AD AD9959BCPZ1 4-channel, 500 msps dds with 10-bit dac Datasheet

4-Channel, 500 MSPS DDS
with 10-Bit DACs
AD9959
FEATURES
Software-/hardware-controlled power-down
Dual supply operation (1.8 V DDS core/3.3 V serial I/O)
Multiple device synchronization
Selectable 4× to 20× REFCLK multiplier (PLL)
Selectable REFCLK crystal oscillator
56-lead LFCSP package
4 synchronized DDS channels @ 500 MSPS
Independent frequency/phase/amplitude control between
channels
Matched latencies for frequency/phase/amplitude changes
Excellent channel-to-channel isolation (>65 dB)
Linear frequency/phase/amplitude sweeping capability
Up to 16 levels of frequency/phase/amplitude modulation
(pin-selectable)
4 integrated 10-bit digital-to-analog converters (DACs)
Individually programmable DAC full-scale currents
0.12 Hz or better frequency tuning resolution
14-bit phase offset resolution
10-bit output amplitude scaling resolution
Serial I/O port interface (SPI) with enhanced data throughput
APPLICATIONS
Agile local oscillators
Phased array radars/sonars
Instrumentation
Synchronized clocking
RF source for AOTF
FUNCTIONAL BLOCK DIAGRAM
(4)
500MSPS
10-BIT DAC
RECONSTRUCTED
SINE WAVE
10-BIT DAC
RECONSTRUCTED
SINE WAVE
10-BIT DAC
RECONSTRUCTED
SINE WAVE
10-BIT DAC
RECONSTRUCTED
SINE WAVE
DDS CORES
SYSTEM
CLOCK
SOURCE
REF CLOCK
INPUT CIRCUITRY
TIMING AND
CONTROL
USER INTERFACE
05246-101
MODULATION
CONTROL
Figure 1.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
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www.analog.com
Fax: 781.461.3113 ©2005–2008 Analog Devices, Inc. All rights reserved.
AD9959
TABLE OF CONTENTS
Features .............................................................................................. 1
Linear Sweep Mode .................................................................... 25
Applications ....................................................................................... 1
Linear Sweep No-Dwell Mode ................................................. 26
Functional Block Diagram .............................................................. 1
Sweep and Phase Accumulator Clearing Functions .............. 27
General Description ......................................................................... 3
Output Amplitude Control Mode ............................................ 28
Specifications..................................................................................... 4
Synchronizing Multiple AD9959 Devices ................................... 29
Absolute Maximum Ratings............................................................ 8
Automatic Mode Synchronization ........................................... 29
ESD Caution .................................................................................. 8
Manual Software Mode Synchronization................................ 29
Pin Configuration and Function Descriptions ............................. 9
Manual Hardware Mode Synchronization .............................. 29
Typical Performance Characteristics ........................................... 11
I/O_UPDATE, SYNC_CLK, and System Clock
Relationships ............................................................................... 30
Application Circuits ....................................................................... 14
Equivalent Input and Output Circuits ......................................... 17
Theory of Operation ...................................................................... 18
DDS Core..................................................................................... 18
Digital-to-Analog Converter .................................................... 18
Modes of Operation ....................................................................... 19
Channel Constraint Guidelines ................................................ 19
Power Supplies ............................................................................ 19
Single-Tone Mode ...................................................................... 19
Reference Clock Modes ............................................................. 20
Scalable DAC Reference Current Control Mode ................... 21
Power-Down Functions ............................................................. 21
Modulation Mode....................................................................... 21
Modulation Using SDIO_x Pins for RU/RD........................... 24
Serial I/O Port ................................................................................. 31
Overview ..................................................................................... 31
Instruction Byte Description .................................................... 32
Serial I/O Port Pin Description ................................................ 32
Serial I/O Port Function Description ...................................... 32
MSB/LSB Transfer Description ................................................ 32
Serial I/O Modes of Operation ................................................. 33
Register Maps and Bit Descriptions ............................................. 36
Register Maps .............................................................................. 36
Descriptions for Control Registers .......................................... 39
Descriptions for Channel Registers ......................................... 41
Outline Dimensions ....................................................................... 44
Ordering Guide .......................................................................... 44
REVISION HISTORY
7/08—Rev. A to Rev. B
Added Pin Profile Toggle Rate Parameter in Table 1 ................... 6
Changes to Figure 24 ...................................................................... 14
Changes to Figure 31 ...................................................................... 17
Changes to Reference Clock Input Circuitry Section ................ 20
Changes to Operation Section ...................................................... 29
Changes to Figure 40 ...................................................................... 30
Changes to Serial Data I/O (SDIO_0, SDIO_1, SDIO_3)
Section .............................................................................................. 32
Changes to Table 38 ........................................................................ 43
Added Exposed Pad Notation to Outline Dimensions ............. 44
3/08—Rev. 0 to Rev. A
Changes to Features.......................................................................... 1
Inserted Figure 1 ............................................................................... 1
Changes to Input Level Specification ............................................. 4
Changes to Layout ............................................................................ 8
Changes to Table 3 ............................................................................ 9
Added Equivalent Input and Output Circuits Section .............. 17
Changes to Figure 35...................................................................... 21
Changes to Setting the Slope of the Linear Sweep Section ....... 25
Changes to Frequency Linear Sweep Example: AFP Bits = 10
Section.............................................................................................. 26
Changes to Figure 37...................................................................... 26
Changes to Figure 38 and Figure 39............................................. 27
Added Table 25 ............................................................................... 31
Changes to Figure 41...................................................................... 31
Changes to Figure 42...................................................................... 32
Added Example Instruction Byte Section ................................... 32
Added Table 27 ............................................................................... 33
Changes to Figure 46, Figure 47, Figure 48, and Figure 49....... 35
Changes to Register Maps and Bit Descriptions Section .......... 36
Added Endnote 1 to Table 30 ........................................................ 38
Changes to Ordering Guide .......................................................... 44
7/05—Revision 0: Initial Version
Rev. B | Page 2 of 44
AD9959
GENERAL DESCRIPTION
frequency tuning word, 14 bits of phase offset, and a 10-bit
output scale multiplier.
The AD9959 consists of four direct digital synthesizer (DDS)
cores that provide independent frequency, phase, and amplitude
control on each channel. This flexibility can be used to correct
imbalances between signals due to analog processing, such as
filtering, amplification, or PCB layout-related mismatches.
Because all channels share a common system clock, they are
inherently synchronized. Synchronization of multiple devices
is supported.
The DAC outputs are supply referenced and must be terminated
into AVDD by a resistor or an AVDD center-tapped transformer.
Each DAC has its own programmable reference to enable
different full-scale currents for each channel.
The DDS acts as a high resolution frequency divider with the
REFCLK as the input and the DAC providing the output. The
REFCLK input source is common to all channels and can be
driven directly or used in combination with an integrated
REFCLK multiplier (PLL) up to a maximum of 500 MSPS.
The PLL multiplication factor is programmable from 4 to 20,
in integer steps. The REFCLK input also features an oscillator
circuit to support an external crystal as the REFCLK source.
The crystal must be between 20 MHz and 30 MHz. The crystal
can be used in combination with the REFCLK multiplier.
The AD9959 can perform up to a 16-level modulation of frequency, phase, or amplitude (FSK, PSK, ASK). Modulation is
performed by applying data to the profile pins. In addition, the
AD9959 also supports linear sweep of frequency, phase, or
amplitude for applications such as radar and instrumentation.
The AD9959 serial I/O port offers multiple configurations to
provide significant flexibility. The serial I/O port offers an SPIcompatible mode of operation that is virtually identical to the
SPI operation found in earlier Analog Devices, Inc., DDS products.
Flexibility is provided by four data pins (SDIO_0/SDIO_1/
SDIO_2/SDIO_3) that allow four programmable modes of
serial I/O operation.
The AD9959 comes in a space-saving 56-lead LFCSP package.
The DDS core (AVDD and DVDD pins) is powered by a 1.8 V
supply. The digital I/O interface (SPI) operates at 3.3 V and
requires DVDD_I/O (Pin 49) be connected to 3.3 V.
The AD9959 uses advanced DDS technology that provides low
power dissipation with high performance. The device incorporates
four integrated, high speed 10-bit DACs with excellent wideband
and narrow-band SFDR. Each channel has a dedicated 32-bit
The AD9959 operates over the industrial temperature range of
−40°C to +85°C.
AD9959
DDS CORE
32
Σ
32
Σ
Σ
15
cos(x)
10
10
DAC
10
10
DAC
10
10
DAC
10
10
DAC
CH0_IOUT
CH0_IOUT
DDS CORE
32
Σ
32
Σ
Σ
15
cos(x)
CH1_IOUT
CH1_IOUT
DDS CORE
32
Σ
32
Σ
Σ
15
cos(x)
CH2_IOUT
CH2_IOUT
DDS CORE
FTW
DFTW
Σ
32
32
SYNC_IN
SYNC_OUT
I/O_UPDATE
SYNC_CLK
REF_CLK
REF_CLK
Σ
Σ
15
PHASE/
ΔPHASE
cos(x)
14
AMP/
ΔAMP
10
SCALABLE
DAC REF
CURRENT
TIMING AND CONTROL LOGIC
÷4
REF CLOCK
MULTIPLIER
BUFFER/ 4× TO 20×
XTAL
OSCILLATOR
CLK_MODE_SEL
CH3_IOUT
CH3_IOUT
DAC_RSET
PWR_DWN_CTL
MASTER_RESET
SYSTEM
CLK
CONTROL
REGISTERS
CHANNEL
REGISTERS
MUX
SERIAL
I/O
PORT
BUFFER
PROFILE
REGISTERS
1.8V
1.8V
AVDD
DVDD
Figure 2. Detailed Block Diagram
Rev. B | Page 3 of 44
P0 P1
P2
P3
DVDD_I/O
SCLK
CS
SDIO_0
SDIO_1
SDIO_2
SDIO_3
05246-001
32
AD9959
SPECIFICATIONS
AVDD and DVDD = 1.8 V ± 5%; DVDD_I/O = 3.3 V ± 5%; T = 25°C; RSET = 1.91 kΩ; external reference clock frequency = 500 MSPS
(REFCLK multiplier bypassed), unless otherwise noted.
Table 1.
Parameter
REFERENCE CLOCK INPUT CHARACTERISTICS
Frequency Range
REFCLK Multiplier Bypassed
REFCLK Multiplier Enabled
Internal VCO Output Frequency Range
VCO Gain Control Bit Set High1
VCO Gain Control Bit Set Low1
Crystal REFCLK Source Range
Input Level
Input Voltage Bias Level
Input Capacitance
Input Impedance
Duty Cycle with REFCLK Multiplier Bypassed
Duty Cycle with REFCLK Multiplier Enabled
CLK Mode Select (Pin 24) Logic 1 Voltage
CLK Mode Select (Pin 24) Logic 0 Voltage
DAC OUTPUT CHARACTERISTICS
Resolution
Full-Scale Output Current
Gain Error
Channel-to-Channel Output Amplitude Matching Error
Output Current Offset
Differential Nonlinearity
Integral Nonlinearity
Output Capacitance
Voltage Compliance Range
Channel-to-Channel Isolation
Min
Typ
Max
Unit
1
10
500
125
MHz
MHz
255
100
20
200
500
160
30
1000
MHz
MHz
MHz
mV
V
pF
Ω
%
%
V
V
1.15
2
1500
45
35
1.25
55
65
1.8
0.5
1.25
−10
−2.5
1
±0.5
±1.0
3
AVDD − 0.50
65
10
10
+10
+2.5
25
AVDD + 0.50
Bits
mA
%FS
%
μA
LSB
LSB
pF
V
dB
WIDEBAND SFDR
1 MHz to 20 MHz Analog Output
20 MHz to 60 MHz Analog Output
60 MHz to 100 MHz Analog Output
100 MHz to 150 MHz Analog Output
150 MHz to 200 MHz Analog Output
NARROW-BAND SFDR
1.1 MHz Analog Output (±10 kHz)
1.1 MHz Analog Output (±50 kHz)
1.1 MHz Analog Output (±250 kHz)
1.1 MHz Analog Output (±1 MHz)
15.1 MHz Analog Output (±10 kHz)
15.1 MHz Analog Output (±50 kHz)
15.1 MHz Analog Output (±250 kHz)
15.1 MHz Analog Output (±1 MHz)
40.1 MHz Analog Output (±10 kHz)
40.1 MHz Analog Output (±50 kHz)
40.1 MHz Analog Output (±250 kHz)
40.1 MHz Analog Output (±1 MHz)
75.1 MHz Analog Output (±10 kHz)
−65
−62
−59
−56
−53
dBc
dBc
dBc
dBc
dBc
−90
−88
−86
−85
−90
−87
−85
−83
−90
−87
−84
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
−82
−87
Rev. B | Page 4 of 44
Test Conditions/Comments
See Figure 34 and Figure 35
Measured at each pin (single-ended)
1.8 V digital input logic
1.8 V digital input logic
Must be referenced to AVDD
DAC supplies tied together
(see Figure 19)
The frequency range for wideband
SFDR is defined as dc to Nyquist
AD9959
Parameter
75.1 MHz Analog Output (±50 kHz)
75.1 MHz Analog Output (±250 kHz)
75.1 MHz Analog Output (±1 MHz)
100.3 MHz Analog Output (±10 kHz)
100.3 MHz Analog Output (±50 kHz)
100.3 MHz Analog Output (±250 kHz)
100.3 MHz Analog Output (±1 MHz)
200.3 MHz Analog Output (±10 kHz)
200.3 MHz Analog Output (±50 kHz)
200.3 MHz Analog Output (±250 kHz)
200.3 MHz Analog Output (±1 MHz)
PHASE NOISE CHARACTERISTICS
Residual Phase Noise @ 15.1 MHz (fOUT)
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 40.1 MHz (fOUT)
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 75.1 MHz (fOUT)
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 100.3 MHz (fOUT)
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 15.1 MHz (fOUT)
with REFCLK Multiplier Enabled 5×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 40.1 MHz (fOUT)
with REFCLK Multiplier Enabled 5×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 75.1 MHz (fOUT)
with REFCLK Multiplier Enabled 5×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Min
Typ
−85
−83
−82
−87
−85
−83
−81
−87
−85
−83
−81
Max
Unit
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
−150
−159
−165
−165
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−142
−151
−160
−162
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−135
−146
−154
−157
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−134
−144
−152
−154
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−139
−149
−153
−148
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−130
−140
−145
−139
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−123
−134
−138
−132
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Rev. B | Page 5 of 44
Test Conditions/Comments
AD9959
Parameter
Residual Phase Noise @ 100.3 MHz (fOUT)
with REFCLK Multiplier Enabled 5×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 15.1 MHz (fOUT)
with REFCLK Multiplier Enabled 20×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 40.1 MHz (fOUT)
with REFCLK Multiplier Enabled 20×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 75.1 MHz (fOUT)
with REFCLK Multiplier Enabled 20×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
Residual Phase Noise @ 100.3 MHz (fOUT)
with REFCLK Multiplier Enabled 20×
@ 1 kHz Offset
@ 10 kHz Offset
@ 100 kHz Offset
@ 1 MHz Offset
SERIAL PORT TIMING CHARACTERISTICS
Maximum Frequency Serial Clock (SCLK)
Minimum SCLK Pulse Width Low (tPWL)
Minimum SCLK Pulse Width High (tPWH)
Minimum Data Setup Time (tDS)
Minimum Data Hold Time
Minimum CS Setup Time (tPRE)
Minimum Data Valid Time for Read Operation
MISCELLANEOUS TIMING CHARACTERISTICS
MASTER_RESET Minimum Pulse Width
I/O_UPDATE Minimum Pulse Width
Minimum Setup Time (I/O_UPDATE to SYNC_CLK)
Minimum Hold Time (I/O_UPDATE to SYNC_CLK)
Minimum Setup Time (Profile Inputs to SYNC_CLK)
Minimum Hold Time (Profile Inputs to SYNC_CLK)
Minimum Setup Time (SDIO Inputs to SYNC_CLK)
Minimum Hold Time (SDIO Inputs to SYNC_CLK)
Propagation Time Between REF_CLK and SYNC_CLK
Profile Pin Toggle Rate
CMOS LOGIC INPUTS
VIH
VIL
Logic 1 Current
Logic 0 Current
Input Capacitance
Min
Typ
Max
−120
−130
−135
−129
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−127
−136
−139
−138
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−117
−128
−132
−130
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−110
−121
−125
−123
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
−107
−119
−121
−119
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
200
1.6
2.2
2.2
0
1.0
12
1
1
4.8
0
5.4
0
2.5
0
2.25
Unit
3.5
5.5
2
2.0
3
−12
2
0.8
12
Rev. B | Page 6 of 44
Test Conditions/Comments
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Sync
clocks
V
V
μA
μA
pF
Min pulse width = 1 sync clock period
Min pulse width = 1 sync clock period
Rising edge to rising edge
Rising edge to rising edge
AD9959
Parameter
CMOS LOGIC OUTPUTS
VOH
VOL
POWER SUPPLY
Total Power Dissipation—All Channels On,
Single-Tone Mode
Total Power Dissipation—All Channels On,
with Sweep Accumulator
Total Power Dissipation—Full Power-Down
IAVDD—All Channels On, Single-Tone Mode
IAVDD—All Channels On, Sweep Accumulator, REFCLK
Multiplier and 10-Bit Output Scalar Enabled
IDVDD—All Channels On, Single-Tone Mode
IDVDD—All Channels On, Sweep Accumulator, REFCLK
Multiplier and 10-Bit Output Scalar Enabled
IDVDD_I/O
IAVDD Power-Down Mode
IDVDD Power-Down Mode
DATA LATENCY (PIPELINE DELAY) SINGLE-TONE MODE2, 3
Frequency, Phase, and Amplitude Words to DAC
Output with Matched Latency Enabled
Frequency Word to DAC Output with Matched
Latency Disabled
Phase Offset Word to DAC Output with Matched
Latency Disabled
Amplitude Word to DAC Output with Matched
Latency Disabled
DATA LATENCY (PIPELINE DELAY) MODULATION MODE3, 4
Frequency Word to DAC Output
Min
Max
Unit
0.4
V
V
540
635
mW
Dominated by supply variation
580
680
mW
Dominated by supply variation
13
155
160
180
185
mW
mA
mA
105
125
125
145
mA
mA
40
30
mA
mA
mA
mA
2.7
0.7
1.1
29
SYSCLK
s
SYSCLK
s
SYSCLK
s
SYSCLK
s
29
25
17
34
Phase Offset Word to DAC Output
29
Amplitude Word to DAC Output
21
DATA LATENCY (PIPELINE DELAY) LINEAR SWEEP MODE3, 4
Frequency Rising/Falling Delta Tuning Word to DAC
Output
Phase Offset Rising/Falling Delta Tuning Word to
DAC Output
Amplitude Rising/Falling Delta Tuning Word to DAC
Output
Typ
SYSCLK
s
SYSCLK
s
SYSCLK
s
41
SYSCLK
s
SYSCLK
s
SYSCLK
s
37
29
1
For the VCO frequency range of 160 MHz to 255 MHz, there is no guarantee of operation.
