LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LPT3323/TBS-1 DATA SHEET DOC. NO : QW0905- LPT3323/TBS-1 REV. : E DATE : 29 - Apr. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TBS-1 Page 1/3 Package Dimension H2 5.0 5.9 7.6 8.6 ΔH P2 W2 H1 12.5MIN L W0 1.EMITTER 2.COLLECTOR W1 W3 1.0MIN 2.3TYP 1 2 D P1 F - + P T Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice Features . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter Description The LPT3323/TBS-1 series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and igh illumination sensitivity the cases of LPT3323/TBS-1 are ncapsulated in water clear plastic T1 3/4 package individuallt •MAXIMUM RATINGS(Ta=25℃) MAXIMUM RATINGS UNIT 100 mw Collector-Emitter Voltage 30 V Emitter-Collector Voltage 5 V PARAMETER Power Dissipation Operating Temperature -50℃ TO +100℃ Storage Temperature -50℃ TO +100℃ 260℃ for 5 seconds Lead Soldering Temperature(1.6mm From Body) •ELECTRICAL CHARACTERISTICS(Ta=25℃) Typ. UNIT TEST CONDITION 30 V Ic=1mA Ee=0mw/c ㎡ 5 V IE=100μA Ee=0mw/c ㎡ V Ic=0.5mA Ee=20mw/c ㎡ PARAMETER SYMBOL Min. Collector-Emitter Breakdown Voltage V(BR)CEO Emitter-Collector Breakdown Voltage V(BR)ECO Collector-Emitter Saturation Voltage VCE(sat) Max. 0.4 Rise Time Tr 5 μs Fall Time Tf 5 μs Collector Dark Current On State Collector Current ICEO Ip(on) 100 nA 1 2 mA 2 4 mA 4 8 mA 8 mA VCE =30V IC=800μA,RL=1K Ω VCE =10V Ee=0mw/c ㎡ VCE =5v Ee=1mw/c ㎡ λP=940nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LPT3323/TBS-1 Page 2/3 •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.2 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 H1 17.5 0.69 18.5 0.73 Feed Hole To Overall Component Height ------- H2 ------- 36 1.42 Lead Length After Component Height ------- L 11 0.43 Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 Feed Hole To Bottom Of Component ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum W mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2000PCS L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/3 PART NO.LPT3323/TBS-1 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11