ETC2 AD847JRZ Microcircuit, linear, high speed, low power, operational amplifier, monolithic silicon Datasheet

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Drawing updated to reflect current requirements. -ro
02-05-28
R. MONNIN
B
Update drawing as part of 5 year review. -rrp
09-05-18
J. RODENBECK
REV
SHEET
REV
SHEET
REV STATUS
REV
B
B
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
PMIC N/A
PREPARED BY
RICK C. OFFICER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
CHARLES E. BESORE
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, HIGH SPEED, LOW
POWER, OPERATIONAL AMPLIFIER,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
93-01-19
REVISION LEVEL
B
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
1 OF
5962-89647
11
5962-E004-08
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89647
01
P
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
AD847S
High speed, low power, operational amplifier
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
Descriptive designator
GDIP1-T8 or CDIP2-T8
Terminals
Package style
8
Dual-in-line
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. (Unless otherwise specified, TA = +25C)
Positive supply voltage (+VS) ........................................................ +18 V dc
Negative supply voltage (-VS) ........................................................
Differential input voltage ................................................................
Input common mode voltage .........................................................
Junction temperature (TJ) ..............................................................
Storage temperature range ............................................................
Power dissipation (PD) ..................................................................
Lead temperature (soldering, 10 seconds) ....................................
Thermal resistance, junction-to-case (JC) .....................................
Thermal resistance, junction-to-ambient (JA) ................................
-18 V dc
±6.0 V dc
±VS
+175C
-65C to +150C
1.1 W 1/
+300C
See MIL-STD-1835
110C/W
1.4 Recommended operating conditions.
Positive supply voltage range (+VS) ...............................................
Negative supply voltage range (-VS) ..............................................
Common mode input voltage (VCM) ...............................................
Ambient operating temperature range(TA) .....................................
+4.5 V dc to +15 V dc
-4.5 V dc to -15 V dc
±12 V dc
-55C to +125C
1/ Derate linearity above TA = +25C at 7.3 mW/C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89647
A
REVISION LEVEL
B
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89647
A
REVISION LEVEL
B
SHEET
3
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Input offset voltage
VIO
1
VCM = 0 V, VS = 5 V
+IIB
1
VCM = 0 V, VS = 5 V,
VS = 15 V
-IIB
Input offset current
IIO
Common mode input
voltage range
3/
Open loop gain
01
+5.0
+7.5
1
+5.0
2,3
+7.5
300
01
1,2,3
01
+2.5
+IVR
VCM = +2.5 V, VS = 5 V
-IVR
VCM = -2.5 V, VS = 5 V
-2.5
+IVR
VCM = +12 V, VS = 15 V
+12
-IVR
VCM = -12 V, VS = 15 V
-12
+AVOL
VOUT = +2.5 V,
1
VS = 5 V, RL = 500 
VOUT = +10 V,
VS = 15 V, RL = 1 k
A
nA
400
2,3
VS = 5 V, 15 V
mV
4.0
2,3
1
VCM = 0 V,
Max
1.0
01
2,3
Input bias current
Unit
Limits 2/
01
2.0
2,3
1.0
1
3.0
2,3
1.5
V
V/mV
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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APR 97
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A
REVISION LEVEL
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SHEET
4
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Open loop gain
-AVOL
1
VOUT = -2.5 V,
VS = 5 V, RL = 500 
VOUT = -10 V,
VS = 15 V, RL = 1 k
Common mode
rejection ratio
+CMRR
-CMRR
Output current 4/
IOUT
01
2,3
1.0
1
3.0
2,3
1.5
1
VCM = +12 V, VS = 15 V
1
80
2,3
75
VCM = -2.5 V, VS = 5 V
1
80
VCM = -12 V, VS = 15 V
1
80
2,3
75
4
Max
2.0
VCM = +2.5 V, VS = 5 V
VOUT = 2.5 V,
Unit
Limits 2/
01
V/mV
80
01
dB
13
mA
VS = 5 V, TA = +25C
20
VOUT = 10 V,
VS = 15 V, TA = +25C
Output voltage swing
+VOUT
1
VS = 5 V, RL = 500 
01
+3.0
2,3
+2.5
VS = 5 V, RL = 150 
1
+2.5
VS = 15 V, RL = 1 k
1,2,3
+12
1
+10
VS = 15 V, RL = 500 
V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89647
A
REVISION LEVEL
B
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Output voltage swing
Quiescent power
supply current
-VOUT
ICC
1
VS = 5 V, RL = 500 
-2.5
VS = 5 V, RL = 150 
1
-2.5
VS = 15 V, RL = 1 k
1,2,3
-12
VS = 15 V, RL = 500 
1
-10
VOUT = 0 V, IOUT = 0 mA,