Data latency is referenced to I/O_UPDATE.
3
Data latency is fixed.
4
Data latency is referenced to a profile change.
2
Rev. B | Page 7 of 44
Test Conditions/Comments
1 mA load
IDVDD = read
IDVDD = write
AD9959
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Maximum Junction Temperature
DVDD_I/O (Pin 49)
AVDD, DVDD
Digital Input Voltage (DVDD_I/O = 3.3 V)
Digital Output Current
Storage Temperature Range
Operating Temperature Range
Lead Temperature (10 sec Soldering)
θJA
θJC
Rating
150°C
4V
2V
−0.7 V to +4 V
5 mA
–65°C to +150°C
–40°C to +85°C
300°C
21°C/W
2°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. B | Page 8 of 44
AD9959
56
55
54
53
52
51
50
49
48
47
46
45
44
43
DGND
DVDD
SYNC_CLK
SDIO_3
SDIO_2
SDIO_1
SDIO_0
DVDD_I/O
SCLK
CS
I/O_UPDATE
DVDD
DGND
P3
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PIN 1
INDICATOR
AD9959
TOP VIEW
(Not to Scale)
42
41
40
39
38
37
36
35
34
33
32
31
30
29
P2
P1
P0
AVDD
AGND
AVDD
CH1_IOUT
CH1_IOUT
AGND
AVDD
AGND
AVDD
CH0_IOUT
CH0_IOUT
AVDD
AGND
DAC_RSET
AGND
AVDD
AGND
AVDD
REF_CLK
REF_CLK
CLK_MODE_SEL
AGND
AVDD
LOOP_FILTER
AGND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SYNC_IN
SYNC_OUT
MASTER_RESET
PWR_DWN_CTL
AVDD
AGND
AVDD
CH2_IOUT
CH2_IOUT
AGND
AVDD
AGND
CH3_IOUT
CH3_IOUT
NOTES
1. THE EXPOSED EPAD ON BOTTOM SIDE OF PACKAGE IS
AN ELECTRICAL CONNECTION AND MUST BE
SOLDERED TO GROUND.
2. PIN 49 IS DVDD_I/O AND IS TIED TO 3.3V.
05246-003
NC = NO CONNECT
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
Mnemonic
SYNC_IN
I/O1
I
2
SYNC_OUT
O
3
MASTER_RESET
I
4
5, 7, 11, 15, 19, 21,
26, 31, 33, 37, 39
6, 10, 12, 16, 18, 20,
25, 28, 32, 34, 38
45, 55
44, 56
8
9
13
14
17
PWR_DWN_CTL
AVDD
I
I
Description
Used to Synchronize Multiple AD9959 Devices. Connects to the SYNC_OUT pin of
the master AD9959 device.
Used to Synchronize Multiple AD9959 Devices. Connects to the SYNC_IN pin of the
slave AD9959 devices.
Active High Reset Pin. Asserting the MASTER_RESET pin forces the AD9959 internal
registers to their default state, as described in the Register Maps and Bit Descriptions
section.
External Power-Down Control.
Analog Power Supply Pins (1.8 V).
AGND
I
Analog Ground Pins.
DVDD
DGND
CH2_IOUT
CH2_IOUT
CH3_IOUT
CH3_IOUT
DAC_RSET
I
I
O
O
O
O
I
22
REF_CLK
I
23
REF_CLK
I
Digital Power Supply Pins (1.8 V).
Digital Power Ground Pins.
True DAC Output. Terminates into AVDD.
Complementary DAC Output. Terminates into AVDD.
True DAC Output. Terminates into AVDD.
Complementary DAC Output. Terminates into AVDD.
Establishes the Reference Current for All DACs. A 1.91 kΩ resistor (nominal) is
connected from Pin 17 to AGND.
Complementary Reference Clock/Oscillator Input. When the REF_CLK is operated
in single-ended mode, this pin should be decoupled to AVDD or AGND with a
0.1 μF capacitor.
Reference Clock/Oscillator Input. When the REF_CLK is operated in single-ended
mode, this is the input. See the Modes of Operation section for the reference clock
configuration.
Rev. B | Page 9 of 44
AD9959
Pin No.
24
Mnemonic
CLK_MODE_SEL
I/O1
I
27
LOOP_FILTER
I
29
30
35
36
40 to 43
CH0_IOUT
CH0_IOUT
CH1_IOUT
CH1_IOUT
P0 to P3
O
O
O
O
I
46
I/O_UPDATE
I
47
48
CS
SCLK
I
I
49
50
51, 52
DVDD_I/O
SDIO_0
SDIO_1, SDIO_2
I
I/O
I/O
53
SDIO_3
I/O
54
SYNC_CLK
O
1
Description
Control Pin for the Oscillator Section. Caution: Do not drive this pin beyond 1.8 V.
When high (1.8 V), the oscillator section is enabled to accept a crystal as the
REF_CLK source. When low, the oscillator section is bypassed.
Connects to the external zero compensation network of the PLL loop filter.
Typically, the network consists of a 0 Ω resistor in series with a 680 pF capacitor
tied to AVDD.
Complementary DAC Output. Terminates into AVDD.
True DAC Output. Terminates into AVDD.
Complementary DAC Output. Terminates into AVDD.
True DAC Output. Terminates into AVDD.
Data pins used for modulation (FSK, PSK, ASK), to start/stop the sweep accumulators
or used to ramp up/ramp down the output amplitude. The data is synchronous to
the SYNC_CLK (Pin 54). The data inputs must meet the setup and hold time
requirements of the SYNC_CLK. The functionality of these pins is controlled by the
profile pin configuration (PPC) bits (FR1[14:12]).
A rising edge transfers data from the serial I/O port buffer to active registers.
I/O_UPDATE is synchronous to the SYNC_CLK (Pin 54). I/O_UPDATE must meet the
setup and hold time requirements of the SYNC_CLK to guarantee a fixed pipeline
delay of data to the DAC output; otherwise, a ±1 SYNC_CLK period of pipeline
uncertainty exists. The minimum pulse width is one SYNC_CLK period.
Active Low Chip Select. Allows multiple devices to share a common I/O bus (SPI).
Serial Data Clock for I/O Operations. Data bits are written on the rising edge of
SCLK and read on the falling edge of SCLK.
3.3 V Digital Power Supply for SPI Port and Digital I/O.
Data Pin SDIO_0 is dedicated to the serial port I/O only.
Data Pin SDIO_1 and Data Pin SDIO_2 can be used for the serial I/O port or used to
initiate a ramp-up/ramp-down (RU/RD) of the DAC output amplitude.
Data Pin SDIO_3 can be used for the serial I/O port or to initiate a ramp-up/ramp-down
(RU/RD) of the DAC output amplitude. In single-bit or 2-bit modes, SDIO_3 is used
for SYNC_I/O. If the SYNC_I/O function is not used, tie to ground or Logic 0. Do not
let SDIO_3 float in single-bit or 2-bit modes.
The SYNC_CLK runs at one-fourth the system clock rate; it can be disabled. I/O_UPDATE
or data (Pin 40 to Pin 43) is synchronous to the SYNC_CLK. To guarantee a fixed pipeline
delay of data to DAC output, I/O_UPDATE or data (Pin 40 to Pin 43) must meet the
setup and hold time requirements to the rising edge of SYNC_CLK; otherwise, a ±1
SYNC_CLK period of uncertainty occurs.
I = input, O = output.
Rev. B | Page 10 of 44
AD9959
TYPICAL PERFORMANCE CHARACTERISTICS
RBW
VBW
SWT
20kHz
20kHz
1.6s
RF ATT
20dB
UNIT
dB
REF LVL
0dBm
0
A
1
–30
–30
–40
–40
–50
25MHz/DIV
DELTA 1 (T1)
–62.84dB
40.08016032MHz
REF LVL
0dBm
RBW
VBW
SWT
STOP 250MHz
20kHz
20kHz
1.6s
RF ATT
20dB
UNIT
dB
START 0Hz
25MHz/DIV
STOP 250MHz
Figure 7. Wideband SFDR, fOUT = 15.1 MHz, fCLK = 500 MSPS
REF Lv]
0dBm
0
A
1
05246-007
05246-004
START 0Hz
DELTA 1 (T1)
–60.13dB
75.15030060MHz
RBW
VBW
SWT
20kHz
20kHz
1.6s
RF ATT
20dB
UNIT
dB
A
1
–10
–20
–20
1AP
–30
–30
–40
–40
(dB)
–50
–60
–50
–60
1
–70
–80
–80
05246-005
–70
–90
START 0Hz
25MHz/DIV
DELTA 1 (T1)
–59.04dB
100.70140281MHz
RBW
VBW
SWT
–100
STOP 250Hz
20kHz
20kHz
1.6s
RF ATT
20dB
UNIT
dB
START 0Hz
25MHz/DIV
REF LVL
0dBm
RBW
DELTA 1 (T1)
–53.84dB
VBW
–101.20240481MHz SWT
–40
–40
(dB)
–30
A
1
–80
–80
05246-006
–70
25MHz/DIV
1AP
–50
–70
START 0Hz
dB
–60
1
–90
20dB
UNIT
–20
1AP
–30
–60
RF ATT
1
–10
–50
20kHz
20kHz
1.6s
0
–10
–20
STOP 250MHz
Figure 8. Wideband SFDR, fOUT = 75.1 MHz, fCLK = 500 MSPS
A
1
1
–90
Figure 5. Wideband SFDR, fOUT = 40.1 MHz, fCLK = 500 MSPS
REF LVL
0dBm
1AP
05246-008
(dB)
1
–90
–10
(dB)
1AP
–50
–100
Figure 4. Wideband SFDR, fOUT = 1.1 MHz, fCLK = 500 MSPS
–100
A
–80
–90
0
20dB
dB
1
–70
1
–80
–100
RF ATT
UNIT
–60
–60
0
20kHz
20kHz
1.6s
–20
1AP
(dB)
(dB)
–20
–100
RBW
VBW
SWT
–10
–10
–70
DELTA 1 (T1)
–69.47dB
30.06012024MHz
05246-009
0
DELTA 1 (T1)
–71.73dB
4.50901804MHz
REF LVL
0dBm
–90
–100
STOP 250MHz
Figure 6. Wideband SFDR, fOUT = 100.3 MHz, fCLK = 500 MSPS
START 0Hz
25MHz/DIV
STOP 250MHz
Figure 9. Wideband SFDR, fOUT = 200.3 MHz, fCLK = 500 MSPS
Rev. B | Page 11 of 44
AD9959
REF LVL
0dBm
0
RBW
VBW
SWT
DELTA 1 (T1)
–84.73dB
254.50901604kHz
500Hz
500Hz
20s
RF ATT
20dB
UNIT
dB
1
REF LVL
0dBm
0
A
–10
–40
–40
(dB)
–50
–60
–70
–70
–80
1AP
–80
CENTER 1.1MHz
100kHz/DIV
–90
–100
SPAN 1MHz
Figure 10. NBSFDR, ±1 MHz, fOUT = 1.1 MHz, fCLK = 500 MSPS
REF LVL
0dBm
RBW
VBW
SWT
DELTA 1 (T1)
–84.10dB
120.24048096kHz
0
500Hz
500Hz
20s
RF ATT
20dB
UNIT
dB
CENTER 15.1MHz
100kHz/DIV
SPAN 1MHz
Figure 13. NBSFDR, ±1 MHz, fOUT = 15.1 MHz, fCLK = 500 MSPS
REF LVL
0dBm
0
A
1
05246-013
1
05246-010
–90
–10
RBW
VBW
SWT
DELTA 1 (T1)
–86.03dB
262.56513026kHz
500Hz
500Hz
20s
RF ATT
20dB
UNIT
dB
A
1
–10
–20
–20
1AP
–30
–30
–40
–40
(dB)
–50
–50
–60
–60
–70
–70
–80
1AP
–80
05246-011
1
–90
CENTER 40.1MHz
100kHz/DIV
–100
SPAN 1MHz
Figure 11. NBSFDR, ±1 MHz, fOUT = 40.1 MHz, fCLK = 500 MSPS
REF LVL
0dBm
DELTA 1 (T1)
–82.63dB
400.80160321kHz
RBW
VBW
SWT
500Hz
500Hz
20s
RF ATT
20dB
UNIT
dB
CENTER 75.1MHz
100kHz/DIV
SPAN 1MHz
Figure 14. NBSFDR, ±1 MHz, fOUT = 75.1 MHz, fCLK = 500 MSPS
REF LVL
0dBm
0
A
1
1
–90
05246-014
(dB)
A
1
1
RBW
VBW
SWT
DELTA 1 (T1)
–83.72dB
–400.80160321kHz
500Hz
500Hz
20s
RF ATT
20dB
UNIT
dB
A
1
–10
–10
–20
–20
1AP
–30
–40
–40
(dB)
–30
–50
–60
–70
–70
–80
1AP
–50
–60
–80
1
–90
CENTER 100.3MHz
100kHz/DIV
05246-012
(dB)
dB
–50
–60
–100
20dB
UNIT
–90
–100
SPAN 1MHz
Figure 12. NBSFDR, ±1 MHz, fOUT = 100.3 MHz, fCLK = 500 MSPS
05246-015
(dB)
–30
0
RF ATT
–20
1AP
–30
–100
500Hz
500Hz
20s
–10
–20
–100
RBW
VBW
SWT
DELTA 1 (T1)
–84.86dB
–200.40080160kHz
1
CENTER 200.3MHz
100kHz/DIV
SPAN 1MHz
Figure 15. NBSFDR, ±1 MHz, fOUT = 200. 3MHz, fCLK = 500 MSPS
Rev. B | Page 12 of 44
AD9959
–60
–100
75.1MHz
–120
–130
100.3MHz
–140
–150
40.1MHz
05246-034
–160
15.1MHz
–170
10
100
1k
10k
100k
1M
–65
SINGLE DAC POWER PLANE
–70
–75
–80
–85
10M
SEPARATE DAC POWER PLANES
05246-037
CHANNEL ISOLATION (dBc)
PHASE NOISE (dBc/Hz)
–110
25.3
50.3
Figure 16. Residual Phase Noise (SSB) with fOUT = 15.1 MHz, 40.1 MHz,
75.1 MHz, 100.3 MHz; fCLK = 500 MHz with REFCLK Multiplier Bypassed
150.3
200.3
175.3
4 CHANNELS ON
100.3MHz
–110
75.1MHz
–120
–130
40.1MHz
–150
05246-035
15.1MHz
–160
100
1k
10k
100k
1M
500
400
2 CHANNELS ON
300
1 CHANNEL ON
200
100
0
10M
3 CHANNELS ON
FREQUENCY OFFSET (Hz)
05246-038
–100
TOTAL POWER DISSIPATION (mW)
–90
PHASE NOISE (dBc/Hz)
125.3
600
–80
–170
10
100.3
Figure 19. Channel Isolation at 500 MSPS Operation; Conditions are Channel
of Interest Fixed at 110.3 MHz, the Other Channels Are Frequency Swept
–70
–140
75.3
FREQUENCY OF COUPLING SPUR (MHz)
FREQUENCY OFFSET (Hz)
500
450
400
350
300
250
200
150
100
50
REFERENCE CLOCK FREQUENCY (MHz)
Figure 17. Residual Phase Noise (SSB) with fOUT = 15.1 MHz, 40.1 MHz,
75.1 MHz, 100.3 MHz; fCLK = 500 MHz with REFCLK Multiplier = 5×
Figure 20. Power Dissipation vs. Reference Clock Frequency vs. Channel(s)
Power On/Off
–70
–45
–80
–50
–100
100.3MHz
–110
SFDR AVERAGED
–55
75.1MHz
SFDR (dBc)
PHASE NOISE (dBc/Hz)
–90
–120
–130
40.1MHz
–140
–60
–65
15.1MHz
–150
100
1k
10k
100k
1M
–75
10M
FREQUENCY OFFSET (Hz)
Figure 18. Residual Phase Noise (SSB) with fOUT = 15.1 MHz, 40.1 MHz,
