)
PCM interface (selectable between PCM Linear/A-law/µ-law)
* Supports HCI commands.
BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry.
The information contained herein can change without notice owing to the product being under development.
1/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
BLOCK DIAGRAM
20-Pin Connector
ANT Chip
MK70120
GND
VDD
Voltage
Regulator
RESET
** XCLK
BB_LSI ML70Q511LA
CPU
ARM7TDMI
ANT
Connector
RF_LSI
ML7050LA
Baseband
Core
4 Mbit
Flash ROM
~
PCM
I/F
32 KB
SRAM
Osc.
13 MHz
VBUS
TEST1
PCM_IN
PCM_OUT
PCM_CLK
PCM_SYNC
UART_RD
UART_TD
* UART_CTS
* UART_RTS
PCM
I/F
BPF
MK70110
(32 kHz ±200 ppm)
USB_D+
USB_D–
USB
I/F
Note: * indicates that the pin will be supported later.
** XCLK is optional
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Power supply voltage
VDD
Ta = 25°C
–0.3 to 4.5
V
Input voltage
VIN
Ta = 25°C
–0.3 to 4.5
V
Input RF power
—
Ta = 25°C
20
dBm
Storage temperature
Tstg
—
–20 to +70
°C
2/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Power supply voltage
VDD
—
3.2
—
3.45
V
“H” level input voltage
Vih
—
2.2
—
3.6
V
“L” level input voltage
Vil
—
0
—
0.8
V
Operating temperature
TOP
—
0
25
50
°C
ELECTRICAL CHARACTERISTICS
Specifications in this section are fulfilled under the conditions that VDD = 3.3 V ±0.1 V, Ta = 0 to 50°C. Values of
the RF characteristics represent those specified at the edge of the module for both the MK70110 and the MK70120.
General Specifications
Items
Conformance Specifications
Power Class
Frequency range
Specification
Bluetooth Specification
Version 1.1
Note
—
Class 2
—
2,402 to 2,480 MHz
—
Number of channels
79ch
—
Channel separation
1 MHz
—
Modulation method
RF input-output impedance
Symbol Rate
GFSK
—
Nominal 50 Ω
2,402 to 2,480 MHz
1 Mbps
—
3/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
DC Characteristics
Output voltage (Applies to digital pins except USB ports)
Symbol
Min.
Typ.
Max.
Unit
“H” level output voltage
Parameter
Voh
2.4
—
—
V
“L” level output voltage
Vol
—
—
0.4
V
Symbol
Min.
Typ.
Max.
Unit
“H” level output voltage
Voh
2.8
—
3.6
V
“L” level output voltage
Vol
—
—
0.3
V
Output voltage (Applies to USB ports (USB_D+, USB_D–))
Parameter
Power consumption (UART interface, with 32 kHz XCLK)
Typ.
Max.
Unit
Initialize (Stop mode)
Mode
10
—
mA
Idle (Cold standby)
6
—
mA
Hold mode (Slave)
40
—
mA
Sniff mode (Slave)
40
—
mA
ACL connection DH1
103
125
mA
SCO connection HV1
113
135
mA
RF Transmission Characteristics
Min.
Max.
Unit
Output power
Parameter
–6
+4
dBm
Frequency deviation
–50
+50
kHz
DH1
–25
+25
kHz
DH3, DH5
–40
+40
kHz
∆f1avg: payload = 11110000
140
175
kHz
∆f2max: payload = 1010…
115
—
kHz
∆f2avg/∆f1avg
80
—
%
20 dB band width
—
1
MHz
Freq. offset = ±2 MHz
—
–20
dBm
Freq. offset ≥ ±3 MHz
—
–40
dBm
30 MHz ≤ f < 1GHz
—
–36
dBm
1 GHz ≤ f ≤ 12.75 GHz
—
–30
dBm
1.8 GHz ≤ f ≤ 1.9 GHz
—
–47
dBm
5.15 GHz ≤ f ≤ 5.30 GHz
—
–47
dBm
Remarks
Frequency drift
Frequency shift
Measured by peak detection
In-band spurious emission
Out-of-band spurious emission
4/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
Reception Characteristics
Parameter
Reception sensitivity
Min.
Max.
Unit
—
0.1
%
Remarks
at –70 dBm input
Specification at ordinary temperature
C/I characteristics
Co-channel
—
14
dB
Adjacent channel C/I = 1 MHz
—
4
dB
Adjacent channel C/I = 2 MHz
—
–30*1
dB
Adjacent channel C/I ≥ 3 MHz
—
–40*1
dB
*2
(Bluetooth Ver.1.1 Test Specification)
Image frequency
—
–6
dB
Image frequency ±1 MHz*2
—
–16
dB
30 MHz ≤ f < 2,000 MHz
–10
—
dBm
2,000 MHz ≤ f ≤ 2,399 MHz
–27
—
dBm
2,498 MHz ≤ f < 3,000 MHz
–27
—
dBm
3,000 MHz ≤ f ≤ 12.75 GHz
–10
—
dBm
Intermodulation characteristic
–25
—
dB
Specification at ordinary temperature
—
0.1
%
Specification at ordinary temperature, at
–20 dBm input
30 MHz ≤ f < 1 GHz
—
–57
dBm
1 GHz ≤ f ≤ 12.75 GHz
—
–47
dBm
Specification at ordinary temperature
Out-of-band blocking
Maximum input level
Limit of collateral radio waves
Spurious emission during inquiry scan
operation
*1 Relaxed C/I specification
On five spurious response frequencies with a distance of ≥ 2 MHz from the wanted signal (except for
image frequency and image ±1 MHz), a relaxed interference requirement C/I = –17 dB is applied.
