SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 D Equivalent Input Noise Voltage . . . D D D D D D D D D 3.5 nV//Hz Typ Unity-Gain Bandwidth . . . 10 MHz Typ Common-Mode Rejection Ratio . . . 100 dB Typ High DC Voltage Gain . . . 100 V/mV Typ Peak-to-Peak Output Voltage Swing 32 V Typ With VCC+ = +18 V and RL = 600 W High Slew Rate . . . 13 V/ms Typ Wide Supply-Voltage Range +3 V to +20 V Low Harmonic Distortion Offset Nulling Capability External Compensation Capability NE5534, SA5534 . . . D (SOIC), P (PDIP), OR PS (SOP) PACKAGE NE5534A, SA5534A . . . D (SOIC) OR P (PDIP) PACKAGE (TOP VIEW) BALANCE IN− IN+ VCC− 1 8 2 7 3 6 4 5 COMP/BAL VCC+ OUT COMP description/ordering information The NE5534, NE5534A, SA5534, and SA5534A are high-performance operational amplifiers combining excellent dc and ac characteristics. Some of the features include very low noise, high output-drive capability, high unity-gain and maximum-output-swing bandwidths, low distortion, and high slew rate. These operational amplifiers are compensated internally for a gain equal to or greater than three. Optimization of the frequency response for various applications can be obtained by use of an external compensation capacitor between COMP and COMP/BAL. The devices feature input-protection diodes, output short-circuit protection, and offset-voltage nulling capability with use of the BALANCE and COMP/BAL pins (see the application circuit diagram). For the NE5534A and SA5534A, a maximum limit is specified for the equivalent input noise voltage. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $"%&! '# '"! ! $#!! $# (# # #) "# '' *+ '"! $!#, '# #!#&+ !&"'# #, && $## POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 description/ordering information (continued) ORDERING INFORMATION TA VIOmax AT 25°C PDIP (P) 0°C 0 C to 70 70°C C 4 mV SOIC (D) SOP (PS) PDIP (P) −40°C to 85°C 4 mV ORDERABLE PART NUMBER PACKAGE† SOIC (D) SOP (PS) TOP-SIDE MARKING Tube of 50 NE5534P NE5534P Tube of 50 NE5534AP NE5534AP Tube of 75 NE5534D Reel of 2500 NE5534DR Tube of 75 NE5534AD Reel of 2500 NE5534ADR Reel of 2000 NE5534PSR N5534 Tube of 50 SA5534P SA5534P Tube of 50 SA5534AP SA5534AP Tube of 75 SA5534D Reel of 2500 SA5534DR Tube of 75 SA5534AD Reel of 2500 SA5534ADR Tube of 80 SA553APS Reel of 2000 SA553APSR NE5534 5534A SA5534 SA5534A SA5534 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. schematic BALANCE COMP/BAL 8 1 100 pF IN+ 12 kΩ COMP 5 7 12 kΩ 3 40 pF 15 Ω 6 IN− 2 12 pF 7 pF All component values shown are nominal. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 OUT 15 Ω 4 2 VCC+ VCC− SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 symbol application circuit VCC+ 22 kΩ COMP 100 kΩ COMP/BAL IN− CC 1 − OUT IN+ 2 + 8 − 5 7 5534 6 BALANCE 3 + 4 VCC− Frequency Compensation and Offset-Voltage Nulling Circuit absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage: VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V VCC− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −22 V Input voltage either input (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC+ Input current (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−. 