IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 4 Ampere Dual Low-Side Ultrafast MOSFET Drivers Features General Description • Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes • Latch-Up Protected Over Entire Operating Range • High Peak Output Current: 4A Peak • Wide Operating Range: 4.5V to 25V • High Capacitive Load Drive Capability: 1800pF in <15ns • Matched Rise And Fall Times • Low Propagation Delay Time • Low Output Impedance • Low Supply Current • Two Drivers in Single Chip The IXDN404/IXDI404/IXDF404 is comprised of two 4 Ampere CMOS high speed MOSFET drivers. Each output can source and sink 4A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETs & IGBT's. The input of the driver is compatible with TTL or CMOS and is fully immune to latch up over the entire operating range. A patent-pending circuit virtually eliminates CMOS power supply cross conduction and current shoot-through. Improved speed and drive capabilities are further enhanced by very low, matched rise and fall times. Applications • • • • • • • • • • Driving MOSFETs and IGBTs Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers Limiting di/dt Under Short Circuit The IXDN404 is configured as a dual non-inverting gate driver, the IXDI404 is a dual inverting gate driver, and the IXDF404 is a dual inverting + non-inverting gate driver. The IXDN404/IXDI404/IXDF404 family are available in the standard 8 pin P-DIP (PI), SOP-8 (SI) and SOP-16 (SI-16) packages. Figure 1 - IXDN404 Dual 4A Non-Inverting Gate Driver Functional Block Diagram Vcc P IN A ANTI-CROSS CONDUCTION CIRCUIT * OUT A N P IN B ANTI-CROSS CONDUCTION CIRCUIT * GND * Patent Pending Copyright © IXYS CORPORATION 2001 First Release OUT B N IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 Figure 2 - IXDI404 Dual Inverting 4A Gate Driver Functional Block Diagram Vcc P ANTI-CROSS CONDUCTION CIRCUIT * IN A OUT A N P ANTI-CROSS CONDUCTION CIRCUIT * IN B OUT B N GND Figure 3 - IXDF404 Inverting + Non-Inverting 4A Gate Driver Functional Block Diagram Vcc P ANTI-CROSS CONDUCTION CIRCUIT * IN A OUT A N P ANTI-CROSS CONDUCTION CIRCUIT * IN B GND * Patent Pending 2 OUT B N IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 Absolute Maximum Ratings (Note 1) Parameter Supply Voltage All Other Pins Operating Ratings Parameter Operating Temperature Range Value 25V -0.3V to VCC + 0.3V 150oC Junction Temperature Storage Temperature Soldering Lead Temperature (10 seconds maximum) IXDI404PI / I404SI / I404SI-16 Value -40oC to 85oC Thermal Impedance (Junction To Ambient) 8 Pin PDIP (PI) (θJA) 120oC/W 8 Pin SOIC (SI) (θJA) 110oC/W 16 Pin SOIC (SI-16) (θJA) 110oC/W -65oC to 150oC 300oC Electrical Characteristics Unless otherwise noted, TA = 25 oC, 4.5V ≤ VCC ≤ 25V . All voltage measurements with respect to GND. Device configured as described in Test Conditions. All specifications are for one channel. Symbol Parameter VIH High input voltage VIL Low input voltage VIN Input voltage range IIN Input current VOH High output voltage VOL Low output voltage ROH Output resistance @ Output High Output resistance @ Output Low Peak output current ROL IPEAK IDC Test Conditions Min 0V ≤ VIN ≤ VCC Units V 0.8 V -5 VCC + 0.3 V -10 10 µA VCC - 0.025 V 0.025 V IOUT = 10mA, VCC = 18V 1.5 3 Ω IOUT = 10mA, VCC = 18V 1.5 3 Ω VCC is 18V 4 tR CL=1800pF Vcc=18V 11 tF Fall time CL=1800pF Vcc=18V tONDLY VCC On-time propagation delay Off-time propagation delay Power supply voltage ICC Power supply current VIN = 3.5V VIN = 0V VIN = + VCC A 1 A 12 15 ns 12 14 17 ns CL=1800pF Vcc=18V 33 34 38 ns CL=1800pF Vcc=18V 28 30 35 ns 4.5 18 25 V 1 0 3 10 10 mA µA µA Ordering Information Part Number IXDN404PI IXDN404SI IXDN404SI-16 IXDI404PI IXDI404SI IXDI404SI-16 IXDF404PI IXDF404SI IXDF404SI-16 Max 3.5 Continuous output current Rise time tOFFDLY Typ Package Type 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Temp. Range Configuration -40°C to +85°C Dual Non