1
VOUT = 0 V, IOUT = 0 mA,
VS = 15 V
PSRR
01
5.7
7.8
1
6.3
2,3
8.4
01
75
2,3
Quiescent power
consumption
5/
PQ
1
VOUT = 0 V, IOUT = 0 mA,
VS = 5 V
VOUT = 0 V, IOUT = 0 mA,
VS = 15 V
Differential input
resistance
4/
RIN
mA
dB
72
01
57
mW
2,3
78
1
189
2,3
252
4
VCM = 0 V, TA = +25C,
V
2,3
1
VS = 5 V to 15 V
Max
-3.0
2,3
VS = 5 V
Power supply
rejection ratio
01
Unit
Limits 2/
01
80
k
VS = 5 V, 15 V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-89647
A
REVISION LEVEL
B
SHEET
6
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Slew rate
4/ 6/
+SR
4
VOUT = -2.5 V to +2.5 V,
01
Unit
Limits 2/
Max
120
V/s
RL = 500 , AV = 1 V/V,
VS = 5 V, measured from
10 % to 90 % point,
rising edge
-SR
VOUT = +2.5 V to -2.5 V,
5,6
90
4
90
5,6
65
4
200
5,6
130
4
145
5,6
120
RL = 500 , AV = 1 V/V,
VS = 5 V, measured from
90 % to 10 % point,
falling edge
+SR
VOUT = -5 V to +5 V,
RL = 1 k, AV = 1 V/V,
VS = 15 V, measured
from 10 % to 90 % point,
rising edge
-SR
VOUT = +5 V to -5 V,
RL = 1 k, AV = 1 V/V,
VS = 15 V, measured
from 90 % to 10 % point,
falling edge
Gain bandwidth
product
4/
GBWP
4
VOUT = 100 mV,
01
25
MHz
RL = 500 , VS = 5 V,
TA = +25C
40
VOUT = 100 mV,
RL = 1 k, VS = 15 V,
TA = +25C
Full power 4/ 7/
bandwidth
FPBW
4
VPK = 2.5 V, RL = 500 ,
01
5.7
MHz
VS = 5 V, TA = +25C
2.8
VPK = 10 V, RL = 1 k,
VS = 15 V, TA = +25C
Closed loop stable
gain
4/
CLSG
4,5,6
VS = 5 V, 15 V,
01
1.0
V/V
RL = 1 k
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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A
REVISION LEVEL
B
SHEET
7
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/
-55C  TA +125C
unless otherwise specified
Group A
subgroups
Device
type
Min
Rise time
4/ 8/
tr
VOUT = 0 V to +200 mV,
Unit
Limits 2/
Max
4,5,6
01
10
ns
4,5,6
01
10
ns
4
01
150
ns
AV = +1, RL = 1 k,
VS = 15 V
Fall time
4/ 8/
tf
VOUT = 0 V to -200 mV,
AV = +1, RL = 1 k,
VS = 15 V
Settling time
4/
ts
AV = -1 V/V, RL = 1 k,
VS = 15 V, TA = +25C,
10 V step at 0.1% of the
fixed value
200
AV = -1 V/V, RL = 1 k,
VS = 15 V, TA = +25C,
10 V step at 0.01% of the
fixed value
Overshoot
4/
+OS
4
VOUT = 0 V to +200 mV,
01
30
%
AV = +1, RL = 1 k,
VS = 15 V, TA = +25C
-OS
30
VOUT = 0 V to -200 mV,
AV = +1, RL = 1 k,
VS = 15 V, TA = +25C
1/
Unless otherwise specified, for dc tests, RS  100 , RL  100 k, VOUT = 0 V, and CL  10 pF.
Unless otherwise specified, for ac tests, AV = ±1 V/V, RL = 1 kΩ, and CL  10 pF.
2/
3/
4/
5/
6/
The limiting terms "min" (minimum) and "max" (maximum) shall be considered to apply to magnitudes only.
Negative current shall be defined as conventional current flow out of a device terminal.
This test is guaranteed by testing CMRR.
If not tested, shall be guaranteed to the limits specified in table I herein.
Quiescent power consumption is based on quiescent supply current test maximum (no load at the output).
Slew rate test limits are guarantee after 5 minutes of warm-up.
7/
Full power bandwidth = SR / (2 x  x VPK).
8/
Rise and fall times measured between 10 percent and 90 percent point.
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Device type
01
Case outline
P
Terminal
number
1
Terminal
symbol
NULL
2
-INPUT
3
+INPUT
4
-VS
5
NC
6
OUTPUT
7
+VS
8
NULL
NC = No connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
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3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015
of MIL-STD-883.
(2) TA = +125C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.3.2 Groups C and D inspections.
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1005 of MIL-STD-883.
(2)
TA = +125C, minimum.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
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TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
1
Final electrical test parameters
(method 5004)
1*,2,3,4,5,6
Group A test requirements
(method 5005)
1,2,3,4,5,6
Groups C and D end-point
electrical parameters
(method 5005)
1,2,3
* PDA applies to subgroup 1.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
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SHEET
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STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 09-05-18
Approved sources of supply for SMD 5962-89647 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/ .
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8964701PA
24355
AD847SQ/883
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
24355
Vendor name
and address
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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