75.1 MHz,100.3 MHz; fCLK = 500 MHz with REFCLK Multiplier = 20×
Rev. B | Page 13 of 44
05246-045
–170
10
–70
05246-036
–160
1.1
15.1
40.1
75.1
100.3
fOUT (MHz)
Figure 21. Averaged Channel SFDR vs. fOUT
200.3
AD9959
APPLICATION CIRCUITS
PULSE
AD9959
ANTENNA
RADIATING
ELEMENTS
FILTER
FILTER
CH1
FILTER
FILTER
CH2
FILTER
FILTER
CH3
FILTER
FILTER
05246-042
CH0
LO
REFCLK
Figure 22. Phase Array Radar Using Precision Frequency/Phase Control from DDS in FMCW or Pulsed Radar Applications;
DDS Provides Either Continuous Wave or Frequency Sweep
AD8349
AD8348
AD8347
AD8346
I BASEBAND
ADL5390
CH2
LO
CH0
AD9959
IMAGE
FREQUENCY
CH1
RF OUTPUT
REFCLK
CH3
05246-043
LO ±90
DEGREES
Q BASEBAND
Figure 23. Single-Sideband-Suppressed Carrier Upconversion
AD9510, AD9511, ADF4106
÷
REFERENCE
PHASE
COMPARATOR
CHARGE
PUMP
LOOP
FILTER
VCO
÷
LPF
REFCLK
05249-039
AD9959
Figure 24. DDS in PLL Locking to Reference Offering Distribution with Fine Frequency and Delay Adjust Tuning
Rev. B | Page 14 of 44
AD9959
AD9510
CLOCK DISTRIBUTOR
WITH
DELAY EQUALIZATION
REF_CLK
AD9510
SYNCHRONIZATION
DELAY EQUALIZATION
FPGA
DATA
SYNC_OUT
C1
S1
SYNC_IN
AD9959
SYNC_CLK
C2
S2
DATA
AD9959
FPGA
FPGA
C3
S3
DATA
AD9959
A3
(SLAVE 2)
SYNC_CLK
FPGA
A2
(SLAVE 1)
SYNC_CLK
CENTRAL
CONTROL
A1
(MASTER)
C4
S4
DATA
AD9959
A4
(SLAVE 3)
SYNC_CLK
A_END
05246-044
CLOCK
SOURCE
Figure 25. Synchronizing Multiple Devices to Increase Channel Capacity Using the AD9510 as a Clock Distributor for the Reference and SYNC_CLK
OPTICAL FIBER CHANNEL
WITH MULTIPLE DISCRETE
WAVELENGTHS
SPLITTER
WDM
SOURCE
WDM SIGNAL
CH1
AD9959
REFCLK
CH2
CH3
INPUTS
AMP
CH0
AMP
CH1
AMP
CH2
AMP
CH3
ACOUSTIC OPTICAL
TUNABLE FILTER
CH0
OUTPUTS
CH1 CH2 CH3
05246-046
CH0
SELECTABLE WAVELENGTH FROM EACH
CHANNEL VIA DDS TUNING AOTF
Figure 26. DDS Providing Stimulus for Acoustic Optical Tunable Filter
CH0
AD9959
CH1
+
05246-041
REFCLK
–
ADCMP563
Figure 27. Agile Clock Source with Duty Cycle Control Using the Phase Offset Value in DDS to Change the DC Voltage to the Comparator
Rev. B | Page 15 of 44
AD9959
PROGRAMMABLE 1 TO 32
DIVIDER AND DELAY ADJUST
AD9515
AD9514
AD9513
AD9512
CH0
IMAGE
AD9959
REFCLK
AD9515
AD9514
AD9513
AD9512
CH2
CH3
n
n
LVPECL
LVDS
CMOS
LVPECL
LVDS
CMOS
LVPECL
LVDS
CMOS
IMAGE
AD9515
AD9514
AD9513
AD9512
n
LVPECL
LVDS
CMOS
n = DEPENDENT ON
PRODUCT SELECTION
05246-040
CH1
AD9515
AD9514
AD9513
AD9512
n
CLOCK OUTPUT
SELECTION(S)
Figure 28. Clock Generation Circuit Using the AD9512/AD9513/AD9514/AD9515 Series of Clock Distribution Chips
Rev. B | Page 16 of 44
AD9959
EQUIVALENT INPUT AND OUTPUT CIRCUITS
DVDD_I/O = 3.3V
INPUT
OUTPUT
05246-002
AVOID OVERDRIVING
DIGITAL INPUTS.
FORWARD BIASING
DIODES MAY COUPLE
DIGITAL NOISE ON
POWER PINS.
Figure 29. CMOS Digital Inputs
CHx_IOUT
TERMINATE OUTPUTS
INTO AVDD. DO NOT
EXCEED VOLTAGE
COMPLIANCE OF
OUTPUTS.
05246-032
CHx_IOUT
Figure 30. DAC Outputs
AVDD
1.5kΩ
Z
Z
1.5kΩ
OSC
REF_CLK
AVDD
AMP
REF_CLK INPUTS ARE
INTERNALLY BIASED AND
NEED TO BE AC-COUPLED.
OSC INPUTS ARE DC-COUPLED.
Figure 31. REF_CLK/REF_CLK Inputs
Rev. B | Page 17 of 44
OSC
05246-033
REF_CLK
AVDD
AD9959
THEORY OF OPERATION
DDS CORE
DIGITAL-TO-ANALOG CONVERTER
The AD9959 has four DDS cores, each consisting of a 32-bit
phase accumulator and phase-to-amplitude converter. Together,
these digital blocks generate a digital sine wave when the phase
accumulator is clocked and the phase increment value (frequency
tuning word) is greater than 0. The phase-to-amplitude converter
simultaneously translates phase information to amplitude
information by a cos(θ) operation.
The AD9959 incorporates four 10-bit current output DACs.
The DAC converts a digital code (amplitude) into a discrete
analog quantity. The DAC current outputs can be modeled as a
current source with high output impedance (typically 100 kΩ).
Unlike many DACs, these current outputs require termination
into AVDD via a resistor or a center-tapped transformer for
expected current flow.
The output frequency (fOUT) of each DDS channel is a function
of the rollover rate of each phase accumulator. The exact
relationship is given in the following equation:
Each DAC has complementary outputs that provide a combined
full-scale output current (IOUT + IOUT). The outputs always sink
f OUT =
(FTW )( f S )
2 32
where:
fS is the system clock rate.
FTW is the frequency tuning word and is 0 ≤ FTW ≤ 231.
232 represents the phase accumulator capacity.
current, and their sum equals the full-scale current at any point
in time. The full-scale current is controlled by means of an
external resistor (RSET) and the scalable DAC current control
bits discussed in the Modes of Operation section. The resistor,
RSET, is connected between the DAC_RSET pin and analog
ground (AGND). The full-scale current is inversely proportional
to the resistor value as follows:
R SET =
Because all four channels share a common system clock, they
are inherently synchronized.
The DDS core architecture also supports the capability to phase
offset the output signal, which is performed by the channel
phase offset word (CPOW). The CPOW is a 14-bit register that
stores a phase offset value. This value is added to the output of
the phase accumulator to offset the current phase of the output
signal. Each channel has its own phase offset word register. This
feature can be used for placing all channels in a known phase
relationship relative to one another. The exact value of phase
offset is given by the following equation:
18.91
I OUT (max)
The maximum full-scale output current of the combined DAC
outputs is 15 mA, but limiting the output to 10 mA provides
optimal spurious-free dynamic range (SFDR) performance.
The DAC output voltage compliance range is AVDD + 0.5 V to
AVDD − 0.5 V. Voltages developed beyond this range may cause
excessive harmonic distortion. Proper attention should be paid
to the load termination to keep the output voltage within its
compliance range. Exceeding this range could potentially damage the DAC output circuitry.
POW
Φ = ⎛⎜ 14 ⎞⎟ × 360°
⎝ 2 ⎠
LPF
CHx_IOUT
DAC
AVDD
1:1
50Ω
05246-016
CHx_IOUT
Figure 32. Typical DAC Output Termination Configuration
Rev. B | Page 18 of 44
AD9959
MODES OF OPERATION
There are many combinations of modes (for example, singletone, modulation, linear sweep) that the AD9959 can perform
simultaneously. However, some modes require multiple data
pins, which can impose limitations. The following guidelines
can help determine if a specific combination of modes can be
performed simultaneously by the AD9959.
CHANNEL CONSTRAINT GUIDELINES
•
•
•
•
•
•
•
•
•
•
•
Single-tone mode, two-level modulation mode, and linear
sweep mode can be enabled on any channel and in any
combination at the same time.
Any one or two channels in any combination can perform
four-level modulation. The remaining channels can be in
single-tone mode.
Any channel can perform eight-level modulation. The
three remaining channels can be in single-tone mode.
Any channel can perform 16-level direct modulation. The
three remaining channels can be in single-tone mode.
The RU/RD function can be used on all four channels in
single-tone mode. See the Output Amplitude Control
Mode section for the RU/RD function.
When Profile Pin P2 and Profile Pin P3 are used for RU/RD,
any two channels can perform two-level modulation with
RU/RD or any two channels can perform linear frequency
or phase sweep with RU/RD. The other two channels can
be in single-tone mode.
When Profile Pin P3 is used for RU/RD, any channel can
be used in eight-level modulation with RU/RD. The other
three channels can be in single-tone mode.
When the SDIO_1, SDIO_2, and SDIO_3 pins are used for
RU/RD, any one or two channels, any three channels, or
all four channels can perform two-level modulation with
RU/RD. Any channels not in the two-level modulation can
be in single-tone mode.
When the SDIO_1, SDIO_2, and SDIO_3 pins are used for
RU/RD, any one or two channels can perform four-level
modulation with RU/RD. Any channels not in four-level
modulation can be in single-tone mode.
When the SDIO_1, SDIO_2, and SDIO_3 pins are used for
RU/RD, any channel can perform 16-level modulation with
RU/RD. The other three channels can be in single-tone mode.
Amplitude modulation, linear amplitude sweep modes,
and the RU/RD function cannot operate simultaneously,
but frequency and phase modulation can operate simultaneously as the RU/RD function.
POWER SUPPLIES
The AVDD and DVDD supply pins provide power to the DDS
core and supporting analog circuitry. These pins connect to a
1.8 V nominal power supply.
The DVDD_I/O pin connects to a 3.3 V nominal power supply.
All digital inputs are 3.3 V logic except for the CLK_MODE_SEL
input. CLK_MODE_SEL (Pin 24) is an analog input and should
be operated by 1.8 V logic.
SINGLE-TONE MODE
Single-tone mode is the default mode of operation after a master
reset signal. In this mode, all four DDS channels share a common
address location for the frequency tuning word (Register 0x04)
and phase offset word (Register 0x05). Channel enable bits are
provided in combination with these shared addresses. As a
result, the frequency tuning word and/or phase offset word can
be independently programmed between channels (see the
following Step 1 through Step 5). The channel enable bits do not
require an I/O update to enable or disable a channel.
See the Register Maps and Bit Descriptions section for a
description of the channel enable bits in the channel select
register (CSR, Register 0x00). The channel enable bits are
enabled or disabled immediately after the CSR data byte is
written.
Address sharing enables channels to be written simultaneously,
if desired. The default state enables all channel enable bits.
Therefore, the frequency tuning word and/or phase offset word
is common to all channels but written only once through the
serial I/O port.
The following steps present a basic protocol to program a
different frequency tuning word and/or phase offset word for
each channel using the channel enable bits.
1.
Power up the DUT and issue a master reset. A master reset
places the part in single-tone mode and single-bit mode for
serial programming operations (refer to the Serial I/O Modes
of Operation section). Frequency tuning words and phase
offset words default to 0 at this point.
2.
Enable only one channel enable bit (Register 0x00) and
disable the other channel enable bits.
3.
Using the serial I/O port, program the desired frequency
tuning word (Register 0x04) and/or the phase offset word
(Register 0x05) for the enabled channel.
