BZT52C2V4LP - BZT52C39LP SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability • • • • Case: X1-DFN1006-2 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Marking Information Terminals: Finish ⎯ NiPdAu Over Copper Leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (Approximate) Bottom View Ordering Information (Note 3) Part Number (Type Number)-7* (Type Number)-7B** Case X1-DFN1006-2 X1-DFN1006-2 Packaging 3,000/Tape & Reel 10,000/Tape & Reel *Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7. **Add “-7B” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2LP-7B. Notes: 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information BZT52CxxLP-7B BZT52CxxLP-7 xx xx Top View Bar Denotes Cathode Side Top View Dot Denotes Cathode Side BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 18 - 2 1 of 5 www.diodes.com xx = Product Type Marking Code September 2011 © Diodes Incorporated BZT52C2V4LP - BZT52C39LP Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Forward Voltage (Note 4) @ IF = 10mA Symbol VF Value 0.9 Unit V Symbol PD RθJA TJ, TSTG Value 250 500 -65 to +150 Unit mW °C/W °C Thermal Characteristics Characteristic Power Dissipation Thermal Resistance, Junction to Ambient Air Operating and Storage Temperature Range (Note 5) TA = 25°C (Note 5) TA = 25°C Electrical Characteristics @TA = 25°C unless otherwise specified Type Number BZT52C2V4LP BZT52C2V7LP BZT52C3V0LP BZT52C3V3LP BZT52C3V6LP BZT52C3V9LP BZT52C4V3LP BZT52C4V7LP BZT52C5V1LP BZT52C5V6LP BZT52C6V2LP BZT52C6V8LP BZT52C7V5LP BZT52C8V2LP BZT52C9V1LP BZT52C10LP BZT52C11LP BZT52C12LP BZT52C13LP BZT52C15LP BZT52C16LP BZT52C18LP BZT52C20LP BZT52C22LP BZT52C24LP BZT52C36LP BZT52C39LP Notes: Zener Voltage Range (Note 4) Marking Code WX W1 W2 W3 W4 W5 W6 W7 9Y 9A 9B 9C 9D 9E 9F 9G 9H 9J 9K 9L 9M 9N 9P 9R 9S 9W 9X Nom (V) 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 36 39 VZ @ IZT Min (V) 2.20 2.5 2.8 3.1 3.4 3.7 4.0 4.4 4.8 5.2 5.8 6.4 7.0 7.7 8.5 9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 34.0 37.0 Max (V) 2.60 2.9 3.2 3.5 3.8 4.1 4.6 5.0 5.4 6.0 6.6 7.2 7.9 8.7 9.6 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 38.0 41.0 Maximum Zener Impedance f = 1kHz IZT mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 ZZT @ IZT ZZK @ IZK Ω 100 600 100 600 95 600 95 600 90 600 90 600 90 600 80 500 60 480 40 400 10 150 15 80 15 80 15 80 15 100 20 150 20 150 25 150 30 170 30 200 40 200 45 225 55 225 55 250 70 250 90 350 130 350 IZK mA 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 Maximum Reverse Current (Note 4) IR @ VR uA V 50 1.0 20 1.0 10 1.0 5 1.0 5 1.0 3 1.0 3 1.0 3 2.0 2.0 2.0 1.0 2.0 3.0 4.0 2.0 4.0 1.0 5.0 0.7 5.0 0.5 6.0 0.2 7.0 0.1 8.0 0.1 8.0 0.1 8.0 0.1 10.5 0.1 11.2 0.1 12.6 0.1 14.0 0.1 15.4 0.1 16.8 0.1 25.2 0.1 27.3 Typical Temperature Coefficient @ IZTC mV/°C Min Max -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0.2 -2.7 1.2 -2 2.5 0.4 3.7 1.2 4.5 2.5 5.3 3.2 6.2 3.8 7.0 4.5 8.0 5.4 9.0 6.0 10.0 7.0 11.0 9.2 13.0 10.4 14.0 12.4 16.0 14.4 18.0 16.4 20.0 18.4 22.0 36.5 45.5 36.8 49.8 Test Current IZTC mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 4. Short duration pulse test used to minimize self-heating effect. 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can be found on our website at http://www.diodes.com. BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 18 - 2 2 of 5 www.diodes.com September 2011 © Diodes Incorporated BZT52C2V4LP - BZT52C39LP IF, INSTANTANEOUS FORWARD VOLTAGE (mA) 300 PD, POWER DISSIPATION (mW) Note 5 250 200 150 100 50 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve 1000 TA= 150°C TA= 125°C 100 TA= 105°C 10 TA= 85°C TA= -40°C TA= -65°C 1 0.1 0 150 100 TA= 25°C 0.3 0.6 0.9 1.2 1.5 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 50 IZ, ZENER CURRENT (mA) 40 T A = 25°C 10 1 C4V7LP 0.1 30 20 10 0 0.01 0 30 1 2 3 4 5 6 0 1 2 3 4 5 6 8 9 10 7 VZ, ZENER VOLTAGE (V) Fig. 4 Typical Zener Breakdown Characteristics C10LP C36LP C15LP 20 C18LP C22LP 10 Test Current IZ 5.0mA IZ, ZENER CURRENT (mA) IZ, ZENER CURRENT (mA) C12LP C39LP Test Current IZ 2.0mA 0 0 30 10 20 VZ, ZENER VOLTAGE (V) Fig. 5 Typical Zener Breakdown Characteristics BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 18 - 2 VZ, ZENER VOLTAGE (V) Fig. 6 Typical Zener Breakdown Characteristics 3 of 5 www.diodes.com September 2011 © Diodes Incorporated BZT52C2V4LP - BZT52C39LP Package Outline Dimensions A A1 D R E b X1-DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm e L Suggested Pad Layout C Dimensions Value (in mm) Z 1.1 G 0.3 X 0.7 Y 0.4 C 0.7 X Y G Z BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 18 - 2 4 of 5 www.diodes.com September 2011 © Diodes Incorporated BZT52C2V4LP - BZT52C39LP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com BZT52C2V4LP - BZT52C39LP Document number: DS30506 Rev. 18 - 2 5 of 5 www.diodes.com September 2011 © Diodes Incorporated