Rohm BA6423AF Standard single-phase full wave fan motor driver Datasheet

Datasheet
DC Brushless Fan Motor Driver
Standard Single-phase Full wave
Fan Motor Driver
BA6423AF
●General Description
This is the summary of application for BA6423AF. BA6423AF incorporates lock protection and automatic restart circuit.
●Package(s)
SOP8
●Features
Lock protection and auto restart
Lock alarm signal (AL) output
W(Typ.) x D(Typ.) x H(Max.)
5.00mm x 6.20mm x 1.71mm
●Applications
General consumer electronics, BD player, DVR, STB
Office equipment, Copier, FAX Laser Printer etc.
SOP8
●Absolute maximum ratings
Symbol
Ratings
Unit
Supply voltage
Vcc
30
V
Power dissipation
Pd
780*
mW
Operation temperature
Topr
-40 to +100
℃
Storage temperature
Tstg
-55 to +150
℃
Output current
Iomax
1.0**
A
Output voltage
Vout
30
V
Val
30
V
Tjmax
150
℃
Parameter
AL signal output voltage
Junction temperature
*
**
Reduce by 6.24mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
This value is not to exceed Pd.
●Operating Conditions
Parameter
Symbol
Ratings
Unit
Operating supply voltage range
Vcc
6.0 to 28.0
V
Hall input voltage range
Vh
2.5 to Vcc
V
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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Datasheet
BA6423AF
●Electrical characteristics (Unless otherwise specified Ta=25℃,Vcc=12V)
Parameter
Symbol
Limits
Unit
Conditions
Characteristics
Min.
Typ.
Max.
Icc
2.7
5.4
8.1
mA
At output OFF
Ildc
1.55
3.10
4.65
μA
Vld=1.8V
-
Ildd
0.33
0.66
0.99
μA
Vld=1.8V
-
rcd
3.0
4.7
6.4
-
rcd=Ildc/Ildd
-
Vldcl
2.00
2.48
3.00
V
-
Vldcp
0.70
0.99
1.30
V
-
Output L voltage
Vol
-
0.8
1.2
V
Io=200mA
Fig.2
Output H voltage
Voh
-
0.9
1.4
V
Io=-200mA
Voltage between
output and Vcc
Fig.3
AL output L voltage
Vall
-
0.1
0.3
V
Ial=10mA
Fig.4
AL output leak current
Iall
-
0
10
μA
Val=30V
-
Vofs
-20
0
20
mV
Circuit current
Charge current of
capacitor for lock
detection
Discharge current of
capacitor for lock
detection
Charge-discharge current
ratio of capacitor for lock
detection
Clamp voltage of
capacitor for lock
detection
Comparison voltage of
capacitor for lock
detection
Hall input - output offset
voltage
Fig.1
-
●Reference Data
2
7
0
-25℃
6
4
100℃
3
2
Output H v oltage, Voh [V]
Output L voltage, Vol [V]
Circuit current, Icc [mA]
25℃
5
1.5
6V
12V
1
28V
0.5
-0.5
28V
-1
12V
6V
-1.5
Operating Voltage Range
1
0
0
0
6
12
18
24
-2
0
30
0.2
0.6
0.8
1
0
Fig.1 Circuit current
12V
6V
0
1.0
2
4
6
8
10
AL current, Ial [mA]
Fig.4 AL output L voltage
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1
1.0
0.1
0.1
0
0.8
10.0
Collector-emitter current, Ice[A]
Collector-emitter current, Ice[A]
28V
0.1
0.6
Fig.3 Output H voltage
10.0
0.15
0.4
Output Current , Io [A]
Fig.2 Output L voltage
0.2
0.05
0.2
Output Current, Io [ A]
Supply voltage, Vcc [V]
AL low voltage, Vall [V]
0.4
0.1
1.0
10.0
100.0
Collector-emitter voltage, Vce[V]
Fig.5 Output Tr ASO（upper）
(TON=100msec)
2/10
0.1
1.0
10.0
100.0
Collector-emitter voltage, Vce[V]
Fig.6 Output Tr ASO（lower）
(TON=100msec)
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19.Jul.2012 Rev.001
Datasheet
BA6423AF
●Block diagram, application circuit, and pin assignment (Constant etc are for reference)
LD
Capacitor for setting lock
detect ing and auto restart time.