Inverting -40°C to +85°C Dual Inverting -40°C to +85°C Inverting + Non Inverting NOTE: Mounting or solder tabs on all packages are connected to ground 3 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 Pin Description SYMBOL IN A FUNCTION A Channel Input GND Ground IN B B Channel Input OUT B B Channel Output VCC Supply Voltage OUT A A Channel Output DESCRIPTION A Channel Input signal-TTL or CMOS compatible. The system ground pin. Internally connected to all circuitry, this pin provides ground reference for the entire chip. This pin should be connected to a low noise analog ground plane for optimum performance. B Channel Input signal-TTL or CMOS compatible. B Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. Positive power-supply voltage input. This pin provides power to the entire chip. The range for this voltage is from 4.5V to 25V. A Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling this component. Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Figure 4 - Characteristics Test Diagram Vcc 10uF 25V 1 NC 2 In A 3 Gnd 4 In B NC 8 7 Out A Vcc 6 Out B 5 Agilent 1147A Current Probe 1800 pF 4 Agilent 1147A Current Probe 1800 pF IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 Typical Performance Characteristics Fig. 6 Rise Time vs. Supply Voltage Fig. 5 Fall Time vs. Supply Voltage 60 40 35 50 30 40 Fall Time (ns) Rise Time (ns) 25 CL=4700 pF 20 15 1800 pF 30 CL=4700 pF 20 1800 pF 10 10 200 pF 5 200 pF 0 0 8 10 12 14 16 8 18 10 12 Fig. 7 14 16 18 Supply Voltage (V) Supply Voltage (V) Rise And Fall Times vs. Case Temperature CL=1nF VCC=18V Fig. 8 Rise Time vs. Load Capacitance 80 25 70 8V 60 15 Rise Time (ns) Time (ns) 20 tF 10 tR 10V 50 12V 40 18V 30 14V 16V 20 5 10 0 -40 -20 0 20 40 60 80 100 0 0k 120 2k 4k Temperature (°C) Fig. 9 6k 8k 10k Load Capacitance (pF) Max / Min Input vs. Case Temperature VCC=18V CL=1nF Fig. 10 Fall Time vs. Load Capacitance 100 3.2 8V 90 3.0 80 Minimum Input High 2.8 Max / Min Input (V) Fall Time (ns) 70 10V 60 12V 50 40 18V 30 14V 16V 2.6 2.4 2.2 Maximum Input Low 2.0 20 1.8 10 0 0k 2k 4k 6k 8k 1.6 -60 10k -40 -20 0 20 40 o Load Capacitance (pF) Temperature ( C) 5 60 80 100 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 Fig. 11 100 Supply Current vs. Load Capacitance Vcc=18V Fig. 12 100 IXDN404PI / N404SI / N404SI-16 Supply Current vs. Frequency Vcc=18V CL= 1800 pF 80 60 2 MHz 1 MHz 500 KHz 40 100 kHz 20 1000 pF Supply Current (mA) Supply Current (mA) 10 200 pF 1 0.1 50 kHz 10 kHz 0 0.1k 0.01 1.0k 1 10.0k 10 Fig. 13 100 100 1000 Frequency (kHz) Load Capacitance (pF) Supply Current vs. Load Capacitance Vcc=12V Fig. 14 100 Supply Current vs. Frequency Vcc=12V Supply Current (mA) Supply Current (mA) 80 60 2 MHz 1 MHz 500 KHz 40 10 CL= 1800 pF 1 200 pF 1000 pF 0.1 20 100 kHz 0 0.1k 50 kHz 10 kHz 1.0k 0.01 1 10.0k 10 Fig. 15 100 100 1000 Frequency (kHz) Load Capacitance (pF) Supply Current vs. Load Capacitance Vcc=8V Fig. 16 100 Supply Current vs. Frequency Vcc=8V 80 Supply Current (mA) Supply Current (mA) 10 60 40 2 MHz 1 MHz 20 0 0.1k 500 KHz CL= 1800 pF 1000 pF 1 200 pF 0.1 100 kHz 50 kHz 10 kHz 0.01 1.0k 1 10.0k Load Capacitance (pF) 10 100 Frequency (kHz) 6 1000 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 50 Propagation Delay vs. Input Voltage CL=1800pF VCC=15V Fig. 18 Propagation Delay vs. Supply Voltage CL=1800pF VIN=5V@1kHz Fig. 17 IXDI404PI / I404SI / I404SI-16 60 50 Propagation Delay (ns) Propagation Delay (ns) 40 tONDLY 30 tOFFDLY 20 10 tONDLY 40 30 tOFFDLY 20 10 0 0 8 10 12 14 16 0 18 2 4 Fig. 19 6 8 10 12 Input Voltage (V) Supply Voltage (V) Fig. 20 Propagation Delay Times vs. Temperature CL=1800pF VCC=18V Quiescent Supply Current vs. Temperature VCC=18V VIN=5V@1kHz CL=1000pF 0.26 60 55 0.24 tONDLY 45 Time (ns) Quiescent Vcc Input Current (mA) 50 40 tOFFDLY 35 30 25 20 15 0.22 0.20 0.18 0.16 0.14 10 -40 -20 0 20 40 60 80 100 -40 120 -20 40 60 80 Temperature ( C) Fig. 22 P