a Quad 8-Bit Multiplying CMOS D/A Converter with Memory DAC8408 FEATURES Four DACs in a 28 Pin, 0.6 Inch Wide DIP or 28-Pin JEDEC Plastic Chip Carrier 61/4 LSB Endpoint Linearity Guaranteed Monotonic DACs Matched to Within 1% Microprocessor Compatible Read/Write Capability (with Memory) TTL/CMOS Compatible Four-Quadrant Multiplication Single-Supply Operation (+5 V) Low Power Consumption Latch-Up Resistant Available In Die Form APPLICATIONS Voltage Set Points in Automatic Test Equipment Systems Requiring Data Access for Self-Diagnostics Industrial Automation Multichannel Microprocessor-Controlled Systems Digitally Controlled Op Amp Offset Adjustment Process Control Digital Attenuators GENERAL DESCRIPTION The DAC8408 is a monolithic quad 8-bit multiplying digital-toanalog CMOS converter. Each DAC has its own reference input, feedback resistor, and onboard data latches that feature read/write capability. The readback function serves as memory for those systems requiring self-diagnostics. A common 8-bit TTL/CMOS compatible input port is used to load data into any of the four DAC data-latches. Control lines DS1, DS2, and A/B determine which DAC will accept data. Data loading is similar to that of a RAMs write cycle. Data can be read back onto the same data bus with control line R/W. The DAC8408 is bus compatible with most 8-bit microprocessors, including the 6800, 8080, 8085, and Z80. The DAC8408 operates on a single +5 volt supply and dissipates less than 20 mW. The DAC8408 is manufactured using PMI’s highly stable, thin-film resistors on an advanced oxide-isolated, silicon-gate, CMOS process. PMI’s improved latch-up resistant design eliminates the need for external protective Schottky diodes. ORDERING INFORMATION1 Model INL DNL Temperature Range Package Description DAC8408GP DAC8408ET DAC8408AT 2 DAC8408FT DAC8408BT 2 DAC8408FPC 3 DAC8408FS DAC8408FP ± 1/4 LSB ± 1/4 LSB ± 1/4 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1/2 LSB ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB ± 1 LSB 0°C to +70°C –40°C to +85°C –55°C to +125°C –40°C to +85°C –55°C to +125°C –40°C to +85°C –40°C to +85°C –40°C to +85°C 28-Pin Plastic DIP 28-Pin Cerdip 28-Pin Cerdip 28-Pin Cerdip 28-Pin Cerdip 28-Contact PLCC 28-Pin SOL 28-Pin Plastic DIP NOTES 1 Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages. For outline information see Package Information section. 2 For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for 883 data sheet. 3 For availability and burn-in information on SO and PLCC packages, contact your local sales office. FUNCTIONAL BLOCK DIAGRAM DAC8408 REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703 DAC8408 ELECTRICAL CHARACTERISTICS (@ VDD = +5 V; VREF = 610 V; VOUTA, B, C, D = 0 V; TA = –558C to +1258C apply for DAC8408AT/BT, TA = –408C to +858C apply for DAC8408ET/FT/FP/FPC/FS; TA = 08C to +708C apply for DAC8408GP, unless otherwise noted. Specifications apply for DAC A, B, C, & D.) Parameter Symbol STATIC ACCURACY Resolution Nonlinearity1, 2 N INL Differential Nonlinearity Gain Error Gain Tempco3, 6 Power Supply Rejection (∆VDD = ± 10%) IOUT 1A, B, C, D Leakage Current13 DNL GFSE TCGFS Conditions Min DAC8408 Typ Max 8 ± 1/4 ± 1/2 ± 1/2 ±1 ±1 ± 40 Bits LSB LSB LSB LSB LSB ppm/°C 0.001 %FSR/% TA =+25°C TA = Full Temperature Range ± 30 ± 100 nA nA RA, B, C, D ± 20 ±1 14 V % kΩ 0.8 V V µA µA pF DAC8408A/E/G DAC8408B/F/H DAC8408A/E/G DAC8408B/F/H (Using Internal RFB) ±2 PSR ILKG REFERENCE INPUT Input Voltage Range Input Resistance Match4 Input Resistance RIN 6 DIGITAL INPUTS Digital Input Low Digital