R EG
4
P. 4
0.47μF
to 4.7μF
+
-
+
Take a measure against Vcc
voltage rise generated by
reverse c onnection of c urrent
and c ounter electromotive
force.
REG
LOCK
DET ECT ION
AND
AUTO
RESTART
-
AL
3
GND
8
This is an open c ollector
output . Connec t a pull-up
res istor.
Vcc
AMP
2
P. 6
Set acc ording to the amplitude
of hall element output and hall
input voltage range.
2kΩ
to 10kΩ
HALL
H+
5
HALL
AMP
+
OUT 2
AMP
LOGIC
-
M
6
7
H-
P. 4
P.7
1
OUT1
T SD
Function
PIN No.
Terminal name
1
OUT2
Motor output terminal2
2
Vcc
Power supply terminal
3
AL
Lock alarm signal output terminal
4
LD
Lock detecting and auto restart capacitor connecting terminal
5
H+
Hall input terminal+
6
H-
Hall input terminal-
7
OUT1
Motor output terminal1
8
GND
GND terminal
H+
H-
OUT1
OUT2
H
L
H
L
L
H
L
H
●Truth table
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AL
normal operation
:L(output is ON)
lock detection
:H(output is OFF)
TSZ02201-0H1H0B100230-1-2
19.Jul.2012 Rev.001
Datasheet
BA6423AF
●Description of operations
1) Lock protection and automatic restart
Lock detection ON time (Ton) and lock detection OFF time (Toff) is set by charging and discharging of
external capacitor of LD terminal.
C･(Vldcl-Vldcp)
Ton (Lock detection ON time) =
C : Capacity of capacitor equipped
externally on LD terminal
Vldcl : LD terminal clamping voltage
Vldcp : LD terminal comparator voltage
Ildc : LD terminal charging current
Ildd : LD terminal discharging current
Ildc
C･(Vldcl-Vldcp)
Toff (Lock detection OFF time) =
Ildd
HOutput Tr OFF
OUT1
Toff
LD terminal
Output Tr
ON
Ton
clamping voltage
LD terminal
LD
comparator voltage
HIGH (open collector)
AL
Motor locking
Lock detection
Lock release
Returns
normal operation
Fig.7 Lock protection timing chart
*BA6423AF returns normal operation by the input of hall signal during Toff.
2) Hall input setting
Hall input voltage range is shown in operating conditions.
Hall input voltage range
Vcc
Hall input voltage range
upper limit
Hall input voltage range
lower limit
GND
Fig.8 Hall input voltage range
Adjust the value of hall element bias resistor R1 in Fig.9 so that the input voltage of a hall amplifier is input in "hall
input voltage range" including signal amplitude.
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Datasheet
BA6423AF
○Reducing the noise of hall signal
Hall element may be affected by Vcc noise or the like depending on the wiring pattern of board. In this case, place
a capacitor like C1 in Fig.9. In addition, when wiring from the hall element output to IC hall input is long, noise may
be loaded on wiring. In this case, place a capacitor like C2 in Fig.9.
H-
H+
Vcc
C2
C1
RH
Hall bias current
Hall element
R1
= Vcc / (RH+R1 )
Fig.9 Application near hall signal
●Equivalent circuit
1) Hall input terminal
2) Motor output terminal
Vcc
Vcc
H+
H-
OUT1
OUT2
GND
3) Lock detection and automatic restart capacitor
connecting terminal
4) AL signal output terminal
Vcc
AL
LD
GND
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Datasheet
BA6423AF
●Safety measure
1) Reverse connection protection diode
Reverse connection of power results in IC destruction as shown in Fig.10. When reverse connection is possible, reverse
connection protection diode must be added between power supply and Vcc.