(According to Bluetooth Specification 1.1, Part A Radio Specification)
*2 Image Frequencies and adjacent interference to image
Image frequency = Co-channel –4 MHz
±1 MHz adjacent interference to image frequency = Co-channel –3 MHz, Co-channel –5 MHz
5/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
MECHANICAL CHARACTERISTICS
Weight Specifications
Model Name
Weight
MK70120 (antenna built-in type)
3.6 g (Max.)
MK70110 (RF coaxial connector type)
3.5 g (Max.)
RF I/O Pin Specifications
The following chip antenna and RF coaxial connector are mounted:
Model Name
RF I/O Type
Manufacturer / Model Name
MK70120
Chip antenna
MURATA MFG. / ANCM12G45
MK70110
RF coaxial connector
HIROSE ELECTRIC / U.FL-R-SMT
Connector Specifications
The following board-to-board connector is mounted:
Interface Type
Board-to-board connector
Manufacturer / Series Name
Matsushita Electric Works / AXK6F20345
A header is mounted on the module side.
It is therefore recommended that a 2.0 mm high socket (AXK5F20545) be used against the socket
insertion side of the connector.
Board-to-board Connector Detail
6/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
CONNECTOR PIN DESCRIPTIONS
Pin
Symbol
Type
Description
5, 6, 7
VDD
—
Power supply pin
15, 16
GND
—
Ground pin
1
UART_RTS
O
If Not Used
*1
—
—
*2
UART Ready To Send (transmission data ready)
*2
Pull_up or VDD
19
UART_CTS
I
UART Clear To Send (transmission ready)
2
UART_TD
O
UART transmission data
Pull_down or GND
Pull_up or VDD
20
UART_RD
I
UART receive data
Pull_up or VDD
12
USB_D+
I/O
USB Data +
Open
9
USB_D–
I/O
USB Data –
Open
HCI transport selection pin
13
VBUS
I
4
PCM_OUT
O
H: USB is used as HCI
L: UART is used as HCI
—
adhering to the above logic at power-on
17
PCM_IN
I
PCM data output
PCM data input
Open
*5
Open
*5
3
PCM_CLK
O
PCM clock output (64 kHz/128 kHz)
18
PCM_SYNC
O
PCM synchronous signal input (8 kHz)
I
Reset signal input pin Reset = L
Effective reset pulse width > 10 µsec
*6
Open
*5
Open
8
RESET
Pull_up
14
XCLK
I
Subclock input pin 32 kHz*3
GND
11
TEST1
I
Test pin for our company's use*4
Open
10
N.C
—
N.C.
Open
*1 Mount an approximately 10 µF tantalum or electrolytic capacitor to the power supply input pin.
The capacitor should be mounted as close to the power supply pin of the module as possible.
*2 At present, this pin is not supported. Must be left open.
*3 At present, this pin does not support a 32 kHz sub-clock. Connect to GND.
*4 Test pin for our company’s use. Must be left open.
*5 The PCM_IN, CLK, and SYNC pins are pulled-down internally.
*6 Setting the reset signal input pin RESET to a “L” level can reset the LSI. The reset state of the LSI is
held for a duration of 10 msec even after the reset signal is switched to a “H” level.
7/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
INTERFACE SPECIFICATIONS
USB Interface
• Conforms to USB1.1
• Supports 12 Mbps
Parameter
Symbol
Rise time
TR
Fall time
TF
Condition
[1], [2], [3]
CL = 50 pF
Min.
Typ.
Max.
4
—
20
4
—
20
Unit
ns
Output signal crossover voltage
VCRS
CL = 50 pF
1.3
—
2
V
Driver output resistance
ZDRV
When being driven in
a steady state
28
—
44
Ω
11.97
—
12.03
Mbps
Data rate
[1]
TDRATE
Average bit rate
(12 Mbps ±0.25%)
TR and TF are the intervals of the transition time from 10% to 90% (TR) or from 90% to 10% (TF) of
an amplitude.
[2] Input signal crossover point (When USB connector is not attached)
VDD
0V
0.8VDD
0.8VDD
0.2VDD
0.2VDD
UART Interface
Various settings can be made for the UART interface by using the Vendor specific command (refer to the
ML70110/MK70120 User’s Manual).