Input High Input Current5 VIL VIH 2.4 Input Capacitance6 IIN CIN DATA BUS OUTPUTS Digital Output Low Digital Output High Output Leakage Current VOL VOH ILKG DAC OUTPUTS6 Propagation Delay7 Settling Time11,12 Output Capacitance tPD tS COUT AC Feedthrough FT Units TA = +25°C TA = Full Temperature Range 16 mA Sink 400 µA Source TA = +25°C TA = Full Temperature Range 10 ± 0.01 0.4 4 ± 0.005 ± 1.0 ± 0.075 ± 10.0 150 190 DAC Latches All “0s” DAC Latches All “1s” (20 Vp-p @ F = 100 kHz) ± 1.0 ± 10.0 8 180 250 30 50 V V µA µA 54 ns ns pF pF dB 90 145 150 175 10 0 0 0 0 220 350 320 430 200 270 0 0 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 6, 10 SWITCHING CHARACTERISTICS Write to Data Strobe Time Data Valid to Strobe Set-Up Time tDS1 or tDS2 tDSU Data Valid to Strobe Hold Time DAC Select to Strobe Set-Up Time DAC Select to Strobe Hold Time Write Select to Strobe Set-Up Time Write Select to Strobe Hold Time Read to Data Strobe Width tDH tAS tAH tWSU tWH tRDS Data Strobe to Output Valid Time tCO Output Data to Deselect Time tOTD Read Select to Strobe Set-Up Time Read Select to Strobe Hold Time tRSU tRH TA = +25°C TA = Full Temperature Range TA = +25°C TA = Full Temperature Range TA = +25°C TA = Full Temperature Range TA = +25°C TA = Full Temperature Range TA = +25°C TA = Full Temperature Range Specifications subject to change without notice. –2– REV. A DAC8408 ELECTRICAL CHARACTERISTICS @ VDD = +5 V; VREF = 610 V; VOUTA, B, C, D = 0 V; TA = –558C to +1258C apply for DAC8408AT/BT, TA = –408C to +858C apply for DAC8408ET/FT/FP/FPC/FS; TA = 08C to +708C apply for DAC8408GP, unless otherwise noted. Specifications apply for DAC A, B, C, & D. Continued Parameter Symbol POWER SUPPLY Voltage Range Supply Current8 Supply Current9 VDD IDD IDD Conditions Min DAC8408 Typ Max 4.5 5.5 50 1.0 1.5 TA = +25°C TA = Full Temperature Range NOTES 1 This is an end-point linearity specification. 2 Guaranteed to be monotonic over the full operating temperature range. 3 ppm/°C of FSR (FSR = Full Scale Range = VREF-1 LSB.) 4 Input Resistance Temperature Coefficient = +300ppm/°C. 5 Logic Inputs are MOS gates. Typical input current at +25°C Is less than 10 nA. 6 Guaranteed by design. Units V µA mA mA 7 From Digital Input to 90% of final analog output current. All Digital Inputs “0” or V DD. All Digital Inputs V IH or VIL. 10 See Timing Diagram. 11 Digital Inputs = 0 V to V DD or VDD to 0 V. 12 Extrapolated: t S (1/2 LSB) = tPD + 6.2τ where τ = the measured first time constant of the final RC decay. 13 All Digital Inputs = 0 V; V REF = +10 V. Specifications subject to change without notice. 8 9 PIN CONNECTIONS DAC8408 TOP VIEW (Not to Scale) ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.) VDD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . 0 V, +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +7 V IOUT 1A, IOUT 1B, IOUT 1C, IOUT 1D to DGND . . . . . . . . . –0.3 V to VDD +0.3 V RFBA, RFBB, RFBC, RFBD to IOUT . . . . . . . . . . . . . . . . . ± 25 V IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D to DGND . . . . . . . . . –0.3 V to VDD + 0.3 V DB0 through DB7 to DGND . . . . . . . . –0.3 V to VDD + 0.3 V Control Logic Input Voltage to DGND . . . . . . . . . . –0.3 V + VDD + 0.3 V VREFA, VREFB, VREFC, VREFD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . . . . . . . ± 25 V Operating Temperature Range Commercial Grade (GP) . . . . . . . . . . . . . . . . 