In normal energization
Reverse power connection
Vcc
After reverse connection
destruction prevention
Vcc
Vcc
Circuit
block
Each
pin
GND
Internal circuit impedance high
amperage small
Circuit
block
Each
pin
Circuit
block
GND
Large current flows
Thermal destruction
Each
pin
GND
No destruction
Fig.10 Flow of current when power is connected reversely
2) Measure against Vcc voltage rise by back electromotive force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, Vcc voltage rises because the diode prevents current flow to power supply.
ON
ON
ON
Phase
switching
ON
Fig.11 Vcc voltage rise by back electromotive force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between Vcc and GND. If necessary, add both (C).
(B) Zener diode
(A) Capacitor
ON
ON
ON
ON
(C) Capacitor and zener diode
ON
ON
Fig.12 Measure against Vcc voltage rise
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Datasheet
BA6423AF
3) Problem of GND line PWM switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
Vcc
Motor
Driver
M
Controller
GND
PWM input
Prohibited
Fig.13 GND Line PWM switching prohibited
4) AL output
AL output is an open collector and requires pull-up resistor.
The IC can be protected by adding resistor R1. An excess of absolute maximum rating, when AL output terminal is
directly connected to power supply, could damage the IC.
Vcc
Pull-up
resistor
AL
Protection
resistor R1
Connector
of board
Fig.14 Protection of AL terminal
Vcc
●Calculation of power consumed by IC
Icc
Power consumed by this IC Pc is approximately calculated as follows:
AL
IAL
Pc=Pc1+Pc2+Pc3
・Pc1：Power consumption by circuit current
Pc1=Vcc×Icc
OUT1
・Pc2：Power consumption at output stage
Pc2=VOL×Io+VOH×Io
VOL is L voltage of output terminal 1 and 2.
VOH is H voltage of output terminal 1 and 2.
Io is the current flowing to output terminal 1 and 2.
・Pc3：Power consumption at AL
Pc3=VAL×IAL
VAL is L voltage of AL output.
IAL is the current of AL.
Io
OUT2
Fig.15 Calculation of power consumed by IC
Power consumption by IC greatly changes with use condition of IC such as power supply voltage and output current.
Consider thermal design so that the maximum power dissipation on IC package is not exceeded.
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Datasheet
BA6423AF
●Thermal derating curve
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25ºC (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ
ja [℃/W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.16 shows the model of
heat resistance of the package.
Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the
equation below:
θja ＝ (Tj - Ta) / P
[℃/W]
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance
θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at
a specified condition. Fig.17 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70
[mm] x 1.6 [mm] (copper foil area below 3 [%]))
θja
= (Tj - Ta) / P
[℃/W]
Ambient temperature Ta[℃]
Chip surface temperature Tj[℃]
Power consumption P[W]
Fig.16 Thermal resistance
Pd(mW)
1000
800
780
600
400
200
0
25
50
75
100
125
150
Ta(℃)
*Reduce by 6.24 mW/℃ over 25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
Fig.17 Thermal derating curve
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Datasheet
BA6423AF
●Cautions on use
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum ratings.
Because the cause of this damage cannot be identified as a short circuit or an open circuit, if any over rated values
will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor
coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including
transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of
individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a
hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an
open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the
IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment
where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is
possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor
between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not
use in a manner where parasitic element is actuated.
14) In use
We are sure that the example of application circuit is preferable, but please check the character further more in
application to a part which requires high precision. In using the unit with external circuit constant changed, consider
the variation of externally equipped parts and our IC including not only static character but also transient character
and allow sufficient margin in determining
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Datasheet
BA6423AF
●Physical Dimension
SOP8
<Tape and Reel information>
6
5
+6°
4° −4°
0.3MIN
7
4.4±0.2
6.2±0.3
8
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
SOP8
(TOP VIEW)
6423A
Lot No.
1PIN MARK
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
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H2S, NH3, SO2, and NO2
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[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
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residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
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5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
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Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
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Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001