AVAGO HLMP-CW46-QRBXX T-1 â¾ (5mm) extra bright precision optical performance white led lamps. Datasheet

HLMP-CW46, HLMP-CW47. HLMP-CW76, HLMP-CW77
T-1 ¾ (5mm) Extra Bright Precision Optical
Performance White LED Lamps.
Data Sheet
Description
Features
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated
by phosphor to produce white. The typical resulting
color is described by the coordinates x = 0.31, y = 0.31
using the 1931 CIE Chromaticity Diagram.
•
•
•
•
•
These T-1 ¾ lamps are untinted, diffused, and
incorporate precise optics which produce well-defined
spatial radiation patterns at specific viewing cone
angle.
Well defined spatial radiation pattern
High luminous white emission
Viewing angle: 50° and 70°.
Standoff or non-standoff leads
Superior resistance to moisture
Applications
•
•
•
•
Electronic signs and signals
Small area illumination
Legend backlighting
General purpose indicators
Benefit
• Reduced power consumption, higher reliability, and
increased optical/mechanical design flexibility
compared to incandescent bulbs and other
alternative white light sources.
Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling and
processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Package Dimension A
Package Dimension B
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
DIMENSION H
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
(1.244)
31.60
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
CATHODE
LEAD
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
1.00 MIN.
(0.039)
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
Part Numbering System
H L M P - CW XX - X X X XX
Mechanical Option
00: Bulk
DD: Ammo Pack Straight Leads
Color Bin Options
0: Full color bin distribution
B: Color bin 2 & 3 only
Maximum Intensity Bin
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Standoff Option
46: 50˚ without standoff
47: 50˚ with standoff
76: 70˚ without standoff
77: 70˚ with standoff
2
DIMENSION H:
50°: 11.98 ± 0.25mm (0.4715 ± 0.01 inches)
70°: 11.09 ± 0.25mm (0.4365 ± 0.01 inches)
Notes:
1. All dimensions are in millimeters /inches.
2. Epoxy meniscus may extend about 1mm
(0.040") down the leads.
3. If heat-sinking application is required, the
terminal for heat sink is anode.
Device Selection Guide
Intensity (mcd) at 20 MA
Part Number
Typical Viewing Angle,
2θ ½ (Degree)
Min.
Max.
Standoff
Package
Dimension
HLMP-CW46-PS0xx
50
880
2500
No
A
HLMP-CW46-QR0xx
50
1150
1900
No
A
HLMP-CW46-QRBxx
50
1150
1900
No
A
HLMP-CW46-RU0xx
50
1500
4200
No
A
HLMP-CW46-ST0xx
50
1900
3200
No
A
HLMP-CW46-STBxx
50
1900
3200
No
A
HLMP-CW47-PS0xx
50
880
2500
Yes
B
HLMP-CW47-QR0xx
50
1150
1900
Yes
B
HLMP-CW47-QRBxx
50
1150
1900
Yes
B
HLMP-CW47-RU0xx
50
1500
4200
Yes
B
HLMP-CW47-ST0xx
50
1900
3200
Yes
B
HLMP-CW47-STBxx
50
1900
3200
Yes
B
HLMP-CW76-NR0xx
70
680
1900
No
A
HLMP-CW76-PQ0xx
70
880
1500
No
A
HLMP-CW76-PQBxx
70
880
1500
No
A
HLMP-CW76-QT0xx
70
1150
3200
No
A
HLMP-CW76-RS0xx
70
1500
2500
No
A
HLMP-CW76-RSBxx
70
1500
2500
No
A
HLMP-CW77-NR0xx
70
680
1900
Yes
B
HLMP-CW77-PQ0xx
70
880
1500
Yes
B
HLMP-CW77-PQBxx
70
880
1500
Yes
B
HLMP-CW77-QT0xx
70
1150
3200
Yes
B
HLMP-CW77-RS0xx
70
1500
2500
Yes
B
HLMP-CW77-RSBxx
70
1500
2500
Yes
B
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity
5. Part numbers in BOLD are recommended for new designs.
3
Absolute Maximum Rating at TA = 25oC
Parameters
Value
Unit
30
mA
100
mA
Power dissipation
105
mW
LED junction temperature
110
o
C
Operating temperature range
-40 to +85
o
C
Storage temperature range
-40 to +100
o
C
DC forward current
[1]
Peak pulsed forward current
[2]
Notes:
1. Derate linearly as shown in figure 2.
2. Duty factor 10%, frequency 1KHz
Electrical/Optical Characteristics TA = 25oC
Parameters
Symbol
Forward voltage
Reverse Voltage
Min
VF
[1]
VR
Thermal resistance
Chromaticity Coordinates
[2]
Capacitance
Typ
Max
Units
Test Condition
3.2
4.0
V
IF = 20 mA
V
IR = 10 µA
o
LED Junction to anode lead
5.0
RθJ-PIN
240
X
Y
0.31
0.31
IF = 20 mA
C
70
VF=0, f=1MHz
C/W
Notes:
1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA
2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
0.6
0.4
0.2
480
580
680
WAVELENGTH - nm
780
Figure 1. Relative Intensity vs. Wavelength
4
30
RθJ-A = 585˚C/W
25
RθJ-A = 780˚C/W
20
15
10
5
0
0
20
40
60
80
100
AMBIENT TEMPERATURE - ˚C
Figure 2. Forward Current vs. Ambient
Temperature
RELATIVE LUMINOUS INTENSITY
0.8
0.0
380
1.5
35
IF - FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
1.0
1.2
0.9
0.6
0.3
0
0
10
20
30
FORWARD CURRENT - mA
Figure 3. Relative Intensity versus DC
Forward Current
Y-COORDINATES
0.015
IF - FORWARD CURRENT - mA
1mA
0.020
5mA
0.010
10mA
0.005
0.000
20mA
-0.005
-0.010
-0.005
Intensity Bin Limit Table
30
0.025
25
Intensity (mcd) at 20 mA
20
Bin
Min
Max
15
N
680
880
10
P
880
1150
Q
1150
1500
R
1500
1900
S
1900
2500
T
2500
3200
5
0
30mA
0.000
0.005
0.010
X-COORDINATES
0.015
Figure 4. Chromaticity shift vs. Current
*Note: (x,y) values @ 20mA reference to
(0,0)
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
VF - FORWARD VOLTAGE - VOLTS
Figure 5. Forward Current vs. Forward
Voltage
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
60
90
60
90
ANGULAR DISPLACEMENT (˚)
Figure 6. Spatial Radiation Pattern for
CW4x
RELATIVE LUMINOUS INTENSITY
1
0.5
0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT (˚)
Figure 7. Spatial Radiation Pattern for
CW7x
5
U
3200
4200
Tolerance for each bin limit is ± 15%
Color Bin Limits with Respect to
CIE 1931 Chromaticity Diagram
Color Bin Limit Table
Rank
Limits (Chromaticity Coordinates)
1
X
0.330
0.330
0.356
0.361
Y
0.360
0.318
0.351
0.385
X
0.287
0.296
0.330
0.330
Y
0.295
0.276
0.318
0.339
X
0.264
0.280
0.296
0.283
Y
0.267
0.248
0.276
0.305
X
0.283
0.287
0.330
0.330
Y
0.305
0.295
0.339
0.360
3
4
Tolerance for each bin limit is ± 0.01
Note:
1. Bin categories are established for classification of products. Products may not be available
in all bin categories. Please contact your Avago Technologies representative for information
on currently available bins.
6
0.35
Y-COORDINATE
2
0.40
4
1
2
0.30
BLACK
BODY
CURVE
3
0.25
0.20
0.26
0.30
0.34
X-COORDINATE
0.38
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must be
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the lead
cutting from traveling to the LED chip die attach and
wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59mm
below the body (encapsulant epoxy) for those parts
without standoff.
• Recommended soldering condition:
• Wave soldering parameter must be set and maintain
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
• If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated. Therefore, the
soldered PCB must be allowed to cool to room
temperature, 25°C before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through holes size for
LED component leads.
Manual Solder
Wave Soldering Dipping
−
Pre-heat temperature 105 °C Max.
Preheat time
30 sec Max
−
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
LED component
ead size
Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.018 x 0.018inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
0.718 mm
(0.028 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information
on soldering LED components.
Recommended Wave Soldering Profile
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
250
200
TEMPERATURE - ˚C
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
150
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
TIME - SECONDS
7
60
70
80
90
100
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-1431EN - May 29, 2006
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