0°C to +70°C Industrial Grade (ET, FT, FP, FPC, FS) . –40°C to +85°C Military Grade (AT, BT) . . . . . . . . . . . . . . –55°C to +125°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C REV. A Package Type uJA* uJC Units 28-Pin Hermetic DIP (T) 28-Pin Plastic DIP (P) 28-Pin SOL (S) 28-Contact PLCC (PC) 55 53 68 66 10 27 23 29 °C/W °C/W °C/W °C/W *θJA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip and P-DIP packages; θJA is specified for device soldered to printed circuit board for SOL and PLCC packages. CAUTION 1. Do not apply voltages higher than VDD +0.3 V or less than –0.3 V potential on any terminal except VREF and RFB. 2. The digital control inputs are diode-protected; however, permanent damage may occur on unconnected inputs from high energy electrostatic fields. Keep in conductive foam at all times until ready to use. 3. Use proper antistatic handling procedures. 4. Absolute Maximum Ratings apply to both packaged devices and DICE. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. –3– DAC8408 Burn-in Circuit CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC8408 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE DICE CHARACTERISTICS 1. VDD 2. VREFA 3. RFBA 4. IOUT 1A 5. IOUT 2A/IOUT 2B 6. IOUT 1B 7. RFBB 8. VREFB 9. DB0 (LSB) 10. DB1 11. DB2 12. DB3 13. DB4 14. DB5 15. DB6 16. DB7 (MSB) 17. A/B 18. R/W 19. DS1 20. DS2 21. VREFD 22. RFBD 23. IOUT 1D 24. IOUT 2C/IOUT 2D 25. IOUT 1C 26. RFBC 27. VREFC 28. DGND DIE SIZE 0.130 × 0.124 inch, 16,120 sq. mils (3.30 × 3.15 mm, 10.4 sq. mm) –4– REV. A DAC8408 WAFER TEST LIMITS at V DD = +5 V; VREF = 610 V; VOUTA, B, C, D = 0 V; TA = +258C, unless otherwise noted. Specifications apply for DAC A, B, C, & D. Conditions DAC8408G Limits Units Using Internal RFB Using Internal RFB 8 ± 1/2 ±1 ±1 0.001 Bits min LSB max LSB max LSB max %FSR/% max All Digital Inputs = 0 V ± 30 nA max RIN 6/14 kΩ min/max RIN ±1 % max DIGITAL INPUTS Digital Input Low Digital Input High Input Current4 VIL VIH IIN 0.8 2.4 ± 1.0 V max V min µA max DATA BUS OUTPUTS Digital Output Low Digital Output High Output Leakage Current VOL VOH ILKG 0.4 4 ± 1.0 V max V min µA max POWER SUPPLY Supply Current5 Supply Current6 IDD IDD 50 1.0 µA max mA max Parameter STATIC ACCURACY Resolution Nonlinearity1 Differential Nonlinearity Gain Error Power Supply Rejection (∆VDD = ± 10%)2 IOUT 1A, B, C, D Leakage Current REFERENCE INPUT Reference Input Resistance3 Input Resistance Match Symbol N INL DNL GFSE PSR ILKG VREF = +10 V 1.6 mA Sink 400 µA Source NOTES 1 This is an endpoint linearity specification. 2 FSR is Full Scale Range = V REF –1 LSB. 3 Input Resistance Temperature Coefficient approximately equals +300 ppm/ °C. 4 Logic inputs are MOS gates.Typical input current at +25°C is less than 10 nA. 5 All Digital Inputs are either “0” or V DD. 6 All Digital Inputs are either V IH or VIL. Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing. REV. A –5– DAC8408 TYPICAL PERFORMANCE CHARACTERISTICS Analog Crosstalk vs. Frequency Supply Current vs. Logic Level –6– REV. A DAC8408 Timing Diagram PARAMETER DEFINITIONS RESOLUTION AC FEEDTHROUGH ERROR Resolution is the number of states (2n) that the full-scale range (FSR) of a DAC is divided (or resolved) into. This is the error caused by capacitance coupling from VREF to the DAC output with all switches off. NONLINEARITY SETTLING TIME Nonlinearity (Relative Accuracy) is a measure of the maximum deviation from a straight line passing through the end-points of the DAC transfer function. It is measured after adjusting for ideal zero and full-scale and is expressed in LSB, %, or ppm of full-scale range. Settling Time is the time required for the output function of the DAC to settle to within 1/2 LSB for a given digital