4.
Repeat Step 2 and Step 3 for each channel.
5.
Send an I/O update signal. After an I/O update, all
channels should output their programmed frequency
and/or phase offset value.
Rev. B | Page 19 of 44
AD9959
REFERENCE CLOCK MODES
The AD9959 supports multiple reference clock configurations
to generate the internal system clock. As an alternative to
clocking the part directly with a high frequency clock source,
the system clock can be generated using the internal, PLL-based
reference clock multiplier. An on-chip oscillator circuit is also
available for providing a low frequency reference signal by
connecting a crystal to the clock input pins. Enabling these
features allows the part to operate with a low frequency clock
source and still provide a high update rate for the DDS and
DAC. However, using the clock multiplier changes the output
phase noise characteristics. For best phase noise performance,
a clean, stable clock with a high slew is required (see Figure 17
and Figure 18).
Enabling the PLL allows multiplication of the reference clock
frequency from 4× to 20×, in integer steps. The PLL multiplication value is represented by a 5-bit multiplier value. These bits
are located in Function Register 1 (FR1, Register 0x01), Bits[22:18]
(see the Register Maps and Bit Descriptions section).
When FR1[22:18] is programmed with values ranging from
4 to 20 (decimal), the clock multiplier is enabled. The integer
value in the register represents the multiplication factor. The
system clock rate with the clock multiplier enabled is equal to
the reference clock rate multiplied by the multiplication factor.
If FR1[22:18] is programmed with a value less than 4 or greater
than 20, the clock multiplier is disabled and the multiplication
factor is effectively 1.
Whenever the PLL clock multiplier is enabled or the multiplication value is changed, time should be allowed to lock the PLL
(typically 1 ms).
Note that the output frequency of the PLL is restricted to a
frequency range of 100 MHz to 500 MHz. However, there is a
VCO gain control bit that must be used appropriately. The VCO
gain control bit defines two ranges (low/high) of frequency
output. The VCO gain control bit defaults to low (see Table 1
for details).
Enabling the on-chip oscillator for crystal operation is performed
by driving CLK_MODE_SEL (Pin 24) to logic high (1.8 V
logic). With the on-chip oscillator enabled, connection of an
external crystal to the REF_CLK and REF_CLK inputs is made,
producing a low frequency reference clock. The frequency of
the crystal must be in the range of 20 MHz to 30 MHz.
Table 4 summarizes the clock modes of operation. See Table 1
for more details.
Reference Clock Input Circuitry
The reference clock input circuitry has two modes of operation
controlled by the logic state of Pin 24 (CLK_MODE_SEL). The
first mode (logic low) configures as an input buffer. In this
mode, the reference clock must be ac-coupled to the input due
to internal dc biasing. This mode supports either differential
or single-ended configurations. If single-ended mode is chosen,
the complementary reference clock input (Pin 22) should be
decoupled to AVDD or AGND via a 0.1 μF capacitor. Figure 33
to Figure 35 exemplify typical reference clock configurations for
the AD9959.
1:1
BALUN
0.1µF
REF_CLK
PIN 23
50Ω
REFCLK
SOURCE
0.1µF
REF_CLK
PIN 22
Figure 33. Differential Coupling from Single-Ended Source
The reference clock inputs can also support an LVPECL or
PECL driver as the reference clock source.
0.1µF
LVPECL/
PECL
DRIVER
REF_CLK
PIN 23
TERMINATION
0.1µF
REF_CLK
PIN 22
05246-018
In single-tone mode, the AD9959 offers matched pipeline delay
to the DAC input for all frequency, phase, and amplitude changes.
This avoids having to deal with different pipeline delays between
the three input ports for such applications. The feature is enabled
by asserting the matched pipe delays active bit found in the
channel function register (CFR, Register 0x03). This feature
is available in single-tone mode only.
The charge pump current in the PLL defaults to 75 μA. This
setting typically produces the best phase noise characteristics.
Increasing the charge pump current may degrade phase noise,
but it decreases the lock time and changes the loop bandwidth.
05246-017
Single-Tone Mode—Matched Pipeline Delay
Figure 34. Differential Clock Source Hook-Up
The second mode of operation (Pin 24 = logic high = 1.8 V)
provides an internal oscillator for crystal operation. In this
mode, both clock inputs are dc-coupled via the crystal leads
and are bypassed. The range of crystal frequencies supported is
from 20 MHz to 30 MHz. Figure 35 shows the configuration
for using a crystal.
Table 4. Clock Configuration
CLK_MODE_SEL, Pin 24
High = 1.8 V Logic
High = 1.8 V Logic
Low
Low
FR1[22:18] PLL Divider Ratio = M
4 ≤ M ≤ 20
M < 4 or M > 20
4 ≤ M ≤ 20
M < 4 or M > 20
Crystal Oscillator Enabled
Yes
Yes
No
No
Rev. B | Page 20 of 44
System Clock (fSYSCLK)
fSYSCLK = fOSC × M
fSYSCLK = fOSC
fSYSCLK = fREFCLK × M
fSYSCLK = fREFCLK
Min/Max Freq. Range (MHz)
100 < fSYSCLK < 500
20 < fSYSCLK < 30
100 < fSYSCLK < 500
0 < fSYSCLK < 500
AD9959
39pF
25MHz
XTAL
When FR1[6] = 1 and the PWR_DWN_CTL input pin is high,
the AD9959 is put into full power-down mode. In this mode, all
functions are powered down. This includes the DAC and PLL,
which take a significant amount of time to power up. When the
PLL is bypassed, the PLL is shut down to conserve power.
REF_CLK
PIN 23
05246-019
REF_CLK
PIN 22
39pF
Figure 35.Crystal Input Configuration
SCALABLE DAC REFERENCE CURRENT CONTROL
MODE
RSET is common to all four DACs. As a result, the full-scale
currents are equal by default. The scalable DAC reference can
be used to set the full-scale current of each DAC independent
from one another. This is accomplished by using the register
bits CFR[9:8]. Table 5 shows how each DAC can be individually
scaled for independent channel control. This scaling provides
for binary attenuation.
Table 5. DAC Full-Scale Current Control
CFR[9:8]
11
01
10
00
LSB Current State
Full scale
Half scale
Quarter scale
Eighth scale
POWER-DOWN FUNCTIONS
The AD9959 supports an externally controlled power-down
feature and the more common software programmable powerdown bits found in previous Analog Devices DDS products.
The software control power-down allows the input clock circuitry, the DAC, and the digital logic (for each separate channel) to
be individually powered down via unique control bits (CFR[7:6]).
These bits are not active when the externally controlled powerdown pin (PWR_DWN_CTL) is high. When the input pin,
PWR_DWN_CTL, is high, the AD9959 enters a power-down
mode based on the FR1[6] bit. When the PWR_DWN_CTL
input pin is low, the external power-down control is inactive.
When FR1[6] = 0 and the PWR_DWN_CTL input pin is high,
the AD9959 is put into a fast recovery power-down mode. In
this mode, the digital logic and the DAC digital logic are powered
down. The DAC bias circuitry, PLL, oscillator, and clock input
circuitry are not powered down.
When the PWR_DWN_CTL input pin is high, the individual
power-down bits (CFR[7:6] and FR1[7]) are invalid (don’t care)
and unused. When the PWR_DWN_CTL input pin is low, the
individual power-down bits control the power-down modes of
operation.
Note that the power-down signals are all designed such that
Logic 1 indicates the low power mode and Logic 0 indicates the
powered-up mode.
MODULATION MODE
The AD9959 can perform 2-/4-/8-/16-level modulation of
frequency, phase, or amplitude. Modulation is achieved by
applying data to the profile pins. Each channel can be programmed separately, but the ability to modulate multiple channels
simultaneously is constrained by the limited number of profile
pins. For instance, 16-level modulation uses all four profile pins,
which inhibits modulation for three channels.
In addition, the AD9959 has the ability to ramp up or ramp
down the output amplitude before, during, or after a modulation
(FSK, PSK only) sequence. This is performed by using the 10-bit
output scalar. If the RU/RD feature is desired, unused profile
pins or unused SDIO_1/SDIO_2/SDIO_3 pins can be configured to initiate the operation. See the Output Amplitude
Control Mode section for more details of the RU/RD feature.
In modulation mode, each channel has its own set of control
bits to determine the type (frequency, phase, or amplitude)
of modulation. Each channel has 16 profile (channel word)
registers for flexibility. Register 0x0A through Register 0x18
are profile registers for modulation of frequency, phase, or
amplitude. Register 0x04, Register 0x05, and Register 0x06
are dedicated registers for frequency, phase, and amplitude,
respectively. These registers contain the first frequency, phase
offset, and amplitude word.
Frequency modulation has 32-bit resolution, phase modulation is
14 bits, and amplitude is 10 bits. When modulating phase or
amplitude, the word value must be MSB aligned in the profile
(channel word) registers and the unused bits are don’t care bits.
Rev. B | Page 21 of 44
AD9959
Because of the number of available channels and limited data
pins, it is necessary to assign the profile pins and/or SDIO_1,
SDIO_2, and SDIO_3 pins to a dedicated channel. This is controlled by the profile pin configuration (PPC) bits (FR1[14:12]).
Each of the following modulation descriptions incorporates
data pin assignments.
In modulation mode, the amplitude frequency phase (AFP)
select bits (CFR[23:22]) and modulation level bits (FR1[9:8])
are programmed to configure the modulation type and level
(see Table 6 and Table 7). Note that the linear sweep enable bit
must be set to Logic 0 in direct modulation mode.
Table 6. Modulation Type Configuration
Two-Level Modulation—No RU/RD
AFP Select
(CFR[23:22])
Linear Sweep Enable
(CFR[14])
Description
00
01
10
11
X
0
0
0
Modulation disabled
Amplitude modulation
Frequency modulation
Phase modulation
The modulation level bits (FR1[9:8]) are set to 00 (two-level).
The AFP select bits (CFR[23:22]) are set to the desired modulation
type. The RU/RD bits (FR1[11:10]) and the linear sweep enable
bit (CFR[14]) are disabled. Table 9 displays how the profile pins
and channels are assigned.
As shown in Table 9, only Profile Pin P0 can be used to modulate
Channel 0. If frequency modulation is selected and Profile Pin
P0 is Logic 0, Channel Frequency Tuning Word 0 (Register
0x04) is chosen; if Profile Pin P0 is Logic 1, Channel Word 1
(Register 0x0A) is chosen.
Table 7. Modulation Level Selection
Modulation Level (FR1[9:8])
Description
00
01
10
11
Two-level modulation
Four-level modulation
Eight-level modulation
16-level modulation
Four-Level Modulation—No RU/RD
The modulation level bits are set to 01 (four-level). The AFP
select bits (CFR[23:22]) are set to the desired modulation type.
The RU/RD bits (FR1[11:10]) and the linear sweep enable bit
(CFR[14]) are disabled. Note that the other two channels not
being used should have their AFP select bits set to 00 due to the
lack of profile pins. Table 10 displays how the profile pins and
channels are assigned to each other.
When modulating, the RU/RD function can be limited based
on pins available for controlling the feature. The SDIO_x pins
are for RU/RD only, not for modulation.
Table 8. RU/RD Profile Pin Assignments
Ramp-Up/Ramp-Down
(RU/RD) (FR1[11:10])
00
01
10
11
Description
RU/RD disabled
Only Profile Pin P2 and Profile Pin P3
available for RU/RD operation
Only Profile Pin P3 available for RU/RD
operation
Only SDIO_1, SDIO_2, and SDIO_3
pins available for RU/RD operation;
this forces the serial I/O to be used
only in 1-bit mode
For the conditions in Table 10, the profile (channel word)
register chosen is based on the 2-bit value presented to Profile
Pins [P0:P1] or Profile Pins [P2:P3].
For example, if PPC = 010, [P0:P1] = 11, and [P2:P3] = 01, then
the contents of the Channel Word 3 register of Channel 0 are
presented to the output of Channel 0 and the contents of the
Channel Word 1 register of Channel 3 are presented to the
output of Channel 3.
If the profile pins are used for RU/RD, Logic 0 is for ramp-up
and Logic 1 is for ramp-down.
Table 9. Profile Pin Channel Assignments
Profile Pin Configuration (PPC) (FR1[14:12])
P0
P1
P2
P3
Description
XXX
CH0
CH1
CH2
CH3
Two-level modulation, all channels, no RU/RD
P1
CH0
CH0
CH0
CH1
CH1
CH2
P2
CH1
CH2
CH3
CH2
CH3
CH3
P3
CH1
CH2
CH3
CH2
CH3
CH3
Description
Four-level modulation on CH0 and CH1, no RU/RD
Four-level modulation on CH0 and CH2, no RU/RD
Four-level modulation on CH0 and CH3, no RU/RD
Four-level modulation on CH1 and CH2, no RU/RD
Four-level modulation on CH1 and CH3, no RU/RD
Four-level modulation on CH2 and CH3, no RU/RD
Table 10. Profile Pin and Channel Assignments
Profile Pin Configuration (PPC) (FR1[14:12])
000
001
010
011
100
101
P0
CH0
CH0
CH0
CH1
CH1
CH2
Rev. B | Page 22 of 44
AD9959
Eight-Level Modulation—No RU/RD
For the conditions in Table 12, the profile register chosen is
based on the 4-bit value presented to Profile Pins [P0:P3].
For example, if PPC = X11 and [P0:P3] = 1110, the contents of
the Channel Word 14 register of Channel 3 is presented to the
output of Channel 3.
The modulation level bits (FR1[9:8]) are set to 10 (eight-level).
The AFP select bits (CFR[23:22]) are set to a nonzero value.
The RU/RD bits (FR1[11:10]) and the linear sweep enable bit
(CFR[14]) are disabled. Note that the AFP select bits of the
three channels not being used must be set to 00. Table 11 shows
the assignment of profile pins and channels.
Two-Level Modulation Using Profile Pins for RU/RD
When the RU/RD bits = 01, Profile Pin P2 and Profile Pin P3
are available for RU/RD. Note that only a modulation level of
two is available in this mode. See Table 13 for available pin
assignments.
For the condition in Table 11, the choice of channel word registers
is based on the 3-bit value presented to Profile Pins [P0:P2]. For
example, if PPC = X10 and [P0:P2] = 111, the contents of the
Channel Word 7 register of Channel 2 are presented to the output
of Channel 2.
Eight-Level Modulation Using a Profile Pin for RU/RD
When the RU/RD bits = 10, Profile Pin P3 is available for RU/RD.
Note that only a modulation level of eight is available in this
mode. See Table 14 for available pin assignments.
16-Level Modulation—No RU/RD
The modulation level bits (FR1[9:8]) are set to 11 (16-level). The
AFP select bits (CFR[23:22]) are set to the desired modulation
type. The RU/RD bits (FR1[11:10]) and the linear sweep enable
bit (CFR[14]) are disabled. The AFP select bits of the three
channels not being used must be set to 00. Table 12 displays how
the profile pins and channels are assigned.