2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage. 3. Excessive current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used. 4. The output may be shorted to ground or to either power supply. Temperature and/or supply voltages must be limited to ensure the maximum dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT VCC+ VCC− Supply voltage 5 15 V Supply voltage −5 −15 V NE5534, NE5534A 0 70 TA Operating free-air temperature range SA5534, SA5534A −40 85 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 °C 3 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 electrical characteristics, VCC± = ±15 V, TA = 25°C (unless otherwise noted) TEST CONDITIONS† PARAMETER MIN TYP MAX 4 Input offset voltage VO = 0, RS = 50 Ω TA = 25°C TA = Full range 0.5 VIO Input offset current VO = 0 TA = 25°C TA = Full range 20 IIO Input bias current VO = 0 TA = 25°C TA = Full range 500 IIB VICR Common-mode input voltage range ±12 ±13 24 26 30 32 25 100 VO(PP) Maximum peak-to-peak output voltage swing RL ≥ 600 Ω VCC± = ±15 V VCC± = ±18 V AVD Large-signal differential voltage amplification VO = ±10 V, RL ≥ 600 Ω TA = 25°C TA = Full range Avd Small-signal differential voltage amplification f = 10 kHz VO = ±10 V BOM B1 ri Maximum-output-swing bandwidth Unity-gain bandwidth 5 mV 300 400 nA 1500 2000 nA V V V/mV 15 CC = 0 UNIT 6 CC = 22 pF 2.2 CC = 0 200 V/mV CC = 22 pF 95 VCC± = ±18 V, RL ≥ 600 Ω, VO = ±14 V, CC = 22 pF 70 CC = 22 pF, CL = 100 pF 10 MHz 100 kΩ RL ≥ 600 Ω, f = 10 kHz 0.3 Ω Input resistance 30 kHz zo Output impedance AVD = 30 dB, CC = 22 pF, CMRR Common-mode rejection ratio VO = 0, RS = 50 Ω VIC = VICRmin, 70 100 dB kSVR Supply-voltage rejection ratio (∆VCC/∆VIO) VCC+ = ±9 V to ±15 V, VO = 0 RS = 50 Ω, 80 100 dB IOS Output short-circuit current 38 mA ICC Supply current VO = 0, No load TA = 25°C 4 8 mA † All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. For NE5534 and NE5534A, full range is 0°C to 70°C. For SA5534 and SA5534A, full range is −40°C to 85°C. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 operating characteristics, VCC ± = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS NE5534, SA5534 TYP SR Slew rate Rise time Overshoot factor tr Rise time Overshoot factor Vn Equivalent input noise voltage In Equivalent input noise current F Average noise figure CC = 0 CC = 22 pF NE5534A, SA5534A MIN TYP 13 13 6 6 UNIT MAX V/ s V/µs VI = 50 mV, RL = 600 Ω, CL = 100 pF AVD = 1, CC = 22 pF 20 20 ns 20 20 % VI = 50 mV, RL = 600 Ω, CL = 500 pF f = 30 Hz AVD = 1, CC = 47 pF 50 50 ns 35 35 % 7 5.5 7 f = 1 kHz 4 3.5 4.5 f = 30 Hz 2.5 1.5 f = 1 kHz 0.6 0.4 RS = 5 kΩ, f = 10 Hz to 20 kHz POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 0.9 nV/√Hz pA/√Hz dB 5 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 NORMALIZED INPUT BIAS CURRENT AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE VO(PP) VOPP − Maximum Peak-to-Peak Output Voltage − V Normalized Input Bias Current and Input Offset Current TYPICAL CHARACTERISTICS† 1.6 VCC± = ±15 V 1.4 Offset 1.2 Bias 1 0.8 0.6 0.4 −75 −50 75 100 −25 0 25 50 TA − Free-Air Temperature − °C 125 ÁÁ ÁÁ ÁÁ MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY 30 CC = 0 25 20 15 10 CC = 22 pF 5 VCC± = ±15 V TA = 25°C 0 100 1k NORMALIZED SLEW RATE AND UNITY-GAIN BANDWIDTH vs SUPPLY VOLTAGE 103 CC = 0 pF 102 CC = 22 pF 1k 10 k 100 k 1 M f − Frequency − Hz 10 M 100 M Normalized Slew Rate and Unity-Gain Bandwidth AVD − Differential Voltage Amplification − V/mV 104 100 TA = 25°C 1.1 Unity-Gain Bandwidth 1 0.9 0.8 0.7 Slew Rate 0.6 0.5 0.4 0 Figure 3 15 5 10 | VCC± | − Supply Voltage − V Figure 4 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. 