input signal. DIFFERENTIAL NONLINEARITY PROPAGATION DELAY This is a measure of the internal delays of the DAC. It is defined as the time from a digital input change to the analog output current reaching 90% of its final value. Differential Nonlinearity is the worst case deviation of any adjacent analog outputs from the ideal 1 LSB step size. A specified differential nonlinearity of ± 1 LSB maximum over the operating temperature range ensures monotonicity. CHANNEL-TO-CHANNEL ISOLATION GAIN ERROR DIGITAL CROSSTALK Gain Error (full-scale error) is a measure of the output error between the ideal and actual DAC output. The ideal full-scale output is VREF –1 LSB. This is the portion of input signal that appears at the output of a DAC from another DAC’s reference input. It is expressed as a ratio in dB. Digital Crosstalk is the glitch energy transferred to the output of one DAC due to a change in digital input code from other DACs. It is specified in nVs. OUTPUT CAPACITANCE Output Capacitance is that capacitance between IOUT 1A, IOUT 1B, IOUT 1C, or IOUT 1D and AGND. REV. A –7– DAC8408 CIRCUIT INFORMATION The DAC8408 combines four identical 8-bit CMOS DACs onto a single monolithic chip. Each DAC has its own reference input, feedback resistor, and on-board data latches. It also features a read/write function that serves as an accessible memory location for digital-input data words. The DAC’s three-state readback drivers place the data word back onto the data bus. D/A CONVERTER SECTION Each DAC contains a highly stable, silicon-chromium, thin-film, R-2R resistor ladder network and eight pairs of current steering switches. These switches are in series with each ladder resistor and are single-pole, double-throw NMOS transistors; the gates of these transistors are controlled by CMOS inverters. Figure 1 shows a simplified circuit of the R-2R resistor ladder section, and Figure 2 shows an approximate equivalent switch circuit. The current through each resistor leg is switched between IOUT 1 and IOUT 2. This maintains a constant current in each leg, regardless of the digital input logic states. Figure 1. Simplified D/A Circuit of DAC8408 Each transistor switch has a finite “ON” resistance that can introduce errors to the DAC’s specified performance. These resistances must be accounted for by making the voltage drop across each transistor equal to each other. This is done by binarilyscaling the transistor’s “ON” resistance from the most significant bit (MSB) to the least significant bit (LSB). With 10 volts applied at the reference input, the current through the MSB switch is 0.5 mA, the next bit is 0.25 mA, etc.; this maintains a constant 10 mV drop across each switch and the converter’s accuracy is maintained. It also results in a constant resistance appearing at the DAC’s reference input terminal; this allows the DAC to be driven by a voltage or current source, ac or dc of positive or negative polarity. Figure 2. N-Channel Current Steering Switch Shown in Figure 3 is an equivalent output circuit for DAC A. The circuit is shown with all digital inputs high. The leakage current source is the combination of surface and junction leakages to the substrate. The 1/256 current source represents the constant 1-bit current drain through the ladder terminating resistor. The situation is reversed with all digital inputs low, as shown in Figure 4. The output capacitance is code dependent, and therefore, is modulated between the low and high values. Figure 3. Equivalent DAC Circuit (AII Digital Inputs HIGH) –8– REV. A DAC8408 INTERFACE LOGIC SECTION