05210 ESD4-LFC LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ I/O Ports ✔ Notebooks & Pocket PCs ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) 5 BUMP FLIP CHIP ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ ESD Protection > 25 kilovolts ✔ Unidirectional Configuration ✔ Low Capacitance: 15pF ✔ Protects Up to Four(4) Data Lines ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ 5 Bump Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURATION G1 05210.R3 2/07 1 www.protekdevices.com ESD4-LFC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS TA -40 to 85 °C TSTG -55 to 150 °C P 200 mW Operating Temperature Storage Temperature DC Power Rating ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER ESD4-LFC @ 25°C Unless Otherwise Specified RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL FORWARD VOLTAGE MAXIMUM CLAMPING VOLTAGE TYPICAL CAPACITANCE PER LINE (See Note 1) V WM VOLTS @ 1mA V(BR) VOLTS @3.3V ID µA @ 10mA VF VOLTS @ IP = 10mA VC VOLTS @2.5V, 1 MHz C pF 5.0 6.0 0.1 0.8 8 15 Note 1: ±20% tolerance. FIGURE 1 CAPACITANCE VS REVERSE VOLTAGE (Normalized to Capacitance at 2.5V DC & 25°C) Cj - Capacitance (Normalized) 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts 05210.R3 2/07 2 www.protekdevices.com ESD4-LFC APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds 05210.R3 2/07 Ramp-up 15 seconds 3 Solder Time 15-20 seconds Ramp-down www.protekdevices.com ESD4-LFC 5 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS MILLIMETERS BOTTOM VIEW A G C SIDE VIEW E O F G B H I 1 0.30 DIA. 63/67 Sn/Pb SOLDER BUMPS 2 I DIM MIN MAX MIN MAX A B C D E F G H I J 0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013 0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018 NOTE: 1. Controlling dimensions in millimeters. J D INCHES Outline & Dimensions: Rev 1 - 8/05, 06055 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. Tape Width 178mm (7”) 8mm A0 B0 K0 D E F W P2 P t 1.08 ± 0.05 1.60 ± 0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025 P0 t MARKING CODE DIAGRAM P0 P2 D 10 Pitches Cumulative Tolerance on Tape. ± 0.2 E Top cover tape 4L A0 F W K0 B0 P User Direction of Feed TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA-481. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., ESD4-LFC-T73-1. Suffix - LF - Lead-Free, i.e., ESD4-LFC-LF-T73-1. Suffix - C - Coated Version, i.e., ESD4-LFC-LF-T73C-1. COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05210.R3 2/07 4 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com