ON MC74ACT241 Octal buffer/line driver with 3−state output Datasheet

MC74ACT241
Octal Buffer/Line Driver
with 3−State Outputs
The MC74ACT241 is an octal buffer and line driver designed to be
employed as a memory address driver, clock driver and bus oriented
transmitter or receiver which provides improved PC board density.
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Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
•
•
•
MARKING
DIAGRAMS
Registers
Outputs Source/Sink 24 mA
TTL Compatible Inputs
Pb−Free Packages are Available
20
1
VCC
OE2
YA1
DB4
YA2
DB3
YA3
DB2
YA4
DB1
20
19
18
17
16
15
14
13
12
11
ACT241
AWLYYWWG
SOIC−20W
DW SUFFIX
CASE 751D
1
20
1
2
3
4
5
6
7
8
9
10
OE1
DA1
YB4
DA2
YB3
DA3
YB2
DA4
YB1
GND
ACT
241
ALYWG
G
1
TSSOP−20
DT SUFFIX
CASE 948E
Figure 1. Pinout: 20−Lead Packages Conductors
1
(Top View)
TRUTH TABLE
Inputs
OE1
D
Outputs
20
(Pins 12, 14, 16, 18)
L
L
L
L
H
H
H
X
Z
1
SOEIAJ−20
M SUFFIX
CASE 967
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
1
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
TRUTH TABLE
Inputs
74ACT241
AWLYWWG
Outputs
OE2
D
(Pins 3, 5, 7, 9)
H
L
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
H
H
H
L
X
Z
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 5
1
Publication Order Number:
MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS
Symbol
VCC
Parameter
DC Supply Voltage
Value
Unit
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 v VI v VCC )0.5
V
VO
DC Output Voltage (Note 1)
*0.5 v VO v VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$50
mA
IO
DC Output Sink/Source Current
$50
mA
ICC
DC Supply Current per Output Pin
$50
mA
IGND
DC Ground Current per Output Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
260
_C
)150
_C
TL
Lead temperature, 1 mm from Case for 10 Seconds
TJ
Junction temperature under Bias
qJA
Thermal Resistance
SOIC
TSSOP
96
128
_C/W
PD
Power Dissipation in Still Air at 85_C
SOIC
TSSOP
500
450
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILatchup
Level 1
Oxygen Index: 30% − 35%
ESD Withstand Voltage
Latchup Performance
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
> 1000
V
Above VCC and Below GND at 85_C (Note 5)
$100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
DC Input Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Typ
Max
Unit
4.5
5.5
V
0
VCC
V
−40
25
+85
°C
0
0
10
8.0
10
8.0
ns/V
Output Current − High
−
−
−24
mA
Output Current − Low
−
−
24
mA
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Note 7)
IOH
IOL
VCC = 4.5 V
VCC = 5.5 V
6. Unused Inputs may not be left open. All inputs must be tied to a high voltage level or low logic voltage level.
7. Vin from 0.8 V to 2.0 V; refer to individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74ACT241
DC CHARACTERISTICS
TA = +255C
VCC
(V)
Typ
TA = −405C to +855C
Guaranteed Limits
Symbol
Parameter
VIH
Minimum High Level Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
V
VOUT = 0.1 V or
VCC − 0.1 V
VIL
Maximum Low Level Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
V
VOUT = 0.1 V or
VCC − 0.1 V
VOH
Minimum High Level Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
V
IOUT = −50 mA
4.5
5.5
−
3.86
4.86
3.76
4.76
V
V
*VIN = VIL or VIH
IOH
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
V
IOUT = 50 mA
4.5
5.5
−
0.36
0.36
0.44
0.44
V
V
*VIN = VIL or VIH
IOL
Maximum Input Leakage Current
5.5
−
±0.1
±1.0
mA
VI = VCC, GND
Additional Maximum ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
Maximum 3−State Current
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
IOLD
IOHD
†Minimum Dynamic Output Current
5.5
5.5
−
−
75
−75
mA
mA
VOLD = 1.65 V Max
VOHD = 3.85 V Min
ICC
Maximum Quiescent Supply Current
5.5
−
8.0
80
mA
VIN = VCC or GND
VOL
IIN
DICCT
IOZ
Maximum Low Level Output Voltage
Unit
Conditions
−24 mA
−24 mA
24 mA
24 mA
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS tr = tf = 3.0 ns (For Figures and Waveforms, See Figures 2, 3, and 4.)
Symbol
Parameter
TA = +255C
CL = 50 pF
TA = −405C to +855C
CL = 50 pF
VCC*
(V)
Min
Typ
Max
Min
Max
Unit
tPLH
Propagation Delay Data to Output
5.0
1.5
6.5
9.0
1.5
10.0
ns
tPHL
Propagation Delay Data to Output
5.0
1.5
7.0
9.0
1.5
10.0
ns
tPZH
Output Enable Time
5.0
1.5
6.0
9.0
1.0
10.0
ns
tPZL
Output Enable Time
5.0
1.5
7.0
10.0
1.5
11.0
ns
tPHZ
Output Disable Time
5.0
1.5
8.0
10.5
1.5
11.5
ns
tPLZ
Output Disable Time
5.0
2.0
7.0
10.5
1.5
11.5
ns
*Voltage Range 5.0 V is 5.0 V ±0.5 V
CAPACITANCE
Symbol
Parameter
Value Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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3
MC74ACT241
SWITCHING WAVEFORMS
tr
tf
3.0 V
50%
INPUT
DATA
GND
tw
1/fmax
tPLH
OUTPUT
tPHL
50%
Figure 2.
3.0 V
OE1
1.3 V
OE2
1.3 V
GND
3.0 V
GND
tPZL tPLZ
OUTPUT Y
(12, 14, 16, 18)
HIGH
IMPEDANCE
1.3 V
10%
VOL
90%
VOH
tPZH tPHZ
OUTPUT Y
(3, 5, 7, 9)
1.3 V
HIGH
IMPEDANCE
Figure 3.
450 W
INPUT
OUTPUT
DEVICE
UNDER
TEST
50 W SCOPE
TEST POINT
CL*
*Includes all probe and jig capacitance
Figure 4. Test Circuit
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4
MC74ACT241
ORDERING INFORMATION
Device
Package
MC74ACT241DW
SOIC−20
MC74ACT241DWG
SOIC−20
(Pb−Free)
MC74ACT241DWR2
SOIC−20
MC74ACT241DWR2G
SOIC−20
(Pb−Free)
MC74ACT241DTR2
TSSOP−20*
MC74ACT241DTR2G
TSSOP−20*
MC74ACT241MEL
SOEIAJ−20
MC74ACT241MELG
SOEIAJ−20
(Pb−Free)
Shipping †
38 Units / Rail
1000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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5
MC74ACT241
PACKAGE DIMENSIONS
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
11
X 45 _
h
1
10
20X
B
B
0.25
M
T A
S
B
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
q
A
B
M
D
18X
e
A1
SEATING
PLANE
C
T
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6
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC74ACT241
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
−U−
L
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
MAX
A
6.40
6.60
0.252
0.260
B
4.30
4.50
0.169
0.177
−−−
−−− 0.047
C
1.20
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
−W−
H
0.27
0.37
0.011
0.015
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0_
8_
0_
8_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MC74ACT241
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
20
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.15
0.25
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.006
0.010
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.032
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MC74ACT241/D
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