DAC Operating Modes • All DACs in HOLD MODE. • DAC A, B, C, or D individually selected (WRITE MODE). • DAC A, B, C, or D individually selected (READ MODE). • DACs A and C simultaneously selected (WRITE MODE). • DACs B and D simultaneously selected (WRITE MODE). DAC Selection: Control inputs, DS1, DS2, and A/B select which DAC can accept data from the input port (see Mode Selection Table). Figure 4. Equivalent DAC Circuit (AII Digital Inputs LOW) DIGITAL SECTION Figure 5 shows the digital input/output structure for one bit. The digital WR, WR, and RD controls shown in the figure are internally generated from the external A/B, R/W, DS1, and DS2 signals. The combination of these signals decide which DAC is selected. The digital inputs are CMOS inverters, designed such that TTL input levels (2.4 V and 0.8 V) are converted into CMOS logic levels. When the digital input is in the region of 1.2 V to 1.8 V, the input stages operate in their linear region and draw current from the +5 V supply (see Typical Supply Current vs. Logic Level curve on page 6). It is recommended that the digital input voltages be as close to VDD and DGND as is practical in order to minimize supply currents. This allows maximum savings in power dissipation inherent with CMOS devices. The three-state readback digital output drivers (in the active mode) provide TTL-compatible digital outputs with a fan-out of one TTL load. The three state digital readback leakage-current is typically 5 nA. Figure 5. Digital Input/Output Structure Mode Selection: Control inputs DS and R/W control the operating mode of the selected DAC. Write Mode: When the control inputs DS and R/W are both low, the selected DAC is in the write mode. The input data latches of the selected DAC are transparent, and its analog output responds to activity on the data inputs DB0–DB7. Hold Mode: The selected DAC latch retains the data that was present on the bus line just prior to DS or R/W going to a high state. All analog outputs remain at the values corresponding to the data in their respective latches. Read Mode: When DS is low and R/W is high, the selected DAC is in the read mode, and the data held in the appropriate latch is put back onto the data bus. MODE SELECTION TABLE DS1 Control Logic DS2 A/B R/W Mode DAC L L H H H H L L H L H L L L L L WRITE WRITE WRITE WRITE A B C D L L H H H H L L H L H L H H H H READ READ READ READ A B C D L L L L H L L L WRITE WRITE A&C B&D H L L H L L X H L X H H HOLD HOLD HOLD A/B/C/D A/B/C/D A/B/C/D L = Low State, H = High State, X = Irrelevant REV. A –9– DAC8408 BASIC APPLICATIONS Some basic circuit configurations are shown in Figures 6 and 7. Figure 6 shows the DAC8408 connected in a unipolar configuration (2-Quadrant Multiplication), and Table I shows the Code Table. Resistors R1, R2, R3, and R4 are used to trim full scale output. Full-scale output voltage = VREF –1 LSB = VREF (1–2–8) or VREF × (255/256) with all digital inputs high. Low temperature coefficient (approximately 50 ppm/°C) resistors or trimmers should be selected if used. Full scale can also be adjusted using VREF voltage. This will eliminate resistors R1, R2, R3, and R4. In many applications, R1 through R4 are not required, and the maximum gain error will then be that of the DAC. Each DAC exhibits a variable output resistance that is codedependent. This produces a code-dependent, differential nonlinearity term at the amplifier’s output which can have a maximum value of 0.67 × the amplifier’s offset voltage. This differential nonlinearity term adds to the R-2R resistor ladder