Ironwood LS-BGA100C-61 Materials and specifications are subject to change without notice Datasheet

10mm [0.394"]
1.4mm [0.055"]
0.8mm typ.
1.4mm
[0.055"]
10mm
[0.394"]
Top View
7.2mm square [0.283"]
1
4.55mm
[0.179"]
2.96mm
[0.117"]
2
RoHS
Side View
0.2mm dia.
[0.008"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. non
clad
2
Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
100 position BGA surface mount land pattern to terminal pins (0.8mm centers, 10x10 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
LS-BGA100C-61 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Scale: 8:1
Rev: C
Drawing: S.Natarajan
Date: 5/3/05
File: LS-BGA100C-61 Dwg.mcd
Modified: 01/18/13, DH
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