LIGITEK LPT3323-TBS-1 Tape and box type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LPT3323/TBS-1
DATA SHEET
DOC. NO :
QW0905- LPT3323/TBS-1
REV.
:
E
DATE
:
29 - Apr. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT3323/TBS-1
Page 1/3
Package Dimension
H2
5.0
5.9
7.6
8.6
ΔH
P2
W2
H1
12.5MIN
L W0
1.EMITTER
2.COLLECTOR
W1 W3
1.0MIN
2.3TYP
1 2
D
P1
F
- +
P
T
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
Features
. High illumination sensitivity
. Stable characteristics
. Spectrally and mechanically
matched with IR emitter
Description
The LPT3323/TBS-1 series are silicon nitride passivated
NPN planar phototransistors with exceptionally table
characteristics and igh illumination sensitivity the cases of
LPT3323/TBS-1 are ncapsulated in water clear plastic T1 3/4
package individuallt
•MAXIMUM RATINGS(Ta=25℃)
MAXIMUM RATINGS
UNIT
100
mw
Collector-Emitter Voltage
30
V
Emitter-Collector Voltage
5
V
PARAMETER
Power Dissipation
Operating Temperature
-50℃ TO +100℃
Storage Temperature
-50℃ TO +100℃
260℃ for 5 seconds
Lead Soldering Temperature(1.6mm From Body)
•ELECTRICAL CHARACTERISTICS(Ta=25℃)
Typ.
UNIT
TEST CONDITION
30
V
Ic=1mA
Ee=0mw/c ㎡
5
V
IE=100μA
Ee=0mw/c ㎡
V
Ic=0.5mA
Ee=20mw/c ㎡
PARAMETER
SYMBOL
Min.
Collector-Emitter
Breakdown Voltage
V(BR)CEO
Emitter-Collector
Breakdown Voltage
V(BR)ECO
Collector-Emitter
Saturation Voltage
VCE(sat)
Max.
0.4
Rise Time
Tr
5
μs
Fall Time
Tf
5
μs
Collector Dark
Current
On State Collector
Current
ICEO
Ip(on)
100
nA
1
2
mA
2
4
mA
4
8
mA
8
mA
VCE =30V
IC=800μA,RL=1K Ω
VCE =10V
Ee=0mw/c ㎡
VCE =5v
Ee=1mw/c ㎡
λP=940nm
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LPT3323/TBS-1
Page 2/3
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.2
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TBS-1
H1
17.5
0.69
18.5
0.73
Feed Hole To Overall Component Height
-------
H2
-------
36
1.42
Lead Length After Component Height
-------
L
11
0.43
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
Feed Hole To Bottom Of Component
-------
W0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
W
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2000PCS
L
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/3
PART NO.LPT3323/TBS-1
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=85 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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