differential-nonlinearity; the output may no longer be monotonic. To maintain monotonicity and minimize gain and linearity errors, it is recommended that the op amp offset voltage be adjusted to less than 10% of 1 LSB (1 LSB = 2–8 × VREF or 1/256 × VREF), or less than 3.9 mV over the operating temperature range. Zeroscale output voltage (with all digital inputs low) may be adjusted using the op amp offset adjustment. Capacitors C1, C2, C3, and C4 provide phase compensation and help prevent overshoot and ringing when using high speed op amps. Figure 7 shows the recommended circuit configuration for the bipolar operation (4-quadrant multiplication), and Table II shows the Code Table. Trimmer resistors R17, R18, R19, and R20 are used only if gain error adjustments are required and range between 50 Ω and 1000 Ω. Resistors R21, R22, R23, and R24 will range betwen 50 Ω and 500 Ω. If these resistors are used, it is essential that resistor pairs R9–R13, R10–R14, R11–R15, R12–R16 are matched both in value and tempco. They should be within 0.01%; wire wound or metal foil types are preferred for best temperature coefficient matching. The circuits of Figure 6 and 7 can either be used as a fixed reference D/A converter, or as an attenuator with an ac input voltage. Table I. Unipolar Binary Code Table (Refer to Figure 6) DAC Data Input MSB LSB Analog Output 255 1 1 1 1 1 1 1 1 –VREF 256 1 0 0 0 0 0 0 1 –VREF 256 1 0 0 0 0 0 0 0 –VREF = 256 2 0 1 1 1 1 1 1 1 –VREF 256 0 0 0 0 0 0 0 1 –VREF 256 0 0 0 0 0 0 0 0 –VREF =0 256 129 128 –VIN 127 1 0 NOTE 1 LSB = (2–8) (VREF) = 1 256 (VREF) Figure 6. Quad DAC Unipolar Operation (2-Quadrant Multiplication) –10– REV. A DAC8408 Figure 7. Quad DAC Bipolar Operation (4-Quadrant Multiplication) Table II. Bipolar (Offset Binary) Code Table (Refer to Figure 7) DAC Data Input MSB LSB Analog Output (DAC A OR DAC B) 127 1 1 1 1 1 1 1 1 +VREF 128 1 0 0 0 0 0 0 1 +VREF 128 1 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 –VREF 128 0 0 0 0 0 0 0 1 –VREF 128 0 0 0 0 0 0 0 0 –VREF 128 1 1 127 128 APPLICATION HINTS General Ground Management: AC or transient voltages between AGND and DGND can appear as noise at the DAC8408’s analog output. Note that in Figures 5 and 6, IOUT2A/IOUT2B and IOUT 2C/IOUT 2D are connected to AGND. Therefore, it is recommended that AGND and DGND be tied together at the DAC8408 socket. In systems where AGND and DGND are tied together on the backplane, two diodes (1N914 or equivalent) should be connected in inverse parallel between AGND and DGND. Write Enable Timing: During the period when both DS and R/W are held low, the DAC latches are transparent and the analog output responds directly to the digital data input. To prevent unwanted variations of the analog output, the R/W should not go low until the data bus is fully settled (DATA VALID). NOTE 1 LSB = (2–7) (VREF) = REV. A 1 128 (VREF) –11– DAC8408 SINGLE SUPPLY, VOLTAGE OUTPUT OPERATION Table III. Single Supply Binary Code Table (Refer to Figure 8) The DAC8408 can be connected with a single +5 V supply to produce DAC output voltages from 0 V to +1.5 V. In Figure 8, the DAC8408 R-2R ladder is inverted from its normal connection. A +1.500 V reference is connected to the current output pin 4 (IOUT 1A), and the normal VREF input pin becomes the DAC output. Instead of a normal current output, the R-2R ladder outputs a voltage. The OP-490, consisting of four precision low power op amps that can operate its inputs and outputs to zero volts, buffers the DAC to produce a low impedance output voltage from 0 V to +1.5 V full-scale. Table III shows