Table 11. Profile Pin and Channel Assignments for Eight-Level Modulation (No RU/RD)
Profile Pin Config. (PPC)
(FR1[14:12])
X00
X01
X10
X11
P0
CH0
CH1
CH2
CH3
P1
CH0
CH1
CH2
CH3
P2
CH0
CH1
CH2
CH3
P3
X
X
X
X
Description
Eight-level modulation on CH0, no RU/RD
Eight-level modulation on CH1, no RU/RD
Eight-level modulation on CH2, no RU/RD
Eight-level modulation on CH3, no RU/RD
Table 12. Profile Pin and Channel Assignments for 16-Level Modulation (No RU/RD)
Profile Pin Config. (PPC)
(FR1[14:12])
X00
X01
X10
X11
P0
CH0
CH1
CH2
CH3
P1
CH0
CH1
CH2
CH3
P2
CH0
CH1
CH2
CH3
P3
CH0
CH1
CH2
CH3
Description
16-level modulation on CH0, no RU/RD
16-level modulation on CH1, no RU/RD
16-level modulation on CH2, no RU/RD
16-level modulation on CH3, no RU/RD
Table 13. Profile Pin and Channel Assignments for Two-Level Modulation (RU/RD Enabled)
Profile Pin Config. (PPC)
(FR1[14:12])
000
001
010
011
100
101
P0
CH0
CH0
CH0
CH1
CH1
CH2
P1
CH1
CH2
CH3
CH2
CH3
CH3
P2
CH0 RU/RD
CH0 RU/RD
CH0 RU/RD
CH1 RU/RD
CH1 RU/RD
CH2 RU/RD
P3
CH1 RU/RD
CH2 RU/RD
CH3 RU/RD
CH2 RU/RD
CH3 RU/RD
CH3 RU/RD
Description
Two-level modulation on CH0 and CH1 with RU/RD
Two-level modulation on CH0 and CH2 with RU/RD
Two-level modulation on CH0 and CH3 with RU/RD
Two-level modulation on CH1 and CH2 with RU/RD
Two-level modulation on CH1 and CH3 with RU/RD
Two-level modulation on CH2 and CH3 with RU/RD
Table 14. Profile Pin and Channel Assignments for Eight-Level Modulation (RU/RD Enabled)
Profile Pin Config. (PPC)
(FR1[14:12])
X00
X01
X10
X11
P0
CH0
CH1
CH2
CH3
P1
CH0
CH1
CH2
CH3
P2
CH0
CH1
CH2
CH3
P3
CH0 RU/RD
CH1 RU/RD
CH2 RU/RD
CH3 RU/RD
Rev. B | Page 23 of 44
Description
Eight-level modulation on CH0 with RU/RD
Eight-level modulation on CH1 with RU/RD
Eight-level modulation on CH2 with RU/RD
Eight-level modulation on CH3 with RU/RD
AD9959
MODULATION USING SDIO_x PINS FOR RU/RD
For RU/RD bits = 11, the SDIO_1, SDIO_2, and SDIO_3 pins
are available for RU/RD. In this mode, modulation levels of 2, 4,
and 16 are available. Note that the serial I/O port can be used only
in 1-bit serial mode.
Two-Level Modulation Using SDIO Pins for RU/RD
Table 15. Profile Pin and Channel Assignments in Two-Level
Modulation (RU/RD Enabled)
Profile Pin Config. (PPC)
(FR1[14:12])
XXX
P0
CH0
P1
CH1
P2
CH2
P3
CH3
For the configuration in Table 15, each profile pin is dedicated
to a specific channel. In this case, the SDIO_x pins can be used
for the RU/RD function, as described in Table 16.
Four-Level Modulation Using SDIO Pins for RU/RD
For RU/RD bits = 11 (the SDIO_1 and SDIO_2 pins are available for RU/RD), the modulation level is set to 4. See Table 17
for pin assignments, including SDIO_x pin assignments.
For the configuration shown in Table 17, the profile (channel
word) register is chosen based on the 2-bit value presented to
Profile Pins [P1:P2] or [P3:P4].
For example, if PPC = 011, [P0:P1] = 11, and [P2:P3] = 01,
the contents of the Channel Word 3 register of Channel 1 are
presented to the output of Channel 1, and the contents of the
Channel Word 1 register of Channel 2 are presented to the
output of Channel 2. SDIO_1 and SDIO_2 provide the RU/RD
function.
16-Level Modulation Using SDIO Pins for RU/RD
The RU/RD bits = 11 (the SDIO_1 pin is available for RU/RD),
and the level is set to 16. See the pin assignments shown in
Table 18.
For the configuration shown in Table 18, the profile (channel
word) register is chosen based on the 4-bit value presented to
Profile Pins [P0:P3]. For example, if PPC = X10 and [P0:P3] =
1101, then the contents of the Channel Word 13 register of
Channel 2 is presented to the output of Channel 2. The SDIO_1
pin provides the RU/RD function.
Table 16. Channel and SDIO_1/SDIO_2/SDIO_3 Pin Assignments for RU/RD Operation
SDIO_1
0
0
0
0
1
1
1
1
SDIO_2
0
0
1
1
0
0
1
1
SDIO_3
0
1
0
1
0
1
0
1
Description
Triggers the ramp-up function for CH0
Triggers the ramp-down function for CH0
Triggers the ramp-up function for CH1
Triggers the ramp-down function for CH1
Triggers the ramp-up function for CH2
Triggers the ramp-down function for CH2
Triggers the ramp-up function for CH3
Triggers the ramp-down function for CH3
Table 17. Channel and Profile Pin Assignments, Including SDIO_1/SDIO_2/SDIO_3 Pin Assignments for RU/RD Operation
Profile Pin Configuration (PPC) (FR1[14:12])
000
001
010
011
100
101
P0
CH0
CH0
CH0
CH1
CH1
CH2
P1
CH0
CH0
CH0
CH1
CH1
CH2
P2
CH1
CH2
CH3
CH2
CH3
CH3
P3
CH1
CH2
CH3
CH2
CH3
CH3
SDIO_1
CH0 RU/RD
CH0 RU/RD
CH0 RU/RD
CH1 RU/RD
CH1 RU/RD
CH2 RU/RD
SDIO_2
CH1 RU/RD
CH2 RU/RD
CH3 RU/RD
CH2 RU/RD
CH3 RU/RD
CH3 RU/RD
SDIO_3
N/A
N/A
N/A
N/A
N/A
N/A
Table 18. Channel and Profile Pin Assignments, Including SDIO_1 Pin Assignments for RU/RD Operation
Profile Pin Configuration (PPC) (FR1[14:12])
X00
X01
X10
X11
P0
CH0
CH1
CH2
CH3
P1
CH0
CH1
CH2
CH3
P2
CH0
CH1
CH2
CH3
Rev. B | Page 24 of 44
P3
CH0
CH1
CH2
CH3
SDIO_1
CH0 RU/RD
CH1 RU/RD
CH2 RU/RD
CH3 RU/RD
SDIO_2
N/A
N/A
N/A
N/A
SDIO_3
N/A
N/A
N/A
N/A
AD9959
Setting the Slope of the Linear Sweep
Linear sweep mode enables the user to sweep frequency, phase,
or amplitude from a starting point (S0) to an endpoint (E0).
The purpose of linear sweep mode is to provide better bandwidth containment compared to direct modulation by replacing
greater instantaneous changes with more gradual, user-defined
changes between S0 and E0.
The slope of the linear sweep is set by the intermediate step size
(delta-tuning word) between S0 and E0 and the time spent
(sweep ramp rate word) at each step. The resolution of the
delta-tuning word is 32 bits for frequency, 14 bits for phase, and
10 bits for amplitude. The resolution for the delta ramp rate
word is eight bits.
In linear sweep mode, S0 is loaded into the Channel Word 0
register (S0 is represented by one of three registers: Register 0x04,
Register 0x05, or Register 0x06, depending on the type of sweep)
and E0 is always loaded into Channel Word 1 (Register 0x0A).
If E0 is configured for frequency sweep, the resolution is 32 bits,
phase sweep is 14 bits, and amplitude sweep is 10 bits. When
sweeping phase or amplitude, the word value must be MSB aligned
in the Channel Word 1 register. The unused bits are don’t care
bits. The profile pins are used to trigger and control the direction
of the linear sweep for frequency, phase, and amplitude. All
channels can be programmed separately for a linear sweep. In
linear sweep mode, Profile Pin P0 is dedicated to Channel 0.
Profile Pin P1 is dedicated to Channel 1, and so on.
In linear sweep, each channel is assigned a rising delta word
(RDW, Register 0x08) and a rising sweep ramp rate word
(RSRR, Register 0x07). These settings apply when sweeping up
toward E0. The falling delta word (FDW, Register 0x09) and
falling sweep ramp rate (FSRR, Register 0x07) apply when
sweeping down toward S0. Figure 36 displays a linear sweep up
and then down using a profile pin. Note that the linear sweep
no-dwell bit is disabled; otherwise, the sweep accumulator
returns to 0 upon reaching E0.
E0
Table 19. Linear Sweep Parameter to Sweep
AFP Select
(CFR[23:22])
00
01
10
11
Linear Sweep Enable
(CFR[14])
1
1
1
1
RSRR
Δt
FSRR
Δt
PROFILE PIN
TIME
Figure 36. Linear Sweep Parameters
For a piecemeal or a nonlinear transition between S0 and E0,
the delta-tuning words and ramp rate words can be reprogrammed during the transition to produce the desired response.
The formulas for calculating the step size of RDW or FDW for
delta frequency, delta phase, or delta amplitude are as follows:
Description
N/A
Amplitude sweep
Frequency sweep
Phase sweep
RDW
Δf = ⎛⎜ 32 ⎞⎟ × SYSCLK (Hz)
⎝ 2
⎠
RDW
ΔΦ = ⎛⎜ 14 ⎞⎟ × 360°
⎝ 2
⎠
RDW
Δa = ⎛⎜ 10 ⎞⎟ × 1024 (DAC full-scale current)
⎝ 2
⎠
Table 20. Modulation Level Assignments
Modulation Level (FR1[9:8])
00 (Required in Linear Sweep)
01
10
11
Δf,p,a
Δf,p,a
S0
To enable linear sweep mode for a particular channel, the AFP
select bits (CFR[23:22]), the modulation level bits (FR1[9:8]),
and the linear sweep enable bit (CFR[14]) are programmed.
The AFP select bits determine the type of linear sweep to be
performed. The modulation level bits must be set to 00 (twolevel) for that specific channel (see Table 19 and Table 20)
FDW
RDW
05246-020
The AD9959 has the ability to ramp up or ramp down (RU/RD)
the output amplitude (using the 10-bit output scalar) before and
after a linear sweep. If the RU/RD feature is desired, unused
profile pins or unused SDIO_1/SDIO_2/SDIO_3 pins can be
configured for the RU/RD operation.
(FREQUENCY/PHASE/AMPLITUDE)
LINEAR SWEEP
LINEAR SWEEP MODE
Description
Two-level modulation
Four-level modulation
Eight-level modulation
16-level modulation
The formula for calculating delta time from RSRR or FSRR is
t = (RSRR ) × 1 / SYNC _ CLK
At 500 MSPS operation (SYNC_CLK = 125 MHz), the maximum time interval between steps is 1/125 MHz × 256 = 2.048 μs.
The minimum time interval is (1/125 MHz) × 1 = 8.0 ns.
The sweep ramp rate block (timer) consists of a loadable 8-bit
down counter that continuously counts down from the loaded
value to 1. When the ramp rate timer equals 1, the proper ramp rate
value is loaded and the counter begins counting down to 1 again.
Rev. B | Page 25 of 44
AD9959
This load and countdown operation continues for as long as the
timer is enabled. However, the count can be reloaded before
reaching 1 by either of the following two methods:
When the profile pin transitions from high to low, the FDW is
applied to the input of the sweep accumulator and the FSRR bits
are loaded into the sweep rate timer.
•
The FDW accumulates at the rate given by the falling sweep ramp
rate (FSRR) until the output is equal to the CFTW0 register
(Register 0x04) value. The sweep is then complete, and the output
is held constant in frequency.
•
Method 1 is to change the profile pin. When the profile pin
changes from Logic 0 to Logic 1, the rising sweep ramp rate
(RSRR) register value is loaded into the ramp rate timer,
which then proceeds to count down as normal. When the
profile pin changes from Logic 1 to Logic 0, the falling sweep
ramp rate (FSRR) register value is loaded into the ramp
rate timer, which then proceeds to count down as normal.
Method 2 is to set the CFR[14] bit and issue an I/O update.
If sweep is enabled and CFR[14] is set, the ramp rate timer
loads the value determined by the profile pin. If the profile
pin is high, the ramp rate timer loads the RSRR; if the profile
pin is low, the ramp rate timer loads FSRR.
See Figure 37 for the linear sweep block diagram. Figure 39
depicts a frequency sweep with no-dwell mode disabled. In this
mode, the output follows the state of the profile pin. A phase or
amplitude sweep works in the same manner.
LINEAR SWEEP NO-DWELL MODE
If the linear sweep no-dwell bit is set (CFR[15]), the rising sweep is
started in an identical manner to the dwell linear sweep mode;
that is, upon detecting Logic 1 on the profile input pin, the rising
sweep action is initiated. The word continues to sweep up at the
rate set by the rising sweep ramp rate at the resolution set by the
rising delta word until it reaches the terminal value. Upon reaching
the terminal value, the output immediately reverts to the starting
point and remains until Logic 1 is detected on the profile pin.
Frequency Linear Sweep Example: AFP Bits = 10
In the following example, the modulation level bits (FR1[9:8]) = 00,
the linear sweep enable bit (CFR[14]) = 1, and the linear sweep
no-dwell bit (CFR[15]) = 0.
In linear sweep mode, when the profile pin transitions from low
to high, the RDW is applied to the input of the sweep accumulator
and the RSRR register is loaded into the sweep rate timer.
Figure 38 shows an example of the no-dwell mode. The points
labeled A indicate where a rising edge is detected on the profile
pin, and the points labeled B indicate where the AD9959 has
determined that the output has reached E0 and reverts to S0.
The falling sweep ramp rate bits (LSRR[15:8]) and the falling
delta word bits (FDW[31:0]) are unused in this mode.
The RDW accumulates at the rate given by the rising sweep
ramp rate (RSRR) bits until the output is equal to the CW1
register value. The sweep is then complete, and the output is
held constant in frequency.
SWEEP ACCUMULATOR
0
FDW
0
32
MUX
RDW
0
32
MUX
32
Z–1
32
32
0
1
0
1
SWEEP ADDER
MUX
0
1
MUX
1
PROFILE PIN
32
CFTW0
RAMP RATE TIMER:
8-BIT LOADABLE DOWN COUNTER
ACCUMULATOR RESET
LOGIC
8
RATE TIME
LOAD CONTROL
LOGIC
MUX
FSRR
PROFILE PIN
32
CW1
1
05246-021
0
LIMIT LOGIC TO
KEEP SWEEP BETWEEN
S0 AND E0
RSRR
Figure 37. Linear Sweep Block Diagram
Rev. B | Page 26 of 44
AD9959
fOUT
B
FTW1
A
FTW0
B
B
A
A
SINGLE-TONE
MODE
P0 = 0
P0 = 1
P0 = 0
P0 = 1
P0 = 0
P0 = 1
05246-047
TIME
LINEAR SWEEP MODE ENABLE—NO-DWELL BIT SET
Figure 38. Linear Sweep Mode (No-Dwell Enabled)
fOUT
B
FTW1
A
FTW0
TIME
P0 = 0
LINEAR SWEEP MODE
P0 = 1
P0 = 0
AT POINT A: LOAD RISING RAMP RATE REGISTER, APPLY RDW<31:0>
AT POINT B: LOAD FALLING RAMP RATE REGISTER, APPLY FDW<31:0>
05246-048
SINGLE-TONE
MODE
Figure 39. Linear Sweep Mode (No-Dwell Disabled)
Continuous Clear Bits
SWEEP AND PHASE ACCUMULATOR CLEARING
FUNCTIONS
The AD9959 allows two different clearing functions. The first
is a continuous zeroing of the sweep logic and phase accumulator (clear and hold). The second is a clear and release or automatic
zeroing function. CFR[4] is the autoclear sweep accumulator bit
and CFR[2] is the autoclear phase accumulator bit. The continuous
clear bits are located in CFR, where CFR[3] clears the sweep
accumulator and CFR[1] clears the phase accumulator.