The default values are as follows:
• Baud rate:
115.2 kbps
• Parity:
Non-parity
• Data length: 8 bits
• Stop bit:
1 bit
• Flow control: off
PCM Interface
• Application format
PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/µ-law
• Bluetooth format
CVSD/A-law/µ-law
8/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
8 bits or 16 bits
PCMCLK (64kHz
or 128kHz)
LSB
MSB
DATA
DATA
DATA
LSB
MSB
DATA
LSB
MSB
DATA
PCMOUT
Data is output at the timing of CLK rise.
PCMSYNC
125 µs (8 kHz)
PCM Output Timing
8 bits or 16 bits
PCMCLK (64kHz
or 128kHz)
LSB
MSB
DATA
DATA
DATA
PCMIN
Data is captured at the timing of CLK fall.
PCMSYNC
125 µs (8 kHz)
PCM Input Timing
9/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
PCM Timing Specifications
Parameter
Symbol Condition
Min.
Typ.
Max.
PCMIN setup time to PCMCLK (input) fall
tPC0
500
—
—
PCMIN hold time to PCMCLK (input) fall
tPC1
500
—
—
PCMOUT setup time to PCMCLK (input) rise
tPC2
500
—
—
PCMOUT hold time to PCMCLK (input) rise
tPC3
500
—
—
PCMSYNC (input) setup time to PCMCLK (input) rise
tPC4
500
—
—
PCMSYNC (input) hold time to PCMCLK (input) rise
tPC5
500
—
—
Delay time from PCMCLK (input) rise to PCMSYNC (output)
tPC6
—
—
500
PCMIN setup time to PCMCLK (output) fall
tPC7
500
—
—
PCMIN hold time to PCMCLK (output) fall
tPC8
500
—
—
PCMOUT setup time to PCMCLK (output) rise
tPC9
500
—
—
PCMOUT hold time to PCMCLK (output) rise
tPC10
500
—
—
PCMSYNC (input) setup time to PCMCLK (output) rise
tPC11
500
—
—
PCMSYNC (input) hold time to PCMCLK (output) rise
tPC12
500
—
—
Delay time from PCMCLK (output) rise to PCMSYNC (output)
tPC13
—
—
500
CL = 50
pF
Unit
ns
PCMCLK (input)
PCMIN
tPC0
tPC1
PCMOUT
tPC2
tPC3
tPC2
tPC3
tPC4
tPC5
tPC4
tPC5
PCMSYNC (input)
PCMSYNC (output)
tPC6
PCMCLK (output)
PCMIN
tPC7
tPC8
PCMOUT
tPC9
tPC10
tPC9
tPC10
tPC11
tPC12
tPC11
tPC12
PCMSYNC (input)
PCMSYNC (output)
tPC13
PCM Timing
10/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
MOUNTING MODULE
Recommended Module Fixing Method
When this module is fixed on a product, our recommended method is to fit the module board-to-board connector
(header) into the board-to-board connector (socket) mounted on the product board, and to solder the module
shielding case to the product board.
Soldering Pattern
25.1
3.6
9.5
3.0
Pattern
inhibiting
zone
4.2
17.5
13.2
4.0
Pad dimension
Unit: [mm]
11.7
Board-to-board connector
(AXK5F20545)
30.5
29.4
26.4
7.9
4.9
1.5 mm maximum (three soldering points)
The pattern inhibiting zone is applied to the MK70120 (antenna built-in type).
: Soldering points
Unit: [mm]
Soldering points in the shielding case for fixation on a product board
11/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
Notes on Mounting the Module
1. This module is not adaptable to reflow mounting. When soldering the shielding case to a product board, use a
soldering iron.
2. If metal is placed around the antenna, the antenna characteristics may deteriorate. Do not place copper foil in
the pattern inhibiting zone shown in the above section. Do not place metal around the antenna if possible.
(Only for MK70120).
3. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that
touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding
case and the pattern. For example, apply resist on the entire surface that touches the shielding case.
4. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the
connection with better electrical characteristics in the module mounted state.
CAUTIONS IN USE
This module consists of precision electronic components. Therefore, note the following when handling the
module:
1. In a case of decomposition or recomposition of this module, the operations in these specifications are not
assured.
2. This module is not waterproof or drip-proof. Do not use the module in wet locations.
3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty
places.
12/16
RF Coaxial Connector
Case
Board to Board Connector
Lot No.
Label
Board to Board Connector Assignment
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
MODULE OUTLINE
Outline of MK70110
13/16
Chip Antenna
Case
Board to Board Connector
Lot No.
Label
Board to Board Connector Assignment
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
Outline of MK70120
14/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
REVISION HISTORY
Document
No.
PEDLMK70-01
Page
Date
Previous
Edition
Current
Edition
Aug. 2001
–
–
Description
Preliminary edition 1
Preliminary edition 2
PEDLMK70-02
Apr. 24, 2002
–
–
Owing to the device name change from MK70
Series to MK70110/MK70120, the contents
have been changed throughout the document.
15/16
PEDLMK70-02
OKI Semiconductor
MK70110/MK70120
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2002 Oki Electric Industry Co., Ltd.
16/16
Similar pages