Channel Output Current Vs. Temperature VCC=18V, CL=1000pF N Channel Output Current Vs. Temperature VCC=18V, CL=1000pF 6 N Channel Output Current (A) 6 P Channel Output Current (A) 20 o Temperature (°C) Fig. 21 0 5 4 3 5 4 3 -40 -20 0 20 40 60 80 100 -40 o -20 0 20 40 o Temperature ( C) Temperature ( C) 7 60 80 100 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 Low-State Output Resistance Vs. Supply Voltage Fig. 24 Fig. 22 High State Output Resistance vs. Supply Voltage Fig. 23 IXDN404PI / N404SI / N404SI-16 5 Low-State Output Resistance (Ohms) 3.0 High State Output Resistance (Ohm) 4 3 2 1 2.0 1.0 0.0 0 10 8 15 20 8 25 10 15 25 Vcc vs. P Channel Output Current VCC vs. N Channel Output Current Fig. 26 0 8 -2 6 N Channel Output Current (A) P Channel Output Current (A) Fig. 25 20 Supply Voltage (V) Supply Voltage (V) -4 4 -6 2 -8 8 10 15 20 25 0 30 8 10 15 20 Vcc Vcc 8 25 30 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDI404PI / I404SI / I404SI-16 PIN CONFIGURATIONS 1 NC 2 IN A 3 GND 4 INB NC 8 1 NC OUT A 7 2 IN A VS 6 3 GND OUT B 5 4 INB 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDN404 1 NC NC 16 NC 8 1 NC OUT A 7 2 IN A VS 6 3 GND OUT B 5 4 INB 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDI404 1 NC NC 16 NC 8 OUT A 7 VS 6 OUT B 5 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDF404 1 NC NC 16 2 IN A OUT A 15 2 IN A OUT A 15 2 IN A OUT A 15 3 NC OUT A 14 3 NC OUT A 14 3 NC OUT A 14 4 GND VCC 13 4 GND VCC 13 4 GND VCC 13 5 GND VCC 12 5 GND VCC 12 5 GND VCC 12 6 NC OUT B 11 6 NC OUT B 11 6 NC OUT B 11 7 IN B OUT B 10 7 IN B OUT B 10 7 IN B OUT B 10 8 NC NC 9 16 Pin SOIC IXDN404SI-16 8 NC NC 9 16 Pin SOIC IXDI404SI-16 8 NC NC 9 16 Pin SOIC IXDF404SI-16 Supply Bypassing, Grounding Practices And Output Lead inductance GROUNDING In order for the design to turn the load off properly, the IXDN404 must be able to drain this 2.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXDN404 and its load. Path #2 is between the IXDN404 and its power supply. Path #3 is between the IXDN404 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXDN404. When designing a circuit to drive a high speed MOSFET utilizing the IXDN404/IXDI404/IXDF404, it is very important to observe certain design criteria in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXDN404 to charge a 2500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I= ∆V C / ∆t, where ∆V=25V C=2500pF & ∆t=25ns, we can determine that to charge 2500pF to 25 volts in 25ns will take a constant current of 2.5A. (In reality, the charging current won’t be constant, and will peak somewhere around 4A). OUTPUT LEAD INDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and its load as short and wide as possible. If the driver must be placed farther than 2” (5mm) from the load, then the output leads should be treated as transmission lines. In this case, a twistedpair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin SUPPLY BYPASSING In order for our design to turn the load on properly, the IXDN404 must be able to draw this 2.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is a magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected, low inductance, low resistance, high-pulse current-service capacitors). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXDN404 to an absolute minimum. of the driver, and connected directly to the ground terminal of the load. 9 IXDN404PI / N404SI / N404SI-16 IXDF404PI / F404SI / F404SI-16 IXDN404PI / N404SI / N404SI-16 IXYS Corporation 3540 Bassett St; Santa Clara, CA 95054 Tel: 408-982-0700; Fax: 408-496-0670 e-mail: [email protected] IXYS Semiconductor GmbH Edisonstrasse15 ; D-68623; Lampertheim Tel: +49-6206-503-0; Fax: +49-6206-503627 e-mail: [email protected] Directed Energy, Inc. An IXYS Company 2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526 Tel: 970-493-1901; Fax: 970-493-1903 e-mail: [email protected] 10 Doc #9200-0234 R1