The continuous clear bits are static control signals that, when
active high, hold the respective accumulator at 0 while the bit is
active. When the bit goes low, the respective accumulator is
allowed to operate.
Clear and Release Bits
The autoclear sweep accumulator bit, when set, clears and
releases the sweep accumulator upon an I/O update or a change
in the profile input pins. The autoclear phase accumulator bit,
when set, clears and releases the phase accumulator upon an
I/O update or a change in the profile pins. The automatic
clearing function is repeated for every subsequent I/O update or
change in profile pins until the clear and release bits are reset
via the serial port.
Rev. B | Page 27 of 44
AD9959
OUTPUT AMPLITUDE CONTROL MODE
A special feature of this mode is that the maximum output
amplitude allowed is limited by the contents of the amplitude
scale factor (ACR[9:0]). This allows the user to ramp to a value
less than full scale.
The 10-bit scale factor (multiplier) controls the ramp-up and
ramp-down (RU/RD) time of an on/off emission from the DAC.
In burst transmissions of digital data, it reduces the adverse
spectral impact of abrupt bursts of data. The multiplier can
be bypassed by clearing the amplitude multiplier enable bit
(ACR[12] = 0).
Ramp Rate Timer
Automatic and manual RU/RD modes are supported. The automatic mode generates a zero-scale up to a full-scale (10 bits)
linear ramp at a rate determined by ACR (Register 0x06). The
start and direction of the ramp can be controlled by either the
profile pins or the SDIO_1/SDIO_2/SDIO_3 pins.
The ramp rate timer is a loadable down counter that generates
the clock signal to the 10-bit counter that generates the internal
scale factor. The ramp rate timer is loaded with the value of the
LSRR (Register 0x07) each time the counter reaches 1 (decimal).
This load and countdown operation continues for as long as the
timer is enabled unless the timer is forced to load before
reaching a count of 1.
Manual mode allows the user to directly control the output
amplitude by manually writing to the amplitude scale factor
value in the ACR (Register 0x06). Manual mode is enabled by
setting ACR[12] = 1 and ACR[11] = 0.
If the load ARR at I/O_UPDATE bit (ACR[10]) is set, the ramp
rate timer is loaded at an I/O update, a change in profile input,
or upon reaching a value of 1. The ramp timer can be loaded
before reaching a count of 1 by three methods.
Automatic RU/RD Mode Operation
•
Automatic RU/RD mode is active when both ACR[12] and
ACR[11] are set. When automatic RU/RD is enabled, the scale
factor is internally generated and applied to the multiplier input
port for scaling the output. The scale factor is the output of a 10-bit
counter that increments/decrements at a rate set by the 8-bit
output ramp rate register. The scale factor increments if the
external pin is high and decrements if the pin is low. The internally generated scale factor step size is controlled by ACR[15:14].
Table 21 describes the increment/decrement step size of the
internally generated scale factor per ACR[15:14].
Table 21. Increment/Decrement Step Size Assignments
Increment/Decrement Step Size
(ACR [15:14])
00
01
10
11
•
•
In the first method, the profile pins or the SDIO_1/
SDIO_2/SDIO_3 pins are changed. When the control
signal changes state, the ACR value is loaded into the ramp
rate timer, which then proceeds to count down as normal.
In the second method, the load ARR at I/O_UPDATE bit
(ACR[10]) is set, and an I/O update is issued.
The third method is to change from inactive automatic
RU/RD mode to active automatic RU/RD mode.
RU/RD Pin-to-Channel Assignment
When all four channels are in single-tone mode, the profile pins
are used for RU/RD operation.
When linear sweep and RU/RD are activated, the SDIO_1/
SDIO_2/SDIO_3 pins are used for RU/RD operation.
Size
1
2
4
8
In modulation mode, refer to the Modulation Mode section for
pin assignments.
Table 22. Profile Pin Assignments for RU/RD Operation
Profile Pin
P0
P1
P2
P3
RU/RD Operation
CH0
CH1
CH2
CH3
Table 23. Channel Assignments of SDIO_1/SDIO_2/SDIO_3 Pins for RU/RD Operation
Linear Sweep and RU/RD Modes Enabled
Simultaneously
Enable for CH0
Enable for CH0
Enable for CH1
Enable for CH1
Enable for CH2
Enable for CH2
Enable for CH3
Enable for CH3
SDIO_1
0
0
0
0
1
1
1
1
SDIO_2
0
0
1
1
0
0
1
1
SDIO_3
0
1
0
1
0
1
0
1
Rev. B | Page 28 of 44
Ramp-Up/Ramp-Down Control Signal Assignment
Ramp-up function for CH0
Ramp-down function for CH0
Ramp-up function for CH1
Ramp-down function for CH1
Ramp-up function for CH2
Ramp-down function for CH2
Ramp-up function for CH3
Ramp-down function for CH3
AD9959
SYNCHRONIZING MULTIPLE AD9959 DEVICES
The AD9959 allows easy synchronization of multiple AD9959
devices. At power-up, the phase of SYNC_CLK can be offset
between multiple devices. To correct for the offset and align the
SYNC_CLK edges, there are three methods (one automatic mode
and two manual modes) of synchronizing the SYNC_CLK edges.
These modes force the internal state machines of multiple
devices to a known state, which aligns the SYNC_CLK edges.
Table 24. System Clock Offset (Delay) Assignments
In addition, the user must send a coincident I/O_UPDATE to
multiple devices to maintain synchronization. Any mismatch in
REF_CLK phase between devices results in a corresponding
phase mismatch on the SYNC_CLK edges.
Automatic Synchronization Status Bits
AUTOMATIC MODE SYNCHRONIZATION
In automatic mode, multiple part synchronization is achieved
by connecting the SYNC_OUT pin on the master device to the
SYNC_IN pins of the slave devices. Devices are configured as
master or slave through programming bits, accessible via the
serial port.
A configuration for synchronizing multiple AD9959 devices in
automatic mode is shown in the Application Circuits section. In
this configuration, the AD9510 provides coincident REF_CLK
and SYNC_OUT signals to all devices.
Operation
The first steps are to program the master and slave devices for
their respective roles and then write the auto sync enable bit
(FR2[7]) = 1. Enabling the master device is performed by writing
its multidevice sync master enable bit in Function Register 2
(FR2[6]) = 1. This causes the SYNC_OUT of the master device
to output a pulse that has a pulse width equal to one system
clock period and a frequency equal to one-fourth of the system
clock frequency. Enabling devices as slaves is performed by
writing FR2[6] = 0.
In automatic synchronizing mode, the slave devices sample
SYNC_OUT pulses from the master device on the SYNC_IN
of the slave devices, and a comparison of all state machines is
made by the autosynchronization circuitry. If the slave devices
state machines are not identical to the master, the slave devices
state machines are stalled for one system clock cycle. This procedure synchronizes the slave devices within three SYNC_CLK
periods.
Delay Time Between SYNC_OUT and SYNC_IN
When the delay between SYNC_OUT and SYNC_IN exceeds
one system clock period, the system clock offset bits (FR2[1:0]) are
used to compensate. The default state of these bits is 00, which
implies that the SYNC_OUT of the master and the SYNC_IN of
the slave have a propagation delay of less than one system clock
period. If the propagation time is greater than one system clock
period, the time should be measured and the appropriate offset
programmed. Table 24 describes the delays required per system
clock offset value.
System Clock
Offset (FR2[1:0])
00
01
10
11
SYNC_OUT/SYNC_IN
Propagation Delay
0 ≤ delay ≤ 1
1 ≤ delay ≤ 2
2 ≤ delay ≤ 3
3 ≤ delay ≤ 4
If a slave device falls out of sync, the sync status bit is set high.
The multidevice sync status bit (FR2[5]) can be read through
the serial port. It is automatically cleared when read.
The synchronization routine continues to operate regardless of
the state of FR2[5]. FR2[5] can be masked by writing Logic 1 to
the multidevice sync mask bit (FR2[4]). If FR2[5] is masked, it is
held low.
MANUAL SOFTWARE MODE SYNCHRONIZATION
Manual software mode is enabled by setting the manual software
sync bit (FR1[0]) to Logic 1 in a device. In this mode, the I/O
update that writes the manual software sync bit to Logic 0 stalls
the state machine of the clock generator for one system clock
cycle. Stalling the clock generation state machine by one cycle
changes the phase relationship of SYNC_CLK between devices
by one system clock period (90°).
Note that the user may have to repeat this process until the
devices have their SYNC_CLK signals in phase. The SYNC_IN
input can be left floating because it has an internal pull-up. The
SYNC_OUT pin is not used.
The synchronization is complete when the master and slave
devices have their SYNC_CLK signals in phase.
MANUAL HARDWARE MODE SYNCHRONIZATION
Manual hardware mode is enabled by setting the manual hardware
sync bit (FR1[1]) to Logic 1 in a device. In manual hardware
synchronization mode, the SYNC_CLK stalls by one system
clock cycle each time a rising edge is detected on the SYNC_IN
input. Stalling the SYNC_CLK state machine by one cycle changes
the phase relationship of SYNC_CLK between devices by one
system clock period (90°).
Note that the user may have to repeat the process until the
devices have their SYNC_CLK signals in phase. The SYNC_IN
input can be left floating because it has an internal pull-up. The
SYNC_OUT is not used.
The synchronization is complete when the master and slave
devices have their SYNC_CLK signals in phase.
Rev. B | Page 29 of 44
AD9959
If the setup time between these signals is met, then constant
latency (pipeline) to the DAC output exists. For example, if
repetitive changes to phase offset via the SPI port is desired, the
latency of those changes to the DAC output is constant; otherwise,
a time uncertainty of one SYNC_CLK period is present.
I/O_UPDATE, SYNC_CLK, AND SYSTEM CLOCK
RELATIONSHIPS
I/O_UPDATE and SYNC_CLK are used together to transfer
data from the serial I/O buffer to the active registers in the
device. Data in the buffer is inactive.
SYNC_CLK is a rising edge active signal. It is derived from
the system clock and a divide-by-4 frequency divider. The
SYNC_CLK, which is externally provided, can be used to
synchronize external hardware to the AD9959 internal clocks.
I/O_UPDATE initiates the start of a buffer transfer. It can be
sent synchronously or asynchronously relative to the SYNC_CLK.
The I/O_UPDATE is essentially oversampled by the SYNC_CLK.
Therefore, I/O_UPDATE must have a minimum pulse width
greater than one SYNC_CLK period.
The timing diagram shown in Figure 40 depicts when data in
the buffer is transferred to the active registers.
SYSCLK
A
B
SYNC_CLK
I/O_UPDATE
DATA IN
I/O BUFFERS
N
N–1
N
N+1
N+1
N+2
THE DEVICE REGISTERS AN I/O UPDATE AT POINT A. THE DATA IS TRANSFERRED FROM THE ASYNCHRONOUSLY LOADED I/O BUFFERS AT POINT B.
Figure 40. I/O_UPDATE Transferring Data from I/O Buffer to Active Registers
Rev. B | Page 30 of 44
05246-049
DATA IN
REGISTERS
AD9959
SERIAL I/O PORT
Three of the four data pins (SDIO_1, SDIO_2, SDIO_3) can be
used for functions other than serial I/O port operation. These pins
can also be used to initiate a ramp-up or ramp-down (RU/RD)
of the 10-bit amplitude output scalar. In addition, SDIO_3 can
be used to provide the SYNC_I/O function that resynchronizes
the serial I/O port controller if it is out of proper sequence.
The maximum speed of the serial I/O port SCLK is 200 MHz,
but the four data pins (SDIO_0, SDIO_1, SDIO_2, SDIO_3)
can be used to further increase data throughput. The maximum
data throughput using all the SDIO pins (SDIO_0, SDIO_1,
SDIO_2, SDIO_3) is 800 Mbps.
For example, when accessing Function Register 1 (FR1), which
is three bytes wide, Phase 2 of the I/O cycle requires that three
bytes be transferred. After transferring all data bytes per the
instruction byte, the communication cycle is completed for that
register.
At the completion of a communication cycle, the AD9959 serial
port controller expects the next set of rising SCLK edges to be
the instruction byte for the next communication cycle. All data
written to the AD9959 is registered on the rising edge of SCLK.
Data is read on the falling edge of SCLK (see Figure 43 through
Figure 49). The timing specifications for Figure 41 and Figure 42
are described in Table 25.
Note that all channels share Register 0x03 to Register 0x18, which
are shown in the Register Maps and Bit Descriptions section.
This address sharing enables all four DDS channels to be written
to simultaneously. For example, if a common frequency tuning
word is desired for all four channels, it can be written once
through the serial I/O port to all four channels. This is the
default mode of operation (all channels enabled). To enable
each channel to be independent, the four channel enable bits
found in the channel select register (CSR, Register 0x00) must
be used.
tPRE
tDSU
There are two phases to a serial communications cycle. Phase 1
is the instruction cycle, which writes the instruction byte into
the AD9959. Each bit of the instruction byte is registered on
each corresponding rising edge of SCLK. The instruction byte
defines whether the upcoming data transfer is a write or read
operation. The instruction byte contains the serial address of
the address register.
tSCLKPWL
SCLK
tSCLKPWH
tDHLD
SDIO_x
Figure 41. Setup and Hold Timing for the Serial I/O Port
CS
There are effectively four sets or copies of addresses (Register 0x03
to Register 0x18) that the channel enable bits can access to provide
channel independence. See the Descriptions for Control Registers
section for further details of programming channels that are
common to or independent from each other. To properly read
back Register 0x03 to Register 0x18, the user must enable only
one channel enable bit at a time.
Serial operation of the AD9959 occurs at the register level,
not the byte level; that is, the controller expects that all bytes
contained in the register address are accessed. The SYNC_I/O
function can be used to abort an I/O operation, thereby allowing
fewer than all bytes to be accessed. This feature can be used to
program only a part of the addressed register. Note that only
completed bytes are affected.
tSCLK
CS
05246-023
The AD9959 serial I/O port offers multiple configurations to
provide significant flexibility. The serial I/O port offers an SPIcompatible mode of operation that is virtually identical to the
SPI operation found in earlier Analog Devices DDS products.
The flexibility is provided by four data pins (SDIO_0, SDIO_1,
SDIO_2, SDIO_3) that allow four programmable modes of
serial I/O operation.
Phase 2 of the I/O cycle consists of the actual data transfer
(write/read) between the serial port controller and the serial
port buffer. The number of bytes transferred during this phase
of the communication cycle is a function of the register being
accessed. The actual number of additional SCLK rising edges
required for the data transfer and instruction byte depends on
the number of bytes in the register and the serial I/O mode of
operation.
SCLK
SDIO_x
SDO (SDIO_2)
tDV
05246-024
OVERVIEW
Figure 42. Timing Diagram for Data Read for Serial I/O Port
Table 25. Timing Specifications
Parameter
tPRE
tSCLK
tDSU
tSCLKPWH
tSCLKPWL
tDHLD
tDV
Rev. B | Page 31 of 44
Min
1.0
5.0
2.2
2.2
1.6
0
12
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
Description
CS setup time
Period of serial data clock
Serial data setup time
Serial data clock pulse width high
Serial data clock pulse width low
Serial data hold time
Data valid time
AD9959
Each set of communication cycles does not require an I/O update
to be issued. The I/O update transfers data from the I/O port
buffer to active registers. The I/O update can be sent for each
communication cycle or can be sent when all serial operations
are complete. However, data is not active until an I/O update is
sent, with the exception of the channel enable bits in the channel
select register (CSR). These bits do not require an I/O update to
be enabled.
INSTRUCTION BYTE DESCRIPTION
The instruction byte contains the following information:
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
R/W
x1
x1
A4
A3
A2
A1
A0
1
x = don’t care bit.