6 1M 1.2 VCC± = ±15 V TA = 25°C 105 1 10 100 k Figure 2 LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREQUENCY 10 10 k f − Frequency − Hz Figure 1 106 CC = 47 pF POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 20 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS† NORMALIZED SLEW RATE AND UNITY-GAIN BANDWIDTH vs FREE-AIR TEMPERATURE TOTAL HARMONIC DISTORTION vs FREQUENCY 0.01 VCC± = ±15 V 1.1 THD − Total Harmonic Distortion − % Normalized Slew Rate and Unity-Gain Bandwidth 1.2 Slew Rate Unity-Gain Bandwidth 1 0.9 0.8 −75 −50 75 100 −25 0 25 50 TA − Free-Air Temperature − °C 0.007 VCC± = ±15 V AVD = 1 VI(rms) = 2 V TA = 25°C 0.004 0.002 0.001 100 125 400 I n − Equivalent Input Noise Current − pA/ Hz Vn − Equivalent Input Noise Voltage − nV/ Hz 10 VCC± = ±15 V TA = 25°C SA5534, NE5534 SA5534A, NE5534A 2 100 40 k 100 k EQUIVALENT INPUT NOISE CURRENT vs FREQUENCY 4 1 10 10 k Figure 6 EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 7 4k f − Frequency − Hz Figure 5 10 1k 1k 10 k 100 k VCC± = ±15 V TA = 25°C 7 4 2 1 SA5534, NE5534 0.7 0.4 SA5534A, NE5534A 0.2 0.1 10 f − Frequency − Hz 100 1k 10 k 100 k f − Frequency − Hz Figure 8 Figure 7 † Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS TOTAL EQUIVALENT INPUT NOISE VOLTAGE vs SOURCE RESISTANCE Total Equivalent Input Noise Voltage − µV 100 70 40 VCC± = ±15 V TA = 25°C 20 10 7 4 f = 10 Hz to 20 kHz 2 1 0.7 0.4 f = 200 Hz to 4 kHz 0.2 0.1 100 1k 10 k 100 k RS − Source Resistance − Ω Figure 9 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1M PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty NE5534AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534AJG OBSOLETE CDIP JG 8 TBD Call TI NE5534AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5534APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5534D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR NE5534IP OBSOLETE PDIP P 8 TBD Call TI NE5534P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5534PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type NE5534PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5534PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NE5534PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SA5534ADRG4 ACTIVE SOIC D 8 SA5534AP ACTIVE PDIP P 8 50 SA5534APE4 ACTIVE PDIP P 8 SA5534D ACTIVE SOIC D SA5534DE4 ACTIVE SOIC SA5534DG4 ACTIVE SA5534DR Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SA5534P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA5534PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SA5534PS ACTIVE SO PS 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534PSE4 ACTIVE SO PS 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534PSG4 ACTIVE SO PS 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SA5534PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant NE5534ADR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 NE5534DR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 NE5534PSR PS 8 SITE 41 330 16 8.2 6.6 2.5 12 16 Q1 SA5534ADR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 SA5534DR D 8 SITE 27 330 12 6.4 5.2 2.1 8 12 Q1 SA5534PSR PS 8 SITE 41 330 16 8.2 6.6 2.5 12 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) NE5534ADR D 8 SITE 27 342.9 336.6 20.64 NE5534DR D 8 SITE 27 342.9 336.6 20.64 NE5534PSR PS 8 SITE 41 346.0 346.0 33.0 SA5534ADR D 8 SITE 27 342.9 336.6 20.64 SA5534DR D 8 SITE 27 342.9 336.6 20.64 SA5534PSR PS 8 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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