the code table. With the supply and reference voltages as shown, better than 1/2 LSB differential and integral nonlinearity can be expected. To maintain this performance level, the +5 V supply must not drop below 4.75 V. Similarly, the reference voltage must be no higher than 1.5 V. This is because the CMOS switches require a minimum level of bias in order to maintain the linearity performance. DAC Data Input MSB LSB Analog Output 255 1 1 1 1 1 1 1 1 VREF , +1.4941 V 256 1 0 0 0 0 0 0 1 , +0.7559 V VREF 256 1 0 0 0 0 00 0 , +0.7500 V VREF 256 0 1 1 1 1 1 1 1 , +0.7441 V VREF 256 0 0 0 0 0 0 0 1 , +0.0059 V VREF 256 0 0 0 0 0 0 0 0 VREF , 0.0000 V 256 129 128 127 1 0 Figure 8. Unipolar Supply, Voltage Output DAC Operation –12– REV. A DAC8408 Figure 9. A Digitally Programmable Universal Active Filter A DIGITALLY PROGRAMMABLE ACTIVE FILTER A powerful D/A converter application is a programmable active filter design as shown in Figure 9. The design is based on the state-variable filter topology which offers stable and repeatable filter characteristics. DAC B and DAC D can be programmed in tandem with a single digital byte load which sets the center frequency of the filter. DAC A sets the Q of the filter. DAC C sets the gain of the filter transfer function. The unique feature of this design is that varying the gain of filter does not affect the Q of the filter. Similarly, the reverse is also true. This makes the programmability of the filter extremely reliable and predictable. Note that low-pass, high-pass, and bandpass outputs are available. This sophisticated function is achieved in only two IC packages. The network analyzer photo shown in Figure 10 superimposes five actual bandpass responses ranging from the lowest frequency of 75 Hz (1 LSB ON) to a full-scale frequency of 19.132 kHz (all bits ON), which is equivalent to a 256 to 1 dynamic range. The frequency is determined by fC = 1/2πRC where R is the ladder resistance (RIN) of the DAC8408, and C is 1000 pF. Note that from device to device, the resistance RIN varies. Thus some tuning may be necessary. REV. A Figure 10. Programmable Active Filter Band-Pass Frequency Response All components used are available off-the-shelf. Using low drift thin-film resistors, the DAC8408 exhibits very stable performance over temperature. The wide bandwidth of the OP-470 produces excellent high frequency and high Q response. In addition, the OP470’s low input offset voltage assures an unusually low dc offset at the filter output. –13– DAC8408 Figure 11. A Digitally Programmable, Low-Distortion Sinewave Oscillator A LOW-DISTORTION, PROGRAMMABLE SINEWAVE OSCILLATOR By varying the previous state-variable filter topology slightly, one can obtain a very low distortion sinewave oscillator with programmable frequency feature as shown in Figure 11. Again, DAC B and DAC D in tandem control the oscillating frequency based on the relationship fC = 1/2πRC. Positive feedback is accomplished via the 82.5 kΩ and the 20 kΩ potentiometer. The Q of the oscillator is determined by the ratio of 10 kΩ and 475Ω in series with the FET transistor, which acts as an automatic gain control variable resistor. The AGC action maintains a very stable sinewave amplitude at any frequency. Again, only two ICs accomplish a very useful function. At the highest frequency setting, the harmonic distortion level measures 0.016%. As the frequencies drop, distortion also drops to a low of 0.006%. At the lowest frequency setting, distortion came back up to a worst case of 0.035%. –14– REV. A –15– –16– PRINTED IN U.S.A. 000000000