HLMP-KA45 T-1 (3 mm) High Intensity InGaN Lamp Data Sheet Description Features This blue LED is designed in an industry standard T-1 package with clear and non-diffused optics. This lamp is ideal for use as indicators and for general purpose lighting. • Popular T1 diameter package Applications • Binned for color and intensity • General purpose leads • Reliable and rugged • InGaN blue dice • Status indicators • Small message panel • Running and decorative lights for commercial use • Back-lighting • Consumer audio Package Dimensions 1.14 (.045) 0.51 (.020) 3.43 (.135) 2.92 (.115) ∅ 2.79 (.110) 2.29 (.090) 24.1(.95) MIN. 0.65 (0.026) max. 1.52 (.060) 1.02 (.040) 3.17 (.125) 2.67 (.105) 4.70 (.185) 4.19 (.165) (0.022) 0.55 SQ. TYP. (0.016) 0.40 6.35 (.250) 5.58 (.220) Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section. CAUTION: Devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. For additional details, refer to Application Note AN-1142. Ordering Information HLMP-X X XX – X X X XX Mechanical Option 00: Bulk Color Bin Selection 0: Full color bin distribution Maximum Iv Bin Options 0: Open (No maximum limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 45:50 degree Color A: Blue Package K: T-1 Absolute Maximum Ratings at TA = 25 °C Parameter HLMP-KA45 (Blue) Unit DC Forward Current[1] 30 mA Peak Pulsed Forward Current [2] 100 mA Power Dissipation 116 mW LED Junction Temperature 115 °C Operating Temperature Range –35 to +85 °C Storage Temperature Range –35 to +85 °C Note: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. 2 Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. HLMP-KA45-E0000 Blue 470 85 – HLMP-KA45-J0000 Blue 470 240 – HLMP-KA45-NQ000 Blue 470 680 1500 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram and represents the color of the lamp. Electrical /Optical Characteristics Table at TA = 25 °C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage VF 2.8 3.2 3.8 V IF = 20 mA Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RθJ-PIN 465 °C/W LED Junction-to-Cathode Lead Viewing Angle 2θ1/2 50 deg Dominant Wavelength λd 470 nm IF = 20 mA Peak Wavelength λP 464 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Δλ1/2 24 nm Wavelength Width at Spectral Distribution ½ Power Point at IF = 20 mA Notes: 1. 2 θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. 2. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. 3 25 FORWARD CURRENT - mA RELATIVE INTENSITY 30 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 WAVELENGTH - nm 630 5 0 1 2 FORWARD VOLTAGE - V 3 4 Figure 2. Forward Current vs. Forward Volatge 35 1.2 30 FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 10 1.4 1.0 0.8 0.6 0.4 0.2 0 25 RθJ-A = 780°C/W 20 15 10 5 0 5 10 15 20 25 30 IF – DC FORWARD CURRENT – mA Figure 3. Relative luminous intensity vs. forward current 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 ANGULAR DISPLACEMENT – DEGREES Figure 5. Radiation pattern 0 0 20 40 60 AMBIENT TEMPERATURE – °C 80 100 Figure 4. Maximum forward current vs. ambient temperature based on Tjmax = 115 °C 1.0 0.9 RELATIVE INTENSITY 15 0 680 Figure 1. Relative Intensity vs. Wavelength 4 20 90 Intensity Bin Limit Color Categories Intensity (mcd) at 20 mA Lambda (nm) Bin Min Max Color Cat # Min. Max. E 85 110 Blue 1 460.0 464.0 F 110 140 2 464.0 468.0 G 140 180 3 468.0 472 .0 H 180 240 4 472 .0 476.0 J 240 310 5 476.0 480.0 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 Tolerance for each bin limit is ±15%. 5 Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. For further clarification/information, contact your local Avago representative. Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25 °C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: • Recommended soldering conditions: LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 60 sec Max. – Dambar shearoff area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Peak Temperature 250 °C Max. 260 °C Max. Lead size (typ.) Dwell Time 3 sec Max. 5 sec Max. 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) Dambar shearoff area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Note: Refer to application note AN1027 for more information on soldering LED components. 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE Flux: Rosin flux Solder bath temperature: 245 °C ± 5 °C (maximum peak temperature = 250 °C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 10 20 30 40 50 60 TIME (SECONDS) Figure 5. Recommended wave soldering profile 6 70 80 90 100 Packing Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number (1P) Item: Part Number (1T) Lot: Lot Number (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant STANDARD LABEL LS0002 e3 temp 250C RoHS max Compliant e3 QTY: max Quantity temp 250C (Q) (Q) QTY: Quantity LPN: LPN: CAT: Intensity Bin CAT: Intensity Bin (9D)MFG Date: Manufacturing Date (9D)MFG Date: Manufacturing Date BIN: Color Bin BIN: Color Bin (P) Customer Item: (P) Customer Item: (V) Vendor ID: (V) Vendor ID: (9D) Date Code: Date Code (9D) Date Code: Date Code DeptID: DeptID: Made In: Country of Origin Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label Baby Label (1P) PART #:Lamps Part Number (1P) PART #: Part Number RoHS Compliant e3 temp 250C RoHS max Compliant e3 max temp 250C (1T) LOT #: Lot Number (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity QUANTITY: Packing Quantity C/O: Country of Origin C/O: Country of Origin Customer P/N: Customer P/N: CAT: Intensity Bin CAT: Intensity Bin Supplier Code: Supplier Code: BIN: Color Bin BIN: Color Bin DATECODE: Date Code DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. AV02-0921EN - May 13, 2015