Bit D7 of the instruction byte (R/W) determines whether a read
or write data transfer occurs after the instruction byte write. A
logic high indicates a read operation. A logic low indicates a
write operation.
Bit D4 to Bit D0 of the instruction byte determine which register is
accessed during the data transfer portion of the communication
cycle. The internal byte addresses are generated by the AD9959.
SERIAL I/O PORT PIN DESCRIPTION
this pin. The SDO function is not available in 2-bit or 4-bit serial
I/O modes.
SYNC_I/O
The SYNC_I/O function is available in 1-bit and 2-bit modes.
SDIO_3 serves as the SYNC_I/O pin when this function is
active. Bits CSR[2:1] control the configuration of this pin.
Otherwise, the SYNC_I/O function is used to synchronize the
I/O port state machines without affecting the addressable register
contents. An active high input on the SYNC_I/O (SDIO_3) pin
causes the current communication cycle to abort. After SDIO_3
returns low (Logic 0), another communication cycle can begin,
starting with the instruction byte write. The SYNC_I/O function is
not available in 4-bit serial I/O mode.
MSB/LSB TRANSFER DESCRIPTION
The AD9959 serial port can support both most significant bit
(MSB) first or least significant bit (LSB) first data formats. This
functionality is controlled by CSR[0]. MSB first is the default
mode. When CSR[0] is set high, the AD9959 serial port is in
LSB first format. The instruction byte must be written in the
format indicated by CSR[0], that is, if the AD9959 is in LSB first
mode, the instruction byte must be written from LSB to MSB. If
the AD9959 is in MSB first mode (default), the instruction byte
must be written from MSB to LSB.
Example Operation
Serial Data Clock (SCLK)
The serial data clock pin is used to synchronize data to and from
the internal state machines of the AD9959. The maximum
SCLK toggle frequency is 200 MHz.
Chip Select (CS)
To write Function Register 1 (FR1, Register 0x01) in MSB first
format, apply an instruction byte of 00000001 starting with the
MSB (in the following example instruction byte, the MSB is
D7). From this instruction, the internal controller recognizes a
write transfer of three bytes starting with the MSB, FR1[23].
Bytes are written on each consecutive rising SCLK edge until
Bit 0 is transferred. When the last data bit is written, the I/O
communication cycle is complete and the next byte is considered
an instruction byte.
The chip select pin allows more than one AD9959 device to be
on the same set of serial communications lines. The chip select
is an active low enable pin. SDIO_x inputs go to a high impedance state when CS is high. If CS is driven high during any
communication cycle, that cycle is suspended until CS is
reactivated low. The CS pin can be tied low in systems that
maintain control of SCLK.
D7
D6
D5
D4
D3
D2
D1
D0
Serial Data I/O (SDIO_0, SDIO_1, SDIO_3)
0
0
0
0
0
0
0
1
Of the four SDIO pins, only the SDIO_0 pin is a dedicated SDIO
pin. SDIO_1, SDIO_2, and SDIO_3 can also be used to ramp
up/ramp down the output amplitude. Bits[2:1] in the channel
select register (CSR, Register 0x00) control the configuration
of these pins. See the Serial I/O Modes of Operation for more
information.
SERIAL I/O PORT FUNCTION DESCRIPTION
Serial Data Out (SDO)
The SDO function is available in single-bit (3-wire) mode only.
In SDO mode, data is read from the SDIO_2 pin for protocols
that use separate lines for transmitting and receiving data (see
Table 26 for pin configuration options). Bits[2:1] in the channel
select register (CSR, Register 0x00) control the configuration of
Example Instruction Byte1
MSB
1
LSB
Note that the bit values are for example purposes only.
To write Function Register 1 (FR1) in LSB first format, apply an
instruction byte of 00000001, starting with the LSB bit (in the
preceding example instruction byte, the LSB is D0). From this
instruction, the internal controller recognizes a write transfer of
three bytes, starting with the LSB, FR1[0]. Bytes are written on
each consecutive rising SCLK edge until Bit 23 is transferred.
When the last data bit is written, the I/O communication cycle is
complete and the next byte is considered an instruction byte.
Rev. B | Page 32 of 44
AD9959
SERIAL I/O MODES OF OPERATION
The following are the four programmable modes of serial I/O
port operation:
•
•
•
•
Single-bit serial 2-wire mode (default mode)
Single-bit serial 3-wire mode
2-bit serial mode
4-bit serial mode (SYNC_I/O not available)
Table 26 displays the function of all six serial I/O interface pins,
depending on the mode of serial I/O operation programmed.
Table 26. Serial I/O Port Pin Function vs. Serial I/O Mode
Pin
SCLK
Single-Bit
Serial 2-Wire
Mode
Serial clock
Single-Bit
Serial 3-Wire
Mode
Serial clock
2-Bit
Serial
Mode
Serial clock
CS
Chip select
Chip select
Chip select
SDIO_0
Serial data I/O
Serial data in
SDIO_1
Not used for
SDIO1
Not used for
SDIO1
SYNC_I/O
Not used for
SDIO1
Serial data
out (SDO)
SYNC_I/O
Serial data
I/O
Serial data
I/O
Not used
for SDIO1
SYNC_I/O
SDIO_2
SDIO_3
1
4-Bit
Serial
Mode
Serial
clock
Chip
select
Serial
data I/O
Serial
data I/O
Serial
data I/O
Serial
data I/O
In serial mode, these pins (SDIO_0/SDIO_1/SDIO_2/SDIO_3) can be used for
RU/RD operation.
The two bits in the channel select register, CSR[2:1], set the
serial I/O mode of operation and are defined in Table 27.
2-Bit Serial Mode
The SPI port operation in 2-bit serial mode is identical to the
SPI port operation in single-bit serial mode, except that two bits
of data are registered on each rising edge of SCLK. Therefore, it
only takes four clock cycles to transfer eight bits of information.
The SDIO_0 pin contains the even numbered data bits using
the notation D[7:0], and the SDIO_1 pin contains the odd
numbered data bits. This even and odd numbered pin/data
alignment is valid in both MSB and LSB first formats (see
Figure 44).
4-Bit Serial Mode
The SPI port in 4-bit serial mode is identical to the SPI port in
single-bit serial mode, except that four bits of data are registered
on each rising edge of SCLK. Therefore, it takes only two clock
cycles to transfer eight bits of information. The SDIO_0 and
SDIO_2 pins contain even numbered data bits using the notation
D[7:0], and the SDIO_0 pin contains the LSB of the nibble. The
SDIO_1 and SDIO_3 pins contain the odd numbered data bits,
and the SDIO_1 pin contains the LSB of the nibble to be accessed.
Note that when programming the device for 4-bit serial mode,
it is important to keep the SDIO_3 pin at Logic 0 until the device is
programmed out of the single-bit serial mode. Failure to do so
can result in the serial I/O port controller being out of sequence.
Table 27. Serial I/O Mode of Operation
Serial I/O Mode Select
(CSR[2:1])
00
01
10
11
In single-bit serial mode, 2-wire interface operation, the
SDIO_0 pin is the single serial data I/O pin. In single-bit serial
mode 3-wire interface operation, the SDIO_0 pin is the serial
data input pin and the SDIO_2 pin is the output data pin.
Regardless of the number of wires used in the interface, the
SDIO_3 pin is configured as an input and operates as the
SYNC_I/O pin in the single-bit serial mode and 2-bit serial
mode. The SDIO_1 pin is unused in this mode (see Table 26).
Mode of Operation
Single-bit serial mode (2-wire mode)
Single-bit serial mode (3-wire mode)
2-bit serial mode
4-bit serial mode
Single-Bit Serial (2-Wire and 3-Wire) Modes
Figure 43 through Figure 45 represent write timing diagrams
for each of the serial I/O modes available. Both MSB and LSB
first modes are shown. LSB first bits are shown in parentheses.
The clock stall low/high feature shown is not required. It is used
to show that data (SDIO) must have the proper setup time
relative to the rising edge of SCLK.
The single-bit serial mode interface allows read/write access to
all registers that configure the AD9959. MSB first or LSB first
transfer formats are supported. In addition, the single-bit serial
mode interface port can be configured either as a single pin I/O,
which allows a 2-wire interface, or as two unidirectional pins
for input/output, which enable a 3-wire interface. Single-bit
mode allows the use of the SYNC_I/O function.
Figure 46 through Figure 49 represent read timing diagrams for
each of the serial I/O modes available. Both MSB and LSB first
modes are shown. LSB first bits are shown in parentheses. The
clock stall low/high feature shown is not required. It is used to
show that data (SDIO) must have the proper setup time relative
to the rising edge of SCLK for the instruction byte and the read
data that follows the falling edge of SCLK.
Rev. B | Page 33 of 44
AD9959
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
I6
(I1)
I5
(I2)
I4
(I3)
I3
(I4)
I2
(I5)
I1
(I6)
I0
(I7)
D7
(D0)
D6
(D1)
D5
(D2)
D4
(D3)
D3
(D4)
D2
(D5)
Figure 43. Single-Bit Serial Mode Write Timing—Clock Stall Low
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO_1
I7
(I1)
I5
(I3)
I3
(I5)
I1
(I7)
D7
(D1)
D5
(D3)
D3
(D5)
D1
(D7)
SDIO_0
I6
(I0)
I4
(I2)
I2
(I4)
I0
(I6)
D6
(D0)
D4
(D2)
D2
(D4)
D0
(D6)
Figure 44. 2-Bit Serial Mode Write Timing—Clock Stall Low
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO_3
I7
(I3)
I3
(I7)
D7
(D3)
D3
(D7)
SDIO_2
I6
(I2)
I2
(I6)
D6
(D2)
D2
(D6)
SDIO_1
I5
(I1)
I1
(I5)
D5
(D1)
D1
(D5)
SDIO_0
I4
(I0)
I0
(I4)
D4
(D0)
D0
(D4)
Figure 45. 4-Bit Serial Mode Write Timing—Clock Stall Low
Rev. B | Page 34 of 44
05246-026
I7
(I0)
05246-027
SDIO_0
D1
(D6)
D0
(D7)
05246-025
SCLK
AD9959
DATA TRANSFER CYCLE
INSTRUCTION CYCLE
CS
I7
(I0)
SDIO_0
I6
(I1)
I5
(I2)
I4
(I3)
I3
(I4)
I2
(I5)
I1
(I6)
I0
(I7)
D7
(D0)
D6
(D1)
D5
(D2)
D4
(D3)
D3
(D4)
D2
(D5)
D1
(D6)
D0
(D7)
05246-028
SCLK
Figure 46. Single-Bit Serial Mode (2-Wire) Read Timing—Clock Stall High
DATA TRANSFER CYCLE
INSTRUCTION CYCLE
CS
SCLK
I6
(I1)
I5
(I2)
I4
(I3)
I3
(I4)
I2
(I5)
I1
(I6)
I0
(I7)
DON'T CARE
SDO
D7
(D0)
(SDIO_2 PIN)
D6
(D1)
D5
(D2)
D4
(D3)
D3
(D4)
D2
(D5)
Figure 47. Single-Bit Serial Mode (3-Wire) Read Timing—Clock Stall Low
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SDIO_1
I7
(I1)
I5
(I3)
I3
(I5)
I1
(I7)
D7
(D1)
D5
(D3)
D3
(D5)
D1
(D7)
SDIO_0
I6
(I0)
I4
(I2)
I2
(I4)
I0
(I6)
D6
(D0)
D4
(D2)
D2
(D4)
D0
(D6)
05246-030
SCLK
Figure 48. 2-Bit Serial Mode Read Timing—Clock Stall High
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SCLK
SDIO_3
I7
(I3)
I3
(I7)
D7
(D3)
D3
(D7)
SDIO_2
I6
(I2)
I2
(I6)
D6
(D2)
D2
(I6)
SDIO_1
I5
(I1)
I1
(I5)
D5
(D1)
D1
(D5)
SDIO_0
I4
(I0)
I0
(I4)
D4
(D0)
D0
(D4)
Figure 49. 4-Bit Serial Mode Read Timing—Clock Stall High
Rev. B | Page 35 of 44
D1
(D6)
D0
(D7)
05246-029
I7
(I0)
05246-031
SDIO_0
AD9959
REGISTER MAPS AND BIT DESCRIPTIONS
REGISTER MAPS
Table 28. Control Register Map
Register
Name
(Serial
Address)
Channel
Select
Register
(CSR)
(0x00)
Function
Register 1
(FR1)
(0x01)
Function
Register 2
(FR2)
(0x02)
Bit
Range
[7:0]
Bit 7
(MSB)
Channel 3
enable1
[23:16]
VCO gain
control
[15:8]
Open
[7:0]
Reference
clock input
power-down
All channels
autoclear
sweep
accumulator
Auto sync
enable
[15:8]
[7:0]
1
Bit 6
Channel 2
enable1
Bit 5
Channel 1
enable1
Bit 4
Channel 0
enable1
Bit 3
Must
be 0
Bit 2
Bit 1
Serial I/O mode
select[2:1]
PLL divider ratio[22:18]
Profile pin configuration (PPC)[14:12]
External powerdown mode
SYNC_CLK
disable
DAC reference
power-down
All channels
clear sweep
accumulator
All channels
autoclear phase
accumulator
All channels
clear phase
accumulator
Multidevice sync
master enable
Multidevice sync
status
Multidevice sync
mask
Ramp-up/
ramp-down
(RU/RD)[11:10]
Open[3:2]
Open[11:10]
Open[3:2]
Bit 0
(LSB)
LSB first
Default
Value
0xF0
Charge pump
control[17:16]
0x00
Modulation level[9:8]
0x00
Manual
Manual
hardware
software
sync
sync
Open[9:8]
0x00
System clock
offset[1:0]
0x00
0x00
Channel enable bits do not require an I/O update to be activated. These bits are active immediately after the byte containing the bits is written. All other bits need an
I/O update to become active. The four channel enable bits shown in Table 28 are used to enable/disable any combination of the four channels. The default for all four
channels is enabled.
In the channel select register, if the user wants four different
frequencies for all four DDS channels, use the following
protocol:
3.
Enable the Channel 1 enable bit only, located in the
channel select register, and disable the other three
channels.
1.
Enable (Logic 1) the Channel 0 enable bit, which is located
in the channel select register, and disable the other three
channels (Logic 0).
4.
Write the desired frequency tuning word for Channel 1 in
Step 3, then disable the Channel 1 enable bit.
2.
Write the desired frequency tuning word for Channel 0, as
described in Step 1, and then disable the Channel 0 enable
bit (Logic 0).
Rev. B | Page 36 of 44
AD9959
Table 29. Channel Register Map
Register
Name
(Serial
Address)
Channel
Function
Register1
(CFR)
(0x03)
Bit
Range
[23:16]
[15:8]
[7:0]
Channel
Frequency
Tuning
Word 01
(CFTW0)
(0x04)
Channel
Phase
Offset
Word 01
(CPOW0)
(0x05)
Amplitude
Control
Register
(ACR)
(0x06)
Linear
Sweep
Ramp
Rate1
(LSRR)
(0x07)
LSR Rising
Delta
Word1
(RDW)
(0x08)
LSR Falling
Delta
Word1
(FDW)
(0x09)
Bit 7
(MSB)
Bit 6
Amplitude freq. phase
(AFP) select[23:22]
Linear
Linear
sweep
sweep
no-dwell
enable
Digital
DAC
powerpowerdown
down
Bit 5
Load SRR at
I/O_UPDATE
Matched
pipe delays
active
[31:24]
[23:16]
[15:8]
[7:0]
[15:8]
[7:0]
[23:16]
[15:8]
[7:0]
[15:8]
[7:0]
Bit 4
Bit 3
Bit 2
Open[21:16]
Open[12:11]
Autoclear
sweep
accumulator
Clear sweep
accumulator
Must be 0
Autoclear
phase
accumulator
Bit 1
Bit 0
(LSB)
DAC full-scale current
control[9:8]
0x03
Sine
wave
output
enable
0x02
Clear phase
accumulator2
Frequency Tuning Word 0[31:24]
Frequency Tuning Word 0[23:16]
Frequency Tuning Word 0[15:8]
Frequency Tuning Word 0[7:0]
Open[15:14]
Increment/decrement
step size[15:14]
0x00
N/A
N/A
N/A
Phase Offset Word 0[13:8]
Phase Offset Word 0[7:0]
Open
Amplitude ramp rate[23:16]
Amplitude
Ramp-up/
Load ARR at
multiplier
ramp-down
I/O_UPDATE
enable
enable
Amplitude scale factor[7:0]
Falling sweep ramp rate (FSRR)[15:8]
Rising sweep ramp rate (RSRR)[7:0]
Default
Value
0x00
0x00
0x00
Amplitude scale
factor[9:8]
N/A
0x00
0x00
N/A
N/A
[31:24]
[23:16]
[15:8]
[7:0]
Rising delta word[31:24]
Rising delta word[23:16]
Rising delta word[15:8]
Rising delta word[7:0]
N/A
N/A
N/A
N/A
[31:24]
[23:16]
[15:8]
[7:0]
Falling delta word[31:24]
Falling delta word[23:16]
Falling delta word[15:8]
Falling delta word[7:0]
N/A
N/A
N/A
N/A
1
There are four sets of channel registers and profile registers, one per channel. This is not shown in the Table 29 or Table 30 because the addresses of all channel
registers and profile registers are the same for each channel. Therefore, the channel enable bits (CSR[7:4]) determine if the channel registers and/or profile registers of
each channel are written to or not.
2
The clear phase accumulator bit is set to Logic 1 after a master reset. It self-clears or is set to Logic 0 when an I/O update is asserted.
Rev. B | Page 37 of 44
AD9959
Table 30. Profile Register Map1
Register Name (Address)
Channel Word 1 (CW1) (0x0A)
Channel Word 2 (CW2) (0x0B)
Channel Word 3 (CW3) (0x0C)
Channel Word 3 (CW4) (0x0D)
Channel Word 5 (CW5) (0x0E)
Channel Word 6 (CW6) (0x0F)
Channel Word 7 (CW7) (0x10)
Channel Word 8 (CW8) (0x11)
Channel Word 9 (CW9) (0x12)
Channel Word 10 (CW10) (0x13)
Channel Word 11 (CW11) (0x14)
Channel Word 12 (CW12) (0x15)
Channel Word 13 (CW13) (0x16)
Channel Word 14 (CW14) (0x17)
Channel Word 15 (CW15) (0x18)
Bit
Range
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
[31:0]
Bit 7
Bit 0
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
(MSB)
(LSB)
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Frequency tuning word[31:0] or phase word[31:18] or amplitude word[31:22]
Default
Value
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
1
Each channel word register has a capacity of 32 bits. If phase or amplitude is stored in the channel word registers, it must be first MSB aligned per the bit range.
Only the MSB byte is shown for each channel word register.
Rev. B | Page 38 of 44
AD9959
DESCRIPTIONS FOR CONTROL REGISTERS
Channel Select Register (CSR)—Address 0x00
One byte is assigned to this register.
The CSR determines if channels are enabled or disabled by the status of the four channel enable bits. All four channels are enabled by
their default state. The CSR also determines which serial mode of operation is selected. In addition, the CSR offers a choice of MSB first
or LSB first format.
Table 31. Bit Descriptions for CSR
Bit
7:4
Mnemonic
Channel [3:0] enable
3
2:1
Must be 0
Serial I/O mode select
0
LSB first
Description
Bits are active immediately after being written. They do not require an I/O update to take effect.
There are four sets of channel registers and profile (channel word) registers, one per channel. This
is not shown in the channel register map or the profile register map. The addresses of all channel
registers and profile registers are the same for each channel. Therefore, the channel enable bits
distinguish the channel registers and profile registers values of each channel. For example,
1001 = only Channel 3 and Channel 0 receive commands from the channel registers and profile
registers.
0010 = only Channel 1 receives commands from the channel registers and profile registers.
Must be set to 0.
00 = single-bit serial (2-wire mode).
01 = single-bit serial (3-wire mode).
10 = 2-bit serial mode.
11 = 4-bit serial mode.
See the Serial I/O Modes of Operation section for more details.
0 = the serial interface accepts serial data in MSB first format (default).
1 = the serial interface accepts serial data in LSB first format.
Function Register 1 (FR1)—Address 0x01
Three bytes are assigned to this register. FR1 is used to control the mode of operation of the chip.
Table 32. Bit Descriptions for FR1
Bit
23
Mnemonic
VCO gain control
22:18
PLL divider ratio
17:16
Charge pump control
15
14:12
Open
Profile pin configuration (PPC)
11:10
Ramp-up/ramp-down (RU/RD)
9:8
Modulation level
7
Reference clock input
power-down
External power-down mode
6
Description
0 = the low range (system clock below 160 MHz) (default).
1 = the high range (system clock above 255 MHz).
If the value is 4 or 20 (decimal) or between 4 and 20, the PLL is enabled and the value sets the
multiplication factor. If the value is outside of 4 and 20 (decimal), the PLL is disabled.
00 (default) = the charge pump current is 75 μA.
01 = charge pump current is 100 μA.
10 = charge pump current is 125 μA.
11 = charge pump current is 150 μA.
The profile pin configuration bits control the configuration of the data and SDIO_x pins for the
different modulation modes. See the Modulation Mode section in this document for details.
The RU/RD bits control the amplitude ramp-up/ramp-down time of a channel. See the Output
Amplitude Control Mode section for more details.
The modulation (FSK, PSK, and ASK) level bits control the level (2/4/8/16) of modulation to be
performed for a channel. See the Modulation Mode section for more details.
0 = the clock input circuitry is enabled for operation (default).
1 = the clock input circuitry is disabled and is in a low power dissipation state.
0 = the external power-down mode is in fast recovery power-down mode (default). In this mode,
when the PWR_DWN_CTL input pin is high, the digital logic and the DAC digital logic are
powered down. The DAC bias circuitry, PLL, oscillator, and clock input circuitry are not powered
down.
1 = the external power-down mode is in full power-down mode. In this mode, when the
PWR_DWN_CTL input pin is high, all functions are powered down. This includes the DAC and PLL,
which take a significant amount of time to power up.
Rev. B | Page 39 of 44
AD9959
Bit
5
Mnemonic
SYNC_CLK disable
4
DAC reference power-down
3:2
1
Open
Manual hardware sync
0
Manual software sync
Description
0 = the SYNC_CLK pin is active (default).
1 = the SYNC_CLK pin assumes a static Logic 0 state (disabled). In this state, the pin drive logic is
shut down. However, the synchronization circuitry remains active internally to maintain normal
device operation.
0 = DAC reference is enabled (default).
1 = DAC reference is powered down.
See the Synchronizing Multiple AD9959 Devices section for details.
0 = the manual hardware synchronization feature of multiple devices is inactive (default).
1 = the manual hardware synchronization feature of multiple devices is active.
0 = the manual software synchronization feature of multiple devices is inactive (default).
1 = the manual software synchronization feature of multiple devices is active. See the
Synchronizing Multiple AD9959 Devices section for details.
Function Register 2 (FR2)—Address 0x02
Two bytes are assigned to this register. The FR2 is used to control the various functions, features, and modes of the AD9959.
Table 33. Bit Descriptions for FR2
Bit
15
Mnemonic
All channels autoclear sweep
accumulator
14
All channels clear
sweep accumulator
All channels autoclear phase
accumulator
13
12
11:8
7
6
5
4
3: 2
1:0
All channels clear phase
accumulator
Open
Auto sync enable
Multidevice sync master enable
Multidevice sync status
Multidevice sync mask
Open
System clock offset
Description
0 = a new delta word is applied to the input, as in normal operation, but not loaded into the
accumulator (default).
1 = this bit automatically and synchronously clears (loads 0s into) the sweep accumulator for one
cycle upon reception of the I/O_UPDATE sequence indicator on all four channels.
0 = the sweep accumulator functions as normal (default).
1 = the sweep accumulator memory elements for all four channels are asynchronously cleared.
0 = a new frequency tuning word is applied to the inputs of the phase accumulator, but not
loaded into the accumulator (default).
1 = this bit automatically and synchronously clears (loads 0s into) the phase accumulator for one
cycle upon receipt of the I/O update sequence indicator on all four channels.
0 = the phase accumulator functions as normal (default).
1 = the phase accumulator memory elements for all four channels are asynchronously cleared.
See the Synchronizing Multiple AD9959 Devices section for more details.
See the Synchronizing Multiple AD9959 Devices section for more details.
See the Synchronizing Multiple AD9959 Devices section for more details.
See the Synchronizing Multiple AD9959 Devices section for more details.
See the Synchronizing Multiple AD9959 Devices section for more details.
Rev. B | Page 40 of 44
AD9959
DESCRIPTIONS FOR CHANNEL REGISTERS
Channel Function Register (CFR)—Address 0x03
Three bytes are assigned to this register.
Table 34. Bit Descriptions for CFR
Bit
23:22
21:16
15
Mnemonic
Amplitude frequency
phase (AFP) select
Open
Linear sweep no-dwell
14
Linear sweep enable
13
Load SRR at
I/O_UPDATE
12:11
10
9:8
7
Open
Must be 0
DAC full-scale current
control
Digital power-down
6
DAC power-down
5
Matched pipe delays
active
4
Autoclear sweep
accumulator
3
Clear sweep
accumulator
Autoclear phase
accumulator
Description
Controls what type of modulation is to be performed for that channel. See the Modulation Mode section
for details.
0 = the linear sweep no-dwell function is inactive (default).
1 = the linear sweep no-dwell function is active. If CFR[15] is active, the linear sweep no-dwell function is
activated. See the Linear Sweep Mode section for details. If CFR[14] is clear, this bit is don’t care.
0 = the linear sweep capability is inactive (default).
1 = the linear sweep capability is enabled. When enabled, the delta frequency tuning word is applied to
the frequency accumulator at the programmed ramp rate.
0 = the linear sweep ramp rate timer is loaded only upon timeout (timer = 1) and is not loaded because
of an I/O_UPDATE input signal (default).
1 = the linear sweep ramp rate timer is loaded upon timeout (timer = 1) or at the time of an I/O_UPDATE
input signal.
Must be set to 0.
11 = the DAC is at the largest LSB value (default).
See Table 5 for other settings.
0 = the digital core is enabled for operation (default).
1 = the digital core is disabled and is in its lowest power dissipation state.
0 = the DAC is enabled for operation (default).
1 = the DAC is disabled and is in its lowest power dissipation state.
0 = matched pipe delay mode is inactive (default).
1 = matched pipe delay mode is active. See the Single-Tone Mode—Matched Pipeline Delay section for
details.
0 = the current state of the sweep accumulator is not impacted by receipt of an I/O_UPDATE signal
(default).
1 = the sweep accumulator is automatically and synchronously cleared for one cycle upon receipt
of an I/O_UPDATE signal.
2
0 = the sweep accumulator functions as normal (default).
1 = the sweep accumulator memory elements are asynchronously cleared.
0 = the current state of the phase accumulator is not impacted by receipt of an I/O_UPDATE signal
(default).
1 = the phase accumulator is automatically and synchronously cleared for one cycle upon receipt
of an I/O_UPDATE signal.
1
0
Clear phase
accumulator
Sine wave output
enable
0 = the phase accumulator functions as normal (default).
1 = the phase accumulator memory elements are asynchronously cleared.
0 = the angle-to-amplitude conversion logic employs a cosine function (default).
1 = the angle-to-amplitude conversion logic employs a sine function.
Rev. B | Page 41 of 44
AD9959
Channel Frequency Tuning Word 0 (CFTW0)—Address 0x04
Four bytes are assigned to this register.
Table 35. Description for CFTW0
Bit
31:0
Mnemonic
Frequency Tuning Word 0
Description
Frequency Tuning Word 0 for each channel.
Channel Phase Offset Word 0 (CPOW0)—Address 0x05
Two bytes are assigned to this register.
Table 36. Description for CPOW0
Bit
15:14
13:0
Mnemonic
Open
Phase Offset Word 0
Description
Phase Offset Word 0 for each channel
Amplitude Control Register (ACR)—Address0x06
Three bytes are assigned to this register.
Table 37. Description for ACR
Bit
23:16
15:14
Mnemonic
Amplitude ramp rate
Increment/decrement
step size
Open
Description
Amplitude ramp rate value.
Amplitude increment/decrement step size.
12
Amplitude multiplier
enable
11
Ramp-up/ramp-down
enable
10
Load ARR at
I/O_UPDATE
9:0
Amplitude scale factor
0 = amplitude multiplier is disabled. The clocks to this scaling function (auto RU/RD) are stopped
for power saving, and the data from the DDS core is routed around the multipliers (default).
1 = amplitude multiplier is enabled.
This bit is valid only when ACR[12] is active high.
0 = when ACR[12] is active, Logic 0 on ACR[11] enables the manual RU/RD operation. See the
Output Amplitude Control Mode section for details (default).
1 = if ACR[12] is active, a Logic 1 on ACR[11] enables the auto RU/RD operation. See the Output
Amplitude Control Mode section for details.
0 = the amplitude ramp rate timer is loaded only upon timeout (timer = 1) and is not loaded due
to an I/O_UPDATE input signal (default).
1 = the amplitude ramp rate timer is loaded upon timeout (timer = 1) or at the time of an
I/O_UPDATE input signal.
Amplitude scale factor for each channel.
13
Rev. B | Page 42 of 44
AD9959
Linear Sweep Ramp Rate (LSRR)—Address 0x07
Two bytes are assigned to this register.
Table 38. Description for LSRR
Bit
15:8
7:0
Mnemonic
Falling sweep ramp rate (FSRR)
Rising sweep ramp rate (RSRR)
Description
Linear falling sweep ramp rate.
Linear rising sweep ramp rate.
LSR Rising Delta Word (RDW)—Address 0x08
Four bytes are assigned to this register.
Table 39. Description for RDW
Bit
31:0
Mnemonic
Rising delta word
Description
32-bit rising delta-tuning word.
LSR Falling Delta Word (FDW)—Address 0x09
Four bytes are assigned to this register.
Table 40. Description for FDW
Bit
31:0
Mnemonic
Falling delta word
Description
32-bit falling delta-tuning word.
Rev. B | Page 43 of 44
AD9959
OUTLINE DIMENSIONS
8.00
BSC SQ
0.60 MAX
0.50
0.40
0.30
12° MAX
SEATING
PLANE
29
28
15 14
0.25 MIN
6.50
REF
0.80 MAX
0.65 TYP
0.50 BSC
6.25
6.10 SQ
5.95
EXPOSED
PAD
(BOTTOM VIEW)
7.75
BSC SQ
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
THE EXPOSED EPAD ON BOTTOM SIDE
OF PACKAGE IS AN ELECTRICAL
CONNECTION AND MUST BE
SOLDERED TO GROUND.
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
061008-A
TOP
VIEW
PIN 1
INDICATOR
56 1
43
42
PIN 1
INDICATOR
1.00
0.85
0.80
0.30
0.23
0.18
0.60 MAX
Figure 50. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9959BCPZ1
AD9959BCPZ-REEL71
AD9959/PCBZ1
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Z = RoHS Compliant Part.
©2005–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05246-0-7/08(B)
Rev. B | Page 44 of 44
Package Option
CP-56-1
CP-56-1
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