Effective July 2014 Supersedes May, 2013 Technical Data 4309 Bussmann CC12H Series High I2t Chip™ fuses HALOGEN Pb HF FREE Applications • Flat panel displays and televisions • Automotive infotainment and ECU • Computer servers • Portable electronics • Mobile device chargers Agency information • cURus Recognition File number: E19180, Guide JDYX2/JDYX8 • AEC-Q200 Automotive Grade Certified Ordering • Product description: • Halogen free, lead free, RoHS compliant • High I2t 1206 footprint surface mount fuse • High inrush withstand capability • Excellent temperature and cycling characteristics • RoHS compliant, and lead free and halogen free construction • Compatible with solder reflow and wave solder 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard 481. Specify Catalog Symbol and package code suffix “-TR”(e.g., CC12H1A-TR) The Bussmann brand of circuit protection products (formerly of the Bussmann Division of Cooper Industries) is now part of Eaton’s Electrical Group, Electronics Division. Bussmann is now part of Eaton Same great products plus even more. Technical Data 4309 CC12H Series High I t Chip™ fuses Effective July 2014 2 Electrical characteristics Environmental data Amp Rating % of Amp Rating Opening Time 750mA-20A 100% 4 Hours, min 1-3A 200% 1-60 Seconds 1-5A 250% 5 Seconds, max 1-5A 300% 0.1-3 Seconds 750mA, 6-20A 350% 5 Seconds, max 750mA-20A 1000% 0.2-20mS Thermal Shock: MIL-STD-202, Method 107, Test Condition B • Vibration: MIL-STD-202, Method 204, Test Condition C • Moisture Resistance: MIL-STD-202, Method 106, 50 day cycle • Solderability: ANSI/J-STD-002, Test B • Normal ambient temperature: 23°C • Operating temperature range -40°C to +125°C Soldering method Specifications Catalog Symbol • • Wave Solder Immersion: 260°C, 10 seconds maximum. • Solder Reflow: 260°C, 30 seconds maximum. Current Rating (amps) Voltage Rating (Vdc) Interrupting Rating* (amps) Resistance (Ω)** Typical Typical Melt (I2t)† DC Typical Voltage Drop (mV)‡ Alpha Marking 0.75 63 50 0.780 0.15 840 E CC12H750mA CC12H1A CC12H1.5A CC12H2A CC12H2.5A CC12H3A CC12H3.5A 1 63 50 0.470 0.18 490 H 1.5 63 50 0.218 0.4 355 K 2 63 50 0.133 1.1 305 N 2.5 63 50 0.079 1.7 240 O 3 63 50 0.049 2.2 185 P 3.5 63 50 0.037 2.7 180 R 4 63 50 0.033 3.2 169 S 4.5 32 100 0.028 4.2 160 X CC12H5A 5 32 100 0.023 6.0 140 T CC12H6A 6 32 100 0.0155 8.0 140 F CC12H7A 7 32 100 0.011 9.0 120 J CC12H8A 8 32 100 0.007 12.0 80 M CC12H10A 10 32 100 0.0065 33 90 U CC12H12A 12 32 100 0.0045 45 80 W CC12H15A 15 32 100 0.0030 40 70 Y CC12H20A 20 32 100 0.0020 50 60 Q CC12H4A CC12H4.5A * DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source) ** DC Cold Resistance (Measured at 10% of rated current) † Typical Melting I2t (Measured with a battery bank at rated DC voltage, 10x-rated current, not to exceed interrupting rating, time constant of calibrated circuit less than 50 microseconds) ‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes) Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. Dimensions - mm (in) Pad layout Drawing not to scale. 0.51 +/- 0.25 typ. (0.02 +/- 0.01) 2 0.51 +/- 0.25 typ. (0.02 +/- 0.01) 1.6 +/- 0.2 typ. (0.063 +/- 0.008) Top View 0.6 + 0.2, -0.15 (0.024 +0.008, -0.006) Side View End View 3.2 +/- 0.2 (0.126 + /- 0.008) 1.6 +/- 0.2 (0.063 +/- 0.008) www.eaton.com/elx 1.52 (0.06) 2.03 (0.08) 1.52 (0.06) CC12H Series High I2t Chip™ fuses Technical Data 4309 Effective July 2014 Time-current curves — 750mA-5A average melt www.eaton.com/elx 3 Technical Data 4309 Effective July 2014 Time-current curves — 6A-20A average melt 4 www.eaton.com/elx CC12H Series High I t Chip™ fuses 2 CC12H Series High I2t Chip™ fuses Technical Data 4309 Effective July 2014 I2t (A2s) I2t vs. time curves — 750mA-5A www.eaton.com/elx 5 Technical Data 4309 Effective July 2014 I2t (A2s) I2t vs. time curves — 6A-20A 6 www.eaton.com/elx CC12H Series High I t Chip™ fuses 2 CC12H Series High I2t Chip™ fuses Technical Data 4309 Effective July 2014 I2t (A2s) I2t vs. current curves — 750mA-5A www.eaton.com/elx 7 Technical Data 4309 Effective July 2014 I2t (A2s) I2t vs. current curves — 6A-20A 8 www.eaton.com/elx CC12H Series High I t Chip™ fuses 2 CC12H Series High I2t Chip™ fuses Technical Data 4309 Effective July 2014 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature 25°C Preheat A Volume mm3 <350 235°C 220°C Package Thickness <2.5mm _2.5mm > TL T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 _ >350 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 – 2.5mm >2.5mm ts Time 25°C to Peak Volume mm3 <350 260°C 260°C 250°C Volume mm3 350 - 2000 260°C 250°C 245°C Volume mm3 >2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak Standard SnPb Solder 100°C • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Eaton’s Electrical Group Electronics Division 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Eaton’s Electrical Group Electronics Division P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Eaton’s Electrical Group Electronics Division Burton-on-the-Wolds Leicestershire, LE 12 5th UK Phone: +44 (0) 1509 882 600 Fax: +44 (0) 1509 882 786 Eaton’s Electrical Group Electronics Division Avda Santa Eulalia, 290 Terrassa, Barcelona 08223 Spain Phone: +34-93-736-2813 Fax: +34-93-783-5055 Asia Pacific Eaton’s Electrical Group Electronics Division No.2, #06-01 Serangoon North Avenue 5 Singapore 554911 Tel: +65 6645 9888 Fax: +65 6728 3155 The only controlled copy of this Data Sheet is the electronic read-only version located on the Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton’s Electrical Group Electronics Division 114 Old State Road Ellisville, MO 63021 United States www.eaton.com/elx © 2014 Eaton All Rights Reserved Publication No. 4309 — BU-SB14479 July 2014 Eaton is a registered trademark. All other trademarks are property of their respective owners. www.eaton.com/elx 9