ASMC-PxB9-Txxxx Envisium Power PLCC-4 Surface Mount LED Data Sheet Envisium Envisium is the premier class of mid-Power LEDs from Agilent and Lumileds utilizing the very best solid-state lighting technologies from these two industry leaders. Envisium LEDs offer unparalleled performance, engineering and design flexibility. For the very first time, customers have options for mid-power LEDs. The Envisium Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. Description The Envisium Power PLCC-4 SMT LED is an extension of Agilent’s PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the conventional PLCC-2 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the conventional PLCC-4 SMT LEDs. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. The Envisium Power PLCC-4 SMT LED is available in 3 colors, red, red-orange and amber. Features • Industry standard PLCC-4 (Plastic Leaded Chip Carrier) • High reliability LED package • Mid-Power intensity brightness with optimum flux performance using TS AlInGaP dice technologies • Available in Red, Red Orange and Amber colors • High optical efficiency • Higher ambient temperature at the same current possible compared to PLCC-2 • Super wide viewing angle at 120° • Available in 8 mm carrier tape on 7inch reel • Compatible with both IR and TTW soldering process Applications • Interior automotive – Instrument panel backlighting – Central console backlighting – Navigation and audio system – Push button backlighting • Exterior automotive – Turn signals – Side repeaters – CHMSL – Rear combination lamp – Puddle light • Electronic signs and signals – Channel lettering – Contour lighting – Indoor variable message sign • Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting Package Dimensions 2.8 ± 0.2 1.9 ± 0.2 2.2 ± 0.2 A 0.8 ± 0.1 0.1 TYP. C 3.2 ± 0.2 3.5 ± 0.2 0.8 ± 0.3 C C 0.5 ± 0.1 0.7 ± 0.1 CATHODE MARKING NOTE: ALL DIMENSIONS IN mm. Device Selection Guide Color Red Red Orange Amber Part Number ASMC-PRB9-TV005 ASMC-PHB9-TW005 ASMC-PAB9-TV005 Total Flux FV (mlm)[2,3] Intensity Bin Min. IV (mcd) Max. IV (mcd) Typ. V1 630.00 1000.00 2600.00 V2 790.00 1260.00 3300.00 W1 1000.00 1600.00 - W1 1000.00 1600.00 4300.00 W2 1200.00 2020.00 5000.00 X1 1580.00 2500.00 - V1 630.00 1000.00 3000.00 V2 790.00 1260.00 3800.00 W1 1000.00 1600.00 - Test Current (mA) Dice Technology 50 AlInGaP 50 AlInGaP 50 AlInGaP Notes: 1. The luminous intensity, IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 3. Flux tested at mono pulse conditions. 2 Part Numbering System ASMC - PX 1 B9 - TX 2 X 3 X 4 X 5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection LED Chip Color Absolute Maximum Ratings (TA = 25°C) Parameters DC Forward ASMC-PxB9-Txxxx Current[1] 70 mA[3,4] Peak Forward Current[2] 200 mA Power Dissipation 240 mW Reverse Voltage 5V Junction Temperature 125°C Operating Temperature -40°C to +100°C Storage Temperature -40°C to +100°C Notes: 1. Derate linearly as shown in figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. 3. Drive current between 10 mA and 70 mA is recommended for best long-term performance. 4. Operation at currents below 5 mA is not recommended. Optical Characteristics (TA = 25°C) Peak Wavelength lPEAK (nm) Dominant Wavelength lD[1] (nm) Viewing Angle 2q1/2[2] (Degrees) Luminous Efficacy hV[3] (lm/W) Luminous Intensity/ Total Flux IV (mcd)/ FV[4,5] (lm) Color Part Number Dice Technology Typ. Typ. Typ. Typ. Typ. Red ASMC-PRB9-Txxx5 AlInGaP 639.0 630.0 120 155 0.30 Red Orange ASMC-PHB9-Txxx5 AlInGaP 623.0 617.0 120 263 0.29 Amber ASMC-PAB9-Txxx5 AlInGaP 594.0 592.0 120 500 0.26 Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Electrical Characteristics (TA = 25°C) Forward Voltage VF (Volts) @ IF = 50 mA Reverse Voltage VR @ 100 µA Part Number Typ. Max. Min. ASMC-PxB9-Txxx5 2.8 3.4 5 3 1.0 RED ORANGE 0.9 AMBER RELATIVE INTENSITY 0.8 RED 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 530 480 630 580 680 730 780 WAVELENGTH – nm 1.4 70 1.2 60 50 40 30 20 10 0 1.0 0.8 0.6 0.4 0.2 0 0 1 2 3 4 80 MAXIMUM FORWARD CURRENT – mA 80 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 50 mA) FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 DC FORWARD CURRENT – mA FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. Figure 3. Relative intensity vs. forward current. 1.0 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -70 -50 -30 -10 10 ANGLE – DEGREES Figure 5. Radiation pattern. 4 30 50 70 90 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125°C, RqJA = 300°C/W. 20 SEC. MAX. TEMPERATURE 240°C MAX. 3°C/SEC. MAX. 100-150°C 183°C –6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME Figure 6a. Recommended Sn-Pb reflow soldering profile. 10 to 20 SEC. 255 °C 217 °C +5 °C -0 °C TEMPERATURE 3 °C/SEC. MAX. 125 °C ± 25 °C 6 °C/SEC. MAX. MAX. 120 SEC. 60 to 150 SEC. TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 6b. Recommended Pb-free reflow soldering profile. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE – °C BOTTOM SIDE OF PC BOARD 200 TOP SIDE OF PC BOARD 150 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA FLUXING 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 60 70 TIME – SECONDS Figure 7. Recommended wave soldering profile. 5 80 90 100 4.05 SOLDER-RESIST 3.8 3.4 4.05 PAD CLEARANCE 1.1 8.5 4.05 0.5 0.2 8.5 PAD CLEARANCE Figure 8. Recommended soldering pad pattern. TRAILER 200 mm MIN. FOR ∅180 REEL. 200 mm MIN. FOR ∅330 REEL. COMPONENT LEADER 480 mm MIN. FOR ∅180 REEL. 960 mm MIN. FOR ∅330 REEL. C A USER FEED DIRECTION Figure 9. Tape leader and trailer dimensions. 6 4 ± 0.1 ∅1.5 +0.1/-0 2 ± 0.05 3.6 ± 0.1 1.75 ± 0.1 B 5.5 ± 0.05 A A C C C A 12 +0.3/-0.1 3.8 ± 0.1 ∅1 +0.1/-0 8 ± 0.1 B 0.229 ± 0.01 VIEW B-B 3.45 ± 0.1 VIEW A-A ALL DIMENSIONS ARE IN MILLIMEERS (mm). Figure 10. Tape dimensions. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 11. Reeling orientation. 7 Intensity Bin Select (X2X3) Individual reel will contain parts from one half bin only Color Bin Select (X4) Individual reel will contain parts from one full bin only. Color Bin Limits Amber/ Yellow Min. (nm) Max. (nm) X2 X4 1 582.0 584.5 Min IV Bin X3 0 Full Distribution 2 584.5 587.0 A 1 and 2 only 3 587.0 589.5 B 2 and 3 only 4 589.5 592.0 0 Full Distribution C 3 and 4 only 5 592.0 594.5 3 3 half bins starting from X61 D 4 and 5 only 6 594.5 597.0 4 4 half bins starting from X61 E 5 and 6 only 5 5 half bins starting from X61 G 1, 2 and 3 only 7 3 half bins starting from X62 H 2, 3 and 4 only 8 4 half bins starting from X62 Red Orange Min. (nm) Max. (nm) J 3, 4 and 5 only 9 5 half bins starting from X62 1 611.0 616.0 K 4, 5 and 6 only 2 616.0 620.0 M 1, 2, 3 and 4 only Intensity Bin Limits & Typical Flux N 2, 3, 4 and 5 only Bin ID Min. (mcd) Max. (mcd) P 3, 4, 5 and 6 only Red Min. (nm) Max. (nm) V1 715.00 900.00 R 1, 2, 3, 4, and 5 only Full Distribution V2 900.00 1125.00 S 2, 3, 4, 5 and 6 only Tolerance of each bin limit = ± 1 nm. W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 Packaging Option (X5) X2 2240.00 2850.00 Option Test Current Package Type Reel Size 5 50 mA Top Mount 7 inch Tolerance of each bin limit = ±12%. 8 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. January